I-HDI PCB Design Guidelines: Ubunjiniyela obuhle kakhulu ku-High-Density Interconnect Technology

Isingeniso

Ubuchwepheshe be-High-Density Interconnect PCB bumele ushintsho olubalulekile endleleni yokusebenza yebhodi lesifunda ephrintiwe, olwenza ukuminyana kwezingxenye okungakaze kubonwe kanye nokusebenza kukagesi emishinini yesimanje kagesi. Njengoba ama-electronics abathengi, amasistimu ezimoto, kanye nezicelo zezimboni zidinga izici zefomu ezincane ezinomsebenzi othuthukisiwe, umklamo we-HDI PCB usuphenduke ikhono elibalulekile konjiniyela abakha imikhiqizo yokuncintisana.

Ukuhlanganiswa kwama-microvia, izinqubo zokulandelana kwe-lamination, kanye nezinto ezithuthukisiwe kuvumela abaklami ukuthi bafinyelele ubuningi bomzila obekungenakwenzeka ngaphambili ngamasu okukhiqiza ama-PCB avamile. Lo mhlahlandlela uhlola izimiso zokuklama ezibalulekile kanye nezinto zokucubungula zokukhiqiza ezichaza ukuqaliswa kwe-HDI PCB okuphumelelayo.

Ukuqonda Okuyisisekelo kwe-HDI PCB

Izici Eziyinhloko ze-HDI Technology

Idizayini ye-HDI PCB izihlukanisa ngezici ezimbalwa ezichazayo ezithinta ngokuqondile ukuminyana kwesekhethi nokusebenza. Ama-Microvia anobubanzi obusuka ku-0.004 amayintshi ukuya ku-0.006 amayintshi anika amandla ukuxhumeka phakathi kwezendlalelo eziseduze ngaphandle kokusebenzisa indawo ethengiswayo yebhodi eyeqile. Inqubo ye-lamination yokwakha elandelanayo ivumela abaklami ukuthi bangeze izendlalelo eziqhutshwayo ngokuqhubekayo, benze izakhiwo eziyinkimbinkimbi zokuxhumanisa ezisekela izingxenye ze-pitch emihle kanye nokudluliselwa kwesignali ngesivinini esikhulu.

Le ndlela yokwakha yehlisa ukujiya kwebhodi kukonke kuyilapho ngasikhathi sinye ikhulisa ukuminyana kwesekethe, okwenza ukulungiselelwa kwesitaki se-HDI PCB kubaluleke kakhulu ezinhlelweni ezibambezeleke isikhala.

Ukuhlukaniswa kwe-HDI Nezinhlobo Zesakhiwo

Izakhiwo ze-PCB ezixhumene ne-High-Density Interconnect zingahlukaniswa ngokucushwa nokubalwa kongqimba:

• Thayipha I-HDI - Isendlalelo esisodwa sama-microvias ohlangothini olulodwa noma zombili zesakhiwo esiyinhloko, esilungele ukusetshenziswa kokuminyana okumaphakathi.
• Uhlobo lwe-II HDI - Ama-microvias agxilile noma astakiwe kuzo zonke izendlalelo zokwakha eziningi, okuvumela ukuminyana okuphezulu kwemizila.
• Uhlobo III+ HDI - Kungcwatshwe ngamapayipi ngaphakathi komgogodla eceleni kwezendlalelo eziningi ze-microvia, ezisekela ukuminyana okuphezulu kakhulu kwamabhodi amakhulu e-smartphone namamojula ekhompuyutha athuthukile.

Ukuqonda lezi zigaba kusiza onjiniyela bakhethe izindlela ezifanele zokuklama ze-HDI PCB ezihambisana nezidingo zabo zikagesi nesabelomali sokukhiqiza.

Ukuqhathanisa Izindlela ze-HDI ne-PCB Yendabuko

Umehluko oyinhloko phakathi komklamo we-HDI PCB kanye nokuhlelwa kwebhodi evamile kulele ekuhlanganiseni kokuxhumana kanye nokwenza ngcono indlela yesignali. Ama-PCB endabuko athembele kakhulu ezimbobeni ezidlulayo ezingena kulo lonke ugqinsi lwebhodi, okudala ubude be-stub obonakalisa ubuqotho besignali kumaza angaphezu kwe-1 GHz.

