Ukukhiqizwa kwe-TMM High Frequency PCB

Ukukhiqizwa kwe-TMM high-frequency PCB kusebenzisa ukwakhiwa kwe-TMM okucacisiwe kumabhodi wesekethe e-RF, i-microwave kanye nokwethenjwa okuphezulu. Ubukhulu be-dielectric obuqediwe, i-geometry yethusi, ukubhoboza, ukubhaliswa kanye nohlelo lokuqinisekisa i-impedance kumele kuhambisane nomklamo we-RF. Ukukhethwa kwebanga kusabalulekile ngoba i-dielectric constant, i-dissipation factor, ubukhulu be-laminate, iphrofayili yethusi kanye nokulingana kwe-stackup konke kuthinta isekethe esiqediwe.

Lo mhlahlandlela uchaza indlela yokukhetha phakathi kweRogers TMM3, TMM4, TMM6, TMM10, TMM10i kanye ne-TMM13i; ukuthi izakhiwo zezinto zithinta kanjani i-PCB yangempela; okufanele kucatshangelwe kuma-microstrip, stripline kanye nama-hybrid stackups; nokuthi yiluphi ulwazi okufanele lufakwe lapho ucela ikhotheshini ye-Rogers TMM PCB. Uma uhlola i-TMM yezihlungi, ama-couplers, ama-antenna, amamojula e-radar, amabhodi okuxhumana ngesathelayithi, ama-power amplifiers noma ama-precision microwave assemblies, leli khasi libhalelwe ukukusiza wenze isinqumo sobunjiniyela kanye nokukhiqiza esisebenzayo.

Lo mhlahlandlela uchaza izilawuli zokukhiqiza ezivamile kumabhodi e-TMM avame kakhulu, okuhlanganisa ukukhishwa kwe-stackup, incazelo yethusi, ukubhoboza, ukubhaliswa kanye nokuqinisekiswa kwe-impedance. Izidingo eziqondene nebanga kanye nezinhlelo zokusebenza kufanele zibuyekezwe ngokuqhathanisa nomklamo okhishwe.

Ububanzi Bokukhiqiza be-PCB Ejwayelekile Ephezulu ye-TMM

I-Rogers TMM high-frequency PCB isebenzisa i-Rogers TMM thermoset microwave laminate njengesendlalelo se-RF dielectric. Ama-TMM laminates ayizinhlanganisela ze-thermoset polymer ezigcwele i-ceramic ezenzelwe amasekethe e-microstrip kanye ne-stripline microwave, ngakho-ke ingxoxo yezinto ezibonakalayo lapha kufanele ifundwe kanye nezidingo zomklamo we-Rogers TMM RF PCB ezifana ne-impedance elawulwayo, izindiza zokubhekisela kanye noshintsho lwe-RF. Ebhodini eliqediwe, le laminate ayiyona nje kuphela ithwali yemishini yemikhondo yethusi; iyingxenye yomklamo kagesi. I-dielectric constant yayo ilawula i-trace impedance, ubude bukagesi, imvamisa ye-resonant kanye ne-wavelength ngaphakathi kwebhodi. Isici sayo sokuhlakazeka sinikeza isandla ekulahlekelweni kwe-dielectric. Ukubekezelela kwayo ukujiya, ukunamathela kwethusi, ukuzinza kobukhulu kanye nokwanda kokushisa kuthinta ukuthi i-PCB eyenziwe ihambisana kanjani nokulingisa; ngemiklamo lapho i-Dk drift kanye ne-thermal cycling kuyizinto ezibaluleke kakhulu, bheka umhlahlandlela ohlobene mayelana nokuziphatha kwe-Rogers TMM temperature-stable PCB.

Igama elithi “TMM” livame ukuseshwa njengokungathi liyinto eyodwa, kodwa empeleni liwumndeni wama-laminate. Lo mndeni uhlanganisa ama-dielectric constant aphansi kuya kwaphezulu, kusukela ku-TMM3 ekugcineni kwe-Dk ephansi kuya ku-TMM13i ekugcineni kwe-Dk ephezulu. Lokhu kuvumela onjiniyela ukuthi bakhethe i-laminate ngokusekelwe kusayizi wesekethe, i-bandwidth, isabelomali sokulahlekelwa, izinga lamandla, ukuthembeka komshini kanye nezindleko. I-Broadband Rogers TMM antenna PCB feed ingadinga impahla ye-DK TMM ephansi ukuze igcine ubukhulu bomkhondo bukhiqizwa futhi ukusabalala kuphansi. Isihlungi esihlangene, i-coupler noma ukushintshwa kwe-ceramic-substrate kungadinga i-TMM10, i-TMM10i noma i-TMM13i ukunciphisa usayizi wesekethe nokusekela ukuziphatha kwe-Dk elawulwayo.

Empeleni, i-Rogers TMM PCB ikhethwa lapho umklamo udinga ukuphindaphindwa kukagesi okwengeziwe kanye nokuqina kwe-microwave kunalokho okunganikezwa yi-FR4, kodwa futhi idinga ukuziphatha okungcono kwemishini kanye nenqubo kunezinto eziningi ezithambile ezisekelwe ku-PTFE. I-TMM iyisistimu ye-thermoset, ngakho imelana nokugeleza okuhambayo nokubanda kangcono kune-PTFE. Ayidingi futhi ukwelashwa kwe-sodium naphthenate ngaphambi kokufakwa kwe-electroless ekwakhiweni okujwayelekile kwe-TMM, okungenza kube lula ukwenziwa kwe-PCB uma kuqhathaniswa nezinye izinto ze-PTFE microwave. Lezo zici zibalulekile lapho ibhodi linezimbobo eziningi ezifakwe i-plated, ama-vias angaboni noma agqitshwe, ukubhaliswa okuqinile, izindawo zokubopha ucingo, noma ukuvezwa okuphindaphindiwe kokushisa; yingakho futhi indlela yokukhiqiza kufanele ibuyekezwe kusenesikhathi nesitolo esinolwazi ekukhiqizweni kwe-Rogers TMM PCB.

Izindinganiso zobunjiniyela ezibalulekile

Ngaphambi kokukhipha i-TMM PCB evame kakhulu, onjiniyela nabathengi ngokuvamile badinga ukuxazulula imibuzo eminingana esebenzayo:

• Yiliphi izinga le-Rogers TMM okufanele ngilisebenzise: TMM3, TMM4, TMM6, TMM10, TMM10i noma TMM13i?
• Ziyini izindinganiso ze-Dk kanye ne-Df, futhi yiziphi i-Dk okufanele zisetshenziswe ku-solver yensimu?
• Ingabe i-TMM ingcono kune-RO4350B, i-RT/duroid 5880 noma i-alumina yomklamo wami?
• Ingabe umenzi we-PCB angacubungula i-TMM ngezinyathelo ezijwayelekile zokubhoboza, zokucwebezela kanye nezokuhlela, futhi kufanele ngimbandakanye nini umenzi we-Rogers TMM PCB?
• Yiliphi i-foil yethusi kanye nokuqedwa kobuso okufanele kusetshenziswe ukunciphisa ukulahleka kwe-RF?
• Ingabe i-TMM ingasetshenziswa ku-stackup ye-hybrid multilayer ene-FR4 noma enye i-Rogers laminate?
• Yiluphi ulwazi okufanele lunikezwe ukuze kutholakale intengo enembile ye-Rogers TMM PCB futhi kugwenywe ingozi yokwenziwa?

Izigaba ezingezansi ziphendula leyo mibuzo ngokombono womthengi we-PCB, unjiniyela we-RF kanye nomkhiqizi.

Kungani Abaklami Bekhetha iRogers TMM yama-PCB Avame Kakhulu

Ukuziphatha okuzinzile kwe-dielectric kwezifunda ze-RF ezilungisiwe

Amasekethe anemvamisa ephezulu azwela ukushintshashintsha okungaguquki kwe-dielectric, yingakho ukuzinza kwezinto, ukulawulwa kwe-stackup kanye nomkhuba wokuhlelwa kwe-RF kufanele kuphathwe njengohlelo olulodwa lokuklama kunezihloko ezihlukene. Iphutha elincane le-Dk lingashintsha imvamisa ephakathi yesihlungi, lishintshe isigaba senethiwekhi yokuphakelayo, likhiphe i-antenna, noma lihambise inethiwekhi efanayo kude nendawo yokuvimba ehlosiwe. Izinto ze-Rogers TMM zenzelwe ukusetshenziswa kwe-microwave, ezinezingqimba ze-dielectric ezilawulwayo kanye nezici zokusabalalisa eziphansi emndenini wonke. Lokhu kuzenza zifaneleke kakhulu kune-FR4 yempahla lapho i-geometry yethusi kumele ihumushe ekusebenzeni kwe-RF okubikezelwayo.

