Mugadziri wePCB wepamusoro wePCB dzakaoma uye dzakakosha
Mufananidzo 1. Kugadzirwa kwePCB Yepamusoro uye Yakaoma Zvikuru
Highleap Electronics inogadzira maPCB akaomarara, HDI, ane mafrequency akawanda, anomhanya zvakanyanya, ane mhangura inorema, inochinjika, inochinjika, ine simba rinochinjika, ine simbi, ine ceramic uye ine thermal management, uye PCB assembly inowanikwa mushure mekugadzirwa. Hunhu hwedu hwepamusoro hwekugadzira hunofukidza mavias asina kujeka uye akavigwa, ma microvia akaunganidzwa uye akarongwa, resin nemhangura kuburikidza nekuzadza, VIPPO, kuchera kumashure, minwe yegoridhe refu-pfupi, electroplating yakasarudzwa, nzvimbo dzakadzika dzakadzorwa uye dzakavharika, edge metallization, special low-loss laminates, hybrid stackups, coins dzemhangura, special finishes uye tightly controlled impedance structures.
Kune mabhodhi anosanganisa zvinodiwa zvakati wandei, maCAM eHighleap nemapoka einjiniya ekugadzirisa anotsanangura nzira imwe chete inoenderana yekugadzira isati yaburitswa. Kutevedzana kwekunyungudutsa, kuboora, kuzadza, kuisa mhangura, kuputira zvakasarudzwa, kugadzirira zvinhu, chifukidzo chesolder, kupedzisa pamusoro, kuongorora uye kugadzira kwekupedzisira zvinorongwa zvichienderana nezvinodiwa zvePCB zvakapedzwa kuitira kuti maitiro chaiwo asagadzire kusawirirana kusingadzoreki neimwe.
Kubva pabhodhi remazuva ano rine zvinhu zvakasiyana-siyana zvine chimiro chimwe chete chakakosha kusvika pakuvaka kwakasimba kunobatanidza HDI, mavhairasi akazadzwa, backdrill, minwe mipfupi mipfupi yegoridhe, zvinhu zveRF zvakakosha, maburi uye kudzora kupindirana kwakasimba, Highleap inoongorora kuvaka kwacho sebasa rimwe chete rekugadzira. Chinangwa ndechekuchengetedza dhizaini yemagetsi neyemakanika yakaburitswa uku ichichishandura kuita data rekugadzira, mapurogiramu emuchina, matavi ekugadzirisa uye nzvimbo dzekuongorora dzinogona kudzorwa pasi pefekitori.
Matrix Yepamusoro Yekugadzira PCB
Kugadzirwa kwePCB kwakakura kunofukidza zvinopfuura kuwanda kwezvikamu, upamhi hwemitsara mishoma uye dhayamita yekuboorera. Mhuri dzinotevera dzehunyanzvi ndidzo maumbirwo nemaitiro anogona kuchinja zvakanyanya nzira yekugadzira, kutevedzana kwemidziyo, kudzora maitiro kana hurongwa hwekuongorora.
| Mhuri yekugona | Maumbirwo uye maitiro | Manufacturing impact |
|---|---|---|
| Yepamusoro kuburikidza nezvivakwa | Ma-vias asingaonekwe, ma-vias akavigwa, ma-vias asingaonekwe emakanika, ma-microvia elaser, ma-microvia akaunganidzwa/akamiswa/asingapindi, any-layer interconnect, via-in-pad. | Inochinja tsananguro ye sub-build, lamination cycles, nzira yekuboorera, metallization uye nzira yekunyoresa. |
| Kuburikidza nekuzadza & plugging | Puragi yeresin, isina kufambisa mvura, copper fill, ma-vias akazadzwa uye akavharirwa, VIPPO, yakavigwa-ne-kuzadza, microvia fill, solder-mask plugging. | Inowedzera kuzadza, kugadzika, kurongedza uye/kana kuputira chivharo pamatanho chaiwo ekugadzira. |
| HDI & kuunganidzwa kwezvikamu zvakatevedzana | 1+N+1, 2+N+2, 3+N+3, HDI yemhando ipi neipi, magadzirirwo akawanda ekuvaka, akarongwa kuburikidza nemagadzirirwo. | Inodzokorora lamination, laser drilling, metallization, kuburikidza ne fill and imaging pane kuvimba ne lamination yekupedzisira ine multilayer. |
| SLP / mSAP | PCB yakaita sesubstrate, yakagadziriswa semi-additive processing, ultra-fine conductors uye fine-pitch BGA escape. | Inoshandisa mhangura yakatetepa uye conductor yakasanganiswa panzvimbo pekushandisa conductor yakakora yakakora. |
| Kuboorera kwakakosha | Chibhorani chekumashure, chibhorani chekumashure chine udzamu hwakawanda, chibhorani chekumashure chepamusoro/pasi, chibhorani chekudzika chakadzorwa, chibhorani chechipiri, maburi anoiswa mupress-fit, sinki yekumashure uye chibhorani chekumashure. | Inowedzera mapurogiramu eCNC akatsaurirwa uye kutonga kweZ-axis / finished-hole. |
| Nzvimbo dzinoiswa migero, migero & maburi | Nzvimbo dzakaiswa jira, nzvimbo dzisina mapofu, nzvimbo dzisina mapofu dzakadzorwa, nzvimbo dzine matanho, homwe, nzvimbo dzine maburi, nzvimbo dzine maburi dzakaiswa jira uye nzvimbo dzakadzika dzakaita sesimbi. | Kugadzira michina kunogona kuitika simbi isati yagadzirwa, mushure mekuputirwa, kana mumatanho anopfuura rimwe chete. |
| Mapurofayiri & kuburitswa kwepaneru | Magadzirirwo akaomarara, nzira chaiyo yekuronga, nzira yeV-score + nzira yekuronga, ma tabs, bevel/chamfer, mipendero yematanho uye magadzirirwo akakosha ekupatsanura. | Inochinja rutsigiro rwepaneru, nzira yezvishandiso uye nzvimbo iyo mutsetse wekupedzisira unogona kuburitswa. |
| Zvigunwe zvegoridhe | Minwe mipfupi mirefu, yakatenderera, yakapatsanurwa, ine mativi maviri uye yakareba zvakasiyana; goridhe rakaoma; goridhe rinosarudzwa; bevel/chamfer. | Inoda kuputirwa kwemagetsi kwakasarudzwa, nzira dzemagetsi dzenguva pfupi, kufukidza uye kuchinjika kwekupedzisira kwemucheto kunodzorwa. |
| Kugadziriswa kwesimbi yemucheto | Kuputira mativi akazara/asina chikamu/akasarudzwa, madziro akafukidzwa, mativi epasi/echifukidziro uye mativi akabatana. | Mipendero yakasarudzwa inofanira kutora chikamu mukugadzirwa kwesimbi uku bhodhi richiramba rakatsigirwa mupaneru. |
| Makomba ehafu akaputirwa & akaputirwa | Maburi ane maburi, maburi ane hafu yemwedzi, maburi ane hafu yemwedzi akaputirwa uye maburi ane module-edge. | Inoshandisa nzira yekuboorera → plate → ine kuratidzwa kwebharero kwakadzorwa uye kunaka kwemucheto. |
| Kuputira kwakakosha kwemhangura | Mhangura yakasarudzika ine maburi akawanda, kuunganidzwa kwemhangura munharaunda, kuputirwa kwemhangura yakakora, kuburikidza nekuzadzwa kwemhangura uye nzira dzekuputirwa dzakanangana nepurojekiti. | Inodzora ukobvu hwemhangura munzvimbo yako pane kushandisa kuunganidza mhangura kwakafanana pamusoro pese. |
| Mixed surface inopera | ENIG + goridhe rakaoma, ENEPIG + goridhe rakaoma, HASL + goridhe rakaoma, goridhe rinosarudzwa uye nzvimbo dzakawanda dzekupedzisa. | Inoda masiki/dziviriro yemuno uye odha yakarongwa yekupedzisa nemagetsi uye makemikari. |
