Umkhiqizi we-Taconic RF-35 High-Frequency PCB

I-Highleap Electronics ikhiqiza ama-PCB e-Taconic RF-35 asebenza kakhulu ezihlungi, ama-couplers, ama-amplifier, ama-antenna, amamojula okuxhumana kanye nama-assemblies okulawula ama-microwave. Ukusekelwa kokukhiqiza kufaka phakathi i-geometry yomugqa wokudlulisa olawulwayo, ukubuyekezwa kwethusi okuphansi, ukucubungula kwe-PTH, izici zomshini ezinembile, ukuhlanganiswa kwesixhumi se-RF kanye nokuhlolwa kokusebenza kwe-RF okuchazwe ngamakhasimende noma i-RF.

I-Highleap iguqula umklamo kagesi okhishwe ube uhlelo lokukhiqiza olulawulwayo oluhlanganisa ububanzi bemvamisa, i-stackup, imodeli ye-Dk, ubukhulu be-dielectric obuqediwe, iphrofayili yethusi, ubukhulu bomugqa obalulekile kanye negebe, ukuqeda kobuso, ukuqaliswa kwesixhumi kanye nendlela yokwamukela. Lokhu kuxhumanisa izidingo zokusebenza kwe-RF nezilawuli zokukhiqiza ezilinganiswayo esikhundleni sokuthembela egameni le-laminate kuphela.

Izici zikagesi neze-RF-35

I-RF-35 ingeyesigaba sezinto ze-PTFE RF ezilahlekelwa kancane. Ekukhiqizeni, inani layo alibanjwa yinombolo eyodwa ye-Dk: impendulo yesekethe ephelele incike nasekujikeni kwe-dielectric, iphrofayili yethusi, ukuma kwe-etch, ithusi elifakwe i-plated, imaski ye-solder, ukwakhiwa kokuqeda kanye nokwakhiwa kokuqalisa.

I-Highleap ixhumanisa lezi zilawuli nenqubo yayo yokwenziwa kwe-PCB evame kakhulu futhi ayinqumi imikhawulo yokwamukelwa kusuka kudatha yewebhu ejwayelekile.

Amandla Okukhiqiza i-Taconic RF-35 High-Frequency PCB

I-RF-35 isalokhu ikhulunywa kabanzi ekwakhiweni kwe-microwave yakudala kanye nakulabhulali ye-AGC technical-article, kodwa ayifakwanga ohlwini lwezinga eliyinhloko lamanje etafuleni lomkhiqizo we-AGC RF/microwave. Ngakho-ke i-Highleap iqinisekisa umthombo wezinto ezilawulwayo kanye nemibhalo yelothi ngaphambi kokukhipha umkhiqizo.

Izilawuli Zokukhiqiza Ziyatholakala Kumasekethe e-RF-35

Amandla Okukhiqiza e-Highleap Rigid RF PCB

Imikhawulo ye-rigid-PCB eshicilelwe yi-Highleap inikeza imvilophu yefektri yokwenziwa kwe-RF-35. Kumasekethe e-microwave, ububanzi bomugqa obalulekile, igebe elihlanganisiwe, ubukhulu be-dielectric, iphrofayili yethusi kanye ne-geometry yesixhumi kukhishwa nge-DFM ethile yephrojekthi kunokuba kuthathwe emikhawulweni ephezulu yefektri. Bheka ithebula eliphelele lamandla e-Highleap rigid PCB ukuze uthole imininingwane yefektri eshicilelwe.

Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.

I-Highleap ikhiqiza ama-PCB e-RF-35 asebenza ngesivinini esiphezulu ama-antenna, izihlungi, ama-couplers, ama-splitter, ama-combiners, ama-power-amplifier circuits, ama-front end e-RF, ama-test fixtures kanye nama-mixed RF/control modules. Izakhiwo zingafaka i-microstrip, i-stripline ezakhiweni ezihlanganisiwe, i-grounded coplanar waveguide, imigqa ehlanganisiwe, ngokusebenzisa uthango, imiphetho ehlanganisiwe, imigodi, ukuqaliswa kwezixhumi kanye nezici zokubhekisela zemishini ezilawulwayo, kuye ngokuvunyelwa kwe-DFM.

