Iyini i-Substrate-Like PCB (SLP)? Incazelo, Ubuchwepheshe, kanye Nezicelo

Ukuqonda I-Substrate-Like PCB Technology

I-PCB Efana Ne-Substrate (SLP) imele ukuthuthuka okubalulekile ekukhiqizweni kwamabhodi wesekethe aphrintiwe, ivala igebe phakathi kwamabhodi e-High-Density Interconnect endabuko kanye nama-substrate wesekethe ahlanganisiwe . Njengoba amadivayisi kagesi edinga izinto eziyinkimbinkimbi kakhulu kanye nobuningi obuphezulu bokuxhumana, ubuchwepheshe be-SLP buhlinzeka ngokusebenza okucishe kube yi-substrate ngenkathi kugcinwa ezomnotho zokukhiqiza ze-PCB.

Lobu buchwepheshe buvumela ububanzi bokulandelela nesikhala esisondela kumazinga angu-30/30 µm, busekela amathrendi amancane abalulekile kuma-smartphone, okugqokekayo, namamojula ekhompuyutha athuthukile. Kubakhiqizi abahlola ukuqaliswa kwe-SLP, amandla enqubo yokuqonda nokucela amavidiyo okukhiqiza asefekthri kanye nemibiko yamakhono kuqinisekisa ukufaneleka okufanelekile kwabahlinzeki.

Ukuchazwa Kwezobuchwepheshe kanye Nokuma Kwe-PCB Enjenge-Substrate

I-PCB efana ne-Substrate ithatha isikhala sobuchwepheshe phakathi kwamabhodi e-HDI athuthukile kanye nama-substrate e-IC angempela. Ngenkathi i-HDI ejwayelekile isebenza ngobubanzi bomugqa kanye nesikhala esingu-50/50 µm noma ngaphezulu, i-SLP isunduza le mingcele iye ku-30/30 µm nangaphansi, lapho ukusetshenziswa okuthuthukile kufinyelela ku-25/25 µm noma amajiyometri amahle kakhulu.

Ubuchwepheshe busebenzisa ama-microvia array aminyene kakhulu, izendlalelo ze-dielectric ezizacile (40-60 µm uma kuqhathaniswa ne-HDI's 75-100 µm), kanye nokubekezelela ukubhalisa okunembe kakhudlwana. Ukwenziwa kosiko kwe-PCB kusebenzisa izinqubo ezikhiphayo ezilwa nezici ezinhle, kuyilapho i-Substrate-Like PCB isebenzisa kakhulu izinqubo eziguquliwe ezingeza kancane ezivumela ukuchazwa kokulandelela okuphakeme futhi zivumele izingxenye ezingaphansi kuka-0.4 mm.

I-Core Manufacturing Technologies ye-Substrate-Like PCB

I-Modified Semi-Additive Process (mSAP)

Indlela ye-mSAP yakha isisekelo sokukhiqiza okuningi kwe-Substrate-Like PCB. Le nqubo iqala ngongqimba oluncane lwembewu yethusi (0.5-2 µm), kulandelwa i-electroplating ekhethiwe ukuze kwakhiwe iphethini ye-conductor oyifunayo, bese iphetha ngokushumeka kwe-flash ukuze kukhishwe ungqimba lwembewu. Lokhu kulandelana kukhiqiza imikhondo enezindonga eziseceleni eziseduze nokume kanye nokusika phansi okuncane, okubalulekile ekugcineni ubuqotho besignali kumzila wephimbo ocwebezelayo ohlukanisa i-SLP nezindlela ezivamile zokukhiqiza.

