Zviri MuPCB Resin: Gwaro Rekugadzira, Kuisa Lamination uye Kugadzira

Kuwanda kwePCB resin chikamu cheresin mukugadzirwa kwelaminate kana prepreg, inowanzotaurwa sechikamu nehuremu. Inokanganisa hunhu hwe dielectric, ukobvu hwakadzvanywa, kuyerera kweresin, copper fill, kufamba kwedimensional uye kuvimbika kwe multilayer.

Highleap Electronics haigadziri resin kana prepreg. Isu tinosarudza uye tinogadzira zvinhu zvinotenderwa nevatengi, tinoisa PCB pasi, tinounganidza PCBA uye tinoona zvinodiwa.

Sei zviri mukati mePCB resin zvichikosha? Nekuti girazi rakafanana rine resin rakasiyana rinogona kugadzira maitiro akasiyana eDk, Df, ukobvu hwakadzvanywa uye hunhu hwekuzadza. Kungotora chete material family uye girazi style hazvina kukwana kuti pave ne multilayer stackup inodzorwa.

Zvinoreva Zviri MuPCB Resin

Prepreg iresin yakacheneswa zvishoma inotakurwa negirazi rakarukwa. Panguva yekumonera, kupisa nekumanikidzwa zvinokonzera kuti resin iyerere, izadze topography yemhangura uye ipinde mu dielectric bond layer. Hunhu hweresin hunokanganisa huwandu hwezvinhu zviripo zvekuzadza nzvimbo uye kuti magirazi akawanda asara mu dielectric yekupedzisira.

Zviri mukati me resin yakawanda

Resin yakawanda inowanikwa yekuzadza mhangura uye inogona kuderedza kushanda kweDk, asi kuyerera kwakanyanya, kusiyana kweukobvu kana kusvinwa kunogona kuitika.

Zviri mukati me resin yakaderera

Chikamu chegirazi chakawanda, kazhinji chinoshanda zvakanyanya uye kuomarara kuri nani, asi kunoderedza mukana wekuzara kwemhangura inorema kana nzvimbo dzakashama.

Aya maitiro, kwete vimbiso yevanhu vose. Kemikari ye resin, magadzirirwo egirazi, kutenderera kwekugadzirwa kwechinhu, maitiro emhangura uye kumanikidzwa zvese zvinoshanda pamwe chete.

Iyi haisi sarudzo yechinhu chega kana kuti yekubatana. Maitiro ekupedzisira anoburitswa nekudyidzana kwekuyerera kweresin panguva yekudzvanya ne finished dielectric thickness uye void control, nepo resin percentage uye glass style uye copper-area distribution zvichiratidza kana dhizaini imwechete inogona kudzokororwa mumapaneru nezvinhu. Ndosaka Highleap ichitanga nemafaira ebhodhi pachinzvimbo che generic product questionnaire.

Kukanganisa Kwakaita Resin Mukati Memagetsi Nemabasa Emakanika

Kudzokorora ndiyo bvunzo huru yekugadzira. Muenzaniso unogona kushanda kunyangwe nguva yekushanda kwayo yakakura, asi kugadzirwa kwehuwandu kunoratidza kusiyana kwezvinhu, kugoverwa kwemhangura, kurodha mapaneru uye kuputira. Tinoisa kudzora kudzvanya nekudzika, kuongorora kuponi nechikamu chidiki, kugadzirisa kuunganidzwa mushure meDFM uye kusarudza kuvaka kweprepreg mukuburitswa kwekugadzira kuti tipe kuenzanisa kwakasimba pakati pezvikamu.

Kuwanda kwe resin kunowanzoreva chikamu chikuru chine resin mushure mekudzvanya, asi mhedzisiro yacho inoenderanawo nerudzi rwegirazi, kufukidzwa kwemhangura uye kuyerera kwe resin. Shanduko iyi inogona kukanganisa kushanda kweDk , ukobvu hwe dielectric, kufamba kwemativi, kuwedzera kwekupisa uye kugona kuzadza zvinhu zvemhangura. Highleap inoongorora huwandu hwe resin sechikamu chekuvakwa kwe stackup, kwete sechikamu chakatorwa kubva patafura ye prepreg.

