Ukukhiqizwa kwe-TMM Microwave PCB

Ukukhiqizwa kwe-TMM microwave PCB kuzwela kakhulu lapho i-geometry yesekethe ithwala umsebenzi, njengezihlungi, ama-couplers kanye nama-RF amplifiers. Izinguquko ezincane ebubanzi bomugqa, isikhala noma ibanga lereferensi zingashintsha impendulo elungisiwe ngisho noma ibanga lezinto lilungile. I- Rogers TMM microwave PCB iyibhodi lesekethe elisebenzisa imvamisa ephezulu elakhelwe phezu kwe-Rogers TMM thermoset microwave laminate yezihlungi, ama-couplers, ama-resonators, ama-power amplifiers, ama-low-noise amplifiers, amamojula e-radar, ihadiwe yokuxhumana ngesathelayithi kanye nama-microwave assemblies aqondile. Kuma-microwave frequency, i-PCB substrate, iphrofayili yethusi, ukuphela kwendawo, ngokusebenzisa ukuguqulwa kanye nokufakwa phansi kuyingxenye yesekethe. Umsebenzi osebenzayo ukukhetha ibanga le-TMM, ukulawula ukulahlekelwa, ukwakha i-stackup nokucaphuna ibhodi ngaphandle kokulahlekelwa impendulo ye-RF elingisiwe. Uma kubhekwa ukwakhiwa okusekelwe ku-PTFE esikhundleni salokho, ukwakhiwa kwe-microwave kwe-RT/duroid 5870 kudinga i-stackup yabo kanye nokubuyekezwa kwenqubo.

Ikhasi le-microwave ligxile ku-geometry yezihlungi, ama-amplifier kanye nama-couplers. Ingxoxo yokukhiqiza ixhumanisa ukwakhiwa kwe-dielectric, ubukhulu be-conductor, ukuguqulwa kwe-plated kanye nokuhlolwa nezakhiwo ze-RF ezinquma impendulo yesekethe esiqediwe.

Ukukhiqizwa kwe-Rogers TMM Microwave PCB Yezisekethe Ezivame Kakhulu

Kungani ukukhiqizwa kwe-microwave PCB kubucayi kakhulu kunokukhiqizwa kwe-RF PCB okujwayelekile?

Amasekethe e-microwave asebenza lapho ubukhulu obubonakalayo buba yingxenye enkulu yobude be-wavelength. I-short via stub, i-connector pad, i-copper finish, i-gond, i-gap noma i-plated edge ingashintsha ukulahleka kokubuya kanye nokulahlekelwa kokufakwa. Isihlungi singashintsha imvamisa ephakathi. I-coupler ingaphuthelwa yi-coupling flat. I-power amplifier ingaba engazinzile uma indlela yomhlabathi ingeyona i-inductance ephansi. Ngakho-ke umenzi udinga ukulondoloza i-geometry kanye ne-stackup ethathwa yimodeli ye-electromagnetic.

Yimaphi amasekethe e-microwave avame ukwakhiwa ku-Rogers TMM?

Amasekethe ajwayelekile afaka izihlungi ze-microstrip, izihlungi ze-interdigital kanye ne-hairpin, ama-branch-line couplers, ama-directional couplers, ama-Wilkinson dividers, ama-hybrid couplers, amabhodi e-amplifier anomsindo ophansi, amabhodi e-power amplifier, ama-impedance transformers, ama-resonator, amabhodi e-oscillator, amabhodi e-radar front-end kanye namamojula okuxhumana ngesathelayithi. I-TMM ikhethwa lapho la masekethe edinga i-Dk ezinzile, ukulahleka okuphansi, ukuziphatha okuhle kokushisa, ukuphathwa okuqinile kanye nokufakwa okuthembekile okumboziwe ngemigodi.

I-Rogers TMM ingena kuphi uma iqhathaniswa ne-PTFE kanye ne-RO4350B?