Ukwakhiwa Kwe-Microvia Okuthuthukisiwe kanye Nokupakisha

Ubuchwepheshe bokubhoboza nge-laser buvumela ama-microvia angaboni abonakala ngezakhiwo ze-PCB ezifana ne-Substrate. Ama-laser e-CO₂ noma e-UV adlula ngezendlalelo ezincane ze-dielectric ukuze adale izimbobo ezincane njenge-50 µm ezibe sezifakwa ngensimbi ngokusebenzisa i-electrolyte copper deposition. Izakhiwo ze-HDI zanoma yiziphi izendlalelo zinikeza ukuguquguquka komzila okudingekayo kumiklamo ye-SLP eyinkimbinkimbi, kuyilapho ukulungiselelwa kwe-microvia ehlanganisiwe nehlanganisiwe kuhlanganiswe nokusetshenziswa kwe-via-in-pad kukhulisa ubuningi bomzila futhi kunciphise ubude bendlela yesignali.

Ukulawulwa Kwekhwalithi Nokwethenjelwa

Ukukhiqiza I-Substrate-Njenge-PCB idinga ukulawulwa kwenqubo okuqinile kuzo zonke izinhlaka ezibalulekile:

• Ububanzi bomugqa nokuvumelana kwesikhala - Ukubekezelela kufanele kuhlale ngaphakathi ± 10% ukuze kuqinisekiswe ukusebenza kukagesi okuthembekile kanye nobuqotho besignali kuzo zonke izici.
• I-Microvia copper Plating - Ukugcwaliswa okuphelele noma ukuvala okulawulwayo kuvimbela ukwehluleka ukwethembeka futhi kuqinisekisa ukuxhumana okungaguquki kukagesi ngokuguqulwa kongqimba.
• Ukulawula ukuhwalala komhlaba – Ukukhomba i-Rz <3 µm endaweni yethusi kuthinta ngokuqondile ukulahlekelwa kokufaka kumaza aphezulu futhi kuthuthukisa ukungaguquguquki kwe-impedance.
• Ikhwalithi ye-Lamination - Isibopho sesendlalelo esingenalutho ngaphandle kokugeleza kwe-resin ngokweqile kugcina ubuqotho be-microvia futhi kuvimbela ukwehluleka kwe-delamination.

Ukukhethwa Kwezinto Ezibalulekile Nokwakhiwa Kwesitaki Kwe-PCB Enjenge-Substrate

I-Dielectric kanye ne-Copper Material Systems

Amasistimu wezinto ezibonakalayo we-Substrate-Njenge-PCB ahluke kakhulu kuzakhiwo ezijwayelekile ze-FR-4. Izinto ze-dielectric ezilahlekelwa kancane ezinezici zokulahla ngaphansi kuka-0.005 kanye nama-dielectric constants phakathi kuka-3.0-3.5 zinikeza ukusebenza kukagesi okudingekile ekusetshenzisweni kwedijithali kwesivinini esikhulu kanye ne-RF. Ukukhethwa kwefoyili yethusi ngokuvamile kuthanda izinketho ezihlanekezelwe noma ezinemininingwane ephansi kakhulu ezinobunzima bobuso obuncishisiwe ukuze kuncishiswe ukulahleka komphumela wesikhumba kumafrikhwensi e-multi-gigahertz, okuthinta ngokuqondile amandla okusebenza e-Substrate-Like PCB ezinhlelweni ezifunwa kakhulu.

Izimiso Zomklamo Wesitaki

Imiklamo yokunqwabelanisa ye-Substrate-Njenge-PCB ivamise ukusebenzisa izakhiwo ezingasimetriki ezinama-dielectric azacile ezindaweni eziminyana eziphakeme kanye nama-cores aminyene wokuzinza kwemishini. I-SLP ejwayelekile engu-6-layer ingase isebenzise izendlalelo ze-dielectric ezingu-50 µm phakathi kwamapheya omzila wangaphakathi ngezisindo zethusi ezingu-0.5 oz kuyilapho igcina inkaba engu-200 µm yobuqotho besakhiwo. Izinto zamamaski ezisoda kufanele zisekele izimbobo zephimbo elihle (150 µm noma ngaphansi) ngokubhaliswa okunembile, kuyilapho ukucatshangelwa kokuphatha okushisayo kuvame ukushayela ukuhlanganiswa kwezinhlamvu zemali zethusi ezishunyekiwe noma izinto ezithuthukisiwe ngokushisa.

