I-Automotive HDI PCB ye-ADAS, Radar & Power Control Systems

Isingeniso

Isimo se -elekthronikhi yezimoto sishintshe kakhulu ngokuthuthuka okusheshayo kwe-Advanced Driver Assistance Systems (ADAS), ubuchwepheshe bokushayela obuzimele, izinhlelo ze-radar yezimoto, kanye namamojula okulawula i-powertrain kagesi. Lezi zinhlelo eziyinkimbinkimbi zidinga ubuningi besignali obungavamile, ukuthembeka okungaguquki, ukuphathwa kokushisa okuphumelelayo, kanye nokusetshenziswa kwesikhala okuhle kakhulu ngaphakathi kwezakhiwo zezimoto ezincane kakhulu.

I-Automotive HDI PCB inikeza izixazululo zokuxhumanisa okuminyanisa okuphezulu kwe-ADAS yesizukulwane esilandelayo nezinhlelo ze-radar, ibhekana nalezi zinselele zokuklama ezibalulekile. Ushintsho olusuka kumabhodi esekethe ajwayelekile aphrintiwe ukuya kubuchwepheshe bokuxhumana obusondelene kakhulu lumelela ushintsho olubalulekile endleleni ugesi wezimoto ofinyelela ngayo amazinga okusebenza nokwethembeka adingekayo ekuphepheni nasekusebenzeni kwemoto yesimanje.

Kungani I-Automotive HDI PCB Technology Ibalulekile

Izidingo Zokudluliswa Kwedatha Yesivinini esikhulu

Amasistimu we-radar we-Millimeter-wave asebenza ku-77 GHz kanye no-79 GHz, ama-multi-camera array, kanye nezinzwa ze-LiDAR akhiqiza ukusakazwa kwedatha okukhulu okudinga ukuqondiswa kwesignali okunembile ngokulahleka okuncane. Ubuchwepheshe be-Automotive HDI PCB buvumela lokhu kudluliselwa ngama-microvias ambozwe nge-laser adala izindlela ezimfishane zesignali, ehlisa ukungaqhubeki kwe-impedance kanye nokugcina ubuqotho besignali. I-architecture estakiwe ye-microvia inciphisa ubude be-stub futhi inikeza izindlela ezilawulwayo zokuvimba i-radar namayunithi okucubungula amakhamera anokucaca okuphezulu.

Ukuthuthukiswa Kwesikhala Kumamojula Wemoto

Amayunithi okulawula kagesi wezimoto zanamuhla (ama-ECU) kanye namamojula ezinzwa kumele alethe ukusebenza okwandayo ngaphakathi kwezinyathelo zomzimba ezinciphayo. Ubuchwepheshe be-HDI PCB bufinyelela ukwanda kobuningi bezingxenye ngokusebenzisa i-lamination elandelanayo, ukungaboni kahle nokugqitshwa ngezakhiwo, kanye namakhono okuqondisa umugqa oqondile afinyelela kuma-micrometer angu-75. Lokhu kunciphisa kuvumela abaklami bezimoto ukuthi bahlanganise amandla amaningi okucubungula, inkumbulo, kanye nezixhumi zezinzwa ngaphakathi kwezindlu zesibuko, amamojula ezinsika, kanye nezinhlangano zedeshibhodi.

Ukuthembeka Ezindaweni Ezinzima Zezimoto

Izinto zikagesi zezimoto zibekezelela izinga lokushisa lokuhamba ngebhayisikili ukusuka ku -40°C ukuya ku-+125°C, ukudlidliza okuqhubekayo, ukuchayeka komswakamo, nokuphazamiseka kazibuthe okudlula kude izindinganiso zomthengi zikagesi. Imiklamo ye-Automotive HDI PCB ihlanganisa izinto ezithuthukisiwe ze-dielectric ezinokuqina okushisayo okuphakeme, i-coefficient ehambisanayo yezakhiwo ezinwebekayo ezishisayo, kanye nama-microvias abhobozwe nge-laser ane-plating yethusi ethuthukisiwe ekwazi ukumelana nezinkulungwane zemijikelezo yokushisa.

Ukucatshangelwa kwe-Automotive HDI PCB Design

Ukukhetha Okubalulekile Kwezimo Ezidlulele

Izinto ze-substrate ezisetshenziswa ekwenziweni kwezimoto ze-HDI PCB kufanele zihlangabezane nezindinganiso eziqinile zokufaneleka kwezimoto kuyilapho kugcinwa ukusebenza kukagesi kuzo zonke izimo zokusebenza ezidlulele. Izimfuneko zezinto zifaka:

• Izinga lokushisa eliphezulu lokushintsha kwengilazi - Amanani e-Tg angaphezu kuka-170°C aqinisekisa ukuzinza kobukhulu phakathi nokuhlanganisa nokusebenza.
• Ukumuncwa komswakama okuphansi - Inciphisa amashifu e-dielectric njalo kanye nezingozi ze-delamination ezindaweni ezinomswakama.
• Ukuzinza Thermal – Izinto ezifana ne-FR-4 esebenza kahle kakhulu, ama-laminate akhethekile aphansi okulahlekelwa, kanye nochungechunge lwe-MEGTRON zigcina izakhiwo kuwo wonke amazinga okushisa ezimoto.

Lezi zinto zisekela ukuhambisana namazinga okuthembeka e-AEC-Q200 kanye nezidingo zekhwalithi ze-IATF16949 ezibalulekile ekuhlanganisweni kochungechunge lokuhlinzekwa kwezimoto.

I-Microvia Architecture kanye Nokwethenjelwa

Isakhiwo se-microvia sichaza uphahla oluthembekile lwemihlangano yezimoto ye-HDI PCB. Ukukhethwa kwesakhiwo phakathi kuka-1+n+1 kanye no-2+n+2 kuncike ekuminyana komzila kanye nezidingo zokwethenjelwa. Ama-microvias agcwele ithusi anezindonga eziseceleni ezifakelwe ugesi anikeza amandla okusebenza aphakeme uma kuqhathaniswa nezinye izindlela ezigcwaliswe nge-resin, ikakhulukazi amanethiwekhi okusabalalisa amandla kuzilawuli zezimoto zikagesi.

Ukufinyelela ukujiya okulinganayo kwe-copper plating kanye ne-coefficient ehambisanayo yokwanda kokushisa phakathi kwezingqimba kudinga ukulawulwa kwenqubo okunembile ngesikhathi semijikelezo ye-lamination elandelanayo . Amapharamitha okubhoboza kanye ne-desmear chemistry kuthinta ngqo isikhathi eside ngokuthembeka ngaphansi kwezimo zokujikeleza kokushisa.

Amasu okuphatha okushisayo

Izilawuli zezimoto zikagesi nezinhlelo zokuphatha ibhethri kufanele zikhiphe ukushisa okukhulu kuyilapho zigcina ukulethwa kwamandla okuzinzile. Ukusatshalaliswa kwesisindo sethusi okubalulekile kuzo zonke izendlalelo zamandla nephansi, kuhlanganiswe ne-thermal nge-array ngaphansi kwama-semiconductors anamandla aphezulu, kudala izindlela zokudlulisa ukushisa ezisebenza kahle. Okuhlukile kwe-Metal-core HDI PCB kuhlanganisa ama-aluminium substrates anezendlalelo ze-HDI zokwakha izinhlelo zokusebenza ezidinga isixhumi esibonakalayo esishisayo esinamasistimu okupholisa.

Ubuqotho Besiginali nokulawulwa kwe-EMI

Amapheya anesivinini esiphezulu aphethe idatha ye-SerDes, i-Ethernet yezimoto, noma amasignali e-radar adinga ukunakwa okucophelelayo ukuze alandelele i-geometry nokuqhubeka kwendiza eyinkomba. Izendlalelo zendiza ephansi ezibekwe eduze kwezendlalelo zesignali zihlinzeka ngokuvikela kazibuthe okunciphisa ukuhlangana phakathi kokufakwayo kwenzwa ye-analog ebucayi kanye namasekhethi okucubungula edijithali anomsindo. Izinto ezingaguquki ze-dielectric eziphansi zinciphisa ukubambezeleka kokusakazwa kwesignali futhi zigcine ukubekezelelana okuqinile okubalulekile ekudlulisweni kwedatha ye-multi-gigabit.

