Intengo ye-Taconic TLY PCB kanye ne-PCBA Quotation
I-Highleap Electronics inikeza izingcaphuno zentengo ze-Taconic TLY PCB ze-radar engu-77 GHz, ama-antenna e-mmWave, i-satellite RF, amamojula ezindiza kanye nemikhiqizo ye-microwave elahlekelwa kancane. Izingcaphuno zingafaka i-TLY laminate eqondile, ukwenziwa kwe-PCB ngokunemba, ukuhlolwa kwento yokuqala, ukutholakala kwezingxenye, ukuhlanganiswa kwe-RF, i-X-ray, ukuhlolwa okuchazwe ngamakhasimende, ukupakisha kanye nokulethwa.
Ayikho intengo eyodwa yeyunithi ye-TLY esebenzayo. I-TLY-3, TLY-5, TLY-5A, TLY-5Z kanye nokwakhiwa kwefa kuhlukile kudatha ye-dielectric, ukutholakala kobukhulu, ithusi, ukuphathwa kwamaphaneli, ukuthembeka kwe-PTH, ukukhiqizwa kwezinto kanye nokusetshenziswa. Intengo ephezulu yezinga elikhishwe kanye nenqubo kunokuhlanganisa umndeni ngaphansi kwesilinganiso esisodwa esijwayelekile.
Umehluko Ohlobene Nentengo we-TLY-3, TLY-5 kanye ne-TLY-5Z
Idatha yamanje ye-AGC ibeka i-TLY-3 kanye ne-TLY-5 njengezinto ze-PTFE zengilazi elukiwe eziphansi kakhulu ze-Dk, ezilahlekelwa kancane zezinhlelo zokusebenza ze-radar, i-satellite, amaselula kanye nezindiza. I-TLY-5Z isebenzisa isakhiwo esilukiwe esigcwele ingilazi esenzelwe ukunwetshwa okuphansi kwe-Z-axis kanye nokuthuthukiswa kokuqina kwembobo efakwe i-plated. Ukukhetha phakathi kwazo kushintsha kokubili ukwakheka kukagesi kanye nezindleko zokukhiqiza.
| Ibanga lamanje | Idatha eshicilelwe / indawo | Umthelela oyinhloko wekhotheshini |
|---|---|---|
| I-TLY-3 | I-Dk 2.33 ± 0.02; I-Df 0.0012; Izinto ze-RF/mmWave eziphansi kakhulu ze-Dk. | Ubukhulu obuqondile, ithusi, isivuno samaphaneli, i-geometry encane kanye nobubanzi bokwamukelwa kwe-RF. |
| I-TLY-5 | I-Dk 2.2 ± 0.02; I-Df 0.0009; izinto ezilahleka kancane kakhulu ezisetshenziselwa i-77 GHz kanye ne-mmWave. | Ukuphathwa kwezinto ezincane, iphrofayili yethusi, ubukhulu obubalulekile kanye nezidingo zokuhlola. |
| I-TLY-5Z | I-Dk 2.2 ± 0.04; I-Df 0.0015; izinto ezisezingeni eliphansi le-Z-axis ezine-PTH-stability positioning. | Ukwakhiwa kwe-PTH, ukujiya, izidingo zemishini kanye nemodeli kagesi evunyiwe. |
| Ifa/enye i-TLY | Sebenzisa ishidi ledatha lamakhasimende elilawulwayo kanye nomthombo ovunyiwe. | Ukuphakelwa, i-MOQ, izitifiketi, iziqu kanye nezindleko zokushintsha ezingaba khona. |
Izinkomba ezisemthethweni: I-AGC TLY-3, i-AGC TLY-5 kanye ne-AGC TLY-5Z.
Intengo ye-Taconic TLY PCB ngokwezinga kanye nokwakhiwa
Umndeni we-TLY uhlanganisa ukwakheka okuhlukile kwe-PTFE ene-Dk ephansi. Amakhasi amanje e-AGC akhomba i-TLY-3, TLY-5 kanye ne-TLY-5Z, ene-Dk, Df, ubuningi, ukuziphatha kwe-Z-axis okuhlukile kanye nokubekwa kwesicelo. Ngakho-ke "intengo ye-TLY PCB" idinga ibanga eliqondile kanye nokwakhiwa.