Ama-laminate e-PTFE amsulwa anganikeza ukulahlekelwa okuphansi kwe-dielectric, kodwa athambile futhi avame ukudinga ukucutshungulwa okukhethekile. I-RO4350B ishibhile futhi isetshenziswa kabanzi kwi-RF ejwayelekile, kodwa ine-Dk ehlukile, ukulahlekelwa, i-CTE kanye nobubanzi bebanga. I-TMM isendaweni ephakathi ewusizo: ukulahlekelwa okuphansi, ukuziphatha kwe-thermoset eqinile, izinketho ze-Dk ephezulu kanye nokuziphatha kokukhulisa ukushisa okulawulwayo. Akuyona into eshibhile ngokuzenzakalelayo noma elahlekelwa kancane; ikhethwa lapho ibhalansi ephelele kagesi, yemishini kanye neyokukhiqiza ifanelana nomkhiqizo.

Ukukhethwa Kwezinto Ze-Microwave ze-Rogers TMM Ngomsebenzi Wesekethe

Ukukhethwa kwezinto ze-microwave kuqala ngomsebenzi wesekethe, hhayi ngenombolo eyodwa ye-Dk. Ushintsho lwe-wideband noma i-feed ingase ithande i-Dk ephansi. I-resonator encane ingadinga i-Dk ephezulu. Isihlungi esivezwe ngokushisa singase sibeke phambili ukuzinza kokushisa. I-amplifier yamandla ingadinga ukuqhuba ukushisa kanye nokusekelwa okuthembekile. Ithebula elingezansi lixhumanisa amazinga e-TMM nokusetshenziswa okuvamile kwe-microwave.

Yiliphi izinga le-TMM elifanele kakhulu izihlungi ze-microwave?

Kuma-filters amancane nama-resonator, i-TMM6, i-TMM10, i-TMM10i kanye ne-TMM13i kuvame ukubuyekezwa ngoba i-Dk ephezulu inciphisa usayizi we-resonator. Kuma-filters ebhendi ebanzi noma izakhiwo ezidinga imigqa ebanzi kanye nokuzwela okuncane kokubekezelelana, i-TMM3 noma i-TMM4 ingaba ngcono. Ukukhetha okulungile kuncike emvamisa ephakathi, i-bandwidth, i-Q engalayishiwe, indawo yokwakheka, izikhala zokuxhuma, ukubekezelelana kokukhiqiza kanye nobubanzi bokushisa obulindelekile.

Yiliphi izinga le-TMM elifanele ama-amplifiers kagesi we-microwave?

Amabhodi e-Power amplifier avame ukubeka phambili i-impedance ezinzile, ukusabalala kokushisa, isisekelo esingenawo umoya ophansi kanye nokuthembeka kokuhlanganiswa. I-TMM3, i-TMM4 noma i-TMM6 yizinto ezivame ukuphakanyiswa lapho ububanzi bomugqa kufanele buhlale busebenza futhi kudingeka ukufanisa i-broadband. I-High-Dk TMM ingasetshenziswa ukufanisa okuhlangene noma i-geometry yemojuli ekhethekile, kodwa imigqa emincane kanye nokuhlushwa kwensimu okwandisiwe kufanele kubuyekezwe ngokucophelela.

Isabelomali Sokufakwa kwe-Microwave PCB-Ukulahlekelwa kuRogers TMM

Yini ebangela ukulahlekelwa kokufakwa kwi-PCB ye-microwave ye-TMM?

Ukulahleka kokufakwa yisamba sokulahlekelwa yi-dielectric, ukulahleka komqhubi, ukulahleka kwemisebe/ukuvuza kanye nokulahlekelwa kokungaqhubeki. Ukulahleka kwe-dielectric kuvela ku-TMM dissipation factor futhi kukhula ngobuningi kanye nobude bomugqa. Ukulahlekelwa komqhubi kuvela ebulukhunini bethusi, ukujiya kwethusi, ukuphela kwendawo kanye nobubanzi bomkhondo. Ukulahlekelwa kwemisebe kuvela ezakhiweni ezivulekile, ukuvikela okubi kanye nokungaqhubeki. Ukulahlekelwa kokungaqhubeki kuvela ekuqaliseni, ukugoba, ama-via, ama-tapers, ama-pad kanye noshintsho lwe-reference-plane.

