Ubunjiniyela Obuphambene be-HDI PCB Bokukhiqiza

Ubunjiniyela be-PCB obusezingeni eliphezulu bubhekana namabhodi adinga kakhulu ubuchwepheshe embonini ye-elekthronikhi: amabhodi e-HDI amaningi (i-High Density Interconnect) anama-microvia, ama-via angaboni futhi agqitshwe, izingxenye ze-BGA ezicijile ku-0.4 mm noma i-0.3 mm ibhola, ububanzi obungaphansi kuka-75 µm, kanye nokubalwa kwezingqimba okungu-10–20+. Lawa mabhodi atholakala emishinini yokuxhumana, kumadivayisi okuthwebula izithombe zezokwelapha, kuma-avionics ezindizayo, ezinhlelweni zokulawula zezimboni, kanye nama-electronics okuzivikela - amapulatifomu abalulekile lapho amabhodi okufaka esikhundleni kumele atholakale isikhathi eside ngemuva kokuba umenzi wokuqala eyeke ukukhiqizwa.

Uma amabhodi abalulekile e-HDI efika ekupheleni kokuphila futhi ukwesekwa kwe-OEM kungasatholakali, izinhlangano zibhekene nokukhetha: ukuyeka lonke uhlelo noma ukwakha kabusha ibhodi kusukela ekuhlaziyweni okungokoqobo. Ubunjiniyela obuphambene ne-PCB buhlinzeka ngendlela esemthethweni yokukhiqiza amabhodi okufaka esikhundleni sokusekelwa kohlelo oludala, ukuphathwa kokuphelelwa yisikhathi, ukuhlaziywa kokuhluleka, kanye neziqu zomthombo wesibili - konke kungaphansi kwemithetho yempahla yobuhlakani kanye nezibopho zenkontileka.

Inselele yobunjiniyela obubuyela emuva ikhula kakhulu ngobuningi bebhodi. Ibhodi elijwayelekile elinezingqimba ezine ezinezingqimba ezingu-0.2 mm kanye nezingxenye ze-QFP ezingu-0.8 mm-pitch lingaklanywa ngokuskena okubonakalayo kanye ne-X-ray eyisisekelo. Ibhodi le-HDI elinezingqimba ezingu-0.05 mm, ama-microvia angu-0.075 mm, kanye ne-BGA engu-0.3 mm-pitch lidinga ukuskena kwe-CT, isofthiwe ekhethekile yokuthwebula izithombe, kanye nonjiniyela abanolwazi ngezinqubo zokukhiqiza ezithuthukisiwe. Umkhawulo wephutha uyancipha ngokulinganayo - iphutha lokubeka elingu-0.025 mm ebhodini elijwayelekile alibonakali, kodwa ebhodini le-HDI elinesikhala sokulandelela esingu-0.1 mm, iphutha elifanayo lidala isekethe emfushane.

Lo mhlahlandlela uhlanganisa indlela ekhethekile yama-PCB e-HDI obunjiniyela obubuyela emuva, kusukela kubuchwepheshe bokuthwebula izithombe obudingekayo ngokwakhiwa kabusha kwe-microvia kuya ekuqinisekisweni kokukhiqiza.

1. Yini Eyenza Ama-PCB Anesisindo Esiphezulu Abe Unjiniyela Onzima Kakhulu Ukuwaguqula

1.1 Usayizi Wesici vs. Isixazululo Sokuthwebula Izithombe

1.2 Inkinga Yobunzima Bokunqwabelana

Amabhodi e-HDI asebenzisa i-lamination elandelanayo — akhiwe ngezigaba, nge-microvias laser-drilled esigabeni ngasinye, kunokuba abholwe futhi afakwe i-plaster ngendlela eyodwa efana namabhodi ajwayelekile. Lokhu kudala ngezakhiwo ezixhumanisa ama-layer pair athile (Isendlalelo 1-2, Isendlalelo 2-3) kunokuba angene ebhodini lonke. Unjiniyela obuyela emuva kumele anqume hhayi nje ukuthi i-via ngayinye ikuphi, kodwa ukuthi yiziphi izendlalelo ezithile ezixhumanisayo — isinqumo esidinga ukuskenwa kwe-CT noma ukuhlukaniswa okubhubhisayo.

2. Izici Zobuchwepheshe be-HDI kanye Nezinselele Zazo ze-RE

2.1 Ama-Microvia

Ama-Microvia (≤0.15 mm ububanzi bokubhoboza) ayisici esichazayo sama -HDI PCB . Abhobozwa nge-laser (awabhobozwa ngomshini) futhi axhumanisa ama-layer pair aseduze. Izinhlobo zifaka:

• Ama-microvia ayimpumputhe: Xhuma ungqimba lwangaphandle nongqimba lwangaphakathi oluseduze kuphela. Kubonakala kusuka endaweni eyodwa njengephedi encane engenasici esihambisanayo endaweni ephambene
• Ama-microvia ahlanganisiwe: Ama-vias amaningi angaboni abekwe phezu komunye nomunye, axhumanisa izendlalelo ezintathu noma ngaphezulu endaweni efanayo ye-XY. I-vias ngayinye ixhumanisa i-pair yesendlalelo esisodwa; i-stack ixhumanisa ububanzi obugcwele
• Ama-microvia axakile: Umsebenzi ofana nama-vias ahlanganisiwe kodwa ahlukaniswe endaweni yesendlalelo ngasinye, okudala iphethini "yezitebhisi". Kunzima kakhulu ukulandelela ngoba i-via ishintsha indawo ekushintsheni kwesendlalelo ngasinye

2.2 I-Via-in-Pad

Izingxenye ze-BGA eziqondile zidinga ubuchwepheshe be-via-in-pad — ama-via abekwe ngqo ku-component pad kunokuba abekwe eceleni. Lawa ma-via avame ukugcwaliswa ngethusi noma nge-epoxy bese efakwa phezu kwawo ukuze kudalwe indawo eyisicaba ye-pad yokunamathisela i-BGA. Unjiniyela obuyela emuva kumele athole izakhiwo ze-via-in-pad (ngokuvamile ezingabonakali ebusweni ngemva kokugcwalisa nokufaka i-plate) ukuze ahlele kahle ukuxhumana kwesendlalelo ngaphansi kwezingxenye ze-BGA.

2.3 Ama-Passives Afakiwe

Amanye amabhodi e-HDI afaka izingxenye ezingasebenzi (ama-resistors efilimu encane, ama-capacitor) ngaphakathi kwe-substrate yebhodi. Lezi zingxenye azibonakali ebusweni futhi zingatholakala kuphela ngokulinganisa kukagesi (ukumelana okungalindelekile noma amandla phakathi kwamaphuzu abonakala exhunywe ngqo ebusweni) noma ukuskena kwe-CT okunesisombululo esiphezulu.

3. Izindlela Zokuthwebula Nokuthwebula Amabhodi E-HDI

3.1 Ukuskena kwe-CT: Ithuluzi Elibalulekile le-HDI

Ukuskena kwe-CT (computed tomography) kuyimpoqo ngempumelelo kubunjiniyela obubuyela emuva be-HDI. I-X-ray ejwayelekile ye-2D ayikwazi ukuxazulula izendlalelo ngazinye ebhodini elinezendlalelo eziyi-12 elinama-microvia — zonke izendlalelo zibekwe ngaphezulu kwesithombe. I-CT idala ivolumu ephelele ye-3D "engasikwa" ekujuleni kwesendlalelo ngasinye, kwembula:

• Amaphethini ethusi kungqimba ngayinye
• Izindawo ze-Microvia kanye nezendlalelo ezithile ezizixhumanisayo
• Izakhiwo ze-Via-in-pad ngaphansi kwezingxenye ze-BGA
• Ukulandelela umzila ezingqimbeni zangaphakathi ezingabonakali kusuka phezulu

Izidingo Zokuxazulula: Ukuskena kwe-CT kwamabhodi e-HDI kudinga osayizi be-voxel abangu-5–15 µm ukuze kuxazululwe iminonjana engu-0.050–0.075 mm. Lokhu kunciphisa indawo ephezulu yebhodi engaskenwa ngesikhathi esisodwa — amabhodi amakhulu angadinga ukuskena okuningi okuhlanganisiwe okuthungwe ndawonye.

3.2 Ukuthwebula Okubonakalayo Okunesisombululo Esiphezulu

Ngemva kokususwa kwengxenye, izendlalelo zangaphandle zithathwa ngesisombululo esiphezulu kusetshenziswa amakhamera e-microscope edijithali (5–10 µm ngephikseli ngayinye). Uhlelo lokuthwebula izithombe kumele luphathe:

• Amaphethini ephedi elinobukhulu obungu-0.050 mm
• Umzila wokulandelela phakathi kwama-BGA pads ezingeni lephethini yomhlaba
• Ukubhaliswa kwemaski yesolder (okubalulekile ekuqinisekiseni ubukhulu bokuvezwa kwephedi)

3.3 Ukwahlukaniswa Okulawulwayo

Ukuqinisekiswa kwe-stackup: ukuhlaziywa kwe-microsection ezindaweni eziningi kuwo wonke amabhodi ukuze kulinganiswe:

• Ubukhulu bebhodi eliphelele kanye nobukhulu besendlalelo ngasinye
• Isisindo sethusi kungqimba ngayinye
• Isilinganiso se-Microvia kanye nekhwalithi ye-plating
• Ukuhlonza izinto ze-dielectric (FR4, izinto ezilahlekelwa kancane njengeMegtron noma i-IS400)

4. Ukwakha Kabusha Izakhiwo ze-HDI: Ama-Microvia, i-Sequential Lamination, kanye ne-Stackup

4.1 Ukwakhiwa Kabusha Kwe-Stackup

Ukuhlanganiswa kwebhodi le-HDI kuyinkimbinkimbi kakhulu kunebhodi elijwayelekile:

• Izendlalelo eziyinhloko (ezibhobozwe ngomshini ngokusebenzisa ama-via) uma kuqhathaniswa nezendlalelo ezakhiwe (ama-microvia abhobozwe nge-laser)
• Ukulandelana kwe-lamination ngokulandelana: yiziphi izendlalelo ezifakwe i-laminate esigabeni ngasinye
• Uhlobo lwezinto ze-dielectric kanye nobukhulu ekushintsheni kwesendlalelo ngasinye (kungahluka phakathi kwezendlalelo eziyinhloko nezendlalelo ezakhiwe)
• Isisindo sethusi kungqimba ngayinye (ngokuvamile sihluke: ithusi elinzima ezingqimbeni zamandla, elilula ezingqimbeni zesignali)

Ukwakhiwa kabusha kwe-stackup okunembile kubalulekile ekubalweni kwe-impedance. Amabhodi e-HDI ngokuvamile ane-controlled-impedance traces (50Ω single-end, 100Ω differential) ezingqimbeni eziningi — ukujiya kwe-dielectric okungalungile ku-stackup specification kuzokhiqiza i-impedance engalungile.

4.2 Iphrothokholi Yokumapha Ama-Microvia

Ukusebenzisa idatha ye-CT scan, yonke i-microvia ihlelwe kumephu:

• Isikhundla se-XY
• Isendlalelo esixhunyiwe (Isendlalelo 1–2? Isendlalelo 2–3? Kuzo zonke izendlalelo?)
• Uhlobo (oluyimpumputhe, olungcwatshwe, olubekwe ndawonye, ​​oluhambahambayo, oludlula)
• Ububanzi bokudonsa
• Ububanzi bephedi kungqimba ngayinye exhunyiwe

Kwibhodi le-HDI eliyinkimbinkimbi, inani lama-microvia lingafinyelela izinkulungwane eziningana — ngalinye lidinga ukwabiwa kwezendlalelo okufanele. Lesi yisici esidla isikhathi kakhulu sobunjiniyela bokubuyela emuva be-HDI.

4.3 Ukwakhiwa Kabusha kwe-BGA Fanout

I-BGA fanout — iphethini yomzila wokulandelela exhumanisa ama-BGA pad kuma-vias nangaphandle kwezendlalelo zomzila wesignali zebhodi — yindawo elinganiselwe kakhulu ngokwejiyometri ebhodini le-HDI. Ku-pitch ye-BGA engu-0.4 mm, ama-trace kumele ahambe phakathi kwama-pad ngesikhala esingu-0.100 mm — eshiya cishe ububanzi bomzila ongu-0.050 mm kanye nesikhala esingu-0.025 mm ohlangothini ngalunye. Lezi zilinganiso kumele zithathwe ngokunemba okuhambisanayo.

5. Ukuhlaziywa Kwezingxenye ze-BGA kanye Nokwakhiwa Kabusha

5.1 Ukunqunywa kweMephu Yebhola

Izingxenye ze-BGA zinokuxhumana kwazo ebusweni obungezansi, okungabonakali lapho ingxenye ifakiwe. Imephu yebhola (yimaphi amabhola axhunyiwe nokuthi yimaphi angaxhumekile) kumele inqunywe kusukela ku:

• Ishidi ledatha lengxenye (uma i-BGA IC ikhonjwe)
• Ukuthwebula izithombe ze-X-ray zengxenye efakiwe (kukhombisa iphethini yebhola kanye nokuxhumeka kwephedi)
• Ukuhlolwa kwephedi ngemva kokususwa (kukhombisa ukuthi yimaphi amaphedi anezinsalela ze-solder ezibonisa amabhola axhunyiwe uma kuqhathaniswa nokuthi yimaphi ahlanzekile abonisa izindawo zokungaxhunywa)

5.2 Ukunemba Kwezinyathelo ze-BGA

Izinyathelo ze-BGA zidinga ukunemba okuphezulu kakhulu kwesimo ekwakhiweni kabusha:

• Isikhala sephedi phakathi nendawo kumele silingane nebhola lengxenye ngaphakathi kuka-±0.025 mm
• Ububanzi bephedi kumele bube bufanele ukwakheka kwejoyinti elinokwethenjelwa (ngokuvamile 0.20–0.35 mm kuma-BGA angu-0.4–0.5 mm)
• Ukuvulwa kwemaski yesolder kumele kuhlinzeke ngokubonakala kwephedi okufanele ngaphandle kokubopha amaphedi aseduze
• Izikhundla ze-Via-in-pad kumele zibe phakathi nendawo ngaphakathi kwe-pad (ama-offset vias anciphisa ivolumu ye-solder kanye nokuthembeka kwamalunga)

6. Ukuqinisekiswa Nokukhiqizwa Kwamabhodi Okufaka Esikhundleni se-HDI

6.1 Ukuqinisekiswa Kwemithetho Yomklamo

Ukwakheka kwe-HDI okwakhiwe kabusha kumele kudlule i-DRC ngokumelene nephrofayili yamandla e-HDI yomkhiqizi oqondiwe:

• Ububanzi obuncane bokulandelela kanye nesikhala (umkhiqizi wemishini yakhe yokubhoboza nge-laser kanye ne-imaging)
• Imikhawulo yesilinganiso se-microvia (ngokuvamile ≤1:1 kuma-microvia e-laser ajwayelekile)
• Kubekwe ngemingcele (inani eliphezulu lezendlalelo ezibekwe ndawonye lincike emandleni okufaka iplati)
• Izidingo zendandatho ehlanganisiwe yama-microvia (aqinile kune-vias yomshini)

6.2 Ukuqinisekiswa Kokuvinjelwa

Kumabhodi e-HDI alawulwayo ane-impedance, ubukhulu be-stackup kanye ne-trace obukhiwe kabusha kumele bukhiqize i-impedance efanele. Lokhu kuqinisekiswa yi:

• Ukubalwa kwesisombululo sensimu ye-2D kusetshenziswa i-stackup eyakhiwe kabusha
• Ukulinganiswa kwe-TDR (i-time-domain reflectometry) ku-prototype eyenziwe
• Ukuqhathanisa phakathi kwe-impedance ebaliwe nelinganisiwe (ukubekezelelana okuvamile: ± 10%)

6.3 Okucatshangwayo Ngokukhiqiza

Amabhodi e-HDI adinga ikhono lokukhiqiza elikhethekile — akuwona wonke umenzi we-PCB ongawakhiqiza:

• Imishini yokubhoboza nge-laser yama-microvia
• Amandla okubopha ngokulingana
• Izithombe ezibhalisiwe kakhulu zokulandelela ama-fine-pitch
• Ngokugcwalisa kanye nokuhlelwa kwe-via-in-pad

Ukukhethwa kwesikhungo sokukhiqiza kumele kuhambisane nezidingo zobuchwepheshe zebhodi — ukuzama ukukhiqiza umklamo we-HDI esitolo esinamakhono ajwayelekile kuzoholela ekwahlulekeni kokukhiqiza nezinkinga zekhwalithi.

7. Izinsizakalo Zobunjiniyela Ezibuyela Emuva ze-HDI PCB ze-Highleap kanye Nokuhambisana Nemithetho ye-IP

I-Highleap Electronics inikeza ubunjiniyela obuhlukile be-HDI obunobuchwepheshe bokuthwebula izithombe, ubuchwepheshe bobunjiniyela, kanye nekhono lokukhiqiza elidingekayo kumabhodi anabantu abaningi:

• Ikhono lokuskena nge-CT: Ukwakhiwa kabusha kwebhodi eliphelele le-3D kusisombululo esingu-5–15 µm sokuthola imephu ye-microvia kanye nokuthwebula ungqimba lwangaphakathi
• Ubuchwepheshe bokuhlela i-HDI: Onjiniyela abanolwazi nge-sequential lamination stackups, i-microvia routing, kanye Imithetho yokuklama i-HDI
• Ukwakhiwa kabusha kwe-BGA okune-pitch encane: Ukunemba kwephedi engu-±0.025 mm kwezingxenye ze-BGA zephimbo elingu-0.3–0.5 mm ezine-via-in-pad
• Ukwakhiwa kabusha okulawulwa yi-impedance: Imininingwane ye-stackup enezibalo ze-impedance eziqinisekiswe yi-TDR kuma-prototypes akhiwe
• Ukukhiqizwa kwe-HDI: Ngaphakathi Ukwenziwa nokuhlanganiswa kwe-HDI ngokubhoboza nge-laser, i-lamination elandelanayo, kanye nekhono lokugcwalisa nge-via-fill
• Qedela ukuqinisekiswa: i-DRC, ukuqinisekiswa kwe-impedance, ukuhlolwa kukagesi, Ukuhlolwa kwe-X-ray yokuhlanganiswa kwe-BGA, kanye nokuqinisekiswa kokusebenza

Ukuzibandakanya Okuvamile

• Ukuvikela kanye ne-aerospace: Amabhodi okufaka esikhundleni sezinhlelo ze-avionics ezindala kanye ne-radar lapho ukukhiqizwa kwe-OEM kuphelile khona kanye nezinhlelo ze-DMSMS (Diminishing Manufacturing Sources and Material Shortages) zidinga ukulingana nomsebenzi.
• Imishini yezokwelapha: Amabhodi e-HDI asele ezinhlelo zokuthwebula izithombe, iziqaphi zeziguli, kanye namathuluzi okuxilonga okumele aqhubeke esebenza ngale kwezikhathi zokuqala zokusekela
• Ingqalasizinda yezimboni: Amabhodi okulawula emigqa yokukhiqiza, izinhlelo zikagesi, kanye nemishini yokuxhumana ngocingo enamathemba okuphila iminyaka engaphezu kwengu-20
• Ukuhlaziywa kokwehluleka: Uphenyo lwembangela oludinga ukwakhiwa kabusha okuphelele kwesakhiwo ukuze kutholakale amaphutha okuklama noma okukhiqiza kuma-HDI ahlanganisiwe ahlulekile ensimini

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