| Masiki yakakosha inosungirirwa uye kudhinda kunoshanda | Masiki inokweshwa, madhamu emasiki anosonerwa zvakanaka, maburi emasiki akasarudzwa, kuburikidza nekubatanidza/kuputira, inki yekabhoni nenzvimbo dzakakosha dzekudzivirira. | Inowedzera mabasa ehunyanzvi, kudhinda/kuputira, kuchenesa uye kuongorora. |
| Zvinhu zveRF & microwave | Rogers, PTFE/RT-duroid, Taconic, Arlon, PTFE yakazadzwa neceramic uye mamwe maRF laminates asinganyanyi kurasikirwa. | Inogona kuchinja kuboorwa, plasma/surface activation, lamination, copper foil uye dielectric control. |
| Zvinhu zvedhijitari zvinomhanya zvikuru | Megtron, Isola/FR408HR-class, FR-4 inomhanya zvikuru, ine ma laminates anoderedza kurasikirwa kwakanyanya uye anoderedza kurasikirwa kwakanyanya. | Inoda kugadzirwa kwe dielectric inodzorwa, kusarudzwa kwemhangura yakaoma uye lamination yakasimba inomhanyisa. |
| Zvinhu zvehybrid zvakaunganidzwa | Rogers + FR-4, PTFE + FR-4, RF + digital, Megtron + Isola uye zvakagadzirwa ne mixed-dielectric. | Zvinhu zvakasiyana zvinofanira kubatanidzwa uye kudzorwa nehukuru hwazvo muchikamu chimwe chete che multilayer. |
| Kudzora impedance | Maumbirwo ane magumo rimwe chete, akasiyana, anoshivirira zvakasimba, ane dielectric inodzorwa uye makuponi eTDR. | Zvinongedzo zvemukati, dielectric yakadzvanywa, ukobvu hwemhangura, geometry yekuburitsa gwara uye kusimbiswa kwemagetsi. |
| Mhangura inorema / yakasanganiswa | Mhangura inorema, mhangura yakakora, huremu hwemhangura hwakasanganiswa, mhangura inorema + mutsetse mutete uye zvinodiwa zvemhangura yakakora yemunharaunda. | Kuchinja kunogadzirisa etch compensation, spacing, resin demand uye copper balance. |
| Zvivako zvekupisa zvakabatanidzwa | Mari yemhangura, simbi yemhangura, simbi yemhangura yakaiswa mukati, chinhu chinoparadzira kupisa uye chinhu chinodziya kuburikidza nezvivako. | Inowedzera machining emukati/mukati memadziro, kuisa simbi, kuzadza resin, lamination uye kudzora planarity. |
| Metal-core PCB | Zvivakwa zvesimbi zvakagadzirwa nesimbi ine ngura, simbi ine ngura uye simbi ine insulated. | Inoshandisa base yesimbi inofambisa kupisa uye dielectric panzvimbo penzira yakajairika ye all-organic multilayer. |
| Ceramic PCB | Al₂O₃, AlN, Si₃N₄, DBC, DPC, AMB, firimu gobvu, firimu diki, LTCC neHTCC. | Inoshandisa matekinoroji ekugadzira simbi nesimbi zvakanangana neceramic pane kugadzira zvinhu zveFR-4. |
| Kuchinjika / kuchinjika-chinjika | Kuchinjika kwemavara akawanda, kuchinjika kweHDI, kuchinjika-kuchinjika, kuchinjika kwehafu, kuchinjika kwenguva refu, kuchinjika kweZIF, zvinosimbisa, zvinofukidza uye zvinodzivirira. | Inochinja maitiro echinhu, lamination, kuvaka kwenzvimbo dzakakombama, kusimbisa uye kubata. |
| Zviyero zvakakosha | Mabhodhi matete zvakanyanya, makobvu, marefu, makuru, matete-marefu, asina kurongeka uye ane chimiro chisina kujairika. | Inochinja maturusi, rutsigiro, mashandisirwo epaneru, kubata uye kutonga kwemativi. |
| Kugadziriswa kwakakosha | Magadzirirwo akagadzirwa, nhanho-uye-kudzokorora, V-score, panera yakarongwa, mixed V-score/routing, breakaway tabs, tooling boundaries uye copper balance. | Kuvakwa kweCAM panel kunova chikamu chekubudirira, kugadziriswa kwekubatanidzwa uye kugadzikana kwemaitiro ekutevera. |
| Maitiro eLaser | Kuboorwa kweLaser, ma microvia eLaser, kucheka/kubvisa mapanelization eLaser, kuvhurika kweLaser uye kuisa chiratidzo cheLaser kana zvichidikanwa. | Inopa mapurogiramu e laser akagadzirirwa uye zvinodzora kupisa/kunyoresa zvakasiyana nekushandisa michina. |
| Kumaka kwakakosha | Kumaka neLaser, QR/barcode, nhamba yeserial, zuva/lot code uye chitupa chekugara. | Inowedzera data rekutevera uku ichidzivirira vanhu vanosangana navo, nzvimbo dzinogoneka kutengeswa uye RF structures. |
Zvivako zveAdvanced Via: Blind Vias, Buried Vias uye Microvias
A via inova chimiro chekugadzira chepamusoro kana ma layer ayo ekutanga/kumisa kana nzira yekuumbwa ichichinja kurongeka kwekuvaka. Ma vias akavigwa anopedzwa mu sub-board yemukati asati aiswa lamination gare gare. Ma blind vias anobatanidza layer yekunze kune layer yemukati ine zita uye anogona kunge akaumbwa ne mechanical kana laser. Ma microvia anotsigira kubatana kwakasimba uye anogona kuunganidzwa, kurongwa, kusvetwa kana kushandiswa sechikamu che any-layer buildup architecture.
Injiniya yeCAM inobatanidza boka rega rega kusvika padanho rayo rekugadzira. Murwi une ma microvia e laser eL1-L2, ma L2-L5 akavigwa uye maburi anoda data rakasiyana uye matanho ekugadzirisa. Saka tsananguro ye via-span ndeyenzira yekuunganidza nekugadzira, kwete chati yekuboorera yakapedzwa chete.
Kugona kweHighleap kugadzira maPCB eHDI kunosanganisira ma-vias asina kuvharwa, ma-microvia, ma-via-in-pad uye ma-lamination akatevedzana.
Kuburikidza nekuzadza nekubatanidza: Resin Plug, Copper Fill, Fill & Cap uye VIPPO
Kuburikidza nekubatanidza, kuzadza uye kuvhara zvinotsanangura mamiriro akasiyana-siyana apera. Kubatanidza chifukidzo chesolder-mask kunovhara kana kufukidza gomba sechikamu chemaitiro ekubatanidza chifukidzo. Kubatanidza chifukidzo cheresin kunozadza via yakagadzirwa nesimbi kare neresini isingafambise mhepo inogadziriswa uye inogadziriswa. Kuzadza kwemhangura kunovaka mhangura muhuwandu hwevhisi kuburikidza ne electroplating. Zvifukidzo zvakazadzwa uye zvakavharirwa zvinowedzera pamusoro pechimiro chakazadzwa.
VIPPO—inoiswa pamusoro pe-in-pad—inoda nzvimbo yakarongwa uye yakaputirwa kuitira kuti BGA, QFN nezvimwe zvikamu zvakapfava zvigone kuunganidzwa zvakananga pamusoro pe-via pasina gomba rakavhurika rinodhonza solder kubva pajoinhi. Kana VIPPO ikaonekwa mukati meHDI kana sequential-lamination construction, kuburikidza nekuzadza kunogona kuva chikamu che buildup cycle isati yawedzerwa dielectric kana microvia level inotevera. Mushure mekunge zvinodiwa zve buildup uye via-fill zvatsanangurwa, huwandu hweHDI board uye kuongororwa zvinobatanidza nyika dzakagadzirwa ne stencil, placement uye solder-joint verification.