Izicelo ze-Automotive HDI PCB

I-ADAS kanye ne-Autonomous Driving Systems

Amabhodi okulawula amakhamera abheke phambili namayunithi okucubungula isignali ye-radar amelela izinhlelo zokusebenza zezimoto ze-HDI PCB ezifunwa kakhulu. Lawa mamojula ahlanganisa izinzwa zesithombe, amaphrosesa e-FPGA noma e-ASIC, ukuphathwa kwamandla, nezindawo zokuxhumana eziningi kuma-compact HDI substrates. Ukungaboni ngobuchwepheshe kunika amandla ukubekwa kwengxenye kuzo zombili izinhlangothi kuyilapho kugcinwa ubuqotho besignali, isekela ukuguqulwa okuncane okudingekayo ukuze kuhlanganiswe ezindlini zesibuko, ama-grille assemblies, nama-sensor pods abekwe ophahleni.

I-Powertrain kagesi kanye nokuphathwa kwebhethri

Ama-inverter ezimoto zikagesi, abalawuli bezimoto, kanye nezinhlelo zokuphatha amabhethri zisebenzisa imiklamo ye-PCB ye-HDI yezimoto ukuphatha ukusatshalaliswa kwamandla kagesi aphezulu kanye nezifunda zokuqapha i-voltage ebucayi kanye nokushisa. Ukwakhiwa kwe-HDI enezingqimba eziningi kuvumela ukuhlukaniswa kwezifunda zokushintsha amandla aphezulu kusuka eziteshini zokulinganisa i-analog ezinomsindo ophansi ngokusebenzisa isabelo sezendlalelo ezihlelekile. Abalawuli bokuphathwa kwamabhethri bazuza kakhulu ekubunjweni kwe-HDI, okuvumela ukuxhumana okuqondile kumakhulu ezindawo zokuqapha amaseli ngenkathi kugcinwa ukuhlukaniswa okudingekayo.

Ukuxhumana kanye Infotainment Amamojula

Izilawuli zokubonisa ezimaphakathi, amamojula we-telematics, namahabhu okuxhumana angenantambo adinga ubuchwepheshe bezimoto be-HDI PCB ukuze busekele izixhumi ezibonakalayo zokucaca okuphezulu kwevidiyo namabhendi amaningi omsakazo ngaphakathi kwezindawo ezivalekile ezifakwe kudeshibhodi. Lezi zinhlelo zokusebenza ziphakamisa amandla okukhweza ingxenye ye-fine-pitch enikwe amandla ama-microvias, okuvumela ukuxhumeka okuqondile kumaphrosesa ohlelo oluthuthukisiwe anamaphakheji we-ball-grid-array at 0.4mm pitch noma kakhudlwana.

Amazinga Okukhiqiza Nekhwalithi Yezimoto ze-HDI PCB

Izinselelo Zokukhiqiza

Ukukhiqizwa kwemihlangano ye-HDI PCB yezimoto kudinga amakhono akhethekile angaphezu kokwenziwa kwezendlalelo eziningi. Imijikelezo yokucindezela eminingi ngokubhaliswa okuqondaniswe, i-laser yokujula elawulwayo ngokukwakheka, kanye nokufakwa kwekhopha okufana nokwahluka ngokuhlukahlukana ngenselelo yokuminyana kokukhiqiza ukungaguquguquki. Izidingo ezibalulekile zokukhiqiza zihlanganisa:

• Ukunemba okulandelanayo kwe-lamination - Imijikelezo eminingi ye-lamination enokubekezela kokubhalisa ngaphansi kwama-micrometer angu-75 igcinwa ngokuhambisana.
• I-Laser drilling control - Ukulawula ukujula ngaphakathi kwama-micrometer angu-± 10 kuqinisekisa ukwakheka okungaguquki kwe-microvia ngaphandle kokulimala kwe-substrate.
• Ukufana kwe-Copper Plating - Ukuthola ukushuba okungaguquki phakathi kokuminyana okuphezulu ngezinkambu kuvimbela ukwehluleka ukwethembeka.

