I-GPB Server PCB Manufacturing

Kungani Khetha I-Highleap Electronics Yokwenziwa Kwe-Server PCB

I-Highleap Electronics igxile ekukhiqizeni ama-PCB amaseva e-GPU kanye nehadiwe ye-AI. Siyifektri ye-PCB enikeza isevisi ephelele ephatha konke kusukela kuma-prototypes kuya ekukhiqizweni okukhulu, sinobuchwepheshe obukhethekile emabhodini ayinkimbinkimbi adingekayo ezinhlelweni zokusebenza zesikhungo sedatha. Isikhungo sethu sikhiqiza amabhodi omama, amakhadi okuphakamisa, amabhodi kagesi, kanye nezinhlelo ezahlukahlukene zokuxhumanisa ezidingwa amaseva e-GPU ukuze zisebenze. Kungakhathaliseki ukuthi udinga ukukhiqizwa kwe-PCB yeseva ejwayelekile noma ukukhiqizwa kwe-PCB ye-GPU okukhethekile , sinamakhono okuletha.

• Amakhono Okukhiqiza we-PCB anesivinini esikhulu: Senza amabhodi asekela isivinini se-PCIe Gen5 (32 GT/s) kanye ne-Gen6 (64 GT/s) anokulawula okungenayo i-impedance phakathi kuka-±7%. Imigqa yethu yokukhiqiza iphatha yonke into kusukela kumabhodi anezingqimba ezi-4 kuya kumiklamo eyinkimbinkimbi yezendlalelo ezingu-28, kusetshenziswa ukuhlola okuzenzakalelayo okuzenzakalelayo ezigabeni eziningi ukuze kubanjwe amaphutha ekuqaleni kwenqubo. Lobu buchwepheshe budlulela ku unqenqema lwekhompiyutha PCB izinhlelo zokusebenza lapho ukubambezeleka nokuthembeka kubalulekile.
• Ukwenziwa Kwebhodi Lezinto Eziningi Eziyinkimbinkimbi: Amabhodi omama weseva ye-GPU ngokuvamile adinga izendlalelo ezingu-16-24 ukuze ahambise wonke amasiginali adingekayo. Sisebenzisa I-HDI PCB ubuchwepheshe obunama-microvias aphansi aze afike ku-75μm ububanzi futhi agcine ukubhaliswa kwesendlalelo kuya kwesendlalelo ngaphakathi kuka-±50μm. Lokhu kunemba kubalulekile lapho uhambisa amakhulu amapheya ahlukene okufanele agcine ubude obufanisiwe.
• Umhlangano we-SMT Wezingxenye Eziminyene: Imishini yethu yokukhetha nendawo ifinyelela ukunemba okungu-±30μm ezingxenyeni zephimbo elihle, iphatha yonke into kusukela kuzingxenye ze-chip ezingu-01005 ukuya kumaphakheji amakhulu e-BGA anamabhola angaphezu kuka-3,000. Sisebenzisa ohhavini bokugcwalisa kabusha i-nitrogen ukuze siqinisekise ukwakheka okuhlangene kwe-solder, okubaluleke kakhulu kuma-BGA amakhulu asetshenziswa iseva motherboard PCB umhlangano.
• Amandla Okukhiqiza Ivolumu: Sikala ukusuka ku-prototype egijima yamabhodi angu-5-10 ukuya kumavolumu okukhiqiza angaphezu kwamayunithi angu-10,000 ngenyanga. Ubudlelwano bethu bochungechunge lokuhlinzekwa kwempahla buqinisekisa ukutholakala kwengxenye ngisho nalapho kushoda, futhi sigcina izindinganiso zekhwalithi ezigcina izinga lokukhubazeka lingaphansi kuka-100 DPPM ngisho nakumavolumu aphezulu.

Le nhlanganisela yamakhono isenza sibe uzakwethu othembekile wezinkampani ezithuthukisa ihadiwe yeseva yesizukulwane esilandelayo. Sihlinzeka ngokukhiqiza nokuhlanganisa iseva ye-GPU ye-GPB, iletha izixazululo ezinesivinini esikhulu, ezithembekile ze-AI nezinhlelo zokusebenza zesikhungo sedatha.

Izidingo Ezibalulekile Zomklamo Wamabhodi Omama Weseva ye-GPU

Ama-PCB eseva ye-GPU aphakathi kwamabhodi ayinkimbinkimbi kakhulu akhiqizwayo namuhla. Ibhodi elijwayelekile kumele lisekele ama-GPU angu-4-8, ngalinye lidinga imizila engu-16 yokuxhumana kwe-PCIe kanye nokulethwa kwamandla okukwazi ukuphatha ama-watts angu-300-700 ngekhadi ngalinye. Lezi zidingo ziqhuba izinqumo zokuklama ezithinta zonke izici zenqubo yokukhiqiza, ikakhulukazi kumadizayini ebhodi le-AI elikhethekile.

• Izidingo Zokubalwa Kwesendlalelo Nezitaki: Amabhodi amaningi weseva ye-GPU asebenzisa izendlalelo eziyi-16-24, yize eminye imiklamo iphushela izendlalelo ezingama-28 noma ngaphezulu. Isitaki kufanele silinganisele izendlalelo zesignali zesivinini esikhulu (ngokujwayelekile ezendlalelo ezingaphandle), izindiza zamandla (ezisebenzisa ithusi elingu-2-4oz), nezithenjwa zaphansi. Uxhumo ngalunye lwe-GPU lulodwa lungase ludinge izendlalelo zomzila ezingu-4-6 ukuze kugcinwe ubuqotho besignali obufanele. Eyethu Imihlahlandlela ye-HDI PCB yamabhodi omama weseva nikeza imininingwane enemininingwane yale miklamo eyinkimbinkimbi.
• Izinselele Zomzila Eziminyana Kakhulu: Umzila uba nzima kakhulu nge-GPU ngayinye eyengeziwe. I-GPU eyodwa idinga cishe amapheya ahlukene ayi-100 e-PCIe, ukuphathwa kwamandla, namasignali ayisizayo. Ukugcina ubude bokulandelela obufaniswayo phakathi kwamamitha angu-5 ngenkathi ugwema i-crosstalk kudinga ukuhlela ngokucophelela futhi ngokuvamile ukuphindaphinda kwemizila eminingi.
• Izimfuneko zokunemba ze-BGA nezixhumi: Izingxenye zeseva zisebenzisa ama-BGA amakhulu adinga ukubekwa okunembayo nokucaba okuphelele. Izikhala ze-GPU kufanele zibambe amakhadi anesisindo esifika ku-3kg kuyilapho egcina ukuthintana kukagesi ngezinkulungwane zemijikelezo yokufaka. Izixhumi zamandla zidinga ukuthwala kufika ku-600W ngenkathi zihlala ngaphakathi kwemikhawulo yezinga lokushisa.

Izinto kanye Nokuphathwa Kwesiginali Esisheshayo

Ijubane le-PCIe Gen5 kanye ne-Gen6 lidinga ukukhethwa kwezinto ngokucophelela kuyo yonke indlela yesignali. Izinto ezijwayelekile ze-FR-4 azikwazi ukugcina ubuqotho besignali kulezi zikhathi, okwenza ukukhethwa kwezinto ze-PCB laminate kube esinye sezinqumo ezibaluleke kakhulu enkambisweni yokuklama.

• Ukukhetha Izinto Ze-PCB Elungile: Izendlalelo zesivinini esikhulu zidinga izinto zokulahlekelwa okuncane njengeMegtron 6, Megtron 7, noma i-laminate ekhethekile yokulahlekelwa okuncane. Lezi zinto zigcina ama-dielectric constants azungeze u-3.3-3.5 kanye nama-tangent okulahlekelwa ngaphansi kuka-0.002 ku-10 GHz. Izindleko zezinto zingafinyelela ku-$500-1000 ngephaneli ngayinye yezingxenye ze-premium, ngakho-ke sivame ukusebenzisa ama-stackup e-hybrid ngezinto zokulahlekelwa okuphezulu kuphela lapho kudingeka khona.
• Ukuphatha Ubuqotho Besiginali ku-32+ GT/s: Ngezivinini ze-PCIe Gen5 ne-Gen6, njalo nge-millimeter ngayinye yokulandela umkhondo, futhi sonke isixhumi sithinta ikhwalithi yesiginali. Sisebenzisa i-back-drilling ukuze sisuse ngama-stubs, sisebenzise okufanele ngesikhala ukuze sinciphise i-crosstalk, futhi siqinisekise ukulawulwa kwe-impedance kulo lonke ushintsho. Ukulingiswa kokuhlelwa kwangaphambili kusiza ukukhomba izindawo eziyinkinga ngaphambi kokuzibophezela kuhadiwe.
• Izindlela Zokuhlola Nokuqinisekisa: Siqinisekisa ukusebenza kwesivinini esikhulu sisebenzisa i-time-domain reflectometry (TDR) yokuqinisekisa i-impedance kanye nabahlaziyi benethiwekhi ye-vector kuzilinganiso zepharamitha ye-S kufika ku-67 GHz. Ukuhlolwa komdwebo wamehlo kuqinisekisa ukuthi amasiginali agcina umkhawulo owanele ngemuva kokubalwa kwezimali ngokuhlukahluka kokukhiqiza.

Ukudiliva Amandla kanye Nezixazululo Zokuphatha Ezishisayo

Ama-GPU esimanje asebenzisa amandla amaningi kakhulu - i-H100 GPU eyodwa ingadonsa ama-700W, futhi amaseva anama-GPU angu-8 adinga ukuletha ama-GPU angaphezu kuka-5kW kuphela. Lawa mandla kumele alethwe kahle ngenkathi kulawulwa ukushisa okukhiqizwa ukuguqulwa kwamandla kanye nama-GPU ngokwawo. Lezi zinselele zinzima kakhulu ezinhlelweni zokukhiqiza ze-PCB zekhompyutha ezisebenza kahle kakhulu.

• Idizayini Yethusi Elisindayo Yesimanjemanje: Izindiza zamandla zisebenzisa ithusi elingu-4-10oz ukuze zibambe imisinga engaphezu kuka-100A nge-GPU ngayinye. Sisebenzisa izindlela zamanje ezihambisanayo futhi sisebenzisa okubanzi ngama-array (ngokuvamile angama-200+ vias) ekushintsheni kwesendlalelo. Ukuhlaziywa kwamanje kokuminyana kuqinisekisa ukuthi azikho izindawo ezedlula u-30A ngeyintshi yesikwele ngayinye, kuvimbela ukushisa ngokweqile.
• Izixazululo Ezihlanganisiwe Ezishisayo: Senza ama-heatsink angokwezifiso, amapuleti abandayo, namakamelo omhwamuko aklanyelwe ngqo ukucushwa kweseva ngayinye. Izimbobo ezishisayo ezingaphansi kwezingxenye zamandla aphezulu zisebenzisa izimbobo ezinobubanzi obungu-0.3mm ezigcwaliswe nge-epoxy ehambisa ukushisa. Ezimweni ezimbi kakhulu, sishumeka izinhlamvu zemali zethusi ngqo ku-PCB ukuze sithole ukumelana nokushisa okungaphansi kuka-1°C/W.
• Ukusebenza Nezinhlelo Zokupholisa: Iziphakeli zesimanje zisebenzisa izindlela zokupholisa ezihlukahlukene - ukupholisa umoya okujwayelekile, ukupholisa uketshezi okuqondile, noma ukupholisa ngokuphelele kokucwiliswa. Imiklamo ye-PCB kufanele ifake izindawo zokukhweza zamapuleti abandayo, izindawo zokuvula amapayipi okushisa, futhi kwezinye izimo, okunamathelayo okukhethekile okuhambisana nokupholisa ukucwiliswa.

Amandla asebenzayo kanye nomklamo oshisayo ubalulekile ekuqinisekiseni ukusebenza okuthembekile kwezinhlelo zekhompuyutha ezisebenza kahle kakhulu, ikakhulukazi ezindaweni zesikhungo sedatha. Ngokuhlanganisa izixazululo ezithuthukisiwe zokulethwa kwamandla kanye nezindlela zokuphatha ezishisayo, sivimbela ukushisa ngokweqile, sinciphisa ukulahlekelwa kwamandla, futhi siqinisekise ubude bezinto ezibucayi, ngaleyo ndlela sigcine ukusebenza kwesistimu okuphelele ngisho nangaphansi kwemithwalo enzima kakhulu yokusebenza.

Ukusuka ku-Prototype kuya Ekukhiqizweni Okuningi ku-GPB Server PCB Manufacturing

Ukushintsha ukusuka kuma-prototypes okuqala ukuya ekukhiqizweni okugcwele kwe-GPB yeseva ye-GPU kudinga ukuhlela okucophelelayo nokunemba. Amadizayini amaningi asebenza nge-prototype angabhekana nezinselele uma esenyuselwa ukukhiqizwa ngobuningi. Kungakho ukuba nobuchwepheshe bokukhiqiza kubalulekile ukuze kuqinisekiswe ukungaguquguquki kanye nekhwalithi kuzo zonke izigaba.

• Ukubuyekezwa kwe-Design for Manufacturing (DFM).: Ngaphambi kokuthi ukukhiqizwa kuqale, senza ukubuyekezwa kwe-DFM ukuze sihlonze izinkinga ezingaba khona, ezifana namaringi angenanyaka anganele noma ukubekwa komkhondo okungafanele. Ukutholwa kusenesikhathi kusiza ukugwema ukwakhiwa kabusha okumba eqolo futhi kuqinisekisa ukuthi idizayini isilungele ukukhiqizwa kumaseva e-GPB e-GPB.
• Inqubo Yokuqinisekisa I-Prototype: Ama-prototypes ethu ahlolwa ngokuphelele, okubandakanya ukuhlukaniswa kwezigaba, ukuhlolwa kwe-X-ray kwamajoyinti e-BGA solder, nokuhlolwa kwe-impedance of traces ebucayi. Ngokuvamile sakha ama-prototype ambalwa ukuze siqinisekise ukuthi idizayini nenqubo yokukhiqiza ihlangabezana namazinga okusebenza okuphezulu adingekayo kumaseva e-GPB e-GPB.
• Ukukala Kumavolumu Okukhiqiza: Izinqubo zethu zokukhiqiza ziqinisekisa ukuvumelana ukuthi kukhiqizwa amayunithi ayi-10 noma ayi-10,000. Sisebenzisa ukulawula inqubo yezibalo, ukuhlola okuzenzakalelayo kokubona, nokuhlola okusekelwe kumasampula, sigcina ikhwalithi nokwethembeka kukho konke ukukhiqizwa kwamaseva e-GPB e-GPU.

Indlela yethu iqinisekisa uguquko olungenamthungo ukusuka ku-prototype ukuya ekukhiqizweni ngobuningi, iletha ama-PCB eseva ye-GPU esezingeni eliphezulu, athembekile ezingxenyekazi zekhompuyutha zeseva yakho yesizukulwane esilandelayo.