Lokho Okungafakwa Yi-Highleap TLY Quotation
| Indawo yephrojekthi | Ukusekelwa kwephrojekthi ye-Highleap |
|---|---|
| Ukuthengwa kwezinto ezibonakalayo | Ibanga eliqondile, ukujiya, ithusi, i-MOQ, isitifiketi kanye nokutholakala |
| Ukwenziwa ngokunemba | Ukuphathwa kwephaneli encane, ukuqopha i-RF, i-PTH, izici zemishini, ukuhlolwa kukagesi nokuhlolwa |
| Ubufakazi bekhwalithi | Ubukhulu obubalulekile, umbiko wesihloko sokuqala, amarekhodi e-impedance/RF kanye ne-X-ray uma kuchazwe |
| Assembly | Izingxenye, i-stencil/NRE, i-MMIC/QFN/BGA, izixhumi ze-RF, izihlangu kanye nokuhlanza okulawulwayo |
| Testing | Ukuhlela, ukuhlolwa kokusebenza kanye nokuqinisekiswa kwe-radar/mmWave okuchazwe ngamakhasimende |
| Ukulethwa/ukusekelwa | Izibonelo kanye nezigaba zomthamo, ukupakisha, ukuthutha, ukulandeleka kanye nokulawula uku-oda okuphindaphindiwe |
Amandla Okukhiqiza e-Highleap Rigid RF PCB
Imikhawulo yefektri eshicilelwe ngezansi inikeza isisekelo sokubuyekezwa kwentengo ye-TLY. Ukuphathwa kwe-PTFE encane, ubukhulu obubalulekile be-RF, ithusi eliphansi, ukwesekwa kwephaneli kanye nokuhlolwa kunganciphisa ifasitela lenqubo esebenzayo yokwakhiwa kwe-TLY ethile. Bheka ithebula eliphelele lamandla e-Highleap rigid PCB ukuze uthole imininingwane yefektri eshicilelwe.
| Into yokukhiqiza | Amandla e-Highleap ashicilelwe | Isimo sephrojekthi ye-RF/PTFE |
|---|---|---|
| Isibalo esiphezulu sesendlalelo | Kufika ku-60 izendlalelo | Inani lezingqimba ze-RF/PTFE ethile noma i-hybrid stackup liyaqinisekiswa ngemuva kokuncishiswa, ukubhaliswa, ukubuyekezwa kwezinto kanye nokwengezwa kwezinto. |
| Umkhondo/isikhala esincane esingaphakathi | 2/2 mil (0.05/0.05 mm) | I-geometry ye-RF ekhishwe incike nasekujiyeni kwethusi, uhlobo lwe-foil, isinxephezelo se-etch kanye nokubekezelelana kobukhulu obubalulekile. |
| Umkhondo/isikhala esincane esingaphandle | 2/2 mil (0.05/0.05 mm) | Izikhala ezincane ze-RF kanye nezakhiwo ezihlangene zidinga izindlela zokuhlola kanye nokwenzeka kwephrojekthi ethile. |
| Ibanga lokujiya kwebhodi | I-0.2-8.0 mm | Ubukhulu obutholakalayo bokwakhiwa kwe-Taconic/AGC okuqanjwe ngegama buxhomeke ku-laminate gauge, indlela yokubopha kanye ne-stackup evunyiwe. |
| Ukubekezelelana kobukhulu bebhodi | ± 0.1 mm ngaphansi kuka-1.0 mm; ± 10% ku-1.0 mm nangaphezulu | Ukuqaliswa kwesixhumi se-RF kanye nezixhumi ezivalekile kufanele kuveze noma yiziphi izidingo eziqinile ezingeni lomkhiqizo. |
| Usayizi webhodi oqediwe okungenani | 10 × 10 mm | Amasekethe amancane angadinga ukulethwa kuphaneli yokukhiqiza noma i-array ukuze kwenziwe futhi kuhlanganiswe. |
| Usayizi webhodi ophelele oqediwe | 22.5 × 47.5 in (571.5 × 1206.5 mm) | Amabhodi e-PTFE amakhulu adinga ukubuyekezwa okuhlukile kosayizi weshidi lezinto, ukubhaliswa, ukuba yisicaba, ukuhanjiswa kanye nokuthunyelwa. |