Masarudzirwo Anoitwa Zviri MuResin Kuti Zvishandiswe Pamwe Chete

1. Ongorora kugoverwa kwemhangura: Mapurani akasimba, masaini akakora uye nzvimbo dzakakura dzakajeka zvinoda huwandu hwakasiyana hwe resin.
2. Tarisa huremu hwemhangura: mhangura inorema inoda kuzadzwa zvakanyanya.
3. Seta chinangwa chakadzvanywa ukobvu: ukobvu hwe dielectric hunobva pakukanda, kwete ukobvu hwepepa husina kucheneswa.
4. Simbisa kuvharirwa: Dk uye ukobvu hwekupedzisira hunofanira kuenderana ne field-solver stackup.
5. Kuenzanisa mapuranga: resin isina kuenzana uye mhangura zvinogona kuwedzera kukwirira uye kutenderera.
6. Lamination inotevedzana yakakodzera: kutenderera kwega kwega kunochinja nhoroondo yekupisa uye kufamba kwemativi.

Kukosha kwedata remagetsi hakukwani kana bvunzo dzemagetsi dzisingakwanise kuona kuchinjika kweimpedance uye kushushikana kwegomba rakaputirwa kana kufa neresin. Ongororo yacho inofanira kushandisa core chaiyo kana prepreg, copper profile, finished thickness uye via route. Apa ndipo panodzivirira mutengi kubva kune mumwe nemumwe kuti akwanise kududzira magwaro akawanda emutengesi ari ega.

Kubuda kweongororo kunofanirwa kunge kuri muunganidzwa unogona kugadzirwa uye runyorwa rupfupi rwezvinhu zvinodzorwa. Highleap inonyora hunhu hwezvinhu zvakabvumiranwa, geometry, nzira yemaitiro uye hwaro hwekuongorora, yobva yabatanidza zvimwe zvese mukati meCAM, kugadzirwa, mhando uye kubatanidzwa.

Migumisiro Yokushandisa Zviri MuResin Zvisiri Izvo

• Kushaya chikafu neresin: resin isina kukwana mashizha anozadzwa zvisina kunaka, kubatana kusina simba kana girazi rakavhurika.
• Kudzvanywa zvakanyanya: Kuyerera kwakawandisa kunogona kuderedza ukobvu hwe dielectric yemunzvimbo uye kukonzera kurasikirwa kwe resin yemumucheto.
• Kuchinja kweImpedance: yakachinja Dr uye yakadzvanywa ukobvu fambisa geometry yemutsara wekutumira.
• Voids: Mhepo yakavharirwa kana kuti isina kuzara zvakakwana inoderedza kuvimbika.
• Warpage: resin isina kuenzana uye kugoverwa kwemhangura zvinopa kushushikana.
• Chikanganiso chekunyoresa: kufamba kwemativi kunogona kukanganisa maficha akanaka uye mavias.

Njodzi idzi dzinofanira kuderedza simba rinodiwa kuti munhu abate fekitori, kwete kuisimudza. Kana Highleap yangogamuchira mafaira eGerber kana edhizaini, tinoongorora kugadzirisa kwestackup mushure meDFM, sarudzo yekuvaka prepreg, press-cycle uye layup control uye coupon ne microsection review chete. Sarudzo dzinokanganisa mashandiro, kutevedzera mitemo, mutengo kana kutumira zvinhu ndizvo zvinodzoserwa kumutengi.

Chinangwa chekutsanangura mhedzisiro iyi hachisi chekurevesa kuti chirongwa chega chega chichakundikana. Chiripo ndechekuratidza kuti ndeapi magadzirirwo anofanirwa kuongororwa usati watenga. Mainjiniya akapihwa basa anotsanangura kuratidzwa kwacho kwedhizaini yakapihwa uye anoronga chero shanduko inodiwa nemapoka ekugadzira, emhando yepamusoro uye ekugadzira.

Chimiro cheGirazi chePrepreg, Zviri mukati meResin uye Ukobvu hwakadzvanywa

Kugadzwa kwe prepreg hakukwani pasina kuvakwa uye huwandu hwe resin. Semuenzaniso, ma prepreg maviri emhando ye1080 anogona kuva neresin percentage dzakasiyana uye kugadzira maitiro akasiyana emagetsi uye kuyerera.

Highleap inoshandisa data rekuvaka kwemutengesi uye ruzivo rwemukati memaitiro ekugadzira kuti ipe purasi yekudhindisa, yobva yasimbisa stackup yakapedzwa kuburikidza nekuyera ukobvu, cross-section uye impedance correlation kana zvichidikanwa.

