Ukukhiqiza i-RO4360G2 PCB Prototype

Uma unjiniyela ama-front-ends e-RF, ama-antenna amakhulu e-MIMO, kanye nehadiwe yesiteshi sesisekelo se-5G, ukunciphisa ukulahleka kwesiginali ngenkathi kunciphisa umthelela obonakalayo kuyinhloso yokuklama. Ukufeza lokhu kuvame ukuphoqa ukukhetha: sebenzisa izinto ze-PTFE (PTFE) ezine-Dk ephezulu bese ubhekana nenqubo yazo yokukhiqiza ebizayo neyinkimbinkimbi, noma sebenzisa i-FR-4 ejwayelekile bese udela ukusebenza kwe-microwave. Uma umklamo wamandla uhlolwa kabusha nge-TC350, Ukukhiqizwa kwe-TC350 kwehadiwe yamandla e-RF kufanele ibhekane kokubili ukugeleza kokushisa kanye ne-geometry ye-RF ebuyekeziwe.

I-Rogers RO4360G2 yaklanywa ngqo ukuze kuqedwe lokhu kwehluleka. Njenge-thermoset laminate egcwele i-hydrocarbon ceramic, inikeza i-Dielectric Constant ephezulu ngokungavamile (Dk ka-6.15) kodwa icutshungulwa ngendlela efanayo ne-FR-4 ejwayelekile. Kumaqembu afuna ukwakha i-Rogers RO4360G2 5G PCB ethembekile, lokhu kwaziswa kunikeza ukuzinza kukagesi kwebhodi lesifunda eliphrintiwe eliphindaphindwayo ngaphandle kwezithiyo ezinzima zesikhathi sokuhola ezihambisana nokucutshungulwa kwe-PTFE yendabuko.

Cela Isilinganiso Sobunjiniyela be-RO4360G2

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Kungani Ukhethe i-Dk 6.15 ye-5G Miniaturization?

Ekuklanyweni kwemvamisa yomsakazo, usayizi obonakalayo wesekethe ye-resonant (njenge-patch antenna array noma i-power divider) ulingana ngokuphambene nomsuka wesikwele we-dielectric constant ye-substrate.

Ngokushintsha kusuka ezintweni ezijwayelekile ze-Dk 3.5 RF kuya ku-RO4360G2's Dk engu-6.15, onjiniyela behadiwe banganciphisa ubukhulu obubonakalayo bezakhiwo zabo ze-RF cishe ngo-20% kuya ku-30%. Lokhu kucindezelwa kwesikhala kubaluleke kakhulu kumayunithi e-antenna asebenzayo agcwele kakhulu (ama-AAU). Ngaphezu kwalokho, izinto zigcina i-Dissipation Factor ephansi kakhulu (i-Df = 0.0038 ku-10 GHz), okuqinisekisa ukuthi izindlela zesignali eziqondiswe ngokuqinile azihlushwa ukulahlekelwa okukhulu kokufakwa.

Imininingwane ye-Thermomechanical Eyinhloko

Ukusebenza kukagesi akusho lutho uma ibhodi lihluleka ngesikhathi sokushiswa noma ukufakelwa kwensimu. I-RO4360G2 igcwele kakhulu i-ceramic, okwenza ibe nokuqina okuphawulekayo kobukhulu uma kuqhathaniswa nama-laminate ajwayelekile engilazi elukiwe.

Ukucwila Okujulile: Ukudlula Ukuncipha Kwe-Plasma Ekwenziweni

Uma ubuza noma yimuphi unjiniyela we-CAM ukuthi yini ebambezela ukukhiqizwa kwebhodi le-microwave, impendulo ithi “PTFE ngokulungiselela.” Lapho i-CNC drill bit inqamula i-PTFE, ukushisa okukhuhlanayo kubangela ukuthi izinto zigcwale izingqimba zethusi zangaphakathi. Ukususa le smear kudinga izinto ezinobuthi kakhulu ze-sodium etchants noma ukubhodlela umugqa wokukhiqiza ngokufaka amaphaneli egumbini le-plasma elingenalutho.

Ngenxa yokuthi i-RO4360G2 iyi-thermoset ye-hydrocarbon eqiniswe ngengilazi, ayincibiliki futhi ayishisi njenge-PTFE.

