I-HDI Blind Via PCB Cost Drivers I-Lamination Drill kanye Nomklamo

Izindleko ze-HDI blind nge-PCB ziqhutshwa ubunzima benqubo, hhayi izinto zokwakha. Imijikelezo yokubopha ngokulandelana, ukusethwa kokubhoboza nge-laser, kanye nezidingo zokugcwalisa zibusa isakhiwo sezindleko - hhayi indawo yebhodi noma isisindo sethusi. Ibhodi le-HDI yohlobo I (1+N+1) lisebenzisa u-2.3–3.2× umklamo ofana nowembobo. Uhlobo II (2+N+2) lunezela olunye u-1.7–2.1× ngaphezu kwalokho. Uhlobo III kanye ne-HDI yanoma yiluphi ungqimba ifinyelela izindleko ze-PCB ezijwayelekile ezingu-4–8×.

Ukuqonda ukuthi yiziphi izici ze-HDI ezidingwa umklamo wakho — nokuthi yiziphi ezichazwe ngokweqile — yikho okuhlukanisa uhlelo lwe-HDI olunezindleko ezingcono kakhulu kolukhokha iphrimiyamu engu-40–60% ngaphandle kwenzuzo kagesi.

Thola i-HDI Blind Via Cost Analysis

1) I-HDI Blind Nge-PCB Cost Drivers

Ku-PCB ejwayelekile, izinto zokwakha kanye nokucubungula okuyisisekelo kuhlanganisa iningi lezindleko. Ebhodini le-HDI, imijikelezo ye-lamination kanye nobunzima bokubhoboza kuthatha indawo. Lolu shintsho lunomthelela oqondile: ukwenza ngcono izindleko ze-HDI kusho ukunciphisa imijikelezo ye-lamination kanye nokubalwa — hhayi ukuxoxisana ngentengo ye-laminate.

Isakhiwo Sezindleko: I-PCB Ejwayelekile vs. I-HDI

Isibonelo Sezindleko Zekhonkrithi: Ibhodi Elinezingqimba Eziyi-6 Eliyi-100×100 mm Ezingcezu Eziyi-100

• I-6L ejwayelekile (umgodi odlulayo): $12–18/ibhodi
• Uhlobo I lwe-HDI (1+4+1): $32–48/ibhodi — iprimiyamu engu-$20–30 ivela emijikelezweni emibili ye-lamination, ukusethwa kokubhoboza nge-laser, kanye nokuhlolwa kwe-X-ray, hhayi ezintweni zokwakha.
• Uhlobo II lwe-HDI (2+2+2): $55–82/ibhodi — imali eyengeziwe engu-$23–34 ngaphezulu kohlobo I ivela emjikelezweni wesithathu we-lamination, ukusebenza kwesibili kokubhoboza nge-laser, kanye nokugcwalisa

Isinyathelo ngasinye sobunzima be-HDI sinokwenyuka kwezindleko okufanayo okuphelele. Umbuzo uhlala uwukuthi ingabe inzuzo yokuqondisa iyasithethelela yini.

Kungani Izindleko ze-HDI Zingalingani Nendawo Yebhodi

Izindleko ze-PCB ezijwayelekile zihambisana nendawo yebhodi. Izindleko ze-HDI zihambisana nemijikelezo yokubala kanye ne-lamination. Ibhodi lohlobo I elingu-50×50 mm elinama-microvia angu-400 livame ukubiza kakhulu njengebhodi lohlobo I elingu-150×150 mm elinama-microvia angu-200 — ibhodi elincane linobuningi obuphindwe kabili kunalo, hhayi ingxenye yezindleko.

2) 1+N+1 vs. 2+N+2 vs. Noma yiluphi ungqimba: Ukuqhubeka Kwezindleko

Uhlobo I (1+N+1): I-HDI Yezinga Lokungena

Isendlalelo esisodwa esihlanganisiwe singeziwe ebusweni ngabunye bangaphandle bomgogodla ojwayelekile onezingqimba eziningi. Ama-vias angaboni axhuma i-L1–L2 kanye ne-Ln–Ln-1. Izimbobo ezidlulayo zisangena ku-stackup ephelele.