Le phrojekthi ibuyekezwa ngezilawuli zokwenziwa kwe-PCB ezisebenza njalo ze-Highleap. Onjiniyela be-CAM bahlonza izendlalelo zomugqa wokudlulisela, ubukhulu bomugqa/igebe elibalulekile, izici ezihambisana nesigaba, izindawo ze-RF, izinguquko zokuqalisa, izakhiwo zokuhlukanisa kanye nanoma yiziphi izilinganiso okumele zilinganiswe ngokwehlukana nokubekezelelana kwe-PCB okuvamile.

Ukuqopha, Iphrofayili Yethusi, kanye Nokuhambisana Kobude Besigaba

Kuma-microwave frequency, ibhodi lingaphumelela ukuhlolwa kokuqhubeka kodwa lihluleke ukufaka-ukulahlekelwa, isigaba noma izidingo zokufanisa. Ngakho-ke i-Highleap iphatha i-conductor geometry kanye nobuso bethusi njengezinto eziguquguqukayo zokukhiqiza, hhayi imininingwane yobuhle.

• Isinxephezelo somsebenzi wobuciko sikhethwa ngesisindo sethusi, i-plating, ubuningi besekethe kanye nokucacisiwe Ukubekezelelana kobukhulu be-RF PCB.
• Ithusi eligoqiwe elisezingeni eliphansi, elilungisiwe emuva noma eligoqiwe liyabuyekezwa uma ukulahlekelwa ngumqhubi kubaluleke kakhulu; sebenzisa umhlahlandlela we-foil yethusi ovame kakhulu ngomongo womklamo.
• Izikhala ezihlanganisiwe ezibalulekile kanye nobukhulu be-resonator kungabekwa ohlelweni lokulinganisa lwesihloko sokuqala esikhundleni sokuthembela kuphela ekuhlolweni kwezinga lephaneli.
• Ubukhulu bethusi obuqediwe bufakiwe kumodeli ye-impedance kanye nobubanzi bomugqa ngoba i-plating ishintsha isigaba se-conductor.
• Imaski yokusongelwa phezu kwemigqa yokudlulisela ilawulwa ngokwemodeli yomklamo; ayifakwa noma ayisuswa ngaphandle kwemvume.
• Ukuqondiswa kwephaneli kanye nendawo yekhuphoni kuhlelwa lapho ukuhambisana kwesigaba noma ubukhulu kuyo yonke iphaneli yokukhiqiza kubalulekile.

I-Highleap iphinde ibukeze ubudlelwano phakathi kwemodeli yokuklama kanye namanani okukhiqiza achazwe ku- dielectric constant kanye ne-loss tangent . Inani le-Dk eliyifa alanele ukukhulula isekethe ebalulekile; indlela yokubala evunyelwe ngamakhasimende kanye nokwakhiwa kulawula i-geometry.

Impedance, Ukulahlekelwa Kokufakwa, kanye Nezidingo Eziphansi ze-PIM

I-impedance elawulwayo ichazwa yisakhiwo somugqa wokudlulisela, ithagethi, ukubekezelelana, imvamisa yokuhlola kanye nokuxhumana kwekhuphoni. Inqubo yokulawula i-impedance ye-RF ye-Highleap ibuyekeza ukujiya kwe-dielectric okuqediwe, ithusi, ububanzi bomugqa, isikhala somhlabathi, i-plating kanye nezimo zemaski ngaphambi kokuba idatha yokukhiqiza ikhishwe.

Ukulahlekelwa kokufakwa, ukulahlekelwa kokubuyiselwa, isigaba kanye ne-PIM akufakiwe ngokuzenzakalelayo kusilinganiso sebhodi elingenalutho. Lapho kudingeka, i-RFQ kumele ichaze indlela yokuhlola, ibhendi yemvamisa, isixhumi noma isixhumi esibonakalayo, indiza yokulinganisa, inani lesampula kanye nomkhawulo wokwamukelwa. I-Highleap ingaxhumanisa ukuhlolwa kwe-RF okuchazwe ngamakhasimende noma ilethe amabhodi alungiselelwe ukusethwa kokuhlolwa okufanelekile kwekhasimende.