Ukwamukelwa Kwezicelo Zokushayela I-substrate-Efana ne-PCB

1. Amabhodi amakhulu e-smartphone - Khonza njengohlelo lokusebenza lwevolumu enkulu kunazo zonke lobuchwepheshe be-Substrate-Like PCB. Imikhawulo yesikhala eyeqile nokuxhumana okuminyene phakathi kwamaphrosesa, inkumbulo, ama-PMIC, nama-transceivers e-RF kufuna ukuminyana komzila okungaphezu kwamandla amabhodi endabuko e-HDI.
2. Amabhodi emojula yekhamera - Nika amandla ukuhlanganiswa okuhlangene kwezinzwa zesithombe, ama-lens actuators, namaphrosesa esignali yesithombe. I-SLP ivumela ukulawulwa okuqondile kwe-impedance kanye nokuhlangana ngezakhiwo ezehlisa ukulahleka kwesignali futhi zithuthukise isivinini sokucubungula izithombe.
3. Izinto zikagesi ezigqokekayo – I-Push miniaturization iqhubekele phambili ngogqinsi lwebhodi ngaphansi kuka-0.4 mm kuyilapho ugcina izingqimba zendlela ezingu-6–8. Ubuchwepheshe be-SLP buqinisekisa ukwethembeka kwemishini naphezu kokugotshwa okuphindaphindiwe kanye nezivalo zedivayisi ezihlangene.
4. Amamojula angenantambo athuthukile kanye ne-5G - Hlanganisa izingxenye eziphambili ze-RF ngaphakathi kwesakhiwo esisodwa esihlangene. Izinto ezilahleka kancane kanye nomzila womugqa ocolekile ku-SLP kuletha ukungaguquki okungaguquki kanye nobuqotho besignali kumaza wamaza wamagagasi amamilimitha.

Kafushane, ukwamukelwa kobuchwepheshe be-Substrate-Like PCB kuqhutshwa izinhlelo zokusebenza ezifuna ukuminyana kwezintambo eziphakeme kakhulu, ukusebenza kukagesi okuphakeme, kanye nokwenza kancane kancane. Njengoba lezi zindlela ziqhubeka, i-SLP isebenza njengesinikezeli esiyinhloko esivala igebe phakathi kokukhiqizwa kwe-HDI PCB kanye ne-IC substrate.

Imihlahlandlela yokudizayina ye-PCB efana ne-Substrate

Imithetho ye-Microvia kanye ne-Trace Design

Onjiniyela abaklama ukwakhiwa kwe-Substrate-Like PCB kumele baguqule indlela yabo ukuze ivumelane namakhono nezithiyo zobuchwepheshe. Amadayamitha e-Microvia kufanele ngokuvamile agcine i-aspect ratio engu-1:1 phakathi kwedayamitha eqediwe nogqinsi lwe-dielectric, ngosayizi bephedi lokuthwebula okungenani elingu-50 µm elikhulu kunodayamitha ukuze kuqinisekiswe ukubekezelela ukubhaliswa okwanele.

Isikhala sokulandelela kufanele sigcine ubuncane obungu-30 µm kumadizayini wokukhiqiza ano-40-50 µm ancanyelwayo ukuze kuthuthukiswe isivuno, kuyilapho ukulawulwa kokuvimba kudinga ukuhlanganiswa okunemininingwane yesitaki ukuze kuzuzwe ukuthinteka okuhlosiwe okungu-50Ω okukodwa noma okungu-90-100Ω okuhlukile.

