Ukuhlola Ukuthembeka kwe-Semiconductor PCB: Amazinga, Izindlela, kanye Nokuqinisekisa

Kungani I-Semiconductor PCB Reliability Testing Ibalulekile

Ama-PCB e-semiconductor asebenza ngaphansi kwamandla aphezulu kanye nokushintshashintsha okukhulu kwezinga lokushisa okudala ukucindezeleka okukhulu kumajoyinti e-solder, ama-trace ethusi, kanye nezakhiwo ze-laminate. Lezi zimo ezidingayo zenza ukuhlolwa kokuthembeka kwe-PCB ye-semiconductor kubaluleke kakhulu ekuvimbeleni ukwehluleka kwensimu nokuqinisekisa ukusebenza kohlelo isikhathi eside. Ngaphandle kokuqinisekiswa okuhlelekile, abakhiqizi bafaka izimangalo zewaranti engozini kanye nesikhathi esibizayo sokungasebenzi kohlelo.

Amaphakheji e-semiconductor esimanje—kusukela kumamojula wamandla kuya kuzinhlelo zokusebenza ze-RF ezivame kakhulu—adinga ukuqinisekiswa ngokumelene nezindinganiso zemboni ezimisiwe. Izinqubo zokuhlola ezifana ne-IPC-6012 kanye ne-IPC-9701 zinikeza izinhlaka ezijwayelekile zokuhlola ubuqotho bezinto, ukuqina kokuxhumana, kanye nokuphathwa kokushisa . Lesi sihloko sihlola amazinga, izindlela, kanye nezilawuli zokukhiqiza eziqinisekisa ukusebenza kwe-PCB ye-semiconductor okuthembekile kuyo yonke impilo yokusebenza.

Izindlela Zokwehluleka Okujwayelekile kuma-PCB we-Semiconductor

I-Solder Joint Fatigue

Ukunwetshwa okushisayo okuphindaphindiwe nemijikelezo yokufinyela kubangela ukukhathala kwamalunga e-solder, imodi yokwehluleka evame kakhulu kuma-semiconductor assembles. I-coefficient of thermal expansion (CTE) ukungafani phakathi kokufa kwe-silicon, ama-copper substrates, nama-organic laminates adala ukucindezeleka komshini ezindaweni zokuxhuma. Ngokuhamba kwesikhathi, lokhu kucindezeleka kuyanqwabelana futhi kuholele ekuqalisweni kokuqhekeka okugcina kubangele ukuyeka ugesi.

Nge-Cracking kanye ne-Delamination

Izimbobo ezifakwe ngaphakathi kanye nama-microvias ahlangabezana nokugxilwa kwengcindezi phakathi nohambo lwezinga lokushisa. Ukuqina kwe-copper plating okunganele noma ukwakheka okuyize ngaphakathi kwemiphongolo kudala amaphuzu abuthakathaka angenwa kalula ukuqhekeka. I-Delamination phakathi kwezendlalelo zethusi ne-dielectric kwenzeka lapho amandla okunamathela engakwazi ukumelana namandla okugunda kusuka ekukhuliseni okuhlukile okushisayo, okuphazamisa ubuqotho besignali.

Ukufuduka Kwezinsimbi

Ukuminyana okuphezulu kwamanje kuhlanganiswe nokuchayeka komswakama kubangela ukufuduka kwe-electrochemical yethusi ezindaweni ezivikelayo. Ukukhula kwe-conductive anodic filament (CAF) phakathi kokulandelana okusondelene kufanekisela ukukhathazeka okukhethekile ekusetshenzisweni kwe-semiconductor ene-voltage ephezulu. Lezi zindlela zokucekela phansi zichaza ukuthi kungani amaphrothokholi okuhlola ukwethembeka kufanele abhekane nokucindezeleka okushisayo nogesi kanyekanye.

Amazinga Abalulekile Okuhlolwa Kokwethembeka kwe-Semiconductor PCB

I-IPC-6012: Izidingo Zokusebenza Ze-PCB Eqinile

I-IPC-6012 isungula izidingo zokufaneleka zamabhodi aprintiwe aqinile kuzo zonke izigaba ezintathu zokusebenza. Isigaba sesi-3, esiyimpoqo ekusetshenzisweni kwe-semiconductor ezinhlelweni ezibalulekile, sichaza ubukhulu bethusi obuncane ezimbobeni ezifakwe amapulangwe (ubuncane bama-micron angu-25), izindlela zobuqotho be-laminate, kanye nemikhawulo yokwamukelwa kweziphambeko zokubona. Indinganiso icacisa izindlela zokuhlola zamandla e-peel, i-dielectric withstanding voltage, kanye nokumelana nokucindezeleka kokushisa.