Kune zvivakwa zvakavigwa, resin fill uye planarization zvinogonawo kupedzwa usati waiswa lamination gare gare. Izvi zvinogadzira sub-board surface yakati sandara uye zvinodzivirira dielectric inotevera kuti isakwanise kuvhura maburi akavharika.
HDI, Sequential Lamination, SLP uye mSAP PCB Kugadzira
HDI imhuri yezvivakwa zvekuvaka kwete nzira imwe chete. 1+N+1, 2+N+2, 3+N+3 uye chero-layer architectures dzinoshandisa imwe kana kupfuura nzira dze lamination, laser drilling, metallization, kuburikidza ne fill ne imaging. Stacked microvias dzinoda kuti chivakwa chezasi chizadzwe uye chigadziriswe zvakakwana kuti chikwanise kutakura interconnect level inotevera, nepo staggered designs dzichishandisa lateral offset pakati pe buildup layers.
Highleap inotsigirawo kugadzirwa kwePCB yakaita seSubstrate kune zvivakwa zvine density yakakura. mSAP inotanga ne seed copper yakatetepa kupfuura nzira yemazuva ese yekubvisa, inovaka conductor nenzira yekusarudza, uye yobva yabvisa seed copper yakaratidzwa ne flash etching. Izvi zvinobvumira ma profiles e conductor akapfava e BGA dense escape uye packaging-like interconnect density.
Mukugadzirwa kweHDI neSLP, dhizaini yekugadzira inotungamirwa ne stackup uye kuburikidza nemepu. Kuverengerwa kwezvikamu chete hakutsananguri kuoma kwemaitiro anodiwa.
Maitiro Ekudhonza Midziyo Yekumashure uye Maitiro Akakosha Ekudhonza Midziyo
Kuboorera kumashure uye kuchera kumashure kwakadzika zvakawanda
Kuboorera kumashure kunobvisa bharero risina kushandiswa rakaputirwa kupfuura iro rekupedzisira rinoshanda kuburikidza nekubatanidza. Iyo via inotanga yagadzirwa uye yaputirwa sekubatanidza kwakajairika; iyo drill inodzorwa yakadzika yobva yabvisa stub inofambisa mhepo kubva kudivi rakatarwa. Mabhodhi ekumhanya kwepamusoro-soro anogona kuda mapoka akati wandei ekuboorera kumashure ane kudzika kwakasiyana, kusanganisira mashandiro ekumusoro nepasi.
Kugona kweHighleap kubhoorera kumashure kwePCB kunoshandiswa kumachaneli anomhanyisa zvikuru uko kudzora kuburikidza nestub kuri chikamu chekushanda kwechiratidzo-kukwana.
Kuboorera kwechipiri / mushure mekuputira
Mamwe maburi anofanira kugadzirwa chete mushure mekutanga kwepuratifomu kana etching operation. CAM inoisa zvinhu izvozvo muchirongwa chekuboora gare gare kuitira kuti zvisatore chikamu mukuita kunofanirwa kuitika gomba rekupedzisira risati ravapo. Kuboora kwekupedzisira kunogonawo kusanganiswa nezvinhu zvakakosha zvemakanika kana zvisiri zvesimbi.
Maburi anoiswa muchina wekudzvanya uye akanyatsoiswa maburi
Maburi ekubatanidza anoiswa mupress anoda kuti dhayamita rakapedzwa uye mhangura yemadziro egomba zvigare mukati mehwindo rinokwana nemechanical fit. Saka saizi yekuboorera kwekugadzira uye mukana wekuputira zvinofanirwa kugadzirwa pamwe chete pane kuongororwa wega.
Sinki yecountersink, counterbore uye kuchera matanho
Ma countersink anogadzira nzvimbo ine denderedzwa; ma counterbores anogadzira nhanho yakaita se cylindrical. Kudzika kunodzorwa uye kubhoorwa kwematanho kunoda divi rekutarisa rakajeka, dhayamita, kona/kudzika uye kushivirira. Mabasa aya anogadzirwa semapurogiramu eCNC akatsaurirwa pane kududzirwa kubva pafaira re round-hole drill rakajairika.
Nzvimbo Dzekuchengetera Mapu, Nzvimbo Dzekuchengetera Mapofu, Makomba, Homwe uye Kugadzira Mashini Kwakadzama
Nzvimbo dzakaputirwa / dzakagadzirwa nesimbi
Nzvimbo inoda mhangura pamadziro ayo inofanira kugadzirwa isati yasvika danho rekugadzirwa kwesimbi. Haigone kutorwa sechikamu chekupedzisira cheprofile. CAM inoparadzanisa data renzvimbo dzakaputirwa kubva kune nzvimbo dzisina kuputirwa uye inoongorora mhangura yakapoteredza, geometry yezvishandiso uye nzira yekudzika kwemvura.
Nzvimbo dzekudzivirira dzakadzika dzakadzorwa uye migero yematanho
Nzvimbo dzisingaonekwe, nzvimbo dzine kudzika zvishoma uye nzvimbo dzine nhanho dzakatsanangurwa mu X/Y na Z. Mufananidzo wapera unofanirwa kuratidza divi rekutarisa, mutsetse, kudzika kana ukobvu hwezvinhu zvasara uye kushivirira. Nzvimbo ine nhanho inogona kugadzira chigaro chemuchina, shanduko yeukobvu hwenzvimbo, nhanho yekudzivirira, nzvimbo yekupisa kana nzvimbo inokombama zvishoma nezvishoma.
Zvivako zvakagadziriswa nesimbi / zvakaderedzwa nesimbi zvishoma
Kana chinhu chapera chichida nzvimbo yakaputirwa uye kudzika kusina kuputirwa, nzira yacho inogona kupatsanura machining nemaune kuita mabasa maviri. Nzvimbo yekutanga/kuvhura kunobatanidzwa mukuisa mhangura; danho rekupedzisira rekugaya rakadzika rinogadzira nhanho yekupedzisira.
Makomba ePCB nemakomba akaputirwa
Makomba anogona kufukidza chikamu, die, shield kana chinhu chinodziya pasi pebhodhi. Mhara isina purasitiki inonyanya kushanda nemakanika chaiwo. Mhara yakaputirwa inoda nzvimbo dzakasarudzwa kuti iite simbi uye nokudaro inochinja nzira isati yagadzirwa. Kugona kweHighleap kugadzira PCB kunosanganisira zvivakwa zvemukati zvakaputirwa zveRF applications.
Nzira Yakakosha, V-Scoring, Bevels, Step Edges uye Complex Board Profiles
Mapurofayiri ePCB akakosha anogona kusanganisa CNC routing, internal milling, V-scoring, routed tabs, mouse-bites, chamfers, bevels uye local step edges. CAM panelization inochengetedza rutsigiro rwakakwana rwemakanika rwekuputira, kufungidzira, kuyedza uye kubata usati waburitsa dhizaini yekupedzisira.
Mapaneru akasanganiswa eV-score + akarongwa anobatsira kana mimwe mipendero yebhodhi yakatwasuka nepo dzimwe nzvimbo dzichida nzira dzisina kurongeka. Mabhodhi ane minwe yegoridhe anogona kuwedzera bevel inodzorwa. Mabhodhi ane masitepisi akatsetseka kana kuti ane masitampu anowedzera zvinodiwa zvehupamhi hwenzvimbo kuchirongwa chepuratifomu. Mabhodhi matete, makobvu kana marefu anogona kuda rutsigiro rwakawedzerwa uye kurongeka kwakasiyana kwepaneru kuti adzivise kukanganisa panguva yekugadzirisa.