Ubuqotho Besiginali kanye Nokuphathwa Okushisayo

Ukubhobolwa emuva kwemigodi edabula izendlalelo zesignali yesivinini esikhulu kusiza ukunciphisa ukuzwakala kwe-stub okona ubuqotho besignali ngaphezu kwama-gigahertz ambalwa, kuyilapho abaklami kufanele basungule izidingo zendandatho yonyaka beqaphela ukuthi ukwakhiwa kwe-Substrate-Like PCB ngokuvamile kusekela ubuncane obuncane (25-30 µm) kunezinqubo ezijwayelekile.

Idizayini yephedi eshisayo yamaphakheji e-QFN kanye ne-BGA kufanele ilinganisele izidingo zevolumu yokunamathisela ye-solder ngokubeka ukuhanjiswa okushisayo ezindizeni zangaphakathi, ukuvimbela ingxenye yokushisa ngokweqile kuyilapho kugcinwa izici zefomu elihlangene eziqhuba ukwamukelwa kobuchwepheshe be-SLP.

Ukuhlolwa Kwekhono Lokukhiqiza kanye Nokuthengwa Kwempahla

Amamethrikhi Amandla Abalulekile

Ukufaneleka komkhiqizi we-PCB enjenge-Substrate kudinga ukuhlolwa okuphelele kwamakhono enqubo ngale kwamaphepha ezicaciso ezijwayelekile:

• Ububanzi obuncane bomugqa ofinyelelekayo nesikhala - Amandla okukhiqiza angokoqobo anesivuno esamukelekayo, ngokuvamile esingu-30/30 µm kuya ku-40/40 µm wokukhiqiza umthamo.
• Ububanzi obuncane obuthembekile be-microvia – Ubukhulu obufakazelwe ukukhiqiza obunekhwalithi yokucwenga engaguquki, ngokuvamile ububanzi obuqediwe obungu-50-75 µm.
• Isibalo esiphezulu sesendlalelo esinanoma yisiphi isendlalelo se-microvia izakhiwo - Inqubo yokuvuthwa kwezitaki eziyinkimbinkimbi ezingaphezu kwezindlela eziyisisekelo zokwakha ngokulandelana.
• Ukubekezelelana kokulawula ukuqina - Ukuphathwa okunembayo kwamabhodi okugcina amancane kuyilapho kugcinwa ukuqina kwemishini kanye nezidingo zokuthi flatness.

Ukuqinisekiswa Kwekhwalithi Nokucatshangelwa Kwezindleko

Isampula lebhodi lokufaneleka kufanele lifake ukuhlaziya okubanzi kwezingxenye ezihlukene ukuze kuqinisekiswe ikhwalithi ye-copper plating, ukufana kwe-dielectric ukujiya, kanye nokunemba kokubhaliswa kwesendlalelo, kuyilapho ukuthwebula kwe-X-ray kuveza kwangaphakathi ngekhwalithi kanye nokungabi nalutho okungenzeka. Idatha yokuhlolwa kukagesi ebonisa ukunemba kokulawulwa kokuvinjwa kanye nedatha yokuhlola ukuhamba ngebhayisikili elishisayo (imvamisa -40°C kuya ku-+125°C imijikelezo engu-500-1000) iqinisekisa ukuqina kwemishini kokwakhiwa kwe-PCB Enjenge-Substrate.

Ukucatshangelwa kwezindleko ze-SLP kuvamise ukuyibeka ku-40-80% ngaphezu kwamabhodi we-HDI wesendlalelo esilinganayo ngenxa yezinqubo ezikhethekile nezinto zokwakha, izikhathi zokuhola ezinweba amaviki angu-2-4 ngaphezu kwe-HDI evamile, nakuba ukukhiqizwa kwevolumu kunciphisa izindleko ezinengqondo njengoba isivuno sithuthuka.

