Ukukhiqiza i-CLTE XT PCB

Ukukhiqizwa kwe-CLTE XT PCB kuwusizo kakhulu lapho umklamo udinga ukwakhiwa kwe-hybrid ephansi ye-CTE futhi izendlalelo azikwazi ukubhekwa njengamabhodi azimele. I-stackup kufanele ibhekele ukubhanqa kwezinto, ukubhaliswa kanye nokwandiswa kokushisa ngaphambi kokuba umzila wokukhiqiza ulungiswe. Ukukhiqizwa kwe-Rogers CLTE-XT PCB kusetshenziswa lapho ibhodi le-RF lidinga ukukhuliswa kokushisa okuphansi, ukuziphatha okuqinile, kanye nokwakhiwa kwe-stackup ye-hybrid okuthembekile. Ngokungafani ne-callout ye-laminate enenani elilodwa, i-CLTE-XT kumele ichazwe ngokujiya okuqondile kanye nokwakhiwa kwethusi ngoba i-Dk esebenzayo incike ekwakhiweni okukhethiwe. I-Highleap Electronics ibuyekeza ukujiya kwezinto, ithusi, ukuguquka kwe-hybrid, ukubhoboza, ukubopha, ukuqeda, kanye nokuvezwa komhlangano ngaphambi kokukhiqizwa.

Okuqukethwe

1. Uma i-CLTE-XT iyi-PCB Material efanele
2. I-CLTE-XT Kufanele Icashunwe Njenge-Hybrid Reliability Stackup
3. Izakhiwo Zezinto Ezithinta Ukukhiqizwa
4. Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna
5. Izilawuli Zenqubo Yokukhiqiza
6. Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

Ububanzi bezinto ezibonakalayo: I-Highleap Electronics ikhiqiza futhi ihlanganise i-PCB eqediwe. Ibanga likaRogers elishiwo kuleli khasi likhomba i-laminate echaziwe; i-Highleap ayikhiqizi noma ayithengisi ama-laminate kaRogers.

Uma i-CLTE-XT iyi-PCB Material efanele

I-CLTE-XT isetshenziswa lapho ibhodi le-RF lidinga ukunwetshwa okuphansi kokushisa, ukuzinza kobukhulu, kanye nokuziphatha okuthembekile kuma-stackups e-hybrid. Ivame ukucatshangelwa ama-antenna, ama-electronics e-aerospace, amamojula e-RF, kanye namabhodi asekelwe ngensimbi noma axubile lapho ukungafani kokunwetshwa kungathinta ukubhaliswa, imigodi eboshwe, kanye nokuthembeka kwesikhathi eside. Uma i-TMM nayo icatshangelwa ukusetshenziswa, ukuhlolwa kokuqina kwezinga lokushisa kwamabhodi e-TMM kunikeza ukuhlolwa okuhlukile kokuziphatha kwe-Dk drift kanye nemigodi eboshwe.

Izinto kufanele zikhethwe kucatshangelwa ukunqwabelana okugcwele. I-CLTE-XT ingahlanganiswa ne-FR-4, amanye ama-RF laminates, ama-prepregs, ama-metal carriers, noma izendlalelo zokulawula zedijithali, ngakho-ke ukulingana kwe-lamination, ibhalansi yethusi, ngesakhiwo, kanye nokuvezwa kokushisa kwenhlangano kudingeka kubuyekezwe ndawonye.

I-CLTE-XT Kufanele Icashunwe Njenge-Hybrid Reliability Stackup

Iphutha elivamile nge-CLTE-XT ukuyiphatha njengegama elilula lezinto ezibonakalayo. Ekwakhiweni kwangempela, umbuzo obalulekile ukuthi ungqimba lwe-CLTE-XT lusebenzisana kanjani ne-FR-4, amanye ama-RF laminates, i-prepreg, izinsimbi zensimbi, noma izingxenye zokulawula zedijithali. I-CTE ephansi isiza ukuzinza kobukhulu, kodwa izinguquko ze-lamination zisengaletha izinkinga zokubhalisa, ukugeleza kwe-resin, kanye ne-via-stress uma i-stackup ingabuyekezwa kusenesikhathi.

Isihloko esifanele ukunakwa kakhulu ukuthembeka kwe-hybrid. I-Highleap ihlola ukungalingani kwe-CTE, ukulingana kwezendlalelo, ibhalansi yethusi, ukubhaliswa kokubhoboza, isakhiwo semigodi ehlanganisiwe, ukuvezwa kokugeleza kabusha, kanye nanoma yisiphi isidingo sokujikeleza kokushisa. I-hybrid stackup ingahluleka ngoba izinto zamukelekile ngazinye kodwa zihlanganiswe kabi, ikakhulukazi lapho izendlalelo ze-RF, izendlalelo zokulawula zedijithali, kanye nezinto zokulungisa konke kudonsa umklamo ngezindlela ezahlukene.