Ifektri ye-Rogers RO4360G2 PCB enekhono elisheshayo ingabhoboza, isuse, futhi ifake amabhodi lawa mabhodi isebenzisa imigqa efanayo ye-chemistry ejwayelekile esetshenziswa ku-FR-4 ejwayelekile. Lokhu "kucutshungulwa kwe-FR-4" kuyimpahla efihliwe kakhulu yezinto ezibonakalayo. Inciphisa kakhulu izikhathi zokuhola zokukhiqiza futhi yehlisa ngqo intengo ye-prototype ye-Rogers RO4360G2 PCB iyonke, ivumela amaqembu e-R&D ukuthi asheshe ngenkathi egcina ukubekezelelana kwe-RF okuqinile.

Ukulawula i-Warpage kuma-Hybrid RF Stackups

Ukuze kuthuthukiswe isabelomali sephrojekthi, akuvamile kakhulu ukusebenzisa i-RO4360G2 kuzo zonke izendlalelo zebhodi lezokuxhumana eliyinkimbinkimbi. Esikhundleni salokho, abaklami bakha ama-hybrid stackups—bebeka izinto zeRogers ezingqimbeni 1 no-2 zokuhambisa i-microwave, kuyilapho besebenzisa i-High-Tg FR-4 engabizi kakhulu (njenge-Isola 370HR) ezingqimbeni zamandla angaphakathi, zomhlabathi, kanye ne-digital logic.

Kodwa-ke, ukuhlanganisa i-hydrocarbon egcwele i-ceramic nge-epoxy FR-4 kuletha ingozi enkulu yomshini: I-Asymmetric Warpage (Umphumela We-Potato-Chip).

Izinhlelo ezahlukene ze-resin zinezinga lokushisa elihlukile le-Glass Transition (Tg) futhi ziyancibilikisa ukuqina. Uma umjikelezo wokucindezela ukhuphuka ngokushesha kakhulu, i-FR-4 prepreg ingase igeleze kuyilapho i-Rogers prepreg ihlala iqinile. Lapho ibhodi iphola, amazinga okufinyela okushisa ahlukene azokwenza iphaneli igobe ngamandla. Njengomkhiqizi we-PCB we-China Rogers RO4360G2 onolwazi, i-Highleap Electronics ivimbela lokhu ngokusebenzisa i-press padding engalingani kanye nezindlela zokupheka ze-thermal ramp ezenziwe ngokwezifiso kakhulu, ukuqinisekisa ukuthi ukwenziwa kwebhodi elingenalutho elinezingqimba eziningi kuphumela kumaphaneli ayisicaba alungele ukuhlanganiswa.

Ukubambisana nomhlinzeki we-Turnkey RO4360G2

Ukuthola umkhiqizo othembekile we-sub-6 GHz noma i-mmWave kuyinqubo enezinyathelo ezimbili: ukwenziwa ngokunemba okulandelwa ukufakwa kwezingxenye okungenaphutha. Noma yiziphi izimbobo ze-solder ngaphansi kwephedi ye-RF amplifier enamandla aphezulu zingasusa isekethe futhi zibangele ukushisa ngokweqile okukhulu.

Sincoma kakhulu ukugcina zombili izigaba ngaphansi kophahla olulodwa ukuvimbela ukuxhumana okungekuhle komhlinzeki. Uma ufuna umhlinzeki we-PCB olahlekelwa kancane we-Rogers RO4360G2, qiniseka ukuthi unamandla okuqinisekisa ibhodi elingenalutho kanye namajoyinti okugcina e-solder. Kwa-Highleap Electronics, insizakalo yethu ephelele yokwenziwa kwe-PCB ye-Rogers RO4360G2 ihlangana ngokulawula nemigqa yethu yokukhiqiza ye-PCBA ethuthukisiwe . Sisebenzisa ukuhlolwa kwe-3D X-Ray (AXI) ukuqinisekisa ukumbozwa kokushisa ngokumelene nohlelo lokuhlola kanye nokubekwa okuqondile kwengxenye ye-RF.

Kungakhathaliseki ukuthi udinga i-prototype esheshayo ye-array entsha ehlukaniswe ngezigaba noma ukukhiqizwa kwevolumu kwengqalasizinda ye-5G, ithimba lethu lobunjiniyela likulungele ukubuyekeza amafayela akho e-Gerber kanye nezidingo ze-stackup.