Kungani ukulahlekelwa ngumqhubi kungabusa ngisho nange-TMM ephansi yokulahlekelwa?

Emazameni e-microwave, ukugeleza kwamandla kagesi eduze kobuso bomqhubi. Ithusi eliqinile landisa ubude bendlela obusebenzayo, futhi ukuqeda okune-nickel kungangeza ukumelana okwengeziwe. Umugqa omncane we-Dk ephezulu ungaba nokulahlekelwa okukhulu komqhubi kunomugqa obanzi we-Dk ophansi, noma ngabe womabili asebenzisa umndeni ofanayo we-laminate. Yingakho ukubuyekezwa kwe-PCB ye-microwave kufanele kufake i-foil yethusi kanye nokuphela kobuso, hhayi i-Dk ne-Df kuphela.

Ukulahlekelwa kufanele kuqinisekiswe kanjani?

Ukuze uthole iphrothokholi, faka ikhuphoni yokufaka nokulahlekelwa esebenzisa uhlobo olufanayo lomugqa, ithusi, ukuqeda kanye ne-dielectric njengesekethe yomkhiqizo. Linganisa ngezixhumi ezihlosiwe kanye nohlelo lokususa ukushumeka uma kudingeka. Uma ukulahlekelwa okulinganisiwe kuphakeme kunokulindelekile, hlukanisa izimbangela: ukulahlekelwa yi-dielectric, ubulukhuni bomqhubi, isijeziso sokuqeda, ukulahlekelwa kokubuyiselwa kokuqalisa, ngokulahlekelwa kokuguquka noma ngemisebe. Ukulinganisa okuhlelekile kuvimbela izinguquko zezinto ezingadingekile.

Ububanzi bezinto zokwakha: Lesi sihloko sikhuluma ngokwenziwa kwe-microwave-PCB lapho umklamo ucacisa i-TMM laminate. Qinisekisa ibanga elivunyiwe, ukwakhiwa kanye nemibhalo yezinto zokwakha ku-RFQ.

Izakhiwo zeMicrostrip, Stripline kanye ne-GCPW zeRogers TMM Microwave PCB

Kunini lapho i-microstrip yamukeleka khona kumasekethe e-microwave?

I-Microstrip iyamukeleka uma ukufinyelela, ukulungisa kanye nokufakwa kwezingxenye kubalulekile futhi imisebe ingalawulwa. Kuvamile ezihlungini, kumanethiwekhi afanayo kanye nasezihlanganisweni. Ezimweni eziphakeme, ukungakwazi ukuhambisana kwe-microstrip kumele kwenziwe imodeli. Imaski yokuhlanganisa, ubukhulu beplati kanye nezindlu zensimbi eziseduze akufanele kunganakwa ngoba kushintsha indawo yasensimini.

Kufanele kusetshenziswe nini i-stripline ekuhlukaniseni i-microwave?

I-Stripline iwusizo lapho isekethe idinga ukuvikelwa kwezinye izindawo zamabhodi noma indawo ebiyelwe. Inciphisa imisebe futhi ingathuthukisa ukulawulwa kokukhuluma. Ukushintshana kuyinkimbinkimbi kakhulu futhi kuncane ukufinyelela kokulungisa. I-Stripline ibeka umthwalo wemfanelo omkhulu ekujiyeni nasekubhalisweni kwe-lamination, ngoba umugqa ugqitshwe futhi awukwazi ukulungiswa ngemva kokwenziwa.

Kungani i-GCPW ivame kakhulu kumamojula we-microwave?