| Indandatho encane yomshini wokubhoboza / indandatho ejikelezayo | 0.15 mm / 0.127 mm | Umklamo wokugcina uncike ekujiyeni kwebhodi, isilinganiso sesici, isidingo sokufaka iplati kanye nenqubo yokubhoboza eqondene nezinto ezithile. |
| Indandatho encane ye-laser drill / indandatho ye-annular | 0.075 mm / 0.075 mm | Ama-microvia e-laser angaphansi kobukhulu be-dielectric, ukwakheka kwe-capture-pad, ukwakheka kwethusi kanye nokubuyekezwa kwe-sequentially-lamination. |
| Isilinganiso sesici sokubhoboza ngomshini | Kuze ku-20: 1 | Isilinganiso esingafinyeleleka sokwakhiwa kwe-RF/PTFE kumele siqinisekiswe ngosayizi wembobo oqediwe, ukujiya kwebhodi kanye nesidingo sokufaka iplati. |
| Isilinganiso sesici se-laser-drill | 1:1 | I-Microvia geometry ikhishwa kuphela ngemva kokubuyekezwa kwe-stackup nokuthembeka. |
| Ithusi elingaphakathi/elingaphandle eliphezulu | Kufika ku-10 oz | Ithusi elikhulu alikwazi ukuhlanganiswa ngokuzenzakalelayo nomkhondo/isikhala esihle kakhulu noma yonke into eyakhiwe nge-PTFE. |
| Ukubekezelelana kwe-PTH / NPTH | I-PTH ±0.075 mm; I-NPTH ±0.05 mm | Izimbobo zokuxhuma kanye ne-RF grounding kufanele zibone ububanzi obuqediwe kanye nanoma yisiphi isidingo sokulingana okuqinile. |
| Ukubekezelelana kwe-contour | ± 0.1 mm | Ukuqaliswa komphetho, imigodi, izikhala kanye nezindawo zokuxhuma kungadinga uhlelo olukhethekile lokulawula ubukhulu. |
| Ukubekezelelana kwe-impedance okulawulwayo | I-single-end kanye ne-differential: ±5 Ω ku-≤50 Ω; ±7% ngaphezu kwama-50 Ω | Ukubekezelelana okucashuniwe kusebenza endleleni evunyiwe yokuqoqa ama-stackup, isu lekhuphoni kanye nendlela yokulinganisa. |
| Ukuqedwa kwendawo okutholakalayo | I-ENIG, i-ENEPIG, i-OSP, i-HASL, isiliva lokucwilisa, ithini lokucwilisa, igolide elikhanyayo, iminwe yegolide eqinile negolide | Ukukhethwa kokuqeda kubuyekezwa ngokulahlekelwa yi-RF, ukushiswa kwe-solder, ukubopha ucingo, ukuxhumana kwesixhumi kanye nezidingo zemvelo. |
Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.
| Isibonelo selungu lomndeni | Indawo eshicilelwe | Umthelela kwezentengiselwano |
|---|---|---|
| I-TLY-3 | Izinto ze-PTFE zengilazi elukiwe eziphansi kakhulu ze-Dk, i-Dk 2.33 ±0.02 | I-geometry ehlukene kanye nesitoko kusuka kumamaki e-Dk-2.2. |
| I-TLY-5 | Izinto eziphansi kakhulu ze-Dk, ezilahlekelwa kancane kakhulu, i-Dk 2.2 ± 0.02 | Kuvamile ezingxoxweni ze-mmWave/radar; ukujiya kanye nethusi kusalawula intengo. |
| I-TLY-5Z | Ukwakhiwa kwe-Low-Dk, i-Z-axis ephansi kanye nokwakhiwa kwe-low-density | Kungakhethwa ukuzinza kwe-PTH noma izinhlelo zokusebenza ezilula; akunantengo njenge-TLY-5 ejwayelekile. |
| Ikhodi yefa noma yekhasimende | Kungabhekisela esichasisweni se-TLY esidala noma imininingwane yangaphakathi | Kudinga i-TDS elawulwayo kanye nomthombo ovunyiwe ngaphambi kwekhotheshini. |
I-Highleap ithi izinga, ubukhulu, ithusi, umthombo, izidingo zesitifiketi kanye nezinye izindlela ezivunyelwe ku-quotation. Akukho lungu lomndeni le-TLY elithathelwa indawo kuphela ngoba igama lalo noma igama elithi Dr liseduze.