Kumabhodi edijithali anemvamisa ephansi, ukuhlukahluka kwe-dielectric kungamuncwa yi-timing margin noma i-equalization. Nokho, kumabhodi e-microwave, i-laminate iba yingxenye ye-equation yesekethe. Umugqa we-quarter-wave, i-branch-line coupler, i-interdigital filter noma i-patch antenna ingahluleka ngoba nje i-dielectric constant yangempela esebenzayo akuyona into eyayicatshangwa yimodeli. Ukusebenzisa i-laminate enemvamisa ephezulu eyaziwayo kusiza ukunciphisa lokhu kungaqiniseki ngaphambi kokuba kwakhiwe i-prototype yokuqala; ngemithetho ebanzi yokwakheka kwe-RF ezungeze indlela yokubuya kanye nokuguqulwa, qhathanisa lo mhlahlandlela wezinto ezibonakalayo nekhasi le-Rogers TMM RF PCB.

Ukuqina kwe-thermoset esikhundleni sokuthamba kwe-PTFE

Ama-laminate amaningi e-microwave aphansi kakhulu asekelwe ku-PTFE. I-PTFE inikeza ukusebenza okuhle kakhulu kokulahlekelwa ugesi, kodwa ingaba thambile ngokomshini futhi ingadinga ukuphathwa noma ukucutshungulwa okukhethekile. I-Rogers TMM inikeza abaklami ibhalansi ehlukile: ihlanganisa ukulahlekelwa okuphansi kwe-dielectric nesakhiwo se-thermoset esiqinile. Inzuzo akuyona nje ukulula komshini. Ukuqina kusiza ukubhaliswa, ikhwalithi yembobo, ukuzinza kwephethini yethusi, ukuba yisicaba kokuhlanganiswa kanye nokuzinza kobukhulu besikhathi eside.

Lokhu kubalulekile ekukhiqizeni kwangempela, ikakhulukazi lapho iphrojekthi isuka ekukhetheni izinto iye ekubholeni, ekuplateni, ekuqondiseni nasekuhloleni. Uma i-PCB iqukethe ugqinsi ngokusebenzisa uthango, imigodi yokufaka efakwe ipulasitiki, i-RF exubile kanye ne-control circuitry, noma ukwakhiwa kwezingqimba eziningi, umenzi kumele abhoboze, abeke ipuleti, isithombe, aqophe, abeke ipulasitiki futhi aqondise ibhodi ngokuphindaphindiwe. Izinto ezimelana nokuqhekeka, ukugeleza okubandayo kanye nomonakalo wenqubo kulula ukuzigcina ngaphakathi kokubekezelelana, okunciphisa ingozi enkambisweni yokwenziwa kwe-TMM. Leso ngesinye sezizathu eziyinhloko ezenza i-TMM isetshenziswe ekuhlanganiseni okudingakalayo kwemvamisa ephezulu esikhundleni sokukhethwa kuphela yizinombolo ze-Dk ne-Df. I-Highleap isebenzisa ibanga lezinto ezikhishwe kanye ne-stackup ukusetha umzila wokwenziwa esikhundleni sokusebenzisa iresiphi eyodwa ejwayelekile ye-TMM kuyo yonke idizayini. Umphumela uba iwindi lenqubo eliboshwe ebangeni, ukujiya kwebhodi, isakhiwo sembobo kanye ne-geometry ye-RF yephrojekthi yangempela. Amanani empahla yezinto ezibonakalayo kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa.

Izinketho ze-High-Dk zezakhiwo ze-microwave eziqinile

Umndeni we-TMM uhlanganisa amazinga aphezulu e-Dk njenge-TMM10, i-TMM10i kanye ne-TMM13i. Lezi zinto zivumela izakhiwo ezincane ze-RF ngoba ubude be-wavelength ngaphakathi kwe-dielectric buyancipha njengoba ukungaguquguquki kwe-dielectric kukhula. Izihlungi, ama-resonator, ama-couplers kanye nezakhiwo ezithile ze-antenna zingaba zincane kakhulu uma kuqhathaniswa nezinto eziphansi ze-Dk.

I-High Dk ayingcono ngokuzenzakalelayo. Inganciphisa i-bandwidth, yandise ukuzwela ekubekezeleleni, yenze ububanzi be-trace bube buncane futhi yandise ukuhlushwa kwensimu kagesi. Kodwa uma i-miniaturization iyimfuneko yangempela, amazinga e-high Dk TMM ahlinzeka ngendlela ewusizo ngaphandle kokushintshela ngokushesha kuma-substrates e-ceramic aqhekekile. Kweminye imiklamo, ikakhulukazi leyo eyayisebenzisa i-alumina ngokomlando ekusebenzeni kwe-high Dk, i-high Dk TMM PCB inganikeza indlela yokukhiqiza efana ne-PCB futhi kufanele ihlolwe ngokusebenza kwe-RF kanye nezindleko ze-Rogers TMM PCB engqondweni.

Ukuthembeka okuhle okumbozwe ngembobo

Izinto ze-Rogers TMM zine-coefficients yokwanda kokushisa ehambisana kakhulu nethusi. Lokhu kubalulekile ekufakweni kwemigodi ngoba imiphongolo yethusi nezinto ze-dielectric zanda ngendlela ehlukile ngesikhathi sokujikeleza kokushisa, ukushiswa kanye nokusebenza. Uma ukungafani kukhulu, imiphongolo edlulayo ingaqhekeka, ama-pads angaphakama, noma ukuthembeka kodonga lwemigodi kungaphazamiseka.

Amabhodi anemvamisa ephezulu avame ukusebenzisa ama-via amaningi: ama-via okuthunga phansi eceleni kwama-waveguides e-coplanar, ngokusebenzisa uthango oluzungeze izihlungi, ama-via okufaka phansi eduze kwama-component pads, ukushintsha phakathi kwezingqimba ze-stripline kanye ne-microstrip, kanye nama-via okushisa ngaphansi kwamadivayisi kagesi; lezi zakhiwo ze-via zixoxwa ngemininingwane eminingi yokusetshenziswa kumhlahlandlela we-Rogers TMM microwave PCB. Kulezo zakhiwo, ukuthembeka kwemigodi ehlanganisiwe akuyona imininingwane yesibili. Kuyingxenye yokusebenza kwe-RF kanye nokuthembeka komkhiqizo wesikhathi eside.

Amabanga Ezinto Ezibalulekile zeRogers TMM kanye Nezakhiwo Eziyinhloko

Umndeni we-TMM uhlanganisa amamaki amaningana anezingqimba ze-dielectric ezihlukene. Iphutha elivame kakhulu ukukhetha ibanga kuphela ngokufanisa inombolo ye-Dk kusuka kumklamo wangaphambilini. Indlela engcono ukuqhathanisa inqubo i-Dk, umklamo i-Dk, i-loss tangent, i-thermal coefficient ye-dielectric constant, i-thermal conductivity, i-CTE, ukutholakala kobukhulu kanye nezidingo zokukhiqiza ndawonye.

Ithebula elingezansi lifingqa amamaki ayinhloko e-Rogers TMM asetshenziselwa umsebenzi we-PCB ovame kakhulu. Amanani ayinani elijwayelekile lokubhekisela futhi kufanele aqinisekiswe uma kuqhathaniswa nedathashethi yakamuva ye-Rogers, ukutholakala kwangempela kwe-laminate kanye nesitoko sezinto ze-TMM zomenzi ngaphambi kokukhishwa ekukhiqizweni.

Inqubo uDkt vs umklamo uDkt

Izinto zeRogers TMM zibala kokubili inqubo i-Dk kanye nomklamo i-Dk. Inqubo i-Dk iyinani elisetshenziselwa ukulawula izinto kanye nokufaneleka ngaphansi kwendlela yokuhlola ethile. I-Dk yomklamo ihloselwe ukumodela isekethe ngaphezu kobubanzi obuphezulu bemvamisa futhi imvamisa iwukufaka okufanele kakhulu komklamo we-microstrip noma we-stripline. Ukudideka kwalezi zinombolo ezimbili kungadala ibhodi elibonakala lilungile kumadokhumenti kodwa lilinganisa ngaphandle kwethagethi ngemva kokwenziwa.