Ubuchwepheshe be-HDI busebenzisa ama-vias angaboni futhi angcwatshwe axhuma izingqimba ezidingekayo kuphela, anciphise i-parasitic inductance namandla ngenkathi kukhulula iziteshi zomzila ukuze uthole imikhondo yesignali eyengeziwe. Le nzuzo yezakhiwo ivumela amabhodi we-HDI ukuthi asekele izingxenye zezingxenye ezingaphansi kuka-0.4mm futhi afinyelele ukunemba kokulawula ukuvinjelwa okubalulekile ekudlulisweni kwedatha ye-multi-gigabit.

HDI PCB Design Izimiso: Stackup Architecture

Ukuhlelwa Kwesendlalelo kanye Nokusabalalisa Kwezimpawu

Umklamo we-HDI PCB stackup ophumelelayo uqala ngokuhlaziya ngokucophelela izidingo zesendlalelo sesignali, izidingo zokusatshalaliswa kwamandla, kanye nezinhloso zokuhambisana kwe-electromagnetic. Onjiniyela kumele balinganisele inani lezendlalelo zokuhambisa isignali ngokumelene nobunzima bokukhiqiza kanye nemikhawulo yezindleko ngenkathi beqinisekisa izindiza zokubhekisela ezanele zokulawula ukuvinjelwa.

Izindiza zamandla nezasemhlabeni kufanele zibekwe eduze kwezendlalelo zesignali enesivinini esiphezulu ukuze kuncishiswe indlela yokubuyela emuva futhi inikeze isivikelo ekuphazamisekeni kozibuthe kagesi. Ugqinsi lwe-dielectric phakathi kwezendlalelo luthonya ngokuqondile ukungasebenzi kahle kwesici, okudinga ukukhethwa kwezinto ezibonakalayo okunembayo ukuze kuzuzwe amanani okuvimba okuqondiwe ngokuvamile aphakathi kuka-50 no-100 ohms.

Impedans Control Strategies

Ukulawulwa kokuphazamiseka kwe-HDI PCB kudinga ukushuba okungaguquki kwe-dielectric kanye ne-trace geometry kuso sonke isitaki. Ukwehluka kogqinsi lwesendlalelo kuya kwesendlalelo kufanele kuhlale phakathi kuka-±10% ukuze kugcinwe ukubekezelela ukuphazamiseka ngaphakathi kobubanzi obamukelekayo bokuxhumana okudijithali kwesivinini esikhulu. Izakhiwo ezilawulwayo ze-impedance zidinga izindiza eziyinkomba eziqhubekayo ngaphansi kokulandela isignali, ngokuphuka kwendiza noma ukuhlukana kugwenywe ezindaweni ezibalulekile zesignali.

I-HDI PCB Design: Ukuqaliswa Kwe-Microvia

I-Microvia Geometry kanye ne-Aspect Ratio

Idizayini ye-Microvia kuzakhiwo ze-HDI PCB idinga ukunakwa kwemikhawulo yesilinganiso nokucatshangelwa kokwethembeka. Abakhiqizi abaningi bacacisa ubukhulu bezilinganiso zokubukeka phakathi kuka-0.75:1 no-1:0 kuma-microvias abhodwe nge-laser, okusho ukuthi ububanzi obungu-0.004-intshi ngokudlula akumele budlule amayintshi angu-0.005 ukujula.

Ama-microvias agcwaliswe ngethusi ahlinzeka ngokuthembeka okuphakeme uma kuqhathaniswa nezinye izindlela ezigcwaliswe nge-resin, ikakhulukazi ezindaweni zamabhayisikili ashisayo lapho ukunwetshwa okuhlukile kungabangela ukwehluleka. Ukucushwa kwe-microvia estakiwe kudinga ukuhlela ngokucophelela ukuze kuqinisekiswe ukufakwa kwethusi okwanele ngaphakathi ngakunye nge-tier.

Izimpumputhe futhi Wangcwatshwa Ngokukhetha

Izimpumputhe nezingcwatshwe nge-Vis zisebenzisa izinjongo ezihlukile ku-HDI PCB design optimization:

• Izimpumputhe nge - Xhuma izendlalelo zangaphandle kuzendlalelo zangaphakathi ngaphandle kokungena kulo lonke ibhodi, ilungele umzila wengxenye engaphezulu.
• Wangcwatshwa nge - Xhuma izendlalelo zangaphakathi kuphela, ulondoloze umthamo wangaphandle womzila wezingxenye eziminyene.
• Ama-microvias astakiwe - Ama-microvias aqondaniswe amaningi ahlanganisa izendlalelo ezimbalwa, adinga ukugcwaliswa kwethusi ukuze athembeke.

Imihlahlandlela eminingi yokuklama incoma izinhlelo ze-microvia ezinyakazayo ukuze kuthuthukiswe isivuno sokukhiqiza nokusebenza kukagesi kuyilapho kunciphisa ukugxila kwengcindezi esakhiweni sethusi.

Idizayini ye-HDI PCB: Ukwenza Umzila Nokulandelela Ukuthuthukisa

I-Trace Geometry Izidingo

Izidingo ze-HDI PCB zokulandelela ububanzi nesikhala zithonya ngokuqondile ubuqotho besignali nokuba nokwenzeka kokukhiqiza. Ububanzi bokulandelela obuncane ngokuvamile busukela ku-0.003 kuye ku-0.004 amayintshi emiklamo ethuthukisiwe ye-HDI, enemikhawulo yesikhala yobukhulu obufanayo obunqunywe yizidingo zokuhlukaniswa kwamandla kagesi namandla okukhiqiza.

Umzila ohlukile wokubhangqwa kokuxhumana okunesivinini esikhulu udinga ukuhambisana okuqinile nesikhala sokulandelela ukuze silandele ngokuvamile esicaciswa izikhathi ezingu-2 kuya kwezingu-3 zobubanzi bokulandelela ukuze kuzuzwe ukufanisa okufanele kokuphazamiseka. Ukufanisa ubude kuba bucayi kakhulu njengoba amanani edatha edlula ama-Gbps angu-5, okudinga amasu omzila wenyoka phakathi kokubekezelelana okucacisiwe.

Ukucatshangelwa kobuqotho besignali

Ukwenziwa kobuqotho besignali ye-HDI PCB kudinga ukunakwa ngemiphumela ye-stub, ukuqhubeka kwendlela yokubuyisela, kanye nokuncishiswa kwe-crosstalk. Ngokusebenzisa ama-stubs amade kunengxenye eyodwa kweshumi yobude beza besignali kungadala ukungaqhubeki kwe-impedance kanye nokuboniswa okwehlisa ikhwalithi yesignali. Ukubhoboza emuva noma ukungaboni ngokusetshenziswa kususa la ma-stubs ezindleleni ezibucayi zesivinini esikhulu.

Ukunqanyulwa kwendlela yokubuyisela okubangelwa ukuhlukana kwendiza noma ukuguquka kwesindlalelo kwethula umsindo wemodi evamile futhi kukhuphule ukukhishwa kwe-electromagnetic. Abaklami kufanele bahambise amapheya ahlukile ezindizeni eziyisithenjwa eziqhubekayo futhi banikeze okwanele ngokuthunga eduze nezinguquko zendiza.

Ukukhetha Okubalulekile kwe-HDI PCB Design

I-Substrate Material Properties

Ukukhetha okubalulekile kwedizayini ye-HDI PCB kuthinta kakhulu ukusebenza kukagesi, ukuphatha okushisayo, nokuthembeka kokukhiqiza. Nakuba izinto ezijwayelekile ze-FR-4 zihlala zilungele izinhlelo zokusebenza ezingaphansi kuka-1 GHz, imiklamo yefrikhwensi ephezulu izuza kuma-laminates alahlekelwa kancane anezici zokulahla ngaphansi kuka-0.01 kumafrikhwensi e-gigahertz.

Izinto zokushisa ezisezingeni eliphezulu zengilazi (Tg> 170°C) zithuthukisa ukuzinza kokushisa phakathi nemijikelezo yokuhlobisa eminingi edingekayo ukuze kwakhiwe ukwakheka okulandelanayo. Ukungaguquguquki okungaguquki kwe-dielectric kuwo wonke ama-frequency range kuthinta ukunemba kokulawulwa kwe-impedance kuyo yonke i-spectrum yokusebenza.

I-Copper Foil kanye Nokwelapha Okungaphezulu

Ukukhethwa kwezinto ze-HDI PCB kudlulela ezicini ze-copper foil kanye nokwelashwa kokuqeda ubuso. Ama-copper foil aphansi anobulukhuni obuncishisiwe anciphisa ukulahlekelwa kwe-dielectric kuma-frequency aphezulu ngenkathi esekela amakhono okuchoboza umugqa ocolekile. Ama-foil aphathwe emuva athuthukisa ukunamathela ezinhlelweni ze-resin ngesikhathi sezinqubo zokulandelana kwe-lamination.

Ukukhethwa kokuqedwa kobuso kuthinta ukwethembeka nokuqina kwe-microvia:

• I-ENIG (Electroless Nickel Immersion Gold) - Impilo yeshelufu enhle kakhulu kanye nokuhambisana kwe-wire bonding, ilungele izinhlelo zokusebenza ze-fine-pitch.
• I-OSP (I-Organic Solderability Preservative) – Ibiza kakhulu inomthelela omncane ezicini zikagesi, impilo yeshelufu elinganiselwe.
• Isiliva Sokucwiliswa - Ibhalansi enhle yezindleko, ukuthengiswa, nokusebenza kukagesi ezinhlelweni eziningi ze-HDI.

Ukucatshangelwa Kokukhiqiza kwe-HDI PCB Design

Idizayini Yezimfuneko Zokukhiqiza

Ukucatshangelwa kokukhiqiza kwedizayini ye-HDI PCB kudlulela ngale kwemithetho yemithetho yokuklama evamile ukuze kuhlanganisa nemikhawulo yenqubo ekhethekile. Izidingo ezincane zendandatho yonyaka zama-microvias ngokuvamile zicacisa amayintshi angu-0.002, zifuna ukunemba okukhethekile kokubhaliswa ngesikhathi sokumba nokuthwebula izithombe.

Izinqubo zokucwangciswa okulandelanayo zethula ukuhamba ngebhayisikili okushisayo okungathinta ukuzinza kwe-dimensional, okudinga izici zesinxephezelo ekwakhiweni kwephaneli nokubeka imbobo yamathuluzi. Abaklami kufanele bagcine ukuxhumana nozakwethu bokukhiqiza ukuze baqinisekise ukuqondanisa kwamandla ngaphambi kokuphothula izakhiwo.

Ukuqondanisa Amandla Enqubo

Ukuqonda amakhono athile omkhiqizi kubalulekile ekusetshenzisweni okuphumelelayo kokukhiqiza i-HDI PCB . Imikhawulo yemishini yokubhoboza nge-laser ichaza ububanzi obuncane obungafinyeleleka be-microvia (ngokuvamile amasentimitha angu-0.004) kanye nesivinini esiphezulu sokucubungula amaphaneli, okuthonya ngqo izindleko zokukhiqiza.

Ukunemba kokubhaliswa kwesendlalelo kuya kwesendlalelo kuthinta indawo encane yokulandela umkhondo kuya kudlule futhi kunquma amamajini edizayini aphephile okukhiqiza inzuzo ephezulu. Ukuhlanganyela ozakwethu bokukhiqiza ekuqaleni komjikelezo wokuklama kunciphisa imijikelezo yokuphindaphinda futhi kusheshisa isikhathi sokuya emakethe ngemikhiqizo esebenzisa ubuchwepheshe be-HDI.

I-HDI PCB Isakhiwo Imikhuba Engcono Kakhulu

Amasu okuphatha we-EMI

Izinqubo ezihamba phambili ze-HDI PCB ezithuthukisiwe zibeka phambili ukuncishiswa kokuphazamiseka kuka-electromagnetic ngokusebenzisa umzila olawulwayo we-impedance, ngokulungiselela, kanye nokuphathwa kwendlela yokubuyisela efanele. Ukulandela umkhondo ophansi phakathi kwamasignali e-analog azwelayo kanye nezindawo zokusebenzelana zedijithali ezinesivinini esikhulu kunikeza ukuhlukaniswa kuyilapho kusetshenziswa izinsiza zomzila ezincane kuzitaki eziminyene ze-HDI.