I-IPC-9701: Ukuhlola Ukuthembeka Okuhlangene Kwe-Solder

I-IPC-9701 ihlinzeka ngohlaka lokuhlola ukusebenza okuhlanganyelwe kwe-solder ngaphansi kwezimo zamabhayisikili ashisayo. Izinga lichaza imiklamo yemoto yokuhlola, amapharamitha wephrofayela yezinga lokushisa, kanye nemibandela yokwehluleka esekelwe ezilinganisweni zokumelana nogesi. Izibalo zempilo yesici zisebenzisa ukuhlaziywa kwe-Weibull zinika amandla ukubikezela kwamazinga okuhluleka kwenkambu kanye nokusungulwa kwezicaciso ezifanele zokuhlolwa kokwethembeka kwe-semiconductor PCB.

Amazinga Okuhlola Okwengeza

Amazinga e-JESD22 avela ku-JEDEC abhekana nokukhathazeka kokwethembeka okuqondene ne-semiconductor:

• I-JESD22-A104 - Izimo zokuhlolwa kokuhamba ngebhayisikili okushisayo kanye nemibandela yokwehluleka kwamaphakheji we-semiconductor
• I-JESD22-A101 - Ukuhlola izinga lokushisa-umswakama-okuchema kokuhlolwa kokuwohloka okuhlobene nomswakama
• I-JESD22-A103 - Imingcele yokuhlola impilo yesitoreji esiphezulu nemibandela yokwamukela
• I-MIL-STD-202 - Izindlela zokufaneleka zebanga lezempi ze-aerospace kanye nezicelo zokuvikela

Izindlela Zokuhlola Okuthembekile Eziyinhloko zama-PCB we-Semiconductor

Ukuhlolwa kwe-Thermal Cycling (TCT)

Izihloko zamabhayisikili ashisayo zihlanganisela ekushintsheni okuphindaphindayo kwezinga lokushisa phakathi kuka -40°C kanye +125°C. Ubude besikhathi sokuhlolwa busuka kumjikelezo we-500 kuye ku-3000 kuye ngezidingo zohlelo lokusebenza. Ukuqapha ukumelana kwe-in-situ kuthola ukuqala kokuwohloka kwejoyinti le-solder noma ngokusakazwa kwe-crack, okuvumela ukubonakaliswa kokwehluleka kokusabalalisa. I-IPC-9701 kanye ne-JESD22-A104 icacisa amaphrofayela ajwayelekile asheshisa izindlela zokuhluleka ezincike esikhathini.

Ukuhlolwa Kwe-Thermal Shock

Ukushaqeka kokushisa kubeka ukuguquka kwezinga lokushisa okusheshayo (ngaphansi kwamasekhondi angu-10) phakathi kwezindawo ezishisayo nezibandayo. Lokhu kuhlola okunzima kuveza ukuthambekela kokuqhekeka kanye nokwakheka kokuqhekeka okungazelelwe okungenzeka kungaveli phakathi nokuhamba kancane kwebhayisikili elishisayo. Amasistimu okugeza oketshezi olubili ahlinzeka ngezimo ezinolaka kakhulu zokuhlola ukunamathela kwempahla kanye nobuqotho besakhiwo ekuhlolweni kokwethembeka kwe-semiconductor PCB.

Isitoreji Sezinga Lokushisa Eliphezulu (HTS)

Ukuchayeka okwandisiwe emazingeni okushisa aphakeme (125°C ukuya ku-150°C) amahora angu-500 kuya kwangu-1000 kuhlola ukuwohloka kwempahla ngaphandle kwemiphumela yokushisa kwamabhayisikili. I-HTS ihlonza ukubola kwe-polymer, i-copper surface oxidation, nokuwohloka kwe-dielectric okuncike esikhathini. Lokhu kuhlola kubaluleke kakhulu kuma-PCB we-semiconductor ahlangabezana namazinga okushisa aphezulu aqhubekayo ezinhlelweni zokuguqulwa kwamandla.