Isibonelo, uma unjiniyela emodela umugqa we-microstrip we-TMM10 esebenzisa inqubo i-Dk engu-9.20 lapho i-Dk yomklamo iseduze no-9.80 yesakhiwo esifanele, i-impedance ebaliwe kanye nobude bukagesi kungase kushintshe. Umehluko ungabaluleka kakhulu kumasekethe aphendulayo, amanethiwekhi ahambisana nesigaba kanye nezakhiwo ze-mmWave. Umkhuba omuhle ukusebenzisa i-Dk yomklamo kumodeli ye-field solver noma ye-electromagnetic, bese uqinisekisa i-stackup yokugcina ngedatha yomkhiqizi we-PCB kanye nomhlinzeki we-laminate.

Ukubekezelelana kwe-Dk kanye nokuphindaphinda kokukhiqiza

Ukubekezelelana kwe-Dk akuyona nje incazelo yokuthenga; kuthinta ukuthi amabhodi okukhiqiza ahluka kangakanani komunye nomunye, ikakhulukazi ekwakhiweni okuzwela izinga lokushisa lapho ukuzinza kwe-Dk phezu kwezinga lokushisa kumele kufakwe kwisabelomali sokubekezelelana. Iphrothokholi eyodwa ingalungiswa ngokusika noma ngokushintsha inani lengxenye. Ukuqhutshwa kokukhiqiza kwamabhodi e-RF kumele kuphindwe kuwo wonke amaphaneli, ama-lots kanye nemijikelezo yokuhlangana. Ububanzi be-dielectric obulawulwa yi-Rogers TMM buyasiza ekunciphiseni ukukhukhuleka kwemvamisa yeyunithi kuya kwenye, kodwa ukuphindaphindeka kokugcina kusancike ekujikeni kwe-laminate, ukujiya kwethusi, isinxephezelo se-etch, izinqumo zemaski ye-solder, inqubo yokucindezela kanye nesiyalo sokulinganisa.

Kuma-high-Q filters, amanethiwekhi okuphakelayo ahlukaniswe ngezigaba, izinzwa ze-microwave kanye neziphetho zangaphambili ze-radar, isabelomali sokubekezelelana kufanele sifake ukubekezelelana kwe-dielectric, ukubekezelelana kwe-copper etch, ukubhaliswa, isikhundla, ubukhulu bokuqeda kanye ne-assembly parasites. Ukukhetha izinto kuyisiqalo, hhayi ikhambi eliphelele.

Indlela i-Dk, i-Df kanye nobukhulu obuthinta ngayo ukusebenza kwe-PCB

Ukulawulwa kwe-dielectric okuqhubekayo kwe-impedance kanye nosayizi obonakalayo

I-dielectric constant inquma ukuthi amasimu kagesi ahamba kanjani ngaphakathi nangaphandle kwe-dielectric ye-PCB. Ku-microstrip, ingxenye yensimu ikwi-laminate kanti ingxenye isemoyeni, ngakho-ke isekethe ibona i-dielectric constant esebenzayo. Ku-stripline, ingxenye enkulu yensimu iqukethwe ngaphakathi kwe-dielectric, ngakho-ke ubudlelwano ne-laminate i-Dk buhlukile. Noma ngabe yikuphi, i-Dk ithinta kakhulu i-impedance, ijubane lesigaba kanye ne-wavelength.

I-Dk Ephakeme yenza ubude be-wavelength bube bufushane. Lokhu kuvumela ama-resonator amancane, izingxenye ezimfushane zama-quarter-wave kanye nezihlungi eziqinile. Ngokuvamile futhi kwenza ububanzi be-trace bube buncane ngenxa ye-impedance ethile kanye nobukhulu be-dielectric. Imigqa emincane ingandisa ukulahlekelwa komqhubi futhi yenze ukubekezelelana kwe-etch kubaluleke kakhulu. I-Dk Ephansi inikeza ama-trace abanzi futhi ingasekela i-bandwidth ebanzi, kodwa idinga indawo yebhodi eyengeziwe yezakhiwo ze-resonant. Ngakho-ke i-Dk efanele iyisinqumo sezinga lesekethe kunesinqumo esilula esithi "okuphezulu kungcono" noma "okuphansi kungcono", futhi kufanele kuhlolwe ngokumelene ne-impedance, ukulahleka, usayizi webhodi kanye nentengo ye-TMM PCB elindelekile.

Isici sokushabalalisa sinegalelo ekulahlekelweni kwe-dielectric

Isici sokusabalalisa, esibizwa nangokuthi i-loss tangent noma i-Df, sichaza ukuthi ingakanani amandla e-RF i-dielectric eyimunca futhi iyiguqulele ekushiseni. Amabanga e-Rogers TMM anamanani aphansi e-Df azungeze u-0.0019 kuya ku-0.0023 ku-10 GHz. Lokho kufanelekile kumabhodi amaningi e-microwave, ikakhulukazi uma kuqhathaniswa ne-FR4 yenhloso ejwayelekile. Kodwa-ke, akuhlali kuphansi kunezinto ze-PTFE ezinhle kakhulu. I-laminate ye-PTFE ephansi kakhulu ingase isanqobe lapho wonke umklamo ulawulwa yizidingo zokufakwa nokulahlekelwa.

Ku-PCB yangempela, ukulahlekelwa kokufakwa kuyisamba semiphumela eminingi. Ukulahlekelwa yi-dielectric kuyingxenye eyodwa kuphela. Ukulahlekelwa yi-conductor, ubulukhuni bethusi, ukuqeda kobuso, imisebe, ukuvuza ngokunqamuka, ngokushintshashintsha kanye nokuqaliswa kwezixhumi konke kungabusa ngesivinini esiphezulu. I-Rogers TMM PCB isengenza kabi uma izinketho zokuqoqa kanye nokukhiqiza zingahambisani nomklamo we-RF; isihloko se-Rogers TMM microwave PCB esihambisanayo sihlanganisa isabelomali sokufakwa nokulahlekelwa ngokujulile.

Ubukhulu buthinta impedance, ukuxhuma kanye nokulahlekelwa

Ubukhulu be-laminate bungenye yezinto ezibaluleke kakhulu ezisebenzayo kwi-PCB enemvamisa ephezulu. Ukuze uthole i-target impedance, i-dielectric ejiyile ngokuvamile idinga i-trace ebanzi, kuyilapho i-dielectric encane idinga i-trace encane. I-trace ebanzi inganciphisa ukulahlekelwa yi-conductor futhi kungaba lula ukuyichoboza njalo, kodwa futhi idla indawo eningi futhi ingandisa ukuxhumanisa ezakhiweni eziseduze. I-dielectrics encane isekela umzila ohlangene kanye nokuxhumanisa okuqinile kodwa ingenza i-impedance izwele kakhulu ekushintsheni kwe-etch.

Ngomsebenzi we-RF olawulwayo-impedance, umdwebo we-PCB kufanele ucacise ubukhulu be-dielectric phakathi kwezingqimba zethusi, hhayi nje ubukhulu bebhodi eliqediwe. Umenzi kufanele aqinisekise ukuthi ubukhulu buyinto eyinhloko, i-prepreg/bondply, noma inani elicindezelwe ngemuva kwe-lamination. Kumabhodi e-hybrid multilayer, lo mehluko ubalulekile ngoba izinto ezahlukene zicindezela ngendlela ehlukile futhi zingaba nezakhiwo ze-dielectric ezahlukene.

Ukuziphatha kokushisa kubalulekile kumasekethe e-RF yamandla

Amabhodi anemvamisa ephezulu awawona njalo amabhodi anamandla aphansi. Ama-amplifiers kagesi, amamojula okudlulisa, amabhodi e-radar kanye namanethiwekhi okuphakelayo e-antenna angakhiqiza ukushisa okukhulu. Izinto zeRogers TMM zinikeza ukuhanjiswa kokushisa okuphakathi kuka-0.70 kuya ku-0.76 W/m·K kuye ngebanga, okusiza uma kuqhathaniswa nama-dielectric amaningi ajwayelekile ashibhile. Noma kunjalo, ukushisa kumele kulawulwe yisakhiwo sebhodi esiphelele: indawo yendiza yethusi, ngama-array, izakhiwo ezisekelwe yinsimbi, indlela yokunamathisela izingxenye, ukuxhumana okuvalekile, ukulawula i-solder void kanye nokugeleza komoya.

Umklamo wokushisa kanye nomklamo we-RF kufanele kubuyekezwe ndawonye. Ukwengeza ama-vias okushisa kungathuthukisa ukusabalala kokushisa kodwa kungaphazamisa ugesi womhlaba noma kudale ukuhlangana okungafuneki uma kungabekwanga kahle. Ukwandisa indawo yethusi kungasiza ekushiseni kodwa kungashintsha futhi i-impedance noma ukuziphatha kwe-resonant. Umklamo omuhle we-Rogers TMM PCB ulinganisa ukuqhubeka kwe-RF, ukuqhutshwa kokushisa kanye nokukhiqizwa esikhundleni sokwenza ngcono ngayinye ibe yodwa.

Indlela Yokukhetha Ibanga Elifanele Le-Rogers TMM

Sebenzisa i-TMM3 uma ama-Dk aphansi kanye nama-RF traces abanzi ewusizo

I-TMM3 ivame ukucatshangelwa lapho umklamo udinga ukulahlekelwa okuphansi, i-Dk elawulwayo kanye nobukhulu obukhulu bomugqa wokudlulisela, njengemigqa yokuphakelayo ye-antenna ebanzi noma umzila we-broadband RF. Ngenqubo i-Dk engu-3.27 kanye nomklamo i-Dk cishe engu-3.45, iwusizo kuma-antenna feeds, imigqa ye-broadband RF, ama-couplers kanye nama-microwave circuits lapho i-Dk ephezulu kakhulu ingenza khona ama-trace abe mancane noma i-bandwidth ilinganiselwe. I-TMM3 ingakhanga futhi lapho ishintsha izinto ze-PTFE ze-Dk ephansi kodwa ifuna ukuqina okungcono komshini. Kwilungu lomndeni le-Dk ephansi, izidingo zebhodi le-TMM3 RF zihumusha ukukhethwa kwebanga ekwakhiweni kwebhodi elithile.

Ukushintshana kuyindawo yebhodi. Isakhiwo se-TMM3 quarter-wave sizoba sikhulu kunesakhiwo esifanayo ku-TMM6, TMM10 noma i-TMM13i. Uma usayizi womkhiqizo ungewona umkhawulo oyinhloko, leyo geometry enkulu ingaba usizo ngoba inciphisa ukuzwela kokuqopha futhi ivumela ukuguquka okuhlanzekile. Uma ukuqina kubalulekile, izinga le-TMM eliphakeme le-Dk lingase lifaneleke kakhulu.

Sebenzisa i-TMM4 noma i-TMM6 uma ulinganisa usayizi kanye nokukhiqizwa

I-TMM4 kanye ne-TMM6 zihlala phakathi komndeni. Zinciphisa usayizi wesekethe uma kuqhathaniswa ne-TMM3 ngenkathi zigwema ukuziphatha kwe-TMM10 kanye ne-TMM13i okune-Dk ephezulu kakhulu. Lawa mabanga angafaneleka kumanethiwekhi e-RF aqinile, izakhiwo ezikhetha imvamisa, amasekethe afanayo kanye nemiklamo lapho ububanzi bokulandelela, izikhala zokuxhumanisa kanye nokuzwela kokubekezelelana kusadingeka kuhlale kukhiqizwa.

Kumadizayini amaningi, i-TMM6 iyindawo ephakathi nendawo esebenzayo. Inikeza ukunciphisa usayizi okunamandla kune-TMM4 kodwa ayicindezeli ukwakheka kuhlelo olufanayo oluncane njenge-TMM10 noma i-TMM13i. Ukukhetha okulungile kufanele kuqinisekiswe ngesibali sokuvimba, isixazululo sensimu ye-2D noma imodeli ye-EM egcwele amagagasi, ngoba ububanzi be-trace obufunwayo kanye nesikhala kungaba yisici esinqumayo kunokuba kube yi-Dk eqanjiwe yodwa; ngemva kwalokho, i-stackup kufanele ihlolwe ngumkhiqizi we-PCB onekhono le-TMM.

Sebenzisa i-TMM10, i-TMM10i noma i-TMM13i kumasekethe amancane ane-Dk ephezulu

I-TMM10, i-TMM10i kanye ne-TMM13i zikhethwa lapho kudingeka khona i-dielectric constant ephezulu ukuze kuncishiswe usayizi obonakalayo noma kufezwe ukusatshalaliswa kwensimu ethile. Lawa mabanga avame ukuphakanyiswa ezihlungi ezincane, ama-resonator, amamojula e-microwave aqinile kanye nezinhlelo zokusebenza lapho ama-substrate e-ceramic angacatshangelwa khona ngenye indlela. Lapho kukhethwa khona ibanga le-Dk eliphezulu, ukukhiqizwa kwe-TMM10 kwe-geometry ye-RF ehlanganisiwe kuletha ubukhulu be-resonator kanye nokuzwela kokukhiqiza ekubuyekezweni.

Umklamo we-High-Dk udinga ukuzithiba. Ukuqina okufanayo okwenza ukwakheka kukhange nakho kungandisa ukuzwela ezinguqukweni ezincane zobukhulu. Izikhala zokuxhuma ziba zibaluleke kakhulu, imiphumela yemaski ye-solder ingabonakala kakhulu, futhi insimbi eseduze ingaba nethonya elinamandla. Kumabhodi e-high-Dk Rogers TMM, umklamo kufanele ubuyekezwe kucatshangelwa ikhono lokugcina lokukhiqiza: umkhondo omncane nendawo, ukubekezelelana kwe-etch, ukubhaliswa, ukuvuleka kokubhoboza kuya ethusi, kanye nobukhulu bokuqedwa kobuso kufanele kuqinisekiswe ngaphambi kokukhululwa kokwakheka.

Cabanga nge-TMM10i kanye ne-TMM13i lapho ukuziphatha kwe-isotropic kubalulekile

U-“i” ku-TMM10i kanye ne-TMM13i ubonisa ukuziphatha kwe-isotropic. Ukuziphatha kwe-dielectric ye-Isotropic kungaba wusizo lapho ukuqondiswa kwensimu kagesi kushintsha khona noma lapho umklamo uncike ekuziphatheni okubikezelwayo kuma-axes amaningi. Kumamojula e-microwave ayinkimbinkimbi, ama-resonator, izakhiwo ezifakiwe noma izinguquko, lokhu kunganciphisa ukungaqiniseki komodeli uma kuqhathaniswa nezinto ezinokuncika okuqinile kokuqondiswa.

Uhlelo lokusebenza olulula lokukhetha amamaki

Inqubo yokukhetha esebenzayo iqala ngomsebenzi we-RF kunohlu lwezinto ezibonakalayo. Okokuqala, nquma i-target impedance, imvamisa yokusebenza, i-bandwidth kanye nokulahlekelwa kokufakwa okuvunyelwe. Okwesibili, linganisa usayizi ongokoqobo odingekayo ngezinto eziphansi, eziphakathi neziphezulu ze-Dk. Okwesithathu, hlola ukuthi ububanzi bomkhondo obuvelayo, izikhala, ngokusebenzisa izimbobo kanye nezici zethusi ziyakhiqizwa yini. Okwesine, qhathanisa isabelomali sokulahlekelwa, izidingo zokushisa kanye nezindleko. Okokugcina, yakha i-prototype yokuqala enezakhiwo zekhuphoni ukuze i-impedance kanye nokulahlekelwa kulinganiswe esikhundleni sokucatshangelwa.

Uma amamaki amabili e-TMM ebonakala esebenza ngogesi, khetha leyo enikeza iwindi lokukhiqiza eliqinile kakhulu. Izinto ezikhiqiza iminonjana emincane kakhulu noma izikhala ezibalulekile zingase zibukeke kahle ekulingiseni kodwa zibize noma zingazinzile ekukhiqizeni. Kumabhodi amaningi e-RF ezentengiselwano, ukukhiqizwa kubaluleke njengokusebenza kukagesi okujwayelekile.

Umklamo Wokunqwabelana Kwe-Rogers TMM High-Frequency PCB

Amabhodi e-RF anesendlalelo esisodwa namabili

I-Rogers TMM PCB elula kakhulu ibhodi elinamacala amabili elinemigqa ye-RF kolunye uhlangothi kanye nendiza eqhubekayo yomhlabathi kolunye, isakhiwo esivame ukusetshenziswa ezinhlelweni ze-Rogers TMM RF PCB. Lesi sakhiwo sivame ukusetshenziswa kumasekethe e-microstrip, ama-antenna feed, izihlungi namabhodi okuhlola. Izinzuzo zaso ukufinyeleleka kalula, izindleko eziphansi, ukuphenya okulula kanye neziguquguquki ezimbalwa ze-lamination. Imikhawulo yaso ifaka phakathi imisebe, ukuchayeka emvelweni kwemigqa ye-RF, kanye nokwehlukaniswa okuncishisiwe uma kuqhathaniswa ne-stripline.

Kumabhodi e-RF anezinhlangothi ezimbili, indiza yomhlabathi kufanele ihlale iqhubeka ngaphansi kwemigqa ye-impedance elawulwayo. Gwema ukuhambisa imigqa yedijithali, ukuhlukaniswa kwamandla noma ama-antipad amakhulu ngqo ngaphansi kwemizila ye-RF ebucayi. Ama-via angaphansi komhlabathi kufanele abekwe eduze kokuguquguquka, izixhumi, izindawo zezingxenye kanye nemiphetho ye-coplanar waveguide. Uma ibhodi liqukethe imigodi yokufaka, izihlangu noma izindlu zensimbi, umphumela wazo emasimini e-RF kufanele ucatshangelwe kusenesikhathi.

I-Microstrip, i-coplanar waveguide ephansi kanye ne-stripline

I-Microstrip isetshenziswa kabanzi ngoba ilula futhi kulula ukuyilungisa. Ivumela izingxenye ukuthi zifakwe ngqo ohlangothini olufanayo ne-RF trace, kodwa ingakhipha ukukhanya okungaphezu kwezakhiwo ezigqitshiwe futhi ingase izwele kuma-solder mask, ukuphakama kwe-enclosure kanye nensimbi eseduze. I-waveguide ye-coplanar egxiliwe inezela ithusi eligayiwe eceleni kwe-RF trace futhi isebenzisa ngokuthunga ukuxhuma lezo zindawo endaweni yokubhekisela. Lokhu kungathuthukisa ukuhlukaniswa futhi kwenze kube lula ukushintsha, kodwa kudinga ukulawulwa ngokucophelela kobubanzi be-trace, igebe kanye nesikhala.

I-Stripline ifaka umkhondo wesignali phakathi kwezindiza zokubhekisela. Ihlinzeka ngokuvikela okungcono kanye nokwahlukaniswa, okuwusizo kumamojula noma amabhodi e-microwave aminyene anezindlela zokwamukela ezibucayi. Izinto ezishintshayo ziyinkimbinkimbi yokwenza, ukulungisa okunzima kakhulu, kanye nokuthembela okuqinile ekulawuleni ubukhulu be-lamination. Uma isekethe isebenzisa i-stripline, i-stackup kumele ichaze ubukhulu bengqimba eyinhloko kanye ne-bonding ngokucacile, futhi umenzi kufanele aqinisekise ubukhulu bokugcina obucindezelwe ngaphambi kokuba i-impedance modeling ikhiywe.

Ama-stackup e-hybrid multilayer

I-hybrid stackup isebenzisa i-Rogers TMM kuphela lapho kudingeka khona ukusebenza kwemvamisa ephezulu futhi isebenzisa enye into, ngokuvamile i-FR4 noma i-Rogers laminate ehlukile, ukuze isetshenziswe ezingqimbeni zedijithali, zokulawula noma zamandla. Le ndlela inganciphisa izindleko futhi igcine ubukhulu bebhodi busebenza. Ingavumela futhi amasekethe e-RF kungqimba lwangaphandle lwe-TMM ngenkathi umzila wedijithali, ukusatshalaliswa kwamandla kanye nokusekelwa kwemishini kubekwa kwenye indawo.

Ukwakhiwa kwe-hybrid kumele kuklanywe ngokucophelela. Izinto ezahlukene zine-CTE ehlukene, ukuziphatha komswakama, amazinga okushisa e-lamination kanye nezakhiwo ze-dielectric. I-stackup kufanele ilingane uma kungenzeka ukuze kuncishiswe i-bow and twist. Ukukhetha i-Bondply kufanele kuhambisane nezinto zombili kanye nomjikelezo we-lamination odingekayo. Imodeli ye-RF kufanele ifake i-dielectric yangempela eduze komkhondo, hhayi izinto ezifanelekile ezinyamalala ngemva kokukhiqizwa.

Izindiza zokubhekisela kanye nokubuyiswa kwamanje

Yonke i-trace ye-high-frequency idinga indlela yokubuyisa elawulwayo. Kuma-RF nama-microwave frequency, i-return current ilandela indlela ye-inductance ephansi kakhulu, ngokuvamile ngaphansi noma eceleni komqhubi wesignali. Ukuhlukana kwendiza, ama-voids, ama-antipads amakhulu, ngezikhala kanye noshintsho olubekwe kabi kuphazamisa le ndlela yamanje. Umphumela ungaba ukungaqhubeki kwe-impedance, ukulahlekelwa okwandisiwe, imisebe, ukukhuluma okuphambene noma ukuzwakala okungalindelekile.

Kuma-PCB e-Rogers TMM anemvamisa ephezulu, ukwakheka kufanele kulondoloze indiza yokubhekisela ye-RF eqhubekayo ngaphansi kwemigqa yokudlulisa. Uma isignali ishintsha izendlalelo, beka ama-via asemhlabeni eduze koshintsho ukuze ugesi wokubuya nawo ushintshe izendlalelo. Uma usebenzisa i-waveguide ye-coplanar ephansi, gcina uthango eduze ngokwanele ukuze lusebenze njengomngcele we-RF kumvamisa wokusebenza, kodwa hhayi eduze kakhulu kangangokuthi ingozi yokukhiqiza noma amandla amaningi iba yinkinga.

Izinqumo zemaski ye-Solder

Izakhiwo eziningi ze-RF zigwema imaski yokusolda phezu kwemigqa ye-impedance elawulwayo ngoba imaski yokusolda ishintsha indawo esebenzayo ye-dielectric futhi ingandisa ukulahleka noma ukuguquka kwe-impedance. Eminye imiklamo isasebenzisa imaski yokusolda ukulawula ukuhlanganiswa, ukuvikela ukugqwala noma ukukhiqizwa. Isihluthulelo ukungaphathi imaski yokusolda njengengabonakali. Uma imaski yokusolda imboza iminonjana ye-RF, yifake kumodeli ye-impedance noma wakhe amakhuphoni okuhlola abonisa ukuphela kwangempela.

Kumasekethe e-microwave azwela kakhulu, chaza “imaski yokusoda engekho kuma-trace e-RF” noma uchaze ukuvuleka kwemaski okuqondile kumanothi okwenziwa. Kumabhodi axubile, imaski yokusoda ingahlala ezindaweni zedijithali nezamandla ngenkathi izingxenye ze-RF zivulwa ngokukhetha. Ukukhetha kokugcina kufanele kucabangele ukuvunwa kokuhlanganiswa, ukuhlanzeka, ingozi yokubola kanye nokusebenza kwe-RF ndawonye.

Ukulawulwa Kokufakwa-Ukulahlekelwa: Ithusi, Ukuqeda kanye neJiyomethri

Ukulahlekelwa yi-dielectric akuyona ukuphela kokulahlekelwa

Iphutha elivamile ukuqhathanisa izinto ze-PCB ezivame kakhulu kuphela ngezinto ze-Df. Df ezibaluleke kakhulu, kodwa ukulahlekelwa ngumqhubi kungaba yinto ebalulekile noma ebaluleke kakhulu, ikakhulukazi njengoba imvamisa ikhuphuka. Kuma-microwave kanye nama-mmWave frequency, ukugeleza kwamanje eduze kobuso bethusi ngenxa yomphumela wesikhumba. Ithusi eliqinile landisa indlela yamanje esebenzayo futhi lingakhuphula ukulahlekelwa kokufakwa. Lokhu kusho ukuthi i-Rogers TMM laminate efanayo ingadala ukulahlekelwa okulinganiselwe okuhlukile kuye ngohlobo lwe-copper foil kanye nokwelashwa kwendawo.

Uma ukulahlekelwa kubalulekile, buza umenzi we-PCB ukuthi iyiphi i-foil yethusi etholakalayo yezinga kanye nobukhulu be-TMM ekhethiwe. I-copper efakwe ngogesi, i-copper egoqiwe kanye ne-copper ephansi ingaba nobulukhuni obuhlukene, ukunamathela kanye nezindleko. Ukukhetha okungcono kuncike ekuvameni, i-trace geometry, izidingo zamandla okuhluba kanye nekhono lokwenza.

Ukukhetha kokuqeda ubuso

Ukuphela kobuso kuvikela ithusi eliveziwe futhi kusekela ukusonta noma ukubopha ngentambo. Kumasekethe e-RF, ukuqeda kungathinta nokulahlekelwa, ukuvinjelwa kanye nekhwalithi yokuxhumana. I-ENIG ivamile futhi iyasontwa, kodwa i-nickel iyalahleka kakhulu uma ivama kakhulu futhi ingaba yinto engathandeki ezindaweni zokuqalisa ze-RF noma kuma-RF traces ade avezwe. Isiliva elicwilisiwe, ithini lokucwiliswa, i-OSP, igolide elithambile noma i-ENEPIG kungacatshangwa kuye ngendlela yokuhlanganisa, isikhathi sokuphelelwa yisikhathi, izidingo zokubopha ngentambo kanye nokuvezwa kwemvelo.

Akukho ukuphela okukodwa okujwayelekile kuyo yonke i-Rogers TMM PCB, ngakho-ke ukuphela kufanele kukhethwe ngokulahlekelwa yi-RF, ukushintshwa, isitoreji, ukubopha kanye nefasitela lenqubo ye-TMM eliqinisekisiwe lomenzi. Imojula ye-microwave eboshwe ngocingo ingadinga ukuphela okuhambisana nokubopha okuthembekile. Ibhodi yokuhlola ye-RF exhunyiwe ingase ibeke phambili ukumelana okuphansi kokuthintana kanye nokuqaliswa okuphindaphindwayo. Ibhodi yokukhiqiza eshisiwe ingase ibeke phambili ukuzinza kokuhlanganiswa kanye nokuqina kokugcina. Ukuphela kufanele kukhethwe kucatshangelwa kokubili izidingo ze-RF kanye nokuhlanganiswa.

Ukuqaliswa kanye nokuguqulwa kwesixhumi

Ngisho nomugqa wokudlulisa we-TMM oklanywe kahle ungahluleka uma ukuqaliswa kwesixhumi kungalungile, yingakho ukuguquka kwesixhumi kuphathwa njengengxenye yokwakheka kwe-RF PCB, hhayi nje ihadiwe yemishini. I-SMA, ukuqaliswa okungu-2.92 mm, 2.4 mm kanye nomkhawulo webhodi kudinga i-geometry yephedi elawulwayo, umhlabathi ngokubeka, ukucaciswa kwendiza ebhekisele kuyo kanye nokuqondaniswa kwemishini. Ukuqaliswa kufanele kwenziwe imodeli noma kukopishwe kusuka kumklamo oqinisekisiwe wobukhulu bebhodi obuqondile kanye nohlobo lwesixhumi.

Ukushintsha kwezingqimba kungenye indlela evamile yokulahlekelwa nokubonakaliswa. Ukushintsha nge-via kusuka ku-microstrip kuya ku-stripline, isibonelo, kufaka phakathi i-inductance, i-pad capacitance, i-antipad geometry kanye ne-return-path vias. Kuma-microwave frequency aphansi, i-via elawulwa kahle ingamukeleka. Kuma-frequency aphezulu, ukuguquka kungadinga ukubhoboza emuva, ubude obuncishisiwe be-stub, ama-antipad alungiselelwe noma isakhiwo se-coaxial via.

Ukubekezelelana kwe-etch kanye nokulawula ububanzi bomugqa

Ukulawulwa kokuphazamiseka kuncike ebubanzini bethusi obuqoshwe ekugcineni, hhayi ububanzi be-CAD bodwa. Ubukhulu bethusi, isinxephezelo se-etch, ukuqondiswa kokulandelela, indawo yephaneli kanye nenqubo yokukhiqiza konke kuthinta ububanzi bokugcina. Lokhu kubaluleke kakhulu ezintweni ze-high-Dk TMM lapho umugqa we-50-ohm ungaba mncane. Ama-micron ambalwa okuhlukahluka angaba nomphumela olinganisekayo.

Umdwebo wokwenziwa kufanele uhlanganise impedance eqondiwe, ukubekezelelana, ireferensi yesendlalelo, izidingo zekhuphoni yokuhlola nokuthi impedance yenziwe yini ngaphambi noma ngemva kokufakwa/ukuqeda. Uma umklamo uqukethe izakhiwo ze-RF ezilungisiwe kunokuba kube yimigqa yokudlulisa kuphela, faka ubukhulu obubalulekile ngokwehlukana bese uxoxa ngokuthi ngabe bulawulwa ukuhlolwa kwe-impedance, ukuhlolwa kobukhulu noma ukuhlolwa kwe-RF.

Izinto Okucatshangelwayo Ngokukhiqizwa kweRogers TMM PCB

Ukubhoboza kanye nokuguga kwamathuluzi

Ama-laminate e-Rogers TMM aqukethe i-ceramic filler, ngakho-ke ingxenye yokwenziwa kwephrojekthi ye-TMM kufanele iphathwe ngendlela ehlukile emsebenzini ojwayelekile we-FR4. Lokhu kuthuthukisa ukuziphatha kukagesi nokushisa, kodwa futhi kwenza ukubhoboza kube nzima kakhulu kune-FR4 ejwayelekile yokubhoboza. I-ceramic filler ingandisa ukuguguleka kwamathuluzi, ngakho-ke amapharamitha okubhoboza, inani lama-hit, ukukhethwa kwamathuluzi kanye nezinto zokungena/zokusekela kufanele kulawulwe. Ukubhoboza okungekuhle kungadala izindonga ezimagebhugebhu, ukugoba kwezipikili, i-smear, ama-burrs noma amaphutha okufaka i-plating.

Umenzi wezinto onolwazi nge-TMM uzolungisa izimo zokubhoboza ukuze athole ikhwalithi yembobo kanye nokuphila kwamathuluzi; lesi esinye sezizathu zokukhetha isitolo esinolwazi lokukhiqiza lwe-Rogers TMM olubhalwe phansi. Ama-via amancane kakhulu, aminyene ngocingo kanye nemigodi enesilinganiso esiphakeme kufanele abuyekezwe ngaphambi kokwenziwa. Uma umklamo udinga ama-via amaningi angaphansi komhlaba e-RF, kungcono ukuqinisekisa ububanzi be-via kanye nesikhala ngokumelene nekhono lomenzi wezinto ze-TMM esikhundleni sokucabanga ukuthi imithetho yokuklama ye-FR4 iyasebenza.

Ukufakwa kweplati nokulungiswa kodonga lwemigodi

Enye inzuzo ye-TMM uma iqhathaniswa nama-laminate amaningi asekelwe ku-PTFE ukuthi i-TMM ejwayelekile ayidingi ukwelashwa kwe-sodium naphthenate ngaphambi kokufakwa kwe-electroless plating, okungenza inqubo ibe lula kumkhiqizi we-Rogers TMM PCB. Lokhu kungenza kube lula ukucubungula futhi kunciphise isinyathelo sobungozi. Kodwa-ke, ukufakwa kwe-plating okuhle kusancike ekulungiseleleni indawo, i-demear/cleaning chemistry, ikhwalithi yodonga lwemigodi kanye nokulawulwa kwenqubo.

Kumabhodi athembeke kakhulu, chaza ubukhulu be-copper plating obudingekayo, izinga lokwamukelwa kanye nanoma yisiphi isidingo sokucindezeleka kokushisa. I-RF ngocingo kanye ne-ground vias akuzona nje izimbobo zemishini; zithwala amandla okubuya futhi zithinta ukuvikela. I-cracked noma i-plaid engafaneleki ingaba amaphutha e-RF aqhubekayo okunzima ukuwathola ngemva kokuhlanganiswa.

Umzila, amaphuzu kanye nemiphetho yemishini

Amabhodi e-Rogers TMM angadinga izimo zokulawula umzila ngoba i-laminate egcwele i-ceramic iziphatha ngendlela ehlukile kune-FR4. Ukuqaliswa kwesixhumi esinomkhawulo webhodi, imiphetho e-castelled, izici ze-cavity kanye nokubekezelelana okuqinile kwemishini kufanele kuxoxwe ngakho kusenesikhathi. Kumabhodi e-RF, umphetho uvame ukuba yingxenye yesixhumi sikagesi: izixhumi ezinomkhawulo webhodi zidinga ukuba flat, ikhwalithi ye-plating, ukuqhubeka komhlaba kanye nokubuyela emuva okunembile kusuka emkhawulweni.

Uma i-PCB izofakwa endlini yensimbi, uhlaka lwebhodi kanye nezindawo zokufaka imigodi kungathinta isisekelo se-RF kanye nokuziphatha kwe-cavity. Ngakho-ke, ukubekezelelana kwemishini kufanele kubuyekezwe ngokuhlelwa kwe-RF, hhayi ngomdwebo we-enclosure kuphela.

Ukuqina kobukhulu kanye nokubhaliswa

Isakhiwo se-thermoset se-TMM kanye nokuziphatha okulawulwayo kokwanda kokushisa kusiza ngokuqina kobukhulu, kodwa ukubhaliswa kwezingqimba eziningi kuseyinselele yokukhiqiza lapho umklamo usebenzisa izici ezinhle, izendlalelo ze-RF ezifihliwe noma izinto ezihlanganisiwe. Kumasekethe anemvamisa ephezulu, ukubhaliswa kuthinta ukulungiswa kwe-via-to-pad, ukugxilisa imigqa phakathi, izikhala zokuxhuma kanye nezakhiwo ze-cavity. Ukuhlelwa kwephaneli yokukhiqiza kufanele kufake amakhuphoni afanele kanye nezinhloso zokubhalisa.

Uma isekethe ibucayi kakhulu, cabanga ngokucela izilinganiso zesihloko sokuqala: ukujiya kwe-dielectric, ukujiya kwethusi, idatha yekhuphoni ye-impedance, ubukhulu besici esibalulekile kanye, uma kusebenza, izilinganiso zepharamitha ye-S zezakhiwo zokuhlola. Lokhu kunikeza unjiniyela kanye nomenzi isisekelo esiyiqiniso sokulungisa isakhiwo esilandelayo.

Ukuhlanganiswa kanye nokubopha ucingo

Izinto zeRogers TMM zisekelwe ohlelweni lwe-thermoset resin futhi zisetshenziswa emiklamo engadinga ukubopha ucingo. Izidingo zokuhlanganisa kufanele zishiwo ngaphambi kokwenziwa ngoba zithinta ukuqeda kwendawo, imaski yokubopha, ukuba yisicaba, ukuhlanzeka kanye nokupakishwa. Uma ibhodi lizosebenzisa idayi engenalutho, ukuhlanganiswa kwe-chip-and-wire noma ukunamathiselwa kwe-eutectic, umdwebo we-PCB kufanele uchaze izindawo ezibophayo kanye nezidingo zokuqeda ngokunembile.

Ezingxenyeni ze-RF ezihlanganisiwe, i-geometry yephethini yomhlaba kanye nevolumu ye-solder kubalulekile. I-solder eyengeziwe ingashintsha i-impedance kuma-pads, kuyilapho i-solder enganele inganciphisa ukuthembeka. Ezingxenyeni ze-RF zamandla, ama-voids ngaphansi kwama-pads okushisa angakhuphula izinga lokushisa futhi ashintshe ukusebenza. Ngakho-ke i-Rogers TMM PCB kufanele ibuyekezwe njengomkhiqizo wokukhiqiza nokuhlanganisa ohlanganisiwe kunokuba kube yibhodi elingenalutho kuphela.

I-Rogers TMM vs PTFE, RO4350B kanye ne-Alumina

I-Rogers TMM akuyona indlela yezinto ezibonakalayo ye-PCB ngayinye enemvamisa ephezulu ngokuzenzakalelayo, ngakho-ke kufanele iqhathaniswe nezinye i-RF laminates ngokusekelwe ekulahlekelweni, ukuqina, ububanzi be-Dk, ubungozi bokucubungula kanye nezidingo zohlelo lokusebenza. Ithatha indawo ethile phakathi kwama-laminates e-PTFE alahleka kancane kakhulu, ama-laminates e-hydrocarbon/ceramic angabizi kakhulu njenge-RO4350B, kanye ne-substrates eqinile ye-ceramic njenge-alumina. Izinto ezifanele zincike ekubalulekeni komklamo.

I-TMM vs PTFE

Ama-laminate e-PTFE anganikeza ukulahlekelwa okuphansi kune-TMM. Isibonelo, i-RT/duroid 5880 yaziwa nge-Dk ephansi kakhulu kanye ne-dissipation factor ephansi kakhulu. Uma umklamo uyindlela ende yokudlulisela elahleka kancane futhi ubunzima bomshini bulinganiselwe, i-PTFE ingaba ukukhetha okungcono kukagesi. Kodwa-ke, izinto ezisekelwe ku-PTFE zingadinga ukwenziwa okukhethekile futhi zingase zingabi nzima kakhulu ngokomshini. I-Rogers TMM ivame ukukhethwa lapho umklamo udinga ibhalansi eqinile yokusebenza kwe-RF, ukuzinza kobukhulu, ukuthembeka kwemigodi ehlanganisiwe kanye nokukwazi ukukhiqizwa.

I-TMM vs RO4350B

I-RO4350B isetshenziswa kabanzi kumabhodi e-RF ezentengiselwano ngoba icubungula ngendlela efanayo ne-epoxy/glass ejwayelekile futhi ingabizi kakhulu. Iyindlela enamandla yama-antenna, amamojula e-RF, ama-amplifiers kagesi kanye nengqalasizinda engenantambo lapho isabelomali sokulahlekelwa kanye nobubanzi be-Dk kuhambisana khona. I-TMM iba yinhle kakhulu lapho umklamo udinga ukulahlekelwa okuphansi kune-RO4350B, inketho ephezulu ye-Dk, ukulawulwa kwe-dielectric okuqinile noma izinto eziqinile ze-thermoset ezinesethi ethile yempahla ye-TMM.

I-TMM vs i-alumina

I-Alumina akuyona i-PCB laminate evamile; iyi-substrate ye-ceramic. Ingaba yinhle kakhulu kumamojula we-microwave asebenza kahle kakhulu, kodwa iyaphuka futhi isebenzisa indlela ehlukile yokukhiqiza nokuhlanganisa. Amabanga e-High-Dk TMM angacatshangelwa lapho umklamo ufuna inzuzo ethile yobukhulu bezinto ezihlala zisebenza njenge-ceramic ngenkathi uhlala usondelene nezindlela zokukhiqiza ze-PCB. Lokhu akusho ukuthi i-TMM ithatha indawo ye-alumina kuzo zonke izimo. Kusho ukuthi i-TMM kufanele ihlolwe lapho umkhiqizo udinga ukuvumelana phakathi kokusebenza kwe-RF ehlanganisiwe kanye nokukhiqizwa kwesitayela se-PCB.

Ukufaneleka Kokukhiqiza kanye Nokusetshenziswa Kwebhodi Okuvamile

Izinhlelo ze-antenna kanye namanethiwekhi okuphakelayo

Ama-PCB e-Rogers TMM avame kakhulu asetshenziswa ezinhlelweni ze-antenna lapho ukuphindaphinda kwesigaba, ukuvimba kanye nokulahlekelwa kubalulekile. Amanethiwekhi okuphakelayo ama-array kumele asakaze amasignali nge-amplitude kanye nesigaba esibikezelwayo. Uma ukushintshashintsha kwe-dielectric kushintsha ubude bukagesi bendlela eyodwa uma kuqhathaniswa nenye, ukusebenza kwe-array kungaphazamiseka. Izakhiwo ze-dielectric ezilawulwa yi-TMM zisiza ukugcina ukuphindaphinda kuwo wonke amabhodi.

Kumabhodi e-antenna, ukukhetha izinto kuncike ku-bandwidth, usayizi we-antenna, ukusebenza kahle kwemisebe, indawo kanye nezindleko. Amabanga e-TMM angaphansi kwe-Dk angasetshenziswa lapho kudingeka khona i-bandwidth ebanzi kanye nemigqa ebanzi. Amabanga aphezulu e-Dk angacatshangelwa ezakhiweni ze-antenna ezihlangene, kodwa abaklami kumele bacabangele ukuguquguquka kwe-bandwidth kanye nokusebenza kahle.

Izihlungi ze-RF, ama-couplers nama-resonator

Izihlungi nama-resonator ziphakathi kwezakhiwo ze-PCB ezizwela kakhulu i-Dk. Ukushintsha okuncane kobukhulu be-dielectric constant noma i-trace kungashukumisa i-passband, ukulahleka kokubuya noma impendulo yokuxhuma. I-TMM ibalulekile ngoba inikeza amanani e-Dk alawulwayo kuwo wonke amamaki amaningana, okuvumela umklami ukuthi akhethe usayizi obonakalayo kanye nokuzwela kokubekezelelana okuhambisana nohlobo lwesihlungi.

Kulezi zisekhethi, umdwebo wokwenziwa kufanele ukhombe ubukhulu obubalulekile kunokuphatha zonke izici zethusi ngokulinganayo. Izikhala zokuxhuma, ubude be-resonator, izakhiwo ze-hairpin, iminwe yedijithali kanye nokuvuleka komhlabathi kungadinga ukuhlolwa okukhethekile. Kwezinye izimo, isu elihle kakhulu lokukhiqiza ukufaka amakhuphoni e-resonator noma ukuvumela ukusebenza kokulungiswa okulawulwayo ngemuva kokulinganisa isihloko sokuqala.

Ama-elekthronikhi e-radar kanye nezindiza

Ama-elekthronikhi e-radar kanye nezindiza ngokuvamile ahlanganisa imvamisa ephezulu, ukujikeleza kokushisa, ukudlidliza, izidingo zokuthembeka okuqinile kanye nokuphila isikhathi eside kwenkonzo. Izinto ezikhethiwe kuphela ngenxa yokulahlekelwa okuncane zingase zinganeli. Ibhodi lidinga nokuthembeka kwemigodi ehlanganisiwe, ukuzinza kobukhulu kanye nokuhambisana nezidingo zokuhlanganiswa kanye nezemvelo.

Ukuqina kwe-thermoset kaRogers TMM, ukuziphatha okulawulwayo kokwanda kokushisa kanye nezakhiwo zikagesi ezivame kakhulu kuyenza ibe yinto efanelekile kumamojula e-radar, amabhodi ezinzwa kanye nezinhlangano ze-microwave ezinokwethenjelwa okuphezulu. Ngomsebenzi wezindiza noma wokuzivikela, imibhalo, ukulandelelwa kwezinto, izidingo zokuhlola kanye nokucatshangelwa kokulawulwa kokuthunyelwa kwamanye amazwe nakho kungadingeka kubhekwe ngesikhathi sokuthengwa.

Izinhlelo zesathelayithi nezokuxhumana

Izinhlelo zokuxhumana ngesathelayithi kanye nezokuxhumana nge-microwave zivame ukusebenzisa izindlela ze-RF ezilawulwayo ezivimbela ugesi, izingxenye zokwamukela umsindo ophansi, ama-amplifiers kagesi, izihlungi kanye namanethiwekhi ahlukaniswe ngezigaba. Ama-PCB e-Rogers TMM angasekela le misebenzi lapho i-stackup iklanyelwe ukulahleka okuphansi kanye nesigaba esizinzile. Ezinhlelweni zokuxhumana, ukuthuthukiswa kokufakwa okuncane nokulahlekelwa kungahumushela ekubeni isabelomali sesixhumanisi esingcono, ukucindezeleka okuphansi kwe-amplifier noma ukuzwela okuthuthukisiwe kokwamukela.

Amabhodi e-Power RF kanye ne-amplifier

Amabhodi e-RF anamandla adinga kokubili ukusebenza kukagesi nokushisa. I-laminate kumele isekele i-impedance ezinzile kanye nokulahlekelwa okuphansi ngenkathi ukwakheka kususa ukushisa kumadivayisi asebenzayo. Ukuqhuba kokushisa kwe-TMM kanye nokuthembeka kwemigodi ehlanganisiwe kungasiza, kodwa ukwakheka kokushisa kwezinga lebhodi kusabalulekile. Sebenzisa ama-vias okushisa, izindiza zethusi, izisabalalisi zokushisa kanye nokuxhumana kwendlu ngamabomu, futhi uqinisekise ukuthi izakhiwo zokushisa aziphazamisi ugesi wokubuya kwe-RF.

Uhlu Lokuhlola Lwezingcaphuno Nokuklama lweRogers TMM PCB

Ikhotheshini ye-Rogers TMM PCB inembe kakhulu uma umenzi ethola iphakheji yobuchwepheshe ephelele; ngaphandle kwalokho umhlinzeki angase acaphune into ehlukile, acabange ukuthi inqubo ephephile kodwa ebiza kakhulu, noma aphuthelwe imininingwane ebalulekile ye-RF ethinta izindleko ze-TMM PCB. Ngenxa yokuthi i-TMM iyi-laminate ekhethekile evame kakhulu, idatha engaphelele ingaholela ekushintsheni kwezinto okungalungile, izinkolelo ezingalungile ze-stackup, ukwanda kwezindleko okungagwenywa noma ukubambezeleka kwe-prototype.

Ulwazi lwezinto ezibonakalayo kanye ne-stackup

• Izinga eliqondile le-Rogers TMM: TMM3, TMM4, TMM6, TMM10, TMM10i noma i-TMM13i.
• Ubukhulu be-laminate obudingekayo kanye nesisindo se-copper cladding.
• Ubukhulu bebhodi eliqediwe kanye nokubekezelelana.
• Inani lezingqimba kanye nokuqoqwa okugcwele, okuhlanganisa nezinto zokubopha ezakhiweni ezihlanganisiwe.
• Yiziphi izendlalelo eziyizendlalelo ze-RF ezilawulwayo ezivimbela ukuvimba.
• Ukuthi imaski ye-solder ivunyelwe yini kuma-trace e-RF.
• Noma yisiphi isidingo sokuvumelana ukulawula umnsalo nokusonta, ikakhulukazi ezakhiweni ezihlanganisiwe ezihlanganisa i-TMM nezinye izinto.

Izidingo zokusebenza kwe-RF

• Ukuvimba okuqondiwe kanye nokubekezelelana kohlobo ngalunye lomugqa we-RF.
• Ububanzi bemvamisa yokusebenza nokuthi umklamo ungowe-narrowband noma i-broadband.
• Ukulahlekelwa okuphezulu kokufakwa, ukulahlekelwa kokubuyiselwa noma ukubekezelelana kwesigaba uma kusebenza.
• Izidingo zekhuphoni zokulinganisa i-impedance, ukulahlekelwa noma i-S-parameter.
• Ubukhulu be-RF obubalulekile njengezikhala zokuxhuma, ubude be-resonator kanye ne-geometry yokuqalisa.
• Uhlobo lwesixhumi kanye nesincomo sokuqalisa uma kusetshenziswa izixhumi ezisemaphethelweni ebhodi.

Izidingo zokukhiqiza nokuhlanganisa

• Umkhondo omncane kanye nesikhala, ukubhoboza okuncane, isilinganiso sesici kanye nohlobo oludlulayo.
• Ubukhulu bokucwebezela, izidingo zokugcwalisa kanye nezidingo zokusebenzisa i-backdrilling uma zikhona.
• Ukuphela kobuso: ENIG, isiliva lokucwiliswa, i-OSP, igolide elithambile, i-ENEPIG noma okunye.
• Izidingo zokubopha ngocingo, ukunamathisela ngodayi noma ukuhlanganiswa okukhethekile.
• Izidingo ze-interface yokushisa: isisekelo sensimbi, ithusi elinzima, ama-via okushisa noma ukuthintana kwe-heat spreader.
• Izinga lokwamukelwa, umbiko wokuhlola, isitifiketi sezinto ezibonakalayo kanye nezidingo zedatha yokuhlolwa.

Imibuzo okufanele uyibuze umenzi wakho we-PCB

Ngaphambi kokukhipha i-Rogers TMM PCB evame kakhulu, buza umenzi ukuthi ngabe usecubungule ibanga kanye nobukhulu obuqondile be-TMM ngaphambili. Buza ukuthi yiziphi izinketho ze-foil yethusi kanye nokuqeda abangazisekela. Qinisekisa ukubekezelelana kwazo kwe-etch okufinyelelekayo ekujikeni kwethusi okukhethiwe. Buza ukuthi bazoyihlola kanjani i-impedance elawulwayo nokuthi isakhiwo sekhuphoni sifana yini nohlobo lomugqa we-RF. Kumabhodi e-hybrid, buza ukuthi i-lamination stackup iqinisekisiwe yini ngokugoba, ukusonta kanye nokuhambisana kwezinto.

Le mibuzo ivimbela inkinga evamile: umklamo oyinkimbinkimbi kagesi kodwa okunzima ukuwudala ngokuphindaphindiwe. Umkhiqizi we-TMM PCB ofanelekayo kufanele akwazi ukuxoxa ngokutholakala kwe-laminate, ezinye izindlela zokuhlanganisa i-stackup, amapharamitha okubhoboza, ukuhwebelana kokuqeda ubuso kanye nokuqinisekiswa kwe-impedance ngaphambi kokuba kubekwe i-oda. Ukuze uthole isilinganiso se-TMM esiphezulu, nikeza ibanga eliqondile, i-stackup, ibhendi yokusebenza, usayizi webhodi, ithusi, imigomo ye-impedance kanye nobuningi. Lokho kwanele ukushintsha kusuka engxoxweni yezinga lomndeni uye ekubuyekezweni okuqondene nomkhiqizo.