Kumikhiqizo ye-antenna ezwela i-PIM, i-Highleap isebenzisa ukwakheka kanye nezilawuli zezinto ezichazwe kumklamo we-PCB we-PIM ephansi kanye nokukhethwa kwezinto ze-PIM ephansi.

Ukulawulwa Kwemishini Nokugoba Okufakwe Amabhodi E-PTFE

I-RF-35 ihlotshaniswa nokwakhiwa kwemvamisa ephezulu okusekelwe ku-PTFE. Ukulungiswa kwemigodi, ukwenziwa kusebenze, ukunamathela kweplati, ukwesekwa komzila kanye nokuphathwa kobukhulu kudinga umzila ohambisana ne-laminate yangempela. I-Highleap iqinisekisa izinto ezinikeziwe kanye nesiqondiso sokucubungula ngaphambi kokusebenzisa inqubo ye-PTH.

Ukuqhubeka Kwezinto Ngaphandle Kokushintsha Kukagesi Okungavunyelwe

Uma isitokwe se-RF-35 esidala silinganiselwe, i-Highleap ihlukanisa inkinga yokuphakelwa nesinqumo sikagesi. Enye indlela ehlongozwayo ayikhishwa kuze kube yilapho ikhasimende libuyekeza imodeli ye-Dk, ukulahleka, ukujiya, ithusi, impendulo yesigaba, inqubo ye-PTH, ukuhambisana nanoma yiluphi ubuciko noma ushintsho lokulungisa.

• Amapharamitha okubhoboza kanye nemikhawulo yokushintsha amathuluzi kukhethwa ngobukhulu be-laminate, ithusi kanye nomgodi;
• Ukulungiswa kodonga lwembobo kuhambisana nezinto eziqinisekisiwe kunokuba kukopishwe kusuka ku-FR-4;
• ithusi elingena-electrolytic kanye nethusi elingasebenzi lilawulwa ngokwesidingo sembobo eqediwe kanye nethusi elingasebenzi;
• izingxenye ezincane ezimele zichazwe ezakhiweni zemigodi enobungozi obukhulu noma izinhlelo zekhwalithi yenkontileka;
• ukuqondisa kanye nokususa amaphaneli kusekela amasekethe e-RF amancane noma azwela ngomshini;
• Izixhumi zomphetho, ama-castellations, imiphetho eboshwe ngepulasitiki, izikhala kanye nama-counterbores kuyabuyekezwa ukuze kutholakale ukuthi kungenzeka yini ukwenziwa kanye nobukhulu bokugcina.

Ukubekwa ngendlela kungathinta futhi ukubuya kwe-RF current kanye ne-resonance. I -RF PCB ngesiqondiso sokuklama inikeza umongo wokuklama, kuyilapho ukubuyekezwa kokukhiqiza kwe-Highleap kuqinisekisa ukuthi yini engabanjwa futhi ilinganiswe ku-stackup yangempela.

Ukuhlanganiswa Kwamadivayisi e-RF, Izixhumi, kanye Nezivikelo

I-Highleap ihlanganisa amabhodi e-RF-35 aneziphazamisi ezincane, amaphakheji e-QFN/LGA, ama-transistors e-RF, ama-mixer, ama-filter, ama-oscillator, amafreyimu okuvikela, izixhumi ze-coaxial kanye nehadiwe yemishini. Indlela yokuhlanganisa ikhethwa kusukela ku-BOM, ukwakheka kokushisa, ukuphela kwephakheji kanye nezidingo ze-RF grounding.

Ukuhlolwa kungafaka phakathi i-SPI, i-AOI, izindlela zokubona kanye nokuhlolwa kwe-X-ray kwama-pad afihliwe. Inqubo iyonke ihambisana nensizakalo yokuhlanganisa i-SMT PCB ye-Highleap kanye nencazelo yokuhlolwa kwe-RF yekhasimende.