Uma ibhodi lizohlanganiswa, iphrofayili ye-solder kanye nesisindo sokushisa sengxenye kufanele kubuyekezwe nge-stackup yebhodi elingenalutho esikhundleni sokwenziwa ngemva kokwenziwa. Izihlangu ze-RF ezisindayo, izixhumi, izithwali zensimbi, noma izisakazo zokushisa zingashintsha ukuvezwa kokushisa kwezimbobo ezifakwe amapulangwe kanye nezixhumi ze-laminate. Ngakho-ke i-RFQ kufanele ichaze indawo yokuhlangana, hhayi ibhodi elingenalutho kuphela.

• Chaza i-hybrid stackup ephelele, okuhlanganisa i-FR-4 noma ezinye izinto ze-RF ezisetshenziswa ne-CLTE-XT.
• Buyekeza ukungalingani kwe-CTE, ibhalansi yethusi, kanye nokuthembeka kwemigodi ehlanganisiwe ngaphambi kokusebenzisa amathuluzi.
• Faka ukuvezwa kokushisa komhlangano lapho umkhiqizo wokugcina unezivikelo, izithwali, noma izixhumi ezisindayo.

Izakhiwo ze-Low-CTE kanye ne-Hybrid-Stackup ezithinta ukukhiqizwa

Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna

Isilinganiso esithembekile siqala ngesethi ephelele ye-Gerber, amafayela okubhoboza, uhlu lwe-net, uhlaka lwebhodi, umdwebo we-stackup, i-callout yezinto zokwakha, isisindo sethusi, ukuqeda kobuso , amanothi emaski e-solder, ama-impedance target, kanye nanoma yiziphi izidingo zokuhlanganisa. I-Highleap ihlola ukuthi umklamo ungenziwa ngokuphindaphindiwe yini ngaphambi kokuqala kwamathuluzi.

Izilawuli Zenqubo Yokukhiqiza

Indlela yenqubo kufanele ikhethwe ngaphambi kokuba izinto zikhishwe ukuze zikhiqizwe. Izilawuli ezijwayelekile zifaka phakathi ukuqinisekiswa kwezinto, ukuhlolwa kwesendlalelo sangaphakathi, ukubuyekezwa kwe-lamination, ikhwalithi yokubhoboza, ukulungiswa kwemigodi odongeni, i-copper plating, ukubhaliswa kwemaski ye-solder, ukuqeda ubuso, ukunemba komzila, ukuhlolwa kukagesi, kanye nokuhlolwa kokugcina. Ngesikhathi sokubuyekezwa kwe-lamination, i-Highleap ihlola ukuthi izinto ezihlanganisiwe zibhangqwe kanjani, ukuthi ubukhulu bakhiwa kanjani nge-stack nokuthi ingozi yokubhalisa igxilile kuphi. Ukuguquguquka okubalulekile kokukhiqiza yi-geometry yezingqimba eziningi eziqediwe, hhayi idatha ye-laminate ngayinye. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa.

Ukukhiqiza okuphindaphindiwe kufanele kusebenzise ukubhanqa kwezinto ezivunyiwe, ukwakhiwa kokucindezela, ifomethi yephaneli kanye nezilawuli zokubhalisa njengesisekelo. Ukushintshana kwezinto noma ukulinganisela kabusha kwe-stackup kungashintsha ukugeleza kwe-resin, ukujiya okuqediwe kanye nokubhaliswa kwezingqimba ngisho noma izinto ngazinye zibonakala zilingana ephepheni.

Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

I-CLTE-XT ifanela ama-antenna e-phased-array, amamojula e-RF, ama-electronics e-aerospace, amabhodi e-hybrid RF-digital, ihadiwe yokuxhumana, kanye nezinhlangano lapho ukujikeleza kwe-thermal kungaguqula khona i-impedance noma imigodi eboshwe ngengcindezi. Kuhlelo lwe-aerospace oluchazwe nge-TMM, imibhalo yezemvelo yamabhodi e-aerospace RF kufanele ichaze iphrofayili yeziqu kanye nobubanzi bokulandelela ngokuhlukile ekuqhathanisweni kwezinto.

Thumela amafayela e-Gerber, idatha yokubhoboza, umdwebo we-stackup, ukujiya kwe-CLTE-XT, ukumbozwa kwethusi, ama-impedance target, imininingwane yezinto ezihlanganisiwe, iphrofayili yokuhlanganiswa, izidingo zokuhlola, ubuningi, kanye nezidingo zokulethwa.

Kokwakhiwa kwe-CLTE-XT hybrid, ubufakazi obuwusizo buhlanganisa amarekhodi e-stackup kanye nezinto ezibonakalayo, ukuhlolwa kobukhulu besihloko sokuqala, ukuhlolwa kwe-lamination/ukubhaliswa kanye nanoma yimiphi imiphumela yokuhlola ukushisa noma ukuthembeka edingwa uhlelo. Imibhalo kufanele ibonise ukwakhiwa kwe-hybrid yangempela okwakufanelekile. Nge-RFQ, nikeza i-stackup ephelele ye-hybrid, ukujiya okuqediwe, ithusi, izidingo zokulungiswa kwezingqimba kanye nezimo zokufaneleka kokushisa. Ngalolo lwazi, umenzi angabeka inani lomsebenzi we-lamination wangempela kanye nomsebenzi wokubhalisa esikhundleni senqubo ejwayelekile ye-multilayer.