Izinto ezibangela izindleko: umjikelezo owodwa owengeziwe we-lamination, ukusethwa kokubhoboza nge-laser, ukuhlolwa kwe-X-ray kwe-blind ngekhwalithi, ukubhaliswa okuqinile (± 0.075 mm vs. ± 0.15 mm ejwayelekile).

Izindleko ezijwayelekile ziphindaphindwa: umklamo ofana nowembobo odlulayo ongu-2.3–3.2×.

Kuyaqondakala uma: iphimbo elingu-0.40–0.50 mm i-BGA edinga umzila we-in-pad noma eduze kwe-pad; ukwehliswa kosayizi webhodi ngo-20–30% uma kuqhathaniswa ne-through-hole; imiklamo ye-RF lapho i-through-hole ngama-stubs ehlisa ukusebenza ngaphezu kwe-5 GHz.

Uhlobo II (2+N+2): Ukwakheka Okubili

Izendlalelo ezimbili ezilandelanayo zokwakheka kwendawo engaphandle ngayinye. Ivumela amazinga amabili e -blind vias : ukwakheka kokuqala kudala i-blind vias ye-L1–L2; ukwakheka kwesibili kudala ukuxhumana kwe-L1–L3 ngama-microvia ahlanganisiwe noma ahlanganisiwe, aboniswe endaweni engezansi.

Izinto ezibangela izindleko: imijikelezo emibili eyengeziwe ye-lamination, imisebenzi emibili yokubhoboza nge-laser, ngokugcwalisa uma kusetshenziswa ama-vias ahlanganisiwe ($0.05–0.15 nge-via ngayinye yepulaki ye-resin, $0.20–0.50 yokugcwalisa ngethusi).

Izindleko ezijwayelekile ziphindaphinda: 4.2–6.5× imbobo edlulayo, noma 1.7–2.1× Uhlobo I.

Kuyaqondakala uma: iphimbo elingu-0.30–0.40 mm i-BGA ene-I/O ephezulu; ukunciphisa usayizi webhodi ngo-35–50%; ukunciphisa inani lezendlalelo (Uhlobo II lwezendlalelo ezingu-8 lungathatha indawo yomklamo wezendlalelo ezingu-10 ezidlulayo).

Uhlobo III: Ukwakhiwa kwe-Bried Vias Plus

Ama-cores wezendlalelo zangaphakathi ane -vias ezifihliwe , kanye nezendlalelo eziqongelelekayo ezine-vias ezingaboni ebusweni bangaphandle.

Izindleko ezibangela: imijikelezo engu-4-5 ye-lamination, imisebenzi eminingi yokubhoboza nge-laser kanye nemishini, ukwabiwa kokulahlekelwa okukhulu kwesivuno (izinyathelo eziningi zenqubo = amathuba amaningi okukhubazeka).

Izindleko ezijwayelekile ziphindaphinda: 5.8–9.5× imbobo edlulayo, noma 1.35–1.85× Uhlobo II.

Kuyaqondakala uma: amabhodi anezingqimba ezingu-12-20 lapho ama-via agqitshwe khona ehlisa inani lezingqimba eliphelele ngo-20-30%; imiklamo yedijithali esheshayo edinga ukuguqulwa kwezingqimba ngaphandle kwezingcezu.

I-HDI Yanoma Yimuphi Ungqimba (Uhlobo IV–VI)

Ukwakheka okulandelanayo kusukela ngaphakathi kuya ngaphandle, noma yiluphi ungqimba oluxhumeka kunoma yiluphi olunye ngokusebenzisa ama-microvia ahlanganisiwe nahlanganisiwe. Imijikelezo ye-lamination engu-5–8; ukubhoboza nge-laser ngemva kwe-lamination ngayinye; ukuhlelwa kwe-planar kuzo zonke izigaba zokwakheka.

Izindleko ezijwayelekile ziphindaphinda: 8–16× imbobo edlulayo.

Kuyaqondakala uma: Amabhodi amakhulu e-smartphone kanye nethebhulethi, ama-substrate ephakethe le-IC athuthukisiwe, noma izinhlelo zokusebenza lapho izindleko zebhodi zingabalulekile uma kuqhathaniswa nenani lengxenye noma lesistimu.