Ukudlidliza kanye Nokuhlolwa Kokushaqeka Kwemishini

Ukuhlolwa kokudlidliza okungahleliwe nge-IPC-TM-650 ngayinye kulingisa ezokuthutha nezindawo zokusebenza. Amaphrofayili e-Sine sweep nama-vibration angahleliwe ajabulisa ama-resonances emishini acindezela amajoyinti athengisa izinto nezinto ezinamathiselwe kwi-imeyili. Ukuhlola ukushaqeka komshini kuhlola ukusinda ngesikhathi sokuphatha nokufakwa, okubalulekile kuma-PCB ezimoto kanye ne-aerospace semiconductor PCB lapho ukuqina komshini kufana nokwethembeka okushisayo.

Izindlela ze-HALT kanye ne-HASS

I-Highly Accelerated Life Testing (HALT) isebenza ukucindezeleka okushisayo nokudlidliza okuhlanganisiwe okungaphezu kwemikhawulo ebekiwe ukuze kubonakale ngokushesha ubuthakathaka bomklamo. I-HALT yembula amaphutha acashile futhi inquma amamajini okusebenza ngaphambi kokukhiqiza. I-Highly Accelerated Stress Screening (HASS) isebenzisa ingcindezi elawulwayo ngesikhathi sokukhiqiza ukuze kuthuthukiswe ukwehluleka kokushona kwezinsana, ukuthuthukisa ikhwalithi ephumayo.

Ukuqinisekiswa Kokwethenjwa Kwe-Semiconductor PCB Kwezokukhiqiza

Ukukhethwa Kwempahla kanye Nokufaneleka

Ukuqinisekisa ukwethembeka kuqala ngokufaneleka kwezinto ezibonakalayo. I-High-Tg laminates (≥170°C izinga lokushisa lokushintsha kwengilazi) igcina ukuqina kohlangothi phakathi nohambo olushisayo oluningi. Izinto ezisezingeni eliphansi ze-CTE zinciphisa ingcindezi ezindaweni zokuhlangana zethusi-laminate. Izinhlelo zokunikeza izitifiketi ziqinisekisa izakhiwo zezinto ezibonakalayo ezingashintshi kuzo zonke izindawo zokukhiqiza, zisungula ukulandeleka okubalulekile ekuhlaziyweni kokwehluleka.

Lamination and Drilling Process Control

Amaphrofayli okushisa okukhazimulayo athonya ngokuqondile ingcindezi eyinsalela ekwakhiweni kwezingqimba eziningi. Amazinga okushisa alawulwayo kanye nokupholisa avimbela ubungozi be-warpage kanye ne-delamination ngesikhathi sokuhlolwa kokwethembeka kwe-semiconductor PCB. Ukulungiswa kwepharamitha ye-Drill kunciphisa ukucindezelwa komgqomo futhi kuqinisekisa izilinganiso ezifanele ze-copper plating.

Ikhwalithi ye-Microvia Copper Plating

I-Microvia electroplating idinga ukulawulwa okuqondile kwamanje kokuminyana ukuze kutholakale ukugcwaliswa kwethusi okungenalutho. Ukuhlaziywa kwezingxenye ezihlukene kuqinisekisa ukugcwaliswa okuphelele kanye nokufakwa kwamakhona okwanele, okubalulekile ekusebenzeni kwebhayisikili elishisayo. Ukuhlolwa kwe-X-ray kuthola izikhala ezingaphansi komhlaba ezingase ziqalise ukwehluleka ngaphansi kwengcindezi yokushisa, okuvumela ukuhlola izinhlelo zokusebenza ezibalulekile.

Ukuhlola Okokugcina Nokuhlola Ugesi

Ukuqinisekiswa kokukhiqiza kufaka izigaba eziningi zokuqinisekisa:

• Ukuhlola Okuzenzakalelayo Okubonakalayo (AOI) - Ukuhlonza isici sobuso ngaphambi kokuhlolwa kukagesi
• Ukuhlolwa kwe-Flying Probe - Ukuqinisekiswa kokuqhubeka kukagesi nezilinganiso zokumelana
• Ukuhlaziywa kwe-Microsectioning - Ubufakazi obuqondile bokuqina kwethusi kanye nekhwalithi yokubhaliswa kongqimba
• Ukuhlolwa kwe-X-ray - Ukutholwa kwe-void yangaphakathi nokuqinisekiswa kokugcwalisa kwe-microvia

Kwa-Highleap Electronics, zonke izinqubo zokuhlola nokukhiqiza ukuthembeka kwe-PCB ye-semiconductor zisebenza ngaphansi kwezinhlelo zekhwalithi ze-IPC-6012 Class 3 kanye ne-ISO/IATF.

Ukuhlola Ukuthembeka Okuthuthukisiwe KwamaSemiconductors Amandla

Power Cycling for Wide Bandgap Amadivayisi

Amadivaysi e-Silicon carbide (SiC) kanye ne-gallium nitride (GaN) asebenza emazingeni okushisa aphezulu e-junction kanye namafrikhwensi okushintsha kunama-silicon semiconductors. Ukuhlolwa kokuhamba ngebhayisikili lamandla kusebenzisa amandla omthwalo wangempela kuyilapho kuqashwe izinga lokushisa lenhlukanandlela ngamapharamitha kagesi. Lokhu kuveza ukuwohloka kwesixhumi esibonakalayo esishisayo kanye nokukhathala kwentambo yebhondi eqondene ngqo namamojula wamandla we-bandgap ebanzi.

Ukuhlaziywa kwe-Thermal Impedance

Ukuhlolwa kokushisa okudlulayo kubonisa ukumelana nokushisa ukusuka ekuhlanganeni kuya endaweni ezungezile. Amajika e-Thermal impedance aveza ukuwohloka kwezindawo zokusebenzelana ezishisayo kanye ne-delamination ngaphakathi kwesitaki se-PCB. I-infrared thermal imaging ngesikhathi sokuhamba ngebhayisikili ngamandla ikhomba izindawo ezishisayo futhi iqinisekise amamodeli okulingisa okushisayo.

Ukubikezela Ukuthembeka Okusizwa Ukulingisa

Amamodeli we-Finite element analysis (FEA) abikezela ukusatshalaliswa kwengcindezi nempilo yokukhathala ngaphambi kokwenziwa kwesibonelo. Ukulingisa okuhlanganisiwe kwe-thermal-mechanical okuhlanganisa izakhiwo zezinto ezibonakalayo kunika amandla ukufaneleka okubonakalayo, okunciphisa imijikelezo yokuhlola ngokomzimba. Ukuhlobana phakathi kwezibikezelo zokulingisa nemiphumela yokuhlola kuthuthukisa ngokuqhubekayo ukunemba kwemodeli yokuhlolwa kokwethembeka kwe-semiconductor ethuthukisiwe ye-PCB.

Isiphetho

Ukuhlolwa kokwethembeka kwe-Semiconductor PCB kuguqula inhloso yedizayini ibe yihadiwe ethembekile ngokuqinisekiswa okuhlelekile. Ukunamathela kumazinga e-IPC-6012, IPC-9701, kanye ne-JEDEC kunikeza uhlaka lokuhlola okuphelele, kuyilapho izivumelwano zokuhlola okunzima ziveza izindlela ezingase zibe khona zokwehluleka ngaphambi kokuthunyelwa kwenkambu. Izilawuli zenqubo yokukhiqiza ziqinisekisa ukuthi amadizayini afanelekile ahumusheka ekukhiqizweni okungaguquki.

I-Highleap Electronics inikeza ukuthembeka kwe-PCB ye-semiconductor okuqinisekisiwe ngokusebenzisa:

• Ukuvumelana Kwemigomo - Ukuhambisana ngokugcwele nezidingo ze-IPC-6012 Class 3 kanye ne-IPC-9701
• Ukuhlolwa Okuphelele - Ukuhamba ngebhayisikili okushisayo, ukushaqeka, ukudlidliza, namandla e-HALT/HASS
• Ukuqinisekiswa Kwenqubo - Ukufaneleka kwezinto ezibonakalayo, ukuqapha okungaphakathi kwenqubo, kanye nezinqubo zokugcina zokuqinisekisa
• Ukuhlaziywa Okuthuthukile - I-Microsectioning, ukuhlolwa kwe-X-ray, kanye nokuhlukaniswa kwe-thermal impedance
• Quality Systems - Ukukhiqiza okuqinisekisiwe kwe-ISO kanye ne-IATF nokulandeleka okuphelele

Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngokuthi indlela yethu yokukhiqiza egxile ekuthembekeni isekela kanjani izidingo zakho zokuhlanganiswa kwe-semiconductor.