Chinangwa chekugadzira uye muripo wefekitori zvine varidzi vakasiyana. Mutengi anotsanangura zvinodiwa zvemagetsi nekuvimbika; Highleap inoshandisa CAM yakatenderwa, kuchera, kuputira uye kugadzirisa lamination kunodiwa kuti isvike pamutengo wapera. Chero shanduko inokanganisa zvivakwa kana hunyanzvi inounzwa kuti ibvumidzwe pachinzvimbo chekuvanzwa mukati mekugadzirisa CAM.

Kudzokorora ndiyo bvunzo huru yekugadzira. Muenzaniso unogona kushanda kunyangwe kana hwindo rekugadzirisa rakafara, asi kugadzirwa kwehuwandu kunoratidza kusiyana kwezvinhu, kugoverwa kwemhangura, kurodha mapaneru uye kuputira. Tinoisa sarudzo yekuvaka prepreg, kudzora kudzvanya uye layup, kuongorora kuponi nechikamu chidiki uye kugadzirisa stackup mushure meDFM mukuburitswa kwekugadzira kuti tipe kuenzanisa kwakasimba pakati pezvikamu.

Zviri mukati meResin muHigh-Speed ​​​​uye RF PCBs

Nekumhanya kwakanyanya, huwandu hwe resin hunochinja musanganiswa we dielectric unoshanda uye hunogona kukanganisa maitiro ekugadzira magirazi , kutsveyama uye kurasikirwa. Modhi yechiteshi inoshandisa Dk imwe chete padanho rega rega inogona kupotsa mutsauko chaiwo wekuvaka.

Kune RF uye mmWave structures, resin flow uye final thickness zvinogona kuchinja zvakananga impedance uye resonant frequency. Tight control inogona kuda structures dzakatarwa pane prepreg-defined critical dielectric layers.

Zvinhu zvakasiyana-siyana zvehunyanzvi muchikamu chino hazvigone kuongororwa zvakazvimirira. Kuchinja kwekugoverwa kwenzvimbo yemhangura kunogona kuchinja mhedzisiro yekuyerera kweresin panguva yekudzvanya, nepo ukobvu hwe dielectric hwakapedzwa uye kutonga kwevasina uye huwandu hweresin uye maitiro egirazi zvinokanganisa geometry uye mhedzisiro yebvunzo inoonekwa pabhodhi rapera. Highleap inoongorora kuvakwa chaiko kwekugadzira saka stackup uye muripo zvinobva pazvinhu zvinotengwa kwete mienzaniso yemazita.

Kune ma "controlled-impedance" uye "low-loss layers", ukobvu hwe "pressed dielectric" uye "resin/glass distribution" zvinofanirwa kuenderana nepfungwa dze "field-solver". Kuvakwa kwakawanda kwe "resin" kunogona kuderedza simba regirazi remunharaunda asi kunogona kuwedzera kushanduka kweukobvu kana kufamba kana "copper pattern" uye "press cycle" zvisina kuenzana. Saka mapurojekiti eRF nema "high-speed" anoda kuvakwa kwakanyatsogadzirwa, kwete chete ukobvu hwebhodhi hwakapedzwa.

Highleap Multilayer Lamination Controls

• kusimbiswa kwezvinhu uye kuvakwa kwekare;
• kuongorora kuwanda kwemhangura uye kudiwa kweresin;
• kuvharidzira kwevacuum nekupisa kwakadzorwa, kumanikidzwa uye kuporesa;
• muripo wekuyera mapaneru nekunyoresa;
• ukobvu hwekupedzisira uye kuongororwa kweuta/kutenderera;
• chikamu chidiki chekuongorora dielectric, plating uye void;
• kuwirirana kweimpedance coupon;
• zvinhu zvakawanda uye kurongeka kwekutevera kana zvichidikanwa.

Chikumbiro chekugona chinokosha chete kana chakabatana nenzira inodzorwa nechitoro. Highleap inobatanidza kusarudzwa kwekuvakwa kweprepreg, kudzora kudzvanya nekudzika, kuongorora kuponi nechikamu chidiki uye kugadzirisa kuunganidzwa mushure meDFM kune kuongororwa kunouya, lamination, drilling, plating , imaging uye kusimbiswa kwekupedzisira. Kutevedzana chaiko kunoramba kuri pasi pekuvakwa kwezvinhu zvakatenderwa uye bhodhi.