Zvigunwe zvegoridhe zvepfupi refu, minwe yakakamurwa uye goridhe rekusarudza electrolytic
Zvigunwe zvegoridhe zvipfupi, zvakapatsanurwa kana kuti zvakakamurwa zvinoda hunyanzvi hwakawanda kupfuura kubatana kwemativi akaenzana nekuti electrolytic hard-gold plating ichiri kuda nzira yemagetsi inoenda kumunwe wega wega wakatarwa. CAM inogona kushandisa mabhazi ekuisa mapaneru, kuwedzerwa kwenguva pfupi kana imwe nzira yekubatanidza yakatenderwa zvichienderana ne geometry yapera.
Kubatanidza kwenguva pfupi ikoko kunofanira kuramba kuripo panguva yekushanda kwekusarudza machira uye kwozobviswa kana kuparadzaniswa panguva yekupedzisira yekuronga/kubhenekera pasina kuchinja kureba kwekubatana kwemutengi. Minwe ine mativi maviri, nzvimbo dzakasiyana dzegoridhe uye zvirambidzo pamachira anooneka zvinogona kuwedzera mamwe maitiro ekusarudza.
Kugadzirwa kwePCB yeminwe yegoridhe yeHighleap kunotsigira kubatana kwegoridhe rakasimba uye kugadzirwa kwemativi maviri akadai se ENIG body + electrolytic hard gold.
Goridhe rakaoma, goridhe rakapfava negoridhe rekunyudza hazvichinjiki
Goridhe rakasimba rinoshandiswa pakubatanidza zvinhu zvisingatsvedzeri. Goridhe rakasimba rinoshandiswa pakushandisa zvinhu zvakasiyana kana kuti panofanira kuva nechinhu chakasiyana chekuchena kana kuti chinobatanidza zvinhu. ENIG neENEPIG masisitimu ekupedzisa zvinhu nemakemikari uye hazvifanirwe kutorwa sezvinhu zvakafanana nekuisa simbi muminwe negoridhe rakasimba. Dhirowa rekugadzira rinofanira kuratidza rudzi rwekupedzisa, nzvimbo yakasarudzwa uye ukobvu hwaro pazvinenge zvakakosha.
Kuisa Mapuranga Emupendero, Nzvimbo Dzekuputira Mapuranga uye Kugadzira Maburi Akaita Sendiro
Zvinhu zvakaputirwa nemucheto uye zvakaputirwa nesimbi ndezvemagetsi uye zvemakanika. Mupendero kana bharero rinofanira kuvapo kare kuti rive simbi, nepo pani yekugadzira ichiri kuda rutsigiro rwakakwana kuti irarame kushanda gare gare.
Kuti pave nekuputira mativi ese kana kuti akasarudzwa, CAM inogadzira maburi anongoburitsa mipendero yebhodhi yakatarwa kumhangura uku ichichengetedza matabhu kana masimbi ekutsigira. RF modules dzinogona kusanganisa mipendero yemiganhu yakaputirwa nefenzi nemakomba akaputirwa kuti dzidzivirire uye dzisimbe.
Maburi ane maburi anotevera nzira yakakosha yekuboorera → plate → nepakati pebharero rakaputirwa . Nzira yekupedzisira inoratidza divi rakaputirwa sechisungo chinogoneka kusungirirwa. Kugadzirwa kwePCB kwakaputirwa kweHighleap kunofukidza zvivakwa zvehafu-hole zvakaputirwa zvinoshandiswa muRF, Bluetooth, Wi-Fi, kutaurirana uye sensor modules.
Kuisa Copper Plating Yakasarudzwa uye Nzira Dzakasanganiswa Dzekupedzisa Nzvimbo
Mhangura yekuwedzera yekusarudza
Kana maburi akasarudzwa akaputirwa achida mhangura yekuwedzera isina kuwedzera mhangura yakafanana pamusoro pekunze kwese, nzira yekugadzira inogona kuisa resist yenguva pfupi. Boka remaburi anotarisirwa rinoramba rakavhurika kuti riwedzere electroplating ukuwo nzvimbo yasara ichidzivirirwa, mushure mezvo resist inobviswa uye maitiro ekunze anoenderera mberi.
Muunganidzwa wemhangura wemunharaunda / wakakora
Kuvaka mhangura munharaunda kunogonawo kushandiswa kana zvinhu zvakatsanangurwa zvemhangura zvinoda ukobvu hwakawedzerwa. Izvi zvakasiyana nekusarudza kuvaka kwakafanana kwemhangura ine mhangura yakawanda pachikamu chose nekuti plating yakasarudzwa inochinja kugoverwa kwazvino, kuramba tsananguro uye geometry yekupedzisira.
Kupedzisa kwepamusoro kwakasanganiswa uye kwakasarudzwa
PCB imwe chete inogona kusanganisa kubatana kwegoridhe neENIG, ENEPIG, HASL, OSP, immersion tin kana immersion silver kune dzimwe nzvimbo. Mabhodhi aya anoda masking yakasarudzwa uye kutevedzana kwekupedzisa kwakadzorwa kuitira kuti nzvimbo yekutanga yapera irambe yakachengetedzwa apo kurapwa kwechipiri kuri kuitwa.
Nzvimbo yekupedzisa pamusoro pePCB yeHighleap inosanganisira ENIG, ENEPIG, sirivha yekunyudza, tin yekunyudza, HASL, OSP, goridhe rakapenya uye purasitiki yegoridhe rakaoma.
Masiki Yekusonesa Yakakosha, Masiki Inobviswa, Inki Yekabhoni uye Maitiro Ekudzivirira
Zvivako zvakanaka zvemasiki anosonerwa
Magadzirirwo eBGA akapfava uye madhizaini eSMT akakora anogona kuda madhamu akamanikana ane mamasiki anosungirirwa, maburi akasarudzwa uye anodzorwa kuburikidza nekutendesa kana kuvharira. Zvivakwa zveVia-in-pad zvinobatwa zvakasiyana zvichienderana nekuti via yakavhurika here, masiki akafukidzwa here, akazadzwa neresin kana kuti VIPPO.
Peelable solder mask
Chifukidzo chesolder chinobviswa chinodzivirira chinobviswa chinoshandiswa chete panzvimbo dzakasarudzwa. Chinogona kuchengetedza vanhu vanobatana kana nzvimbo dzisingapindi panguva yekuputira mafungu/kusarudza, kuputira kwakafanana kana imwe nzira yekudzika kwemvura uye chinobviswa mushure mezvo.
Ingi yekabhoni uye ma contacts akadhindwa anoshanda
Inki yekabhoni inogona kugadzira ma keypad contacts anoshanda, nzvimbo dze switch dzinodhura zvishoma kana zvimwe zvinhu zvinofambisa/zvinodzivisa. Inogadziriswa se functional print layer pane nganowo zvayo. Mufananidzo unofanirwa kutsanangura dunhu rekabhoni, uye zvinodiwa papurojekiti zvinogona kusanganisira contact resistance, printed cruise kana kuti inoenderana ne copper/finish iri pasi.
Tepi yekudzivirira / Kapton masking
Tepi yekudzivirira inogona kuiswa isati yashandiswa kupisa, kemikari kana kuunganidza kuti idzivirire zvinhu zvakapedzwa kana nzvimbo dzakasarudzwa. Nzvimbo yekushandisa uye nzvimbo iyo tepi inoiswa, inoongororwa uye inobviswa zvinotsanangurwa nemufambi wekugadzira.