Isibuyekezo Sobunjiniyela, Ukulethwa, kanye Nesilinganiso se-RF-35

I-Highleap inikeza ishejuli ezinikele ngemuva kokuqinisekisa izinto, idatha yobunjiniyela, umzila wokukhiqiza, i-BOM yokuhlanganisa kanye nobubanzi bokuhlola. Izinketho zokusheshisa zihlolwa ngokukhiqizwa okusheshayo kwe-PCB okuvamise kakhulu futhi kungafaka phakathi ukukhiqiza okubalulekile, ukuthunyelwa kwento yokuqala noma imigqa ehlukene yebhodi elingenalutho kanye ne-PCBA.

Ukuze uthole umzila ophelele we-PCB kanye ne-PCBA, i-Highleap ingahlanganisa ukubuyekezwa kwe-RF laminate nobunjiniyela bokuhlanganisa be-RF PCB kanye nesilinganiso sokukhiqiza esisemthethweni.

Isikhathi sekhotheshini siqala ngedatha ephelele ye-RF. I-Highleap iqinisekisa ukulungela izinto kanye nenqubo ngaphambi kokunikeza ukukhiqizwa okujwayelekile noma okusheshayo ngendlela yayo esheshayo yokukhiqiza i-PCB evame kakhulu.

Thumela i-Gerber/ODB++, umdwebo wokwenziwa, i-stackup elawulwayo, i-RF geometry noma ithebula le-impedance, ithusi, ukuqeda, amafayela okubhoboza/umzila, imibhalo yezinto ezibonakalayo, ubuningi, usuku oluqondiwe, i-BOM, i-centroid, imidwebo yokuhlanganiswa kanye nendlela yokuhlola i-RF nge- Highleap Electronics . Ukuze uthole imininingwane yezindleko zezentengiselwano, bheka intengo ye-RF-35 PCB kanye nesikhathi sokuhola ; ukuze uthole ububanzi bokukhiqiza obuphelele, bheka ukwenziwa kwe-RF-35 PCB kanye nokuhlanganiswa.

Ingabe i-Highleap ingakwazi ukukhiqiza amasekethe e-RF-35 ahambisana nesigaba?

Yebo, ngemva kokuchazwa kwezakhiwo ezifanisiwe, imodeli yokuklama, ukubekezelelana kokukhiqiza, indlela yokulinganisa kanye nemikhawulo yokwamukelwa.

Ingabe ukuhlolwa kwe-Highleap kubuyisela ukulahlekelwa noma ukulahlekelwa?

Ukuhlolwa kwe-RF okuchazwe yikhasimende kungabuyekezwa. Imvamisa, i-fixture, i-calibration plane, inani lesampula kanye nemikhawulo kumele kuvunyelwane ngayo ngaphambi kwekhotheshini.

Ingabe i-RF-35 ingahlanganiswa nezendlalelo ze-FR-4?

Ukwakhiwa kwe-hybrid kungenzeka, kodwa izinto zokubopha, ukugeleza kokucindezela, ukwanda kokushisa, ukujiya okuphelele kanye noshintsho lwe-RF kumele kuklanywe futhi kuvunyelwe.

Kwenzekani uma izinto ze-RF-35 zingatholakali?

I-Highleap ibika isimo sezinto ezibonakalayo futhi ingaphakamisa indlela ehlukile ebhalwe phansi yokuvunyelwa kwamakhasimende. Akukho okunye okusetshenziswa esikhundleni salokho ngaphandle kwemvume ebhaliwe.

Yimiphi idatha ye-RF okufanele ifakwe kumafayela e-PCB?

Faka ububanzi bemvamisa, i-stackup, ubukhulu obulawulwayo, ama-impedance target, izidingo zesigaba noma zokufakwa-ukulahlekelwa, ithusi kanye nokuqeda, ukuqaliswa kwesixhumi, izidingo zekhuphoni kanye nendlela yokuhlola noma umkhawulo wokwamukelwa.

Ingabe i-Highleap iyayinikeza i-RF-35 PCB assembly kanye ne-connector installation?

Yebo. I-Highleap ingacaphuna i-SMT/THT assembly, ukufakwa kwesixhumi se-RF kanye nesihlangu, ukuhlolwa, ukuhlanza, ukuhlela kanye nokuhlolwa kokusebenza okuchazwe ngamakhasimende noma kwe-RF njengephakheji eyodwa yokukhiqiza.