Magadzirirwo akasiyana anoda mahwindo akasiyana ekugadzirisa zvinhu. Ukobvu hwebhodhi, kemikari yezvinhu, kuenzana kwemhangura, magadzirirwo emaburi uye saizi yepaneru zvinogona kuchinja mamiriro ekugadzirira, kudzvanya uye kuputira. Mainjiniya akapihwa anoronga CAM, kugadzirwa uye mhando kuitira kuti mutengi agamuchire mhinduro imwe chete yekugadzira panzvimbo pemibvunzo yakasiyana kubva kudhipatimendi rega rega.

Nei Zviri MuResin Zvichiri Kukosha Mushure mekugadzirwa

Dielectric yakagadziriswa inokanganisa kuomarara kwebhodhi, mhinduro yehunyoro, kuwedzera kweZ-axis uye maitiro ekudzoka kwemvura . Kuungana kwakawanda, maBGA makuru uye kutenderera kwekupisa kunodzokororwa zvinogona kuratidza lamination isina simba kana warpage. Highleap inoongorora kuvakwa kwebhodhi risina chinhu uye chimiro chekubatanidza pamwe chete.

Chikumbiro chekugona chinokosha chete kana chakabatana nenzira inodzorwa nechitoro. Highleap inobatanidza kudzora kwepress-cycle uye layup, coupon uye microsection review, kugadzirisa stackup mushure meDFM uye prepreg construction kuongororo inouya, lamination, drilling, plating, imaging uye kusimbiswa kwekupedzisira. Kurongeka chaiko kunoramba kuri pasi pemvumo yezvinhu nekuvakwa kwebhodhi.

Mhedzisiro yekumonera inokanganisa mashandiro ekupedzisira. Kushaya simba kana kuvharwa kwe resin kunogona kushayisa simba kubatana kwe interlayer uye kuisa madziro emaburi panjodzi yekuvimbika, nepo kuyerera kwakanyanya kwe resin kunogona kuchinja ukobvu, kunyoreswa uye kusatsetseka kwebhodhi. Panguva yekuunganidza, kunyudzwa kwemvura uye kudzokororwa kwekupisa kunoshanda pane system ye resin yakacheneswa. Data re microsection uye ukobvu rinopa humbowo hwekuti chivakwa chairo chakaitwa.

Tumira Mafaira eGerber kana PCB Design kuti Uwane Ongororo yeStackup

Hamufanirwe kuverenga huwandu hwe resin musati makumbira Highleap kuti mupe mutengo. Tumirai mafaira eGerber kana mafaira ekugadzira ePCB emuno kutanga. Kana zvinyorwa zve stackup nekugadzira zvatovepo, zvinogona kuongororwa zvakananga pasina fomu rakasiyana.

Mainjiniya edu ekugadzira lamination anopedzisa hurukuro yekugadzira

Mainjiniya wenyu weHighleap achaongorora kugoverwa kwemhangura, chimiro chelayer, ukobvu hwechinangwa uye impedance nechikwata chedu che stackup ne lamination. Tichaona chivakwa chakakodzera che prepreg uye tichakubatai chete kana muchida sarudzo yedhizaini kana mvumo yemutengi.

Ruzivo rwekutanga rusina kukwana harumisi quotation otomatiki. Tinoona zvatotsanangurwa, tinosiyanisa zvinodiwa kubva pane zvinodiwa, uye tinotsanangura kuti ndechipi chisarudzo chisina kugadziriswa chiri kuvharira zvechokwadi. Kana kuunganidza kuchidikanwa, mafaira eBOM nekuisa anogona kupihwa mushure mekunge scope yebhodhi isina chinhu yanzwisiswa.

Mutengo uye Migumisiro Yenguva Yekutungamira

Zvivakwa zvakakosha zve resin, ma plies akawanda ekugadzirira, magirazi anodzorwa uye lamination inotevedzana zvinogona kuwedzera mutengo wezvinhu uye kuoma kwekudzvanya. Zvisinei, kuvaka kusina kuzadzwa zvakakwana kana kusagadzikana kunokonzera mitengo yakakura zvikuru kuburikidza netsvina, kukwidziridzwa patsva uye kutadza kushanda zvakanaka mumunda.

Nguva yekushanda inowanzo dzorwa nekuwanikwa kwezvinhu, mhangura yakakosha, huwandu hushoma hwemutengesi, kugadziriswa kwakatevedzana kana hunhu hwekunze. Mainjiniya anoona chirambidzo chaicho chenguva uye anotarisa kana imwe nzira yakatenderwa inogona kuchibvisa pasina kuchinja zvinodiwa zvechigadzirwa.