MaLaminate Akakosha uye Zvinhu Zvakasanganiswa Zvakaunganidzwa
Highleap inogadzira maPCB ichishandisa RF/microwave, high-speed digital, high-Tg, polyimide nedzimwe nzira dze laminate dzinoshandiswa nevatengi. Laminate inogona kuchinja maitiro ekuboorera, kuyerera kwe resin, kufamba kwedimensional, kunamira kwemhangura, kushanda kwepamusoro uye mamiriro e lamination kunyangwe kana hunyanzvi hwemhangura husina kuchinja.
Rogers, PTFE, Taconic naArlon
PTFE nezvinhu zveRF zvakazadzwa neceramic zvinogona kuda kubhoorwa kwezvinhu zvakasiyana-siyana uye kuvhurwa kwemadziro asati ashandisa electroless copper. RF yeHighleap inosanganisira kurapwa kweplasma uye kugadzirira pamusoro pe sodium kana zvichibvira. Mabhodhi eHybrid RF anogona kusanganisa zvinhu izvi neFR-4 kana imwe digital laminate ine kurasikirwa kwakaderera.
Megtron, Isola / FR408HR-kirasi uye yakaderera-kurasikirwa FR-4
Zvinhu zvedhijitari zvinomhanya zvakanyanya zvinosarudzwa kuti zvideredze kurasikirwa kwemagetsi, zvinodzora hunhu hwemagetsi uye kushanda kwekupisa kuri nani. Kugadzikana kwelamination, chimiro chemhangura-foil uye ukobvu hwemagetsi zvinova zvakakosha kana bhodhi riine nzira dzemagigabit akawanda uye impedance inodzorwa.
N4000-series, IT-150DA, ma laminates asina halogen uye anokodzera vatengi
Mapurogiramu ezvinhu anotenderwa nevatengi anogona kuda nzira dzakatsaurirwa dzekugadzirisa kana nzira dzakatenderwa dzekugadzira. Kuwanikwa kwegiredhi chaiyo, zvakaenzana zvinobvumidzwa uye maitiro akakodzera zvinosimbiswa zvisati zvaburitswa pane kufunga kuti laminate yega yega ine high-Tg kana yakaderera inogona kushandisa generic FR-4 sequence yakafanana.
Kuti uwane kugadzirwa kweRF zvakanangana, ona maitiro ekugadzira eRogers PCB eHighleap.
Mugadziri weRF, Microwave uye PCB Inoshanda Kakawanda
Kugadzirwa kwePCB kwakawanda kunobatanidza kudzora zvinhu, jiyometa yemuchina uye zvivakwa zvemakanika zvakakosha. Highleap inotsigira mabhodhi eRF/microwave/mmWave achishandisa zvinhu zvinorasikirwa zvishoma, ma hybrid stackups, controlled impedance, backdrill, via-in-pad, edge plating uye plated cavities.
Kuti pave nekudzora kurasikirwa kweRF, chimiro chemhangura chinogona kukosha sehukobvu hwemhangura hwakafanana nehwemhando yepamusoro. VLP, HVLP nedzimwe foil dzemhangura dzisina chimiro chakaderera dzinoderedza kurasikirwa kwemuchina wekufambisa mhepo nekuda kwehukobvu pahuwandu hwemafrequency akakwira. Magadzirirwo eAntenna, firita uye macoupler anoitawo kuti kushivirira kwekugadzira kuve chikamu chekushanda kwedunhu nekuti saizi yemuchina wekufambisa mhepo uye hukobvu hwe dielectric hwakadzvanywa zvinokanganisa zvakananga mhinduro yemagetsi.
Mabhodhi eRF anogonawo kubatanidza zvivakwa zvemukati zvakaputirwa, madziro emucheto weperimeter uye akakora kuburikidza nefenzi yekudzivirira/kudzika. Zvinhu izvi zvinofanirwa kurongwa usati wapedza kugadzira nekuti nzvimbo dzakagadzirwa nesimbi dzinoda mukana wekuwana maitiro ekubvisa mhangura.
Mugadziri wePCB yedhijitari yeHigh-Speed: Backdrill, Low-Loss Stackup uye Tight Impedance
Mabhodhi edhijitari anomhanya zvikuru anogona kusanganisa zvinhu zveMegtron/Isola-class low-loss, high-layer-count stackups, VIPPO, press-fit connectors, backdrill uye controlled impedance. Nzira yekugadzira inofanirwa kudzora dielectric thickness, copper thickness, trace geometry, reference-plane relationship uye kuburikidza nestub length seimwe yemagetsi structure.
Kugona kwaHighleap kwakasimba kunoburitsa kutonga kweimpedance kwe±5 Ω kune zvinangwa zviri pa50 Ω kana pasi pazvo uye ±7% kune zvinangwa zviri pamusoro pe50 Ω, nepo RF builds dzakatsigirwa dzichigona kushandisa kudzora kwakasimba kwepurojekiti. Chinangwa chinogamuchirwa chinosimbiswa nekugadzirwa kwacho pane kutorwa kubva pachikamu chimwe chete.
Makuponi eTDR nemagadzirirwo ekuyedza anosimbisa mhedzisiro yeimpedance yakagadzirwa. Kune vanovaka vepamusoro, kuponi inomiririra zvinhu chaizvo zvepaneru, mhangura uye nzira yekushanda kwete chete geometry yeCAD. Ona kugadzirwa kwePCB yeimpedance-control yeHighleap.
Kugadzira Mhangura Yakakura, Mhangura Yakasanganiswa, Mari yeMhangura uye PCB Inopisa
Mhangura inorema uye huremu hwakasanganiswa hwemhangura
Kugona kwazvino kweHighleap kunoratidza mhangura yemukati neyekunze inosvika 10 oz yezvivakwa zvakakodzera. Kuchinja kwemhangura kwakawanda, nzvimbo shoma, kuenzana kwemhangura uye huwandu hweresin inodiwa kuzadza topography yemuchina panguva yekuyeresa. Murwi wakasanganiswa unogona kushandisa zvidimbu zvemagetsi zvakakora uye zvidimbu zvitete zvechiratidzo kuitira kuti zvinodiwa zvemagetsi epamusoro uye nzira dzakapfava zvigone kushanda pamwe chete.
Ona peji reHighleap rekugadzira PCB yemhangura ine mhangura yakawanda kuti uwane pfungwa dzakatsaurirwa dzekugadzira.
Mari yemhangura, mhangura inopinzwa mukati uye zvinoparadzira kupisa zvakaiswa mukati
Tekinoroji yemari yemhangura inogadzira nzira yekupisa ine simba guru pasi pemudziyo une simba guru. Nzira iyi inogona kusanganisira kugadzira machira akanyatsogadzirwa, kuisa zvidimbu zvemhangura, kuzadza resin, lamination uye planarization. Kugadzirwa kwePCB yemari yemhangura yeHighleap kunosanganisira zvivakwa zvekupisa zvakaiswa mukati uye zvinopinda mukati.
Metal-core PCB
MaPCB ealuminium-core necopper-core anoshandisa substrate yesimbi inodzivirirwa kuti iparadzire kupisa. Aya marudzi akasiyana ekuvaka kubva kumabhodhi eFR-4 ane mhangura yakawanda uye ma multilayer ecopper-coin. Kusimba kwe dielectric mukupisa, kupatsanurwa kwemagetsi, machining ebase-metal uye kuyerera kwekupisa mukuunganidza zvinodzorwa sechikamu chekuvaka.
Mugadziri wePCB yeCeramic: Al₂O₃, AlN, Si₃N₄, DBC, DPC, AMB, LTCC neHTCC
Highleap inogadzira maPCB eceramic ichishandisa substrates dzealumina (Al₂O₃), aluminium nitride (AlN) uye silicon nitride (Si₃N₄). Nzira yesimbi inosarudzwa zvichienderana nekukora kwemhangura, mutoro wekupisa, huwandu hwemuchina wekufambisa, zvinodiwa zvekuvimbika uye dhizaini ye multilayer.