Ngokuncishiswa kwe-stub ngokubhoboza emuva noma ukwenziwa ngcono ngokubeka kunciphisa ukuboniswa nama-resonance okona ikhwalithi yesiginali ngaphezu kuka-10 GHz. Ukubekwa kwe-decoupling capacitor eduze nezikhonkwane zamandla, ngokuvamile phakathi kwamayintshi angu-0.2, kunciphisa ukuphazamiseka kwenethiwekhi yokusabalalisa amandla kumaza aphezulu.

Ukuhlanganiswa Kwezokuphatha Okushisayo

Idizayini ye-HDI PCB kufanele ibhekane nezinselele ezishisayo ezidalwe ukuminyana kwengxenye eyandayo. Izimbobo ezishisayo ezixhuma izingxenye zamandla aphezulu ezindizeni zethusi ezingaphakathi noma ezingaphansi zenza kube lula ukuqeda ukushisa. Nge-arrays enezikhala ezingamayintshi angu-0.020 ukuya kwangu-0.030 kunikeza ukuqhutshwa kwe-thermal okusebenzayo kuyilapho kugcinwa ubuqotho besakhiwo.

Ukuthuthukisa Izindleko ku-HDI PCB Design

Ukuphathwa Kwekubalwa Kwezendlalelo Zecebo

Ukuthuthukiswa kwezindleko ze-HDI PCB kudinga izinqumo zamasu mayelana nokubalwa kwesendlalelo, ngokusetshenziswa kobuchwepheshe, kanye nokusebenza kahle kwamaphaneli. Ukukhawulela inani lezendlalelo ezakhayo ezilandelanayo kunciphisa inkimbinkimbi yokukhiqiza kuyilapho kudinga isibalo esengeziwe sesendlalelo esiyinhloko ukuze kugcinwe umthamo womzila.

Ukusetshenziswa okukhethekile kwama-microvias kuphela lapho izingxenye zephimbo elicolisekile ziwadinga, esikhundleni sawo wonke umklamo, kunganciphisa izindleko zokumba nge-laser ngo-30-40%. Okujwayelekile ngokusetshenziswa ezindaweni ezingaminyana kancane kuhlinzeka ngoxhumano olungabizi kakhulu ngaphandle kokuphazamisa ukusebenza.

Ukusebenza Kwephaneli Nokucatshangelwa Kwevolumu

Ukulungiselelwa kosayizi wephaneli kanye nezakhiwo zamalungu afanayo asebenza kahle kunciphisa udoti wezinto ezibonakalayo futhi kwandise inani lamabhodi akhiqizwa iphaneli ngayinye yokukhiqiza. Osayizi bephaneli abajwayelekile abangamayintshi angu-18×24 bavumela abakhiqizi abaningi ukuthi bacubungule amabhodi e-HDI ngendlela efanele. Ubukhulu bedizayini obunika amandla amaphaneli amaningi ngohlelo ngalunye lwehlisa izindleko zeyunithi ngayinye ngevolumu yokukhiqiza engaphezu kwamayunithi ayi-1000.

HDI structures and production-release questions

Via structure, layer sequencing and pad geometry determine the HDI fabrication route. Define these features before comparing processes, costs and inspection options.

Isiphetho

Umklamo ophumelelayo we-HDI PCB uhlanganisa izimiso zikagesi nolwazi lokukhiqiza ukuze uhlangabezane nezidingo zokusebenza, izindleko, kanye neshejuli. Izinto ezibalulekile zifaka izakhiwo zesitaki eziqondaniswe nobuqotho besignali, ukusetshenziswa okuthembekile kwe-microvia, kanye nomzila olungiselelwe amasignali anesivinini esikhulu.

Njengoba izinhlelo ze-elekthronikhi zidinga ubuningi obukhulu kanye namazinga edatha asheshayo, ukuqonda iziqondiso zokuklama ze-HDI kubalulekile emikhiqizweni encintisanayo. I-Highleap Electronics inikeza ukwesekwa kokukhiqiza nokuklama kwe-HDI PCB okuthuthukisiwe, okusiza amaqembu obunjiniyela ukuthi athuthukise izakhiwo zokusebenza kanye nokukhiqizwa. Xhumana nethimba lethu lobuchwepheshe ukuze uxoxe ngezidingo zakho ze-HDI PCB futhi usebenzise ubuchwepheshe bethu.