Goho rinofanira kutariswa kubva pamuenzaniso kusvika pahuwandu. Zvinhu zvine chekuita nekuchinja kweimpedance uye kushushikana kwegomba rakaputirwa kana kusiyana kwakanyanya kweukobvu zvinogona kuwedzera marara, kugadziriswazve uye kurasikirwa kwezvikamu. Kuvakwa kwakanyorwa kwakasimba kunowanzova nemutengo wakaderera pane dhizaini yakasimba inoda kuchinjwa kakawanda mushure mekubatanidzwa.

Kuzadzwa kweresin kwakaoma kunogona kuda kugadziriswa kwakasiyana, mamwe ma plies, kuba kwecopper, revised layer copper balance kana modified press cycle. Kuchinja uku kunokanganisa mashandisirwo ezvinhu, nguva yekugadzira uye goho. Highleap inogona kuderedza mutengo nekugadzirisa matambudziko ekugoverwa kwecopper munzvimbo pane kungowedzera resin yakawanda kana kuwedzera ukobvu hwebhodhi rese.

Zviri Mukati meResin Chinhu Chinoshanduka Mukugadzirwa, Kwete Rugwaro rweDatasheet

Zviri mukati me resin zvinobatanidza kusarudzwa kwezvinhu ne lamination, mashandiro emagetsi uye kuvimbika. Highleap inodzora kuvakwa kwakatenderwa uye inoongorora bhodhi rekupedzisira pane kushandisa ese ma prepregs negirazi rakafanana nerinochinjika.

Chikamu chakadhindwa patafura yekugadzirira hachitauri zvakananga ukobvu hwekupedzisira hwebond-line kana kugoverwa kweresin muPCB. Mhedzisiro iyoyo inogadzirwa panguva yekuramwa negirazi rakasarudzwa, patani yemhangura, kumanikidzwa, tembiricha uye kutenderera kwevacuum. Highleap inoshandura dhizaini kuita layup inogadzirwa uye inosimbisa mhedzisiro kuburikidza nekudzvanya kwakadzorwa, kuyerwa kweukobvu uye microsection pazvinodiwa.

Kuti vaongorore kekutanga, mutengi anongoda kutumira mafaira ekugadzira eGerber kana PCB. Mainjiniya edu ekugadzira zvinhu zvemhando yepamusoro nelamination anogona kuona kana patani yemhangura ichikonzera kudiwa kweresin kusingawanzoitiki uye vozokurukura nezvekuchinja kwekuvaka kunodiwa. Mutengi haafanire kuverenga huwandu hweresin asati akumbira mutengo.

Mibvunzo Inonyanya Kubvunzwa

Ko huwandu hwe resin hwakafanana here nekuyerera kwe resin?

Kwete. Huwandu hwe resin hunoreva huwandu hwe resin iri mukugadzirwa kwayo; kuyerera kwayo kunotsanangura kufamba kwayo pasi pebvunzo kana maitiro akatsanangurwa e lamination.

Ko huwandu hwakawanda hwe resin hunogara huchireva here kuti Drk yakaderera?

Kazhinji Dk inoshanda inoderera sezvo chikamu cheresin chichiwedzera nekuti E-glass inowanzova neDk yakakwira, asi mhedzisiro chaiyo inoenderana nesystem yeresin uye kuvakwa kwayo.

Ko ma prepreg maviri ane girazi rakafanana anogona kutsiviwa here?

Kwete otomatiki. Huremu hwe resin, kemikari ye resin, kuyerera kwayo, ukobvu hwayo hwakachena uye hunhu hwemagetsi zvinogona kusiyana.

Ukobvu hwakadzvanywa hunodzorwa sei?

Nekusarudza mavakirwo uye huwandu hwema ply, kuongorora kudiwa kwemhangura, uye kudzora tembiricha ye lamination, kumanikidzwa, vacuum uye cure.

Ko Highleap inogadzira zvinhu here?

Kwete. Tinogadzira maPCB nemaPCBA tichishandisa laminate yakatenderwa uye prereg kubva kuvatengesi vane hunyanzvi.

Ndinofanira kuverenga huwandu hwe resin ndisati ndakumbira mutengo wePCB here?

Kwete. Tumira mafaira eGerber kana mafaira ekugadzira ePCB emuno kutanga. Highleap ichaongorora kugoverwa kwe stackup necopper nechikwata che lamination uye ichasimbisa chero sarudzo dzinodiwa dze prepreg kana resin-content newe.