DBC inobatanidza zvakananga mhangura yakakora neceramic kuti ishandise magetsi emagetsi. DPC inoshandisa mbeu/simbi dzakatetepa uye electroplating kuti iite zvinhu zvakanaka. AMB inoshandisa active-metal brazing kuti ishande nesimbi yakasimba kubva kuceramic. Nzira dzakatetepa nefirimu dzakatetepa dzinotsigira matekinoroji akasiyana-siyana ekufambisa, nepo LTCC neHTCC dzichigadzira zvivakwa zveceramic zvine jira rakawanda.
Kugona kweHighleap kugadzira maPCB eceramic kunotsigirawo maitiro ekubatanidza zvinhu zvakaita seSMT, die attach uye wire bonding kumapurojekiti akakodzera.
Mugadziri wePCB Inochinjika, Yakagadzika, HDI Flex, Semi-Flex uye Ultra-Long Flexible
Kuchinjika kwePCB neHDI
Maseketi anochinjika anogona kushandisa magadzirirwo epolyimide ane machira maviri, maviri kana akawanda ane machira ekuvhara, ZIF contacts, stiffeners uye shielding. HDI flex inowedzera laser microvias, sequential buildup uye kuburikidza nekuzadza kune flexible stack.
Rigid-flex
Kugadzirwa kwePCB yakasimba-inochinjika kunobatanidza zvikamu zvakasimba uye zvinochinjika mubhodhi rimwe chete. Nzira iyi inodzora kuchinja-kuchinjika, kufukidza, kusarudza kubatana, nzvimbo dzakakombama uye kubata kwekupedzisira. HDI yakasimba-inochinjika inogonawo kusanganisa ma-vias asina kuvonekwa/akavigwa, ma-microvia uye kudzorwa kweimpedance.
Semi-flex
Kugadzirwa kwePCB kunogadzira nzvimbo ine mwero wekuzvimba nekugaya kwakadzika kwechimiro chakasimba cheFR-4. Ukobvu hwasara, nzira yemhangura uye kudzika kwekugaya zvinosarudza mashandiro enzvimbo inokombama.
Kuchinjika kwenguva refu kwazvo
Kugadzirwa kwePCB kwakareba kwazvo muHighleap kunotarisa macircuit anochinjika-chinjika ane chiyero chemita uko kubata, kunyoresa, kudzikira kwevoltage, lamination uye kutumira zvinova zvipingamupinyi zvikuru pakuita basa.
Mufananidzo 2. PCB yakasimba-inochinjika, PCB yeceramic, PCB ine frequency yakakwira
Saizi Yakakosha, Panelization, Laser Processing uye Marking
Mabhodhi matete zvakanyanya, makobvu, marefu uye makuru
Zviyero zvebhodhi zvakakosha zvinogona kuchinja maturusi, rutsigiro rwezvinhu, marongerwo epaneru, muripo wehukuru uye kurongedza. Mapaneru matete anoda rutsigiro rwekuwedzera rwekubata; mapuranga makobvu anowedzera kudiwa kwekuboorwa/aspect-ratio; mapuranga marefu uye akamanikana anogona kukonzera matambudziko ekukomba/kukotama uye kunyoresa.
Kugadzirisa mapaneru nenzira yaunoda
Kugadziriswa kweCAM kunogona kusanganisira step-and-repeat arrays, V-scoring, routed breakaways, breakaway tabs, assembly rails, tooling holes, fiducials, test coupon uye copper balancing. Kurongeka kwebhodhi kunogonawo kudziviswa ne flex bend direction, gold-finger plating, material grain kana special machining.
Kuboora, kucheka uye kubvisa mapaneti uchishandisa laser
Laser inoshandiswa kuma microvia uye inogonawo kutsigira mabasa ekucheka, kuvhura kana kubvisa mapaneti akasarudzwa uko dhizaini nezvinhu zvakakodzera. Mapurogiramu eLaser anoda kunyoreswa kwakatsaurirwa uye kudzora nzvimbo dzine kupisa uye haafanirwe kuvhiringidzwa neLDI, inova tekinoroji yemifananidzo kwete yekuboorera nelaser.
Kunyora neLaser uye zvachose
Makodhi eQR, mabarcode, manhamba eserial, zviziviso zvezuva/lot nezvimwe zviratidzo zvechigarire zvinogona kuwedzerwa kuti zvionekwe kana zvichienderana nezvinhu uye kupedzisa. Nzvimbo yekuisa chiratidzo inoongororwa kuitira kuti isakanganise vanhu vakasangana navo, RF structures kana nzvimbo dzinosungirirwa.
Zvivako zvePCB Zvakaiswa Mukati uye Zvakanangana neProjekiti
Zvimwe zvigadzirwa zvepamusoro zvinoshandisa mhangura yakaputirwa, zvinoparadzira kupisa, zvivakwa zvisingashande kana zvimwe zvinhu zvisiri zvemhando yepamusoro mukati mePCB. Highleap inogona kuongorora zvivakwa zvakaputirwa zvinoenderana nevatengi pamwe chete nezvinodiwa nelaminate, cavity, plating uye assembly.
Zvinodzivirira zvakaiswa mukati, capacitor, inductor kana active-component concepts zvinoda kusimbiswa kweprojekiti nekuti system yezvinhu, muridzi weprocess, nzira yekufanirwa uye zvinodiwa zvekuvimbika zvinosiyana zvakanyanya. Hazvifanirwe kutorwa sezviri otomatiki zvakafanana nekugadzirwa kwakajairika kwe multilayer nekuti chimiro chinogona kumirirwa muCAD.
Kuongororwa Kwakakosha uye Kudzora Kuvimbika kweMaPCB Akakwira
Kugadzira zvinhu zvemhando yepamusoro kunowanzoda kusimbiswa kupfuura kungoongororwa nemaziso. Kuongorora kana bvunzo kunoiswa panogona kuongorora chimiro chakakodzera usati wavanza kana kuchichinja.
| ongororo | Zvainoongorora | Chaizvoizvo kushandiswa |
|---|---|---|
| AOI yemukati | Kuvhura kwemuchina wemukati, mapfupi uye zvikanganiso zvemifananidzo | Pamberi pe lamination, zvikamu zvemukati zvinovigwa. |
| Outer-layer AOI | Geometry yekupedzisira yemutyairi wekunze | Chifukidzo chisati chaputirwa, chikamu chemhangura chinovharwa. |
| Kusimbiswa kwekunyoresa / kurongeka | Kunyoresa kubva paburi kuenda paburi uye kutungamira | Magadzirirwo ane maburi akawanda, HDI uye maburi akaomarara kubva kumhangura. |
| Kudzivirira maburi / kwakakosha kuburikidza nekusimbiswa | Kushanda kwemagetsi kwekubatanidza kwakatarwa kwakapetwa | Zvinodiwa zvakakosha zvekubatanidza zvinhu zvine maburi kana kuti maburi akabatana. |
| Kuedzwa kweTDR impedance | Impedance yakapedzwa inodzorwa | Zvivakwa zvemagetsi zvinomhanya zvakanyanya uye RF. |
| Chikamu chidiki / chikamu chakayambuka | Mhangura ine madziro maburi, kuburikidza nekuzadza, nzvimbo dzezvikamu uye kuvakwa kwe dielectric | HDI, ma-vias akazadzwa, chiyero chepamusoro uye kuvakwa kwezvitupa. |
| Kuenderera mberi kwemagetsi / kupatsanurwa | Kuperera kwechokwadi chakazara | PCB isina chinhu yakapedzwa. |
| Kuongorora X-ray / chimiro chakavanzika | Kunyoresa mukati kana zvinhu zvakavanzika kana zvichibvira | Kusimbiswa kwemhando yepamusoro ye multilayer / assembly. |
| Kushushikana kwekupisa / kutenderera kwekupisa / IST / CAF | Kuvimbika kana uchinetseka nekupisa kana magetsi | Inoshandiswa kana zvichidikanwa nechirongwa chechigadzirwa, chemutengi kana chezvitupa. |
Kuyedzwa kwemagetsi kwePCB nePCB zveHighleap zvinofukidza hurongwa hwakakura hwekuongorora nekuongorora.
Mienzaniso yekuvaka kwePCB yepamusoro ine maitiro akasiyana-siyana akakosha
Dambudziko rekugadzira rinokura kana zvivakwa zvakawanda zvepamusoro zvikagovana muunganidzwa mumwe chete. Highleap inoongorora misanganiswa iyi senzira imwe chete yekushanda kuitira kuti nguva yekuisa plating, kuzadza, lamination, kupedzisa uye mashandiro emakanika irambe ichienderana.
| Kuvakwa kwePCB | Maitiro anofanirwa kurongeka | Kuvimba nekugadzirwa kwezvinhu zvakakosha |
|---|---|---|
| Zvigunwe zvipfupi zvegoridhe zvakasimba + mavhiya akavigwa akavharirwa neresin + mavhiya akavigwa/akavigwa + nzvimbo yekuvhara yakadzama | Sub-board vias, resin fill/planarization, sequential lamination, selective hard gold, plating-current paths uye depth-controlled routing. | Mavhaira akavigwa anofanira kuzadzwa asati aiswa lamination chaiyo; mamiriro ekuisa jira panzvimbo yacho anogadza nzvimbo yayo yekugadzira; minwe mipfupi yegoridhe inoda nzira inoshanda yekuisa jira isati yaburitswa. |
| Rogers/PTFE hybrid + stacked microvias + plated cavity + edge plating + tight impedance | Kugadzirira PTFE, hybrid lamination, laser buildup, copper via fill, cavity/edge metallization uye TDR verification. | Zvinhu zvakagadzirwa, simbi ine gomba, simbi yemupendero uye geometry ye impedance zvese zvinoenderana nekugadzirwa kwakafanana. |
| Megtron ine jira repamusoro-soro + VIPPO + chidhinha chekumashure chakadzama + chinobatanidza chinodzvanywa nepress-fit | Kuunganidza zvinhu zvishoma-shoma, ma-vias akazadzwa/akavharirwa, mabhora ekudhirowa akadzama, maburi akaputirwa nemazvo uye kudzora impedance. | Chidhinha chekumashure chinofanira kuchengetedza kubatana kwechikamu chinoshanda ukuwo maburi anodzvanywa achichengetedza dhayamita inodiwa uye mhangura yemubharero. |
| Matanda esimba emhangura anorema + matanda echiratidzo emutsetse wakanaka + mari yemhangura + mavhasi akazadzwa | Kurema kwemhangura kwakasanganiswa, kudzora kuyerera kweresin, kuisa mari yemhangura uye kuburikidza nekuzadza/kuronga. | Kuumbwa kwemhangura ine mhangura yakawanda uye kuenzana kwemari kunokanganisa kucheneswa kwesimbi ukuwo zvidimbu zvemitsetse midiki zvinoda nzira yakasimba yekufambisa simbi. |
| HDI rigid-flex + stacked microvias + VIPPO + ENEPIG + controlled impedance | Rigid-flex lamination, coverlay, laser buildup, kuburikidza ne fill/cap, finish uye impedance stackup. | Ma "high-density" anobatanidza zvinhu anofanira kuramba achishanda pamwe chete nenzvimbo dzakakombama uye achiramba achipa ma "flat assembly pads". |
| Module yeRF yakakandwa + mapedhi eENIG + macontacts egoridhe rakaoma + kuputira mucheto | Kuboorera/kurongedza/nzira yeCastellation, goridhe rakasimba rakasarudzwa, kupedzisa kwemakemikari, kuchekwa kwesimbi mumucheto uye chimiro chekupedzisira. | Rutsigiro rwepaneru uye zvinhu zvechinguvana zvekuputira zvinofanirwa kuramba zviripo kusvika zvivakwa zvese zvesimbi zvapera. |
| SLP/mSAP + ma microvia akaunganidzwa + BGA yakanaka kwazvo + zvinhu zvisinganyanyi kurasikirwa | Kuumbwa kwemuchina wekufambisa zvinhu zvishoma, ma-laser vias akanaka, kuburikidza nekuzadza, kuunganidzwa kwemuchina wekuisa zvinhu zvishoma uye kunyoreswa kwakarurama. | Geometry yemuchina, ukobvu hwe dielectric uye kunyoreswa kwema microvia zvinoshanda mukati mehwindo rimwe chete rekuita kwehuwandu hwepamusoro. |
| Mitsetse midiki yeAlN ceramic + DPC + waya inosungirirwa + die attach | Kugadzirwa kwesimbi yeCeramic, kugadzirwa kwemuchina wekufambisa zvinhu zvakanaka, kupedzisa kwakasarudzwa uye kuungana kweceramic. | Kugadzirwa kwesimbi yeceramic nesimbi yakagadzirwa zvinofanirwa kunge zvichienderana nekugadzirwa kwesimbi yekupedzisira. |
Maitiro eCAM Engineering anobatanidza Maitiro Akakosha ePCB
Kugona kwakakosha kunobatsira chete kana kwaiswa panzvimbo chaiyo munzira yekugadzira. Nzira yakavigwa inoiswa mukati me sub-build. Microvia yakaunganidzwa zvinoenderana nemamiriro ekuzadza ari pasi payo. Nzvimbo yakaputirwa inofanira kuvapo metallization isati yavapo. Backdrill inoitika chete mushure mekunge nzira yakaputirwa yavapo. Munwe wegoridhe mupfupi unoda nzira yawo yemagetsi usati wabvisa zvinhu zvenguva pfupi.
| Chinodiwa chapedzwa | Tsananguro yekugadzira yakagadzirwa neCAM / process engineering |
|---|---|
| Bofu / rakavigwa kuburikidza | Via span, sub-build, drilling stage, plating stage uye lamination cycle. |
| Microvia yakarongedzwa | Dzikisa kuburikidza nekuzadza/kuronga usati wasvika padanho rinotevera re laser-via. |
| VIPPO | Nzira yekuzadza, mushonga, kurongeka, chivharo chemhangura uye mamiriro ekupedzisira epedhi. |
| Chidhiraivho chekumashure | Rutivi rwekuboorera, kudzika kwechinangwa/stub, dhayamita yechishandiso uye rukoko rwekubatanidza rwakachengetedzwa. |
| Minwe yegoridhe mipfupi mirefu | Nzvimbo yakasarudzwa, nzira yenguva pfupi yekuputira-yazvino, dziviriro, nzira yekubvisa bevel uye lead. |
| Nzvimbo/gomba rakadzama rakadzorwa | Rutivi rwekunongedzera, XY geometry, Z kudzika/ukobvu hwasara uye mamiriro ekuisa plating. |
| Nzvimbo yekumonera/kumonera yakaputirwa | Kuvhura puratifomu usati waisa puratifomu uye nzira yekupedzisira yekutsigira panel/profile. |
| Mhangura yekuwedzera yekusarudza | Chidziviriro chenguva pfupi uye danho rakatsaurirwa rekuputira boka remaburi rakasarudzwa. |
| PTFE / RF laminate | Mirayiridzo yekuboorera, kubika, kugadzirira plasma/pamusoro uye lamination. |
| Kuunganidzwa kwemhando yehybrid | Nzvimbo dzekubatanidza zvinhu, sisitimu yekubatanidza, muripo wehukuru uye chimiro che impedance. |
| Mhangura inorema | Kugadzirisa matanda, kuongorora nzvimbo dzakasara, kuenzana kwemhangura uye nzira yekuzadza resin. |
| Mari yemhangura | Geometry yemugodhi/inlay, danho rekupinza, kuzadza resin, lamination uye planarization. |
| Kupedzisa kwakasanganiswa | Kuvhara/kudzivirira kwakasarudzwa uye kurongeka kwekupedzisa. |
| Kudzora impedance | Kuunganidzwa kwekugadzirwa, geometry yemutyairi akabhadharwa, data remakuponi/bvunzo uye chinangwa chekugamuchirwa. |
| Rigid-flex / semi-flex | Kuchinja kwezvinhu, kufukidza/kusimbisa, nzvimbo yakakombama kana kutevedzana kwekugaya kwakadzama kwakadzorwa. |
Peji reHighleap remaitiro ekugadzira PCB rinotsanangura kupatsanurwa kwakakura kwekugadzirwa kwePCB, ukuwo mufambi wekugadzira achitonga kuti basa rinoburitswa rinofamba sei mufekitori.
Kuwana Mutengo wePCB Kuri Nyore
Hamufanirwe kugadzirira pasuru yakaoma yekugadzira usati wataura neHighleap. Kana muine mafaira eGerber kana mafaira ePCB/source , atumirei kwatiri uye timu yedu inogona kutanga ongororo. Kana dhizaini ichiri kugadzirwa, kana kuti musina chokwadi chekuti mafaira api anodiwa, ingotaurai nesu motumira chero ruzivo rwamunarwo parizvino.
Chikwata chedu chekutengesa neinjiniya chichabatsira kuona ruzivo rwuri kushaikwa uye kubvunza mibvunzo inodiwa chete kuti chirongwa chifambise mberi. Pakuumbwa kwePCB, ruzivo rweBOM neruzivo rwekuisa zvinhu zvinobatsira kana zviripo, asi unogona kutibata tisati tapedza mafaira iwayo.
- Une mafaira eGerber here? Vatumirei.
- Pane kudaro, une mafaira ekugadzira PCB here? Tumira izvozvo.
- Unoda PCB + kuunganidza? Wedzera BOM nedata rekuisa kana zvagadzirira.
- Mafaira haana kukwana kana kuti hauzive zvekutumira? Bata Highleap kutanga. Chikwata chedu chichakutungamira padanho rinotevera.
Kune zvivakwa zvepamusoro zvakaita sema "vias" asina kuvharwa, zvinhu zvakadzika zvakadzorwa, zvinhu zvakakosha kana ma "finishes" akasarudzwa, mainjiniya edu anogona kukumbira imwe dhizaini kana kujekeswa mushure mekuongorora mafaira. Hamufanirwe kunzwisisa maitiro ekugadzira pachine nguva; timu yeinjiniya ichashandura zvinodiwa zvakapedzwa kuita nzira yekugadzira.
Kutaurirana kweProjekiti Yakatsaurirwa uye Kutevera Kurongeka
Kune mapurojekiti ari kushanda, Highleap inogona kuronga boka rekutaurirana remapurojekiti kuitira kuti vanhu vane basa reodha vagone kushanda kubva paruzivo rumwe chete. Kutengesa, CAM/engineering, kugadzira, mhando, nhengo dzePCB assembly uye logistics team vanogona kubatana sezvinodiwa neprojekti.
Izvi zvinopa mutengi nzvimbo imwe chete yekutevera mibvunzo yeinjiniya, kusimbiswa kwemafaira, mamiriro ezvinhu, kufambira mberi kwekugadzirwa, ruzivo rwemhando yepamusoro, nyaya dzekuunganidza uye kugadziriswa kwekutumira. Kana mubvunzo ukaonekwa panguva yekuongorora kana kugadzira kweCAM, timu yehunyanzvi yakakodzera inogona kuunzwa muhurukuro pane kuendesa meseji kuburikidza nevanhu vakasiyana.
Kutaurirana kweinjiniya
Mibvunzo yeCAM/DFM, kusimbiswa kwezvikamu, kujekesa maitiro chaiwo, kutsiva zvinhu uye kubvumidzwa kwevatengi.
Kutevera kugadzirwa
Kugadzirira zvinhu, kufambira mberi kwekugadzira, mamiriro akakosha ekuita uye kuronga nguva.
Kutevera kwemhando yepamusoro
Zvakawanikwa pakuongorora, kugadziriswa kweinjiniya, ruzivo rwebvunzo uye magwaro emhando yepamusoro kana zvichidikanwa.
Kuungana kwePCB & kutumira
Kurongeka kwezvikamu/kuungana, mamiriro ekugadzirwa, kuyedzwa kwekupedzisira, ruzivo rwekurongedza uye kutumira.
Nhoroondo yepurojekiti imwe chete iyi inoramba ichionekwa nechikwata mukati meodha yacho, izvo zvinobatsira sarudzo dzeinjiniya, mvumo uye zvigadziriso zvekugadzira kuti zvirambe zvakabatana negadziridzo chaiyo uye zvinodiwa nevatengi.
Mugadziri wePCB uye Fekitori yePCB Assembly Under One Workflow
Highleap inopa zvese kugadzirwa kwePCB isina chinhu uye kuungana kwePCB . Izvi zvinonyanya kubatsira pamabhodhi epamusoro nekuti ruzivo rwekugadzira runogona kukanganisa zvakananga SMT, through-hole uye mechanical assembly. VIPPO inokanganisa BGA soldering; maburi anodzvanywa anokanganisa kuiswa kwechinobatanidza; flex uye rigid-flex zvinoda rutsigiro rwakakodzera; mabhodhi eceramic necopper-coin anochinja maitiro ekupisa; zvinobatanidza zvemucheto uye finishes dzakakosha zvinokanganisa interface yekupedzisira yemechanical.
Kana kugadzirwa nekusanganiswa kwechinhu kwakabatana, mapaneru, mafiducial, kuburikidza nekurapwa, kupedzisa pamusoro, kubvisa mapaneru, kuchengetedza uye nzira yekuyedza zvinogona kuongororwa usati waburitsa PCB. Mapurojekiti anoda kuwanikwa kwezvikamu, SMT/THT, programming kana functional testing anogona kuenderera mberi kuburikidza neHighleap's turnkey PCB assembly workflow.
Kusimbiswa kweProjekiti Yakanangana neZvivakwa Zvisiri ZveStandard
Mamwe magadzirirwo anoshandisa zvinhu zvisina kujairika zvakaiswa mukati, ma laminates asingawanzo kuwanikwa nevatengi, zvinhu zvakagadzirwa ne laser, saizi dzinoshamisa kana musanganiswa kunze kwehwindo rekugadzira rakajairika. Highleap inoongorora mapurojekiti aya isati yagadzirwa uye inosimbisa zvinhu zvinoshanda, maturusi, michina uye nzira yekukodzera dhizaini chaiyo.
Tumira Mafaira Ako ePCB kuHighleap
Mafaira eGerber kana maPCB design akakwana kutanga. Kana mafaira ako asina kukwana kana kuti usina chokwadi chekuti wopa chii, taura nesu uye timu yedu ichatungamira chirongwa ichi kubva pakuongorora mainjiniya kusvika pakugadzira maPCB, kuunganidza, kudzora mhando uye kuendeswa kwawo.
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Nzira yekuwana sei quote yePCBs
Ngatimhanyei DFM/DFA ongororo yenyu todzokera kwamuri nereport. Unogona kurodha mafaera ako zvakachengeteka kuburikidza newebhusaiti yedu. Isu tinoda ruzivo rwunotevera kuti tikupe iwe quote:
-
- Gerber, ODB++, kana .pcb, spec.
- BOM rondedzero kana iwe uchida kusangana
- uwandu
- Kuchinja nguva
Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.