Isiphetho

Ubuchwepheshe be-Substrate-Like PCB (SLP) buvala igebe phakathi kwezixazululo ze-HDI ne-IC substrate, buvumela umzila ongcono kakhulu, izakhiwo ezihlangene, nokuxhumana okuthembekile kwemikhiqizo kagesi yesizukulwane esilandelayo. Inhlanganisela yayo yokucubungula i-mSAP, ubuchwepheshe be-microvia, nezinto ezithuthukisiwe ziletha ukuminyana nokusebenza kwemiklamo yesimanje edinga kuwo wonke ama-smartphones, izinto ezigqokwayo, namamojula ekhompyutha anesivinini esikhulu.

I-Highleap Electronics igxile ekukhiqizweni nasekuhlanganisweni kwe -PCB , ihlinzeka ngezixazululo eziphelele kusukela ku-prototype kuya ekukhiqizweni okugcwele:

• Ukukhiqiza okuphelele kwe-SLP - Ukusekelwa okugcwele kolayini ocolekileyo (≤30 µm) kanye ne-microvia (≤75 µm) izakhiwo.
• Ukusebenza obala - Amavidiyo okukhiqiza amafekthri nemibiko enemininingwane yamandla yokuqinisekisa ubunjiniyela.
• I-DFM kanye nokwesekwa kwezobuchwepheshe - Impendulo yedizayini yochwepheshe ukuze kuthuthukiswe ukwethembeka, isivuno, kanye nokusebenza kahle kwezindleko.

Ufuna ukuhlola noma ukukhiqiza ama-PCB afana ne-Substrate? Xhumana ne-Highleap Electronics ukuze ufinyelele izixazululo zethu zokukhiqiza ze-SLP kusukela ekuqaleni kuze kube sekupheleni futhi uqinisekise ukuthi imiklamo yakho yabantu abaningi ifinyelela kokubili ukusebenza kanye nokukhiqizwa kalula.

imibuzo ejwayelekile ukubuzwa

1. Ingabe I-Substrate-Njenge-PCB ingakwazi ukufaka esikhundleni ngokuphelele ama-substrates e-IC?
Ngenkathi i-SLP isondela ekusebenzeni kwezinga le-substrate ezicini eziningi, ama-IC substrates eqiniso asagcina izinzuzo ngosayizi wesici wokugcina (ngaphansi kuka-20 µm L/S), ukwakheka kwephakeji okukhethekile, kanye nongqimba oluphezulu kakhulu lubala ukweqa izendlalelo eziyi-12. I-SLP isebenzisa izinhlelo zokusebenza lapho ukusebenza kwe-substrate kufunwa khona kodwa izindleko ezigcwele ze-substrate nesikhathi sokuhola azithetheleleki.

2. Yibuphi ubuncane obujwayelekile bobubanzi bomugqa kanye namandla okuhlukanisa i-Substrate-Like PCB?
Amakhono okukhiqiza e-SLP ngokuvamile asuka ku-30/30 µm ukuya ku-40/40 µm ngobubanzi bomugqa nesikhala, ngezinqubo ezithuthukisiwe ezifinyelela ku-25/25 µm. Amakhono athile ayahluka kumkhiqizi futhi kufanele aqinisekiswe ngesikhathi sokufaneleka komphakeli, njengoba izici ezincane ezikhangisiwe zingase zibonise amandla aselabhorethri kunesivuno sokukhiqiza.

3. Izindleko ezifana ne-Substrate-Like PCB ziqhathaniswa kanjani ne-HDI ne-IC substrates?
I-SLP ngokuvamile ibiza u-40-80% ngaphezu kwamabhodi e-HDI aqhathanisekayo ngenxa yezinqubo ze-mSAP nezinto eziyisipesheli, kuyilapho isele ngo-50-70% ingabizi kakhulu kunama-substrates e-IC eqiniso. Ukukhiqizwa kwevolumu nokwenza ngcono idizayini kungaba nomthelela omkhulu ezindlekweni zokugcina, kwenze ukusebenzelana komhlinzeki kusenesikhathi kubaluleke ezinhlelweni ezingazweli kakhulu