I-GCPW inikeza indawo yokuvala insimu engqimbeni engaphandle ngenkathi igcina izingxenye zifinyeleleka kalula. Isetshenziswa kabanzi ekuqaliseni izixhumi, amamojula aminyene kanye nokuguqulwa kwe-mmWave. Igebe eliseceleni komhlabathi, elidlula ocingweni kanye nokuqhubeka komhlabathi kubalulekile. Ukuntuleka noma ukungaguquguquki kocingweni kungadala ukuzwakala komsindo futhi kwehlise ukulahlekelwa kokubuya.

Isihlungi se-Rogers TMM Microwave kanye ne-Coupler PCB Design

Kungani izihlungi ze-microwave zizwela kakhulu ekubekezeleni kwe-TMM Drk kanye nokubekezelelana kwe-etch?

Impendulo yemvamisa yokuhlunga incike kubude be-resonator, igebe lokuxhuma, i-dielectric constant kanye nokulahlekelwa yi-conductor. Uma i-Dk yangempela ihlukile enanini elimodeliwe, imvamisa ephakathi iyashintsha. Uma izikhala zikhula kakhulu noma zincane kakhulu, i-bandwidth kanye ne-ripple kuyashintsha. Uma ukulahlekelwa kwethusi noma kokuqeda kuphezulu kakhulu, ukulahlekelwa kokufakwa kuyanda futhi i-Q iyehla. I-TMM iyasiza ngokunikeza i-Dk elawulwayo, kodwa impendulo yokugcina isancike ekuziphatheni kokukhiqiza.

Izikhala zemigqa ehlanganisiwe kufanele zisingathwe kanjani ekwakhiweni?

Izihlungi zemigqa ehlanganisiwe kanye nama-couplers zivame ukusebenzisa izikhala ezincane. Lezi zikhala kufanele zibonwe njengezinga elibalulekile emdwebweni. Umenzi kufanele abukeze ikhono elincane lezikhala, isinxephezelo se-etch kanye nendlela yokuhlola. Uma izikhala ziseduze nomkhawulo wokwenziwa, umklami kungadingeka alungise ukujiya kwe-dielectric, i-Dk noma i-topology kunokuphoqa i-geometry ebuthakathaka ekukhiqizeni.

Ingabe i-TMM ingayithatha indawo ye-alumina kwamanye amamojula e-microwave?

URogers ubeka i-TMM10 kanye ne-TMM10i njengabantu abazothatha indawo ye-alumina substrates kwezinye izinhlelo zokusebenza. Isizathu ukuhlanganiswa kwe-Dk ephezulu, ukuziphatha kwe-thermoset eqinile kanye nokucutshungulwa okufana ne-PCB. Lokhu akuyona indawo evamile: i-alumina isenokushisa okuphezulu kakhulu kanye nezinzuzo ezithile ze-ceramic. I-TMM iyabuyekezwa lapho umklamo ufuna ukuziphatha okuqinile kwe-Dk ephezulu ngokukhiqizwa kwe-PCB, izimbobo ezifakwe amapulangwe kanye nokuhlanganiswa kwamabhodi okulula.

Isakhiwo se-Rogers TMM Power Amplifier PCB kanye Nomklamo Wokushisa

Yini ebaluleke kakhulu kwi-PCB ye-TMM power amplifier?

Amabhodi e-power amplifier adinga i-input/output impedance elawulwayo, i-grounding ye-inductance ephansi, ukusabalala kokushisa, i-bias routing ezinzile kanye nokuhlanganiswa okuthembekile. Inethiwekhi yokufanisa i-RF kumele ibe seduze nedivayisi futhi yakhelwe phezu kwe-dielectric ehlosiwe. Ama-ground vias angaphansi naseduze kwephakheji kufanele abe makhulu ngokwanele ukunciphisa i-inductance futhi asekele ukugeleza kokushisa. Indawo yethusi, ama-thermal vias kanye nesu lokufaka kufanele kufane nedatha yedivayisi kanye nendlela yokushisa yesistimu.