3) Umnotho Wokubhoboza We-Laser vs. Mechanical

Ukuhlaziywa Kwezindleko Zokubhoboza Nge-Laser

Ukubhoboza nge-laser (CO₂ noma i-UV) kuyadingeka kuma-microvia angaphansi kuka-0.20 mm ububanzi.

Izindleko zokusetha zibusa kakhulu uma kubalwa ama-via aphansi. Kumaphaneli ane-vias engaphansi kwe-100, ukusetha kugijima u-$1–2 nge-via. Kuma-vias angaphezu kwe-1,000 ngephaneli, ukusetha kwehla kuye ku-$0.10–0.20 nge-via.

Ukuhlaziywa Kwezindleko Zokubhoboza Kwemishini

Ukubhoboza ngomshini kuyasebenza kuma-vias angaboni ≥0.20 mm ububanzi kanye nesilinganiso sobukhulu ≤5:1.

Kuma-vias angu-≥0.20 mm, ukubhoboza ngomshini kubiza ngaphansi ngo-50-65% nge-via kune-laser.

Ukubhoboza Okuhlanganisiwe: Ukuthuthukisa Izindleko Ezisebenzayo

Amabhodi amaningi ayazuza ngokuhlanganisa zombili izindlela. Izindawo ze-BGA zokubhoboza nge-laser kanye nama-via <0.20 mm; ukubhoboza ngamandla, umhlabathi, kanye nama-via okushisa ngomshini ≥0.20 mm ezindaweni ezinobuncane obuphansi.

Isibonelo: Uhlobo I HDI olune-600 blind vias

• I-laser yonke: 600 × $0.35 = $210/ibhodi
• I-Hybrid (i-laser engu-200 + i-mechanical engu-400): $70 + $48 = $118/ibhodi
• Ukonga: $92/ibhodi (44%). Kumabhodi angu-500: $46,000.

4) Ngokugcwalisa kanye Nokufaka Izindleko Ezihlanganisiwe

Ngokuqhathanisa Indlela Yokugcwalisa

Ama-Microvia ahlanganisiwe vs. ahlanganisiwe

Lesi yisinqumo esisodwa sezindleko esinomthelela omkhulu kumklamo wohlobo lwesibili nohlobo lwesithathu lwe-HDI.

Ama-microvia ahlanganisiwe ahlanganisa ama-via ezingqimbeni ezilandelanayo ezilandelanayo endaweni efanayo ye-XY. Adinga ukugcwaliswa kanye nokuhlelwa ngaphambi kwe-lamination elandelayo - engeza u-$0.30–0.70 ngokuhlanganisa ngakunye okuhlanganisiwe kanye nokuhlolwa kwe-X-ray.

Ama-microvia agxilile ahlukanisa ama-via ngo-≥0.25 mm phakathi kwezingqimba, axhunywe ngemikhondo emifushane ezingqimbeni eziphakathi. Akukho ukugcwaliswa okudingekayo. Akukho zindleko ezengeziwe zokucubungula ngale kwe-baseline blind via.

Isibonelo: Uhlobo II lwe-HDI olunezixhumanisi ezingama-300 eziphakathi kwezingqimba

• Okubekwe ndawonye: amabhangqa angu-300 × $0.50 = $150/ibhodi
• Okungajwayelekile: $0 eyengeziwe
• Ukonga: $150/ibhodi. Ngamabhodi angu-500: $75,000.
• Ukushintshana: okuhleliwe kudinga indawo yomzila engaphezulu kuka-~5–8%. Kuyafaneleka ngaphandle kokuthi ukuminyana kukhuliswe ngokuphelele.

Izindleko ze-Via-in-Pad (VIP)

I-Via-in-pad ibeka ama-via ngqo ngaphakathi kwama-component pads — okuwukuphela kwesisombululo sokuqondisa ama-BGA e-pitch angu-0.30–0.35 mm, futhi ngezinye izikhathi kuyadingeka kuma-pitch angu-0.40 mm anenani eliphezulu le-I/O.

Umthelela wezindleko: ukugcwaliswa kwethusi + ukuhlelwa kabusha $0.30–0.70 nge-via; ukuhlolwa okwengeziwe kwe-X-ray $3–8 ngephaneli ngayinye; ukwabiwa kokulahlekelwa okukhulu kwesivuno senhlangano (i-VIP yandisa ingozi yokukhubazeka ngo-2–4%).

Ukuthuthukisa izindleko: Sebenzisa ama-vias e-dog-bone (angu-0.20–0.30 mm ngaphandle kwe-pad) noma ngabe iphimbo livuma. I-dog-bone isusa ngokuphelele izidingo zokugcwalisa, yonge u-$0.25–0.60 nge-via ngayinye. Ukuze uthole okwengeziwe ngokusetshenziswa kwe -via-in-pad kumiklamo ye-flex ne-rigid-flex HDI , indlela efanayo yezindleko iyasebenza ngokucabangela okwengeziwe kwezinto ezibonakalayo.

5) Izinqumo Zokuklama Ezilawula Izindleko

Ukukhetha Uhlobo lwe-HDI: Sebenzisa Okudingekayo Okuncane

Izinhlobo ze-HDI azizona amamaki ekhwalithi. Uhlobo I aluphansi kunohlobo II — luyisinqumo esifanele lapho Uhlobo I luhlangabezana nezidingo zakho zomzila. Ukucacisa ngokweqile uhlobo lwe-HDI kuyiphutha lokuklama elivame kakhulu nelibiza kakhulu.

Ngokusetshenziswa Kobubanzi

Imiklamo echaza okungu-3 noma ngaphezulu ngamadayamitha (0.10, 0.15, 0.20 mm) iphoqa izinguquko eziningi zamapharamitha e-laser noma ukushintshana kwama-drill bit, okwengeza isikhathi sokusetha ngokushintsha kobubanzi ngabunye.

Ukulinganisa ububanzi obubili obuphezulu: 0.15 mm ezifundeni ze-BGA ezinobuthi obukhulu; 0.20 mm kukho konke okunye (okwenza futhi kube lula ukubhoboza ngomshini ezindaweni ezinobuthi obuphansi). Ukonga okuvamile: 8–15% wezindleko zokubhoboza.

Ukusetshenziswa kwephaneli

Izindleko zokubhoboza ze-HDI zikhokhiswa ngephaneli ngayinye, hhayi ngebhodi ngalinye. Ushintsho lobukhulu obungu-2–3 mm oluthuthukisa ukusetshenziswa kwephaneli ngo-10–15% lusho ngqo ekunciphiseni izindleko ngebhodi ngalinye.

Isibonelo: Ukushintsha kusuka ku-82×118 mm (amabhodi/iphaneli angu-20) kuya ku-80×115 mm (amabhodi/iphaneli angu-24) kuma-vias/ibhodi angu-350:

• Okwamanje: $38/ibhodi
• Kulungiselelwe: $32/ibhodi (inzuzo yokusetshenziswa engu-20% → ukuncishiswa kwezindleko okungu-16%)

Ukunciphisa Inani Lezingqimba Nge-HDI

I-HDI inika amandla ubuningi obukhulu bomzila ngesendlalelo ngasinye , okungenzeka kunciphise inani lesendlalelo. Ibhodi elijwayelekile elinezingqimba ezingu-8 lingafinyeleleka njenge-HDI yoHlobo I enezingqimba ezingu-6 — isindisa izingqimba ezimbili zangaphakathi ezintweni nasekucutshungulweni.

Ukuqhathanisa: I-8L ejwayelekile = $18, i-6L Uhlobo I = $32. I-HDI ibiza kakhulu ngebhodi ngalinye kodwa ivumela indawo encane. Uma indawo yebhodi incipha ngo-25% ngenxa yobuningi be-HDI, izindleko ezisebenzayo ziba ngu-$32 × 0.75 = $24 — ezishibhile kunomklamo wembobo engu-8L ngenkathi ziletha ubuqotho obungcono besignali.

6) Umnotho Wevolumu kanye Nokuncishiswa Kwemali Kwe-NRE

Ukwahlukaniswa Kwezindleko ze-NRE Ngohlobo lwe-HDI

Ukunciphisa i-NRE ngamanani ahlukene

Isibonelo se-Hlobo I HDI (i-NRE = $1,200, izindleko eziyisisekelo = $35/ibhodi):

• Amabhodi ayi-10 (uhlobo lwesibonelo): I-NRE ingeza u-$120/ibhodi → $155 isiyonke
• Amabhodi angu-50: I-NRE ingeza u-$24/ibhodi → $59 isiyonke
• Amabhodi angu-100: I-NRE ingeza u-$12/ibhodi → $47 isiyonke
• Amabhodi angu-500: I-NRE ingeza u-$2.40/ibhodi → $37.40 isiyonke
• Amabhodi angu-2,000: I-NRE ingeza u-$0.60/ibhodi → $35.60 isiyonke (ngokuyisisekelo ngezindleko eziyisisekelo)

Intengo ye-prototype HDI ingama-3–4× amanani okukhiqiza ngenxa nje yokwehla kwe-NRE. Ungalokothi uchaze izindleko zamayunithi e-prototype ukuze ubikezele isabelomali sokukhiqiza.

Ukwakheka Kwentengo Yevolumu

7) Izixazululo ze-HDI Ezilungiselelwe Ngezindleko ezivela ku-Highleap

I-Highleap Electronics yakha i-HDI blind ngama-PCB kusukela ku-Type I kuya ku-Type III, okuhlanganisa izakhiwo ze-stacked microvia, ukumiswa kwe-HDI stackup okuyinkimbinkimbi , kanye nokwakhiwa kwe-hybrid nge-laminate ekhethekile ene-low loss noma izendlalelo zangaphandle ze-Megtron kuma-cores angaphakathi e-FR4.

Ukwehlukaniswa Kwezindleko Okungafihli

Isilinganiso ngasinye se-Highleap HDI sihlukanisa izindleko ngokwehlukana:

• Izinto eziyisisekelo ngohlobo lwe-laminate kanye nebanga le-foil yethusi
• Imijikelezo yokubopha (ngokuvamile ibiza u-$2.50–4.00 ngomjikelezo ngamunye ebhodini ngalinye)
• Ukusethwa kokubhoboza nge-laser + izindleko ze-per-via, kanye nokubhoboza ngomshini, okuboniswe ngokwehlukana
• Ngokugcwalisa (ipulaki ye-resin vs. ukugcwaliswa kwethusi, izindleko nge-via ngayinye)
• Ukuhlolwa: i-X-ray ejwayelekile (ebonakalayo + kagesi + isampula) uma kuqhathaniswa ne-X-ray ethuthukisiwe (100% X-ray) uma kuqhathaniswa ne-Class 3 (isigaba esincane)
• I-NRE iboniswa ngokwehlukana ngokugcinwa kwamathuluzi izinyanga ezingu-24

Isibuyekezo Sokunciphisa Izindleko ze-DFM

Ubunjiniyela be-Highleap bubuyekeza yonke idizayini entsha ye-HDI ngaphambi kokucaphuna. Okutholakele okuvamile:

• Ukunciphisa uhlobo lwe-HDI: Hlola ukuthi umklamo wohlobo lwesibili ungahamba njengohlobo lwe-1 ngokusebenzisa ukunikezwa kabusha kwesendlalelo - ukonga okuvamile $22–35/ibhodi
• Ukususwa kokugcwalisa: Maka ama-via acacisiwe njengagcwalisiwe angadingi ukugcwaliswa (hhayi nge-in-pad, hhayi i-stacked) — wonge u-$0.05–0.15 nge-via ngayinye
• Ukuguqulwa kokubhoboza okuhlanganisiwe: Ama-flag vias ≥0.20 mm afanelekela ukubhobozwa ngomshini — onge u-$0.15–0.25 nge-via ngayinye
• Okuhlanganisiwe kuya kokuhlanganisiwe: Phakamisa ezinye izindlela zokuhambisa imigqa ezihleliwe — wonge u-$0.30–0.70 ngepheya ngayinye
• Ukulungiswa kwamaphaneli: Ncoma ukulungiswa kobukhulu obungu-1–3 mm okuthuthukisa ukusetshenziswa kwephaneli ngo-10–25%

Lezi zincomo zibuyiselwa zingakapheli amahora angu-8-12 mahhala futhi ngokuvamile zikhomba ukwehliswa kwezindleko okungu-15-35% ngaphandle kokuguqulwa kabusha komklamo. Ukuze uthole umbono ophelele wokuthi yiluphi ulwazi oludingekayo ukuze uthole i-HDI blind enembile ngesilinganiso se-PCB , bheka umhlahlandlela wethu wokucaphuna.

Amanani Womthamo

Amandla Enqubo Nokukhiqiza

• Isivuno sokuqala se-HDI sohlobo I: 97–98% (isilinganiso semboni singu-94–96%)
• Isivuno sokuqala se-HDI sohlobo lwesibili: 95–97% (isilinganiso semboni 90–94%)
• Izinga lokuvula ngokungaboni: <0.5% (isilinganiso semboni esingu-1.5–3% ekukhiqizeni kokuqala)
• Ukunemba kokubhalisa: ±0.060 mm okujwayelekile, ±0.085 mm esiphezulu

Inzuzo ephezulu inciphisa izindleko eziphelele zobunikazi ngale kwentengo ecashuniwe — amabhodi ambalwa enqatshwa ekuhlolweni okungenayo, ukwehluleka okuncane kokuhlanganiswa okubangelwa amaphutha e-substrate.

Ngemiklamo ehlanganisa i-HDI nezidingo ze-RF ezithuthukisiwe, i-Highleap iphinde idale ama-stackup e-hybrid HDI/high-frequency isebenzisa i-laminate ekhethekile ene-low-loss ekhethekile kanye nama-laminate e-Megtron kuma-core e-HDI. Ngezinhlelo zokusebenza ze-HDI eziyinkimbinkimbi kumapulatifomu amancane, bheka iziqondiso zethu ze-drone kanye ne-UAV HDI PCB kanye ne -semiconductor packing HDI ukuze uthole ukucatshangelwa komklamo oqondene nesicelo.

Thola Isilinganiso Sakho Se-HDI Esilungiselelwe Ngezindleko

imibuzo ejwayelekile ukubuzwa

Yini ebangela izindleko ezinkulu kakhulu ku-HDI blind ngokusebenzisa ukukhiqizwa kwe-PCB?

Imijikelezo yokubopha ngokulinganisa kanye nokusethwa kokubhoboza nge-laser — hhayi izinto zokwakha. Ku-PCB ejwayelekile, izinto zokwakha eziyisisekelo zimele u-20-30% wezindleko. Kubhodi le-HDI yohlobo lwesibili, ukubhoboza kuphela kubalelwa ku-25-35% kanye nokubopha ngokulinganisa ...

Ingakanani intengo ye-Hlobo II HDI uma iqhathaniswa ne-Hlobo I?

Uhlobo II (2+N+2) lusebenzisa u-1.7–2.1× wezindleko zebhodi elilinganayo lohlobo I (1+N+1). Ebhodini elinezingqimba eziyi-6 elingu-100×100 mm elinezingcezu eziyi-100, Uhlobo I lubiza u-$32–48/ibhodi kanti Uhlobo II lubiza u-$55–82/ibhodi. Izindleko ezengeziwe zivela emjikelezweni wesithathu we-lamination, umsebenzi wesibili wokubhoboza nge-laser, kanye nezidingo zokugcwalisa — hhayi ezintweni ezingaphansi komhlaba ngokwazo.

Kunini lapho kudingeka khona ngempela ukugcwalisa nge-pass ku-HDI blind nge-PCB?

Ukugcwaliswa kwe-Via kuyadingeka kuphela ngokwesakhiwo ezimweni ezimbili: izindawo ze-via-in-pad ngaphansi kwama-BGA pads acwebezelayo (ukuvimbela ukugoba kwe-solder ngesikhathi sokuhlanganiswa), kanye nokulungