Izinto ze-PCB ze-Isola I-Speed ​​​​zemibuthano Yesivinini Esiphezulu

Njengoba izakhiwo zeseva zikhula ukuze zisekele i-PCIe Gen 5 kanye namanethiwekhi okuxhumana adlula i-400G Ethernet, onjiniyela behadiwe babhekene nesabelomali esiqinile sobuqotho besiginali. Ama-laminate ajwayelekile e-FR-4 aletha ukulahlekelwa okungamukeleki kokufakwa, okubangela ukuthi imidwebo yamehlo yedijithali iwele eziteshini ezinde zomzila. Ukuze kulondolozwe ukucaca kwesiginali ngaphandle kokudonsa izindleko ezinkulu zezinto ze-PTFE (Teflon), ikhambi elijwayelekile lemboni yi-Isola I-Speed.

Kodwa-ke, ukukhetha i-laminate yedijithali eshesha kakhulu kuyisigamu sempi. Inselele yangempela isekusetshenzisweni kwefektri. Ama-backplane eseva anezingqimba eziphakeme adinga ukubhaliswa komshini okungenaphutha, ukulawulwa kwe-impedance okunembile, kanye namasu okubhoboza athuthukile ukuvimbela ama-short circuits angaphakathi. Njengomkhiqizi we-PCB we-China Isola I-Speed ​​okhethekile , i-Highleap Electronics iklame lo mhlahlandlela wezobuchwepheshe ukukusiza uqonde izakhiwo zezinto, abashayeli bangempela bezindleko zokukhiqiza, kanye nendlela yokuguqula ngempumelelo umklamo wakho wesivinini esikhulu ube ukukhiqizwa okukhulu.

Cela Isilinganiso Sokwenziwa Kwe-Isola I-Speed

Ishidi Ledatha Le-Isola I-Speed: Izakhiwo Zezinto Eziyinhloko

Lapho onjiniyela behlola i-PCB yesivinini esiphezulu ye-Isola I-Speed ​​​​eyenziwe ngokwezifiso, bafuna i-substrate ehlanganisa igebe phakathi kwe-epoxy yendabuko nama-RF laminates abizayo. I-Isola I-Speed ​​isebenzisa uhlelo lwe-resin olune-low-loss oluhlanganisiwe nezitayela zeglasi ezithuthukisiwe (njenge-spread glass) ukunciphisa "umphumela we-fiber weave" nokunciphisa i-timing skew kuma-differential pairs.

Amapharamitha edatha abalulekile anquma ubuqotho besiginali afaka:

• I-Dielectric Constant (Dk): Isibaya 3.30 (ku-10 GHz). Le-Dk ephansi ivumela amasignali ukuthi asakazeke ngokushesha futhi inciphise umthwalo we-capacitive kuma-traces anesivinini esikhulu.
• I-Disipation Factor (Df): Okuphansi kakhulu 0.0071 (ku-10 GHz)Lokhu kunciphisa kakhulu ukuncishiswa kwesignali (ukulahlekelwa kokufakwa) kuzo zonke iziteshi zomzila ezinde ze-backplane.
• I-Thermal Robustness: Njengoba i-Glass Transition Temperature (Tg) ingu-180°C kanye ne-Decomposition Temperature (Td) ingu-360°C, ibhodi lesekethe le-Isola I-Speed ​​​​limelana nemijikelezo eminingi ye-SMT engenalo i-lead kanye namazinga okushisa aphezulu okusebenza kuma-server racks aminyene ngaphandle kokuhlukanisa.

Izindleko Zokukhiqiza Ekwenziweni Kwebhodi Le-I-Speed ​​​​Multilayer

Kumaqembu okuthenga, isici esikhanga kakhulu se-Isola I-Speed ​​akukona nje ukusebenza kwayo kagesi, kodwa nokusebenziseka kwayo kwe-FR-4. Ngokungafani namabhodi e-PTFE (Teflon) asebenzisa imvamisa ephezulu adinga ukugqwala i-sodium okuyingozi noma imijikelezo ye-vacuum plasma desmear ebizayo, i-I-Speed ​​ingasuswa futhi ibekwe nge-plated kusetshenziswa imigqa ejwayelekile ye-alkaline permanganate chemistry.

Inzuzo ye-Hybrid Stackup

Ukuze bathuthukise kakhulu isilinganiso sakho sokwenziwa kwe-Isola I-Speed ​​PCB , abaklami abanolwazi abavamile ukusebenzisa le nto ethuthukisiwe kuzo zonke izingqimba zebhodi leseva elinezingqimba ezingu-24. Kunalokho, baklama ama-stackup ahlanganisiwe.

• Ngenxa yokuthi uhlelo lwe-resin lwe-I-Speed ​​luhlanganyela i-kinetics yokwelapha ehambisanayo kanye namazinga okushisa okucindezela ane-Tg FR-4 ejwayelekile (njenge-Isola 370HR), zingahlanganiswa ngomjikelezo ofanayo wokucindezela we-lamination.
• Sibeka njalo i-I-Speed ​​ezingqimbeni zangaphakathi ezibalulekile neziqondile ze-PCIe Gen 5 routing, kuyilapho sisebenzisa i-370HR eshibhile yezendlalelo zamandla, zomhlabathi, kanye ne-digital logic ehamba kancane. Lokhu kunciphisa izindleko zezinto ngenkathi kugcinwa iphaneli eliyisicaba ngokuphelele lingenazo i-warpage engalingani.

Ukuvimbela Ukwehluleka kwe-CAF kuma-Backplanes Aphezulu

Njengoba imishini yokuxhumana incipha, i-pitch (ibanga eliphakathi kwemigodi ebholiwe) iba lukhuni kakhulu. Emabhodini eseva anezinga eliphezulu asebenza ngaphansi kwe-voltage bias eqhubekayo, usongo olukhulu lokuthembeka ukwehluleka kwe -Conductive Anodic Filament (CAF) . I-CAF yenzeka lapho ama-ion ethusi ehamba ngezintambo ze-glass fiber phakathi kwama-vias amabili asondelene, okubangela i-short circuit yangaphakathi engabonakali.

Inkinga Yokubhoboza Kwemishini

Nakuba i-resin ye-I-Speed ​​​​yakhiwe ngamakhemikhali ukuze imelane kakhulu ne-CAF, imishini engafanele efektri ingalimaza lesi sivikelo. Uma ifektri ye-PCB yeseva ye-Isola I-Speed ​​engenalwazi isebenzisa ama-drill bits angabonakali noma isivinini sokuphonsa esingalungile (umthwalo we-chip) ngesikhathi sokwenziwa kwebhodi le-I-Speed ​​​​multilayer, ukulimala okubuthuntu komshini kuzophula imicu yengilazi ezungeze udonga. Lokhu kuqhekeka okuncane kakhulu kudala iziteshi ze-capillary ezingenalutho ukuze ama-ion ethusi adlule kuzo.

Isixazululo Sokukhiqiza se-Highleap

Ukuze siqinisekise ukuthembeka okuphelele kwe-CAF, siphoqelela izinqubo eziqinile zokubhoboza ngomshini. Sinciphisa kakhulu umkhawulo "wokushaya" wama-bits ethu okubhoboza e-CNC—siwalahle ngaphambi kwesikhathi kunemingcele ejwayelekile ye-FR-4 ukuqinisekisa ukusika okubukhali njenge-razor. Ngokwenza ngcono ama-RPM e-spindle nokusebenzisa amasu okubhoboza ngezinyathelo ukuze kube nezilinganiso eziphezulu, sigunda kahle izitayela zengilazi ezithuthukisiwe kunokuzidabula, sigcina ubuqotho bomgoqo we-dielectric.

Ukubekezelelana Kokulandelela Kokujika Okusheshayo I-Isola I-Speed ​​PCB Prototype

I-Time-to-market iyona eyinhloko embonini yezokuxhumana. Uma ucela i- prototype ye-Isola I-Speed ​​PCB esheshayo ukuqinisekisa ukulingisa kwakho kwe-Signal Integrity (SI), kubalulekile ukunikeza izidingo eziphelele ze-stackup kanye ne-impedance kusenesikhathi.

Ngaphambi kokuqalisa ukwenziwa, onjiniyela bethu be-CAM bazokwenza ukuhlolwa okuqinile kwe-Design for Manufacturability (DFM). Sisebenzisa ama-impedance calculators athuthukisiwe (njenge-Polar Instruments) ukuze sibheke ububanzi be-trace yakho kanye nesikhala se-dielectric ngokumelene namakhono ethu okuchoboza ngokomzimba. Uma kudingeka ukulungiswa ukuze kufinyelelwe imigomo yakho yomehluko engu-50-ohm eyodwa noma engu-100-ohm, sihlinzeka ngombiko we-stackup oguquliwe ukuze uwuvume ngaphambi kokukhiqiza.

Umhlangano we-Turnkey SMT wamaBhodi E-Telecom Asheshayo

I-backplane yedijithali esheshayo iyinkimbinkimbi kakhulu, ivame ukuba nezindiza zethusi ezisindayo, izinkulungwane zama-pad e-BGA, kanye nobunzima obukhulu bokushisa. Ukuthembela ekwakhiweni kwebhodi elingenalutho kumthengisi oyedwa kanye nokuhlanganiswa kwezingxenye kumuntu wesithathu kuletha izingozi ezinkulu zokufaka iphrofayili yokushisa ngesikhathi sesigaba sokugoqa.

Ukusebenza nomhlinzeki we-Isola I-Speed ​​​​backplane PCB ozinikele kanye nomenzi we-Isola high speed PCB kususa izindawo ezingabonakali. Sishintsha kalula iphrojekthi yakho kusuka emigqeni yethu yebhodi engenalutho ethuthukisiwe iye ngqo esikhungweni sethu sokukhiqiza se-PCBA esinembile.

Ukuqinisekisa ukuthi amabhodi eseva amakhulu, asindayo amunca ukushisa ngokulinganayo ngesikhathi sokugeleza kabusha kwe-SMT ngaphandle kokugoba, onjiniyela bethu bezinqubo bathuthukisa amaphrofayili okushisa enziwe ngokwezifiso kakhulu. Ngokusebenzisa ubuchwepheshe be-3D Automated Optical Inspection (AOI) kanye ne-X-Ray (AXI), siqinisekisa yonke ijoyinti ye-solder ye-BGA efihliwe, siqinisekisa ukuthi amaswishi akho e-400G kanye nama-router esikhungo sedatha asebenza kahle ensimini. Hlola ukukhetha kwethu okubanzi kwezinto ze-PCB laminate noma xhumana nethimba lethu lobunjiniyela namuhla ukuze uqalise iphrojekthi yakho yesivinini esikhulu.