Ubukhulu Bezinto, Ithusi, kanye Nokusetshenziswa Kwephaneli
Intengo ye-TLY ithintwa kakhulu ukujiya kwe-laminate kanye nenketho yethusi. Ama-cores amancane e-mmWave, ithusi elingaphansi kwephrofayili/eligoqiwe kanye nokulungiswa kweshidi okungejwayelekile kungaba nokutholakala okuhlukile, ukuthengwa okuncane kanye nesivuno sokuphatha.
Ukuhlukanisa Intengo Yezinto Ezibalulekile Nengozi Yokukhiqiza
Intengo ephansi ye-laminate ayiqinisekisi izindleko ze-PCB eziqediwe eziphansi uma ukwakhiwa kunciphisa isivuno sephaneli, kudinga ukuphathwa okuqinile, kunezela ingozi ye-PTH noma kushintsha izidingo zokuhlolwa kwe-RF. I-Highleap ibala lawo ma-driver futhi ingaqhathanisa izinketho ze-TLY nezindleko ezikhethekile ze-PCB ze-laminate eziphansi noma eminye imizila yezinto ezivunyiwe lapho umnikazi womklamo evumela ezinye izindlela.
- ukujiya kanye nokubekezelelana kwe-dielectric ngqo;
- uhlobo lwe-copper foil, isisindo kanye nephrofayili yobuso;
- ubukhulu bebhodi eliqediwe kanye nobuningi ngephaneli ngayinye yokukhiqiza;
- izitimela zamathuluzi, amakhuphoni, izimfuneko ze-fiducials kanye nephaneli yokuhlanganisa;
- ukuqondiswa kwebhodi lapho isakhiwo esilukiwe noma i-geometry ye-antenna kubalulekile khona;
- inzuzo esebenzisekayo ngemva kokusebenzisa i-routing, amakhuphoni okuhlola kanye nezici zokuqalisa umkhawulo.
I-Highleap ibuyekeza ukusetshenziswa kwezinto zokwakha kanye nemodeli yezindleko ze-PCB evame kakhulu kanye nokukhetha i-RF copper foil . Iziphakamiso zokwehlisa izindleko zigxile ekwakheni okujwayelekile okutholakalayo kanye nokusetshenziswa kwephaneli okungcono, hhayi ushintsho olungavunyelwe ekusebenzeni kukagesi.
Izindleko Zokukhiqiza Nekhwalithi Yezisekethe ze-TLY
Izindleko zokwenziwa kwe-TLY zibonisa okungaphezu kweshidi le-PTFE. Ukuphathwa kwezinto ezincane, ukuthwebula izithombe ngokunemba, isinxephezelo sokusika, ukulungiswa kwembobo efakwe ipulasitiki, izici ze-laser, i-hybrid lamination, ukwesekwa komzila kanye nobufakazi be-RF kungaba yinto ebalulekile.
| Indawo yezindleko | Kungani kudingeka | Indlela yokuyilawula |
|---|---|---|
| Ukuthwebula/ukuqopha i-RF okunembile | I-mmWave geometry ingaba bucayi ezinguqukweni ezincane zobukhulu | Khomba kuphela izici ezibaluleke kakhulu kanye nokubekezelelana okulinganisekayo. |
| I-PTH noma ngokucubungula | Ukulungiswa kwezinto ezithile kanye nokuthembeka kwembobo | Sebenzisa izilinganiso zembobo/i-aspect ezingakhiqizwa kanye ne-scope ye-microsection echaziwe. |
| I-lamination ye-hybrid | Uhlelo lokubopha, ukugeleza, ingcindezi kanye nokubhaliswa | Nikeza i-stackup ekhishwe futhi ugweme imijikelezo yokunyathelisa engadingekile. |
| Amakhuphoni/ukuhlolwa kwe-RF | Iqinisekisa izidingo ze-impedance, ukulahlekelwa noma isigaba | Vumelana ngendlela yokuhlola kanye nokuthatha amasampula ngaphambi kokusebenzisa amathuluzi. |
| Ukwesekwa kwemishini | Amaphaneli amancane adinga izinto zokwakha kanye nokuphathwa okuvikelayo | Yakha ama-paneli rails aqinile kanye nokusekelwa kokuthunyelwa. |
| Amadokhumenti ekhwalithi | Ukulandelela, i-FAI, amarekhodi obukhulu kanye nogesi | Cacisa ubufakazi obudingekayo ngokwesivumelwano kunokuba kube yimibiko ejwayelekile. |
Inqubo yokubekezelela i-RF ye-Highleap kanye nezinketho zokuhlola i-RF PCB zisetshenziselwa ukuchaza ubufakazi bokukhiqiza obudingekayo.
Ukuhlelwa Kwezindleko Ze-TLY Prototype, NPI, kanye Nomthamo
Intengo ye-TLY yohlobo lwe-prototype ifaka phakathi ubuncane bezinto ezibonakalayo, ubunjiniyela, amathuluzi kanye nokusetha inani elincane. I-NPI yengeza ukubuyekezwa kwesihloko sokuqala, ukufunda kokuhlanganisa kanye nokuthuthukiswa kokuhlolwa. Izindleko zomthamo zingathuthuka ngokuthenga okubikezelwe, ukuphinda amathuluzi, ukwenza ngcono amaphaneli kanye namashejuli okukhishwa azinzile.
| Stage | Ukugxila kwezindleko okuyinhloko | Umphumela wesilinganiso se-Highleap |
|---|---|---|
| prototype | Impendulo encane yezinto ezibonakalayo kanye nobunjiniyela obusheshayo | Izinketho ezijwayelekile nezisheshayo ezinobufakazi obuyisisekelo. |
| Ukuqinisekiswa kwe-RF | Ubukhulu obubalulekile, amakhuphoni, ukuqaliswa kwesixhumi kanye nokuhlolwa kwe-RF | Uhlelo lwesihloko sokuqala kanye nokuhlolwa okuhlukile/i-NRE. |
| Umshayeli we-PCBA | Ukutholakala kwe-BOM, i-stencil, i-fixture, ukuhlolwa kanye nokuhlela | Ibhodi elingenalutho, ukusetha, ukuhlanganisa kanye nokuhlaziywa kokuhlolwa. |
| ivolumu | Inzuzo yephaneli, isibikezelo sezinto ezibonakalayo, amanani ezinto kanye nesivinini sokulethwa | Ukwephulwa kwenani kanye namanani okukhishwa okuhleliwe. |
| Uhlelo lwempilo ende | Ukuqhubeka kwezinto ezibonakalayo, ukulawula ushintsho kanye nokulandeleka | Isu lokubhukha/lomthombo wesibili lincike ekuvunyelweni. |
Izindleko ze-PCBA zakhiwe kusukela ku-BOM kanye nengxube yephakheji kusetshenziswa izinto zezindleko zokuhlanganisa ze-PCB kanye nensizakalo yokuhlanganisa ye-PCB ye-turnkey ye-Highleap.
Isikhathi Sokuhola: Izinto Ezibalulekile Nokuhlolwa Ngokuvamile Kubeka Indlela Ebucayi
Isikhathi sokulethwa kwe-TLY sincike ebangeni eliqondile, ukujiya, ithusi, ubuningi obudingekayo, ubunzima bokwenziwa, izingxenye zokuhlanganisa kanye nokuhlolwa kwe-RF. I-Highleap iyaqinisekisa lezo zinto ngaphambi kokwenza usuku.
I-Highleap iqinisekisa isikhathi sokucaphuna ngemva kokutholakala kwezinto, ukusebenziseka kahle kwesici, isimo sengxenye yokuhlanganisa kanye nokulungiselela ukuhlolwa kuyaziwa. Ukwenziwa okusheshayo, ukuhlanganiswa kwento yokuqala kanye nokuthunyelwa kokukhiqiza kubiza futhi kuhlelwe njengokulethwa okuhlukile lapho lokho kunciphisa ubungozi bohlelo.
- ukubuyekezwa kwezinto eziza kuqala kanye nokwakhiwa kwezinto ukukhiqizwa kwe-PCB okusheshayo;
- ukuthunyelwa kwe-bare-board-first noma kwe-first article ukuze kuqinisekiswe i-RF kusenesikhathi;
- ingqophamlando yokuhlanganisa lapho izingxenye noma izinto ezisetshenziswayo zinesikhathi eside sokuhola;
- ukulethwa kwenani elihlukanisiwe lapho ukuqinisekiswa kokukhiqiza kungaqala ngaphambi kwe-oda eligcwele;
- ukubikezela kanye nokuhlela izinto ezigciniwe ukuze kudingeke okuphindaphindwayo.
Ikhotheshini ikhomba izibikezelo zosuku kanye nanoma yisiphi isenzo samakhasimende esidingekayo ukuze kugcinwe ishejuli, njengokuvunyelwa kwe-stackup, ukuvunyelwa kwengxenye ehlukile, ukukhishwa kwe-test-fix noma ukwamukelwa kokuthunyelwa okuhlukanisiwe.
Cela Intengo ye-TLY PCB kanye neSheduli ye-PCBA
Thumela ibanga eliqondile le-TLY, isidingo sezinto/ukujiya/sethusi, i-Gerber/ODB++, umdwebo wokwenziwa, i-stackup, i-RF geometry noma i-impedance, idatha yokubhoboza/yomzila, ukuqeda kwendawo, ubuningi, usuku oluqondiwe, indawo yokulethwa, i-BOM, i-centroid, imidwebo yokuhlanganisa, i-firmware kanye nencazelo yokuhlola ngesilinganiso esisheshayo se-Highleap noma uxhumane ne-Highleap.
Ukuze ukhiqize i-TLY-5 mmWave, buyekeza ukukhiqiza i-TLY-5 PCB . Ukuze uqhathanise amanye ama-laminate e-RF, sebenzisa ukuqhathanisa izinto ze-RF PCB.
Ingabe i-Highleap ingacaphuna intengo ye-TLY PCB kusuka kubukhulu bebhodi kuphela?
Isabelomali esingaphelele singaba khona. Intengo eqinile idinga ibanga eliqondile, ukujiya kwe-dielectric, ithusi, idatha yokwenziwa, ubuningi, ukuqeda kanye nobubanzi bekhwalithi/bokuhlola.
Yiliphi izinga le-TLY elishibhile kakhulu?
Ayikho impendulo ebanzi. Izinga, ukujiya, ithusi, isitokwe, isivuno sephaneli, inqubo kanye neziqu kunquma izindleko eziphelele.
Ingabe i-Highleap inganikeza i-prototype ye-TLY esheshayo?
Ukukhiqizwa okusheshayo kungase kutholakale ngemva kokukhishwa kwezinto zokwakha kanye nobunjiniyela. Izibalo zithi zithathe izinyathelo ezibalulekile zokukhiqiza nokuhlanganisa.
Ingabe i-Highleap ingafaka ukuhlanganiswa kwe-RF nokuhlolwa?
Yebo. I-BOM, izingozi zephakheji, ukufakwa, ukulinganiswa, imvamisa kanye nemikhawulo yokwamukelwa kumele inikezwe noma icashunwe njengokuthuthukiswa kokuhlolwa.
Yiluphi ulwazi oludingekayo ngentengo ye-TLY PCB yenkampani?
Nikeza ibanga eliqondile, ukujiya, ithusi, i-Gerber/ODB++, ukudweba, ukuqoqa, ubukhulu be-RF obubalulekile, ubuningi, ukulethwa okuqondiwe, i-BOM, imidwebo yokuhlanganisa kanye nezidingo zokuhlola.
Ingabe i-Highleap ingaphakamisa ukwehliswa kwezindleko ngaphandle kokushintsha ukusebenza kwe-RF?
I-Highleap ingabuyekeza ukusetshenziswa kwephaneli, ukwakhiwa kwezinto ezijwayelekile, ukwabiwa kokubekezelelana, izinga lokuhlola, ukulethwa okuhlukanisiwe kanye nokupakishwa kokuhlanganiswa. Noma yikuphi ukwakheka, ukujiya, ithusi noma ushintsho lukagesi kudinga imvume yamakhasimende ngaphambi kokukhishwa kwekhotheshini.
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I-Taconic RF 35 vs RO4350B PCB
Uhlu lokuqukethweRF-35 vs RO4350B Ukuthengwa kanye...
Ungasithola kanjani isilinganiso sama-PCB
Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:
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- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.