Ukuqinisekisa Ikhwalithi Nokuhlolwa

Ukucaciswa kwezimoto kudinga izivumelwano zokuhlola eziphelele ukuze kuqinisekiswe ikhwalithi yokukhiqiza nokubikezela ukwethembeka kwesikhathi eside. Ukuhlola okuzenzakalelayo kwe-Optical Inspection (AOI) kuqinisekisa ikhwalithi yokwakheka kwe-microvia futhi kuthwebula idatha yobukhulu ukuze ilawulwe inqubo. Ukuhlolwa kwe-Flying probe kuqinisekisa ukuqhubeka kukagesi kuwo wonke umzila oyinkimbinkimbi ngaphandle kokulungiswa kokuhlola okuzinikele. Ukuhlolwa kwe-X-ray kuhlaziya ngaphakathi ngesakhiwo kanye nekhwalithi yokugcwalisa yethusi engabonakali ngokuhlola indawo.

Okusheshisiwe kokuqinisekiswa kokuhamba ngebhayisikili okushisayo kuncike ekuhlanganiseni kwezimoto ze-HDI PCB kuya ezingeni lokushisa elidlule izimfuneko zokusebenza, ngokuvamile imijikelezo engu-1000 ukusuka ku--40°C ukuya ku-+125°C, ukubikezela ukwethembeka kwesikhathi eside. Amasistimu okuphatha ikhwalithi aqinisekiswe ku-IATF16949 ahlinzeka ngohlaka lokukhiqiza ukulandeleka nokulawulwa kwenqubo okudingwa ama-OEM ezimoto nabahlinzeki besigaba sokuqala.

Isiphetho

Ubuchwepheshe bezimoto be-HDI PCB sebubalulekile ekuhlangabezaneni nokuminyana, ukwethembeka, kanye nezidingo zokusebenza kwemishini yesimanje yezimoto. Inhlanganisela yomzila oqondile, izakhiwo ze-microvia estakiwe, nezinto ezithuthukisiwe ze-substrate zenza abaklami bezimoto bathole amazinga okusebenza angenakwenzeka ngobuchwepheshe obuvamile be-PCB kuyilapho kugcinwa ukuqina okudingekayo amashumi eminyaka yokusebenza ngaphansi kwezimo zemvelo ezinzima.

I-Highleap Electronics iletha izixazululo eziphelele zezimoto ze-HDI PCB ezinamakhono afakazelwe:

• Ukukhiqiza okuqinisekisiwe kwe-IATF16949 - Ukuhambisana ngokugcwele nezinhlelo zokuphatha ikhwalithi yezimoto kanye nezidingo zokulandeleka.
• Ubuchwepheshe be-HDI obuthuthukisiwe - Amakhono alandelanayo asekela i-1+n+1 kanye ne-2+n+2 microvia izakhiwo ezinembayo nge-laser.
• Ukuqinisekisa ukwethembeka - Ukuhlolwa kokuhamba ngebhayisikili okushisayo, ukuhlaziywa kwe-microsection, kanye nokuhlolwa okusheshisiwe kwempilo kumazinga ezimoto.
• Ukwesekwa kwedizayini - Ukusebenzisana kwezobunjiniyela ukuze kuthuthukiswe Izitaki ze-HDI ngokwenziwa ngenkathi ihlangabezana nezimfuneko eziqinile zokusebenza kwezimoto.

Bambisana ne-Highleap Electronics kumaphrojekthi akho e-HDI PCB yezimoto futhi uzuze kobuchwepheshe bethu ku-ADAS, izinhlelo ze-radar, amamojula okulawula amandla, kanye nezinhlelo zokusebenza zokuphatha ibhethri. Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngezidingo zakho ze-PCB yezimoto futhi uqinisekise impumelelo yokuqala kule ngxenye yemakethe edinga kakhulu.