I-TMM isiza kanjani ngokuqina kokushisa?

I-TMM ine-coefficient ephansi yokushisa kwe-dielectric constant kanye ne-conductivity engcono yokushisa kune-laminates eziningi zendabuko ezisekelwe ku-PTFE. Njengoba ibhodi lifudumala, ubude bukagesi kanye nokufanisa kuhlala kuzinzile kakhulu kunezinto ezishintsha kakhulu i-Dk yazo. Ukuziphatha kwezinga lokushisa kubaluleke kakhulu kuma-amplifier, ama-oscillator kanye nezihlungi ezisebenza ezindaweni eziningi zemvelo. Imininingwane eyengeziwe ihlanganiswe ekhasini le-PCB elizinzile lokushisa le-Rogers TMM.

Yimaphi amaphutha okukhiqiza athinta ukuzinza kwe-PA?

Amaphutha avamile afaka phakathi ama-via angaphansi komhlaba, ama-loop amade okuhlukanisa, i-geometry yokuqalisa engalawulwa, ukungena kwe-solder-mask emigqeni ye-RF, ukuqeda okungafanele, ukushisa okubi nge-plating kanye nezinguquko ekujiyeni kwe-dielectric ngemuva kokulingisa. Lezi zinkinga zinganciphisa inzuzo, zandise ukulahlekelwa, zidale ukujiya noma zibangele izinkinga zokuthembeka kokushisa.

Isixhumi se-Microwave Siyaqala, Ngokushintsha Nokumisa

Kungani ukuqaliswa kwezixhumi kudinga ukubuyekezwa okukhethekile?

Ukuqaliswa kwesixhumi kuwukushintshwa phakathi kwemodi ye-coaxial kanye nemodi yomugqa wokudlulisa we-PCB. Usayizi wephedi, umhlabathi ngokubeka, ukususwa kwendiza yokubhekisela, ivolumu ye-solder kanye nokuqeda konke kuthinta ukulahlekelwa kokubuya. Ukuqaliswa okusebenza ku-2 GHz kungase kungamukeleki ku-18 GHz noma ku-40 GHz. Ukuqaliswa kufanele kwenziwe imodeli noma kusekelwe kusinyathelo esiqinisekisiwe sesixhumi esikhethiwe kanye ne-TMM stackup.

Kunini lapho kudingeka khona ukubhoboza emuva?

Ukudonsa emuva kususa okungasetshenziswanga ngama-stubs angazwakala futhi onakalise ukusebenza kwe-microwave. Kufanele kusetshenziswe lapho ubude be-stub bubaluleke kakhulu ngogesi kubhendi yokusebenza nalapho i-mechanical stackup ivuma. Ukudonsa emuva kwenezela izidingo zezindleko nokubekezelelana, ngakho-ke kufanele kuchazwe ngesidingo sangempela sokusebenza kunokuba kube yinto ezenzakalelayo.

Kufanele kuklanywe kanjani ukusekela phansi?

Ukufakwa kwe-microwave kudinga izihibe zamandla ezimfushane, izindiza zokubhekisela eziqhubekayo, ngokuthunga nxazonke ze-GCPW, umhlabathi oqinile ozungeze izixhumi kanye nezindawo zedivayisi ezingenayo i-inductance ephansi. Umhlabathi uyingxenye yesekethe, akuyona iphethini yokugcwalisa eyengeziwe ngemva kokuhambisa. Ukufakwa kwe-ground okungekuhle kubonakala njengokulahlekelwa kokubuya, ukukhuluma nge-crosstalk, i-gain ripple, ukungazinzi kwe-PA noma imisebe.

Izilawuli Zokukhiqiza zama-Rogers TMM Microwave PCB

Izidingo Zokudweba Zokukhiqiza

Umdwebo wokwenziwa kufanele uchaze izinto ezithinta ngqo ukusebenza kwe-RF, ukwenziwa kanye nokuhlolwa. Izidingo ezibalulekile zifaka phakathi ibanga likaRogers TMM, ukujiya kwe-dielectric, i-layer stackup, ukujiya kwebhodi eliqediwe, isisindo sethusi, ukuqeda kobuso, imikhawulo yemaski ye-solder, i-impedance elawulwayo, ubukhulu obubalulekile, ikilasi lokwamukelwa, izidingo zokuhlola kanye nezidingo zekhuphoni. I-Highleap ibuyekeza ukwakhiwa kwengqimba ye-microwave, ama-via, incazelo yethusi kanye nanoma yiziphi izilinganiso ezilungisiwe ngaphambi kokwenziwa. Ukuqinisekiswa kwesihloko sokuqala kufanele kufane nohlobo lwesekethe, lapho kusetshenziswa khona isilinganiso se-RF lapho ukukhishwa kokukhiqiza kuncike ekusebenzeni okulinganisiwe. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa. Uhlelo lokwamukelwa kwe-microwave kufanele luhlukanise ukuqinisekiswa kwe-impedance emigqeni yokudlulisela ye-TMM kunoma yiziphi izilinganiso ezengeziwe ze-RF ezidingwa yikhasimende.

Kuma-microwave filters, ama-couplers nama-resonator, ubude be-resonator obubalulekile, izikhala zokuxhumanisa kanye nokuvuleka komhlabathi kufanele kuphawulwe ngokucacile. Kumabhodi e-antenna, ubukhulu be-patch, i-feed geometry, i-edge clearance kanye ne-solder mask keeper kufanele kuchazwe. Kumabhodi e-power amplifier, ama-thermal via arrays, ithusi eliveziwe, ama-grounding pads kanye nezindawo ezisabalala ngokushisa kufanele kuchazwe. Ekuqaliseni izixhumi, umdwebo kufanele ubonise uhlobo lwesixhumi, indawo yokuqalisa, isimo se-reference-plane kanye nephethini ye-ground-via.

Amanothi angacacile anjengokuthi “izinto ezivame kakhulu” noma “ukuqeda okujwayelekile” angadala izingozi zekhotheshini kanye nokukhiqiza. Umdwebo we-PCB we-microwave we-Rogers TMM kufanele usebenzise izidingo ezilinganiswayo ukuze amaqembu obunjiniyela, ama-CAM, abakhiqizi kanye nabahloli alandele izimo ezifanayo zokwakha.

Idatha Yesibonelo Yokulawula Ukukhiqiza

Imiphumela yesibonelo kufanele iguqulwe ibe ukubuyekezwa kokukhiqiza okulawulwayo. Uma ukulahlekelwa kokufakwa kuphakeme kunalokho obekulindelekile, iphrofayili yethusi, ukuqeda kobuso, ububanzi bokulandelela obuqediwe, isimo semaski ye-solder kanye nokulahlekelwa kokuqaliswa kwesixhumi kufanele kubuyekezwe ngaphambi kokushintsha ibanga le-Rogers TMM. Uma imvamisa ishintsha, ukubuyekezwa kufanele kugxile ekuqineni kwe-dielectric, ukucabanga kwe-Dk yomklamo, ubude obuqoshwe, igebe lokuxhuma kanye nobukhulu bebhodi. Uma ukulahlekelwa kokubuya kukubi, i-geometry yokuqalisa, ngokushintshashintsha, ukubekwa komhlaba kanye nokuqhubeka kwendiza yereferensi kufanele kuhlolwe.

Ngemva kokuthi imbangela isiqinisekisiwe, iphakheji yokukhiqiza kufanele ibuyekezwe ngama-Gerbers abuyekeziwe, i-stackup evunyiwe, idatha ye-impedance elinganisiwe kanye namanothi okukhiqiza alungisiwe. Ama-oda aphindaphindwayo kufanele alandele ukubuyekezwa okufanayo okulawulwayo, hhayi amazwana e-prototype angakahleleki. Ukuhamba komsebenzi we-prototype-to-production kuchazwa kumhlahlandlela we-prototype we-Rogers TMM PCB.

Uhlu Lokuhlola Izilinganiso ze-Microwave PCB zeRogers TMM Builds

Kudingeka Idatha Yobunjiniyela Ukuze Kutholakale Isilinganiso Esinembile

Isilinganiso se-PCB se-microwave se-Rogers TMM kufanele sisekelwe kudatha ephelele yobunjiniyela, hhayi nje kuphela usayizi webhodi kanye nenani lezingqimba. I-RFQ kufanele ibonise ngokucacile umsebenzi we-RF, isidingo sezinto ezibonakalayo, i-stackup, amafayela okukhiqiza, ama-impedance target, isidingo sokuqeda, uhlelo lokuhlola, ubuningi kanye nezidingo zokuhlanganisa.

• Ububanzi bemvamisa yokusebenza kanye nomsebenzi we-RF, njenge-antenna, isihlungi, i-coupler, i-power amplifier, inethiwekhi yokuphakelayo noma i-test fixture.
• Amafayela e-Gerber, i-ODB++ noma i-IPC-2581, idatha yokubhoboza kanye nomdwebo wokwenziwa.
• Ibanga le-Rogers TMM, ukujiya kwe-dielectric kanye nokujiya kwebhodi okuqediwe.
• Ukuhlanganiswa kwezingqimba, isisindo sethusi, izinkomba kanye nezinto zokubopha zokwakha ezihlanganisiwe.
• Uhlobo lomugqa wokudlulisela, njenge-microstrip, i-stripline noma i-waveguide ye-coplanar egxilile.
• Izinhloso zokuvimbela ezilawulwayo, ukubekezelelana kanye nezidingo zekhuphoni.
• Ubukhulu obubalulekile bezihlungi, ama-couplers, ama-resonator, izindawo ze-antenna kanye nokuqaliswa kwezixhumi.
• Ukuqeda ubuso, ukukhetha iphrofayili yethusi kanye nemikhawulo yemaski yokusongelwa.
• Ngezidingo, kufaka phakathi ama-RF grounding vias, ngocingo kanye nokushisa ngama-array.
• Izimfuneko zokuhlola kanye nemibhalo, njengombiko we-impedance, i-microsection, isitifiketi sezinto noma isitifiketi sokuhambisana.
• Ubuningi, inhloso yokulethwa, i-prototype noma isimo sokukhiqiza kanye nezidingo ze-PCBA uma kudingeka ukwesekwa kokuhlanganiswa.

Izici Zentengo Neshejuli

Ikhotheshini yokugcina incike ebangeni likaRogers TMM, ukutholakala kwezinto, ukujiya kwe-dielectric, ukusetshenziswa kwamaphaneli, inani lezingqimba, ukwakhiwa kwe-hybrid, iphrofayili yethusi, ukuqeda kobuso, ubunzima bokubhoboza, ngobuningi, ukuhlolwa kwe-impedance, izidingo zekhuphoni, izinga lokubhala, inani le-oda kanye nesikhathi sokuhola.

Ukuze ugweme izinguquko zamanani ngemva kokubuyekezwa, i-RFQ kufanele ihlukanise izidingo eziqinile nezinketho eziguquguqukayo. Uma ibanga le-Rogers TMM, ukuqeda kobuso, umbiko we-impedance noma i-microsection kuyimpoqo, kufanele kushiwo ngaphambi kwekhotheshini. Ukuze uthole ukuhlela izindleko kanye neziguquguquko zekhotheshini, bheka umhlahlandlela wamanani we-Rogers TMM PCB. Ukuze uthole ikhotheshini, nikeza i-topology ye-microwave noma ubukhulu obubalulekile, i-stackup, ibhendi yemvamisa, ukuqeda kanye nobuningi. Umhlinzeki angase ahlulele ububanzi bokusebenza, ukuhlolwa kanye nokuqinisekiswa kwe-RF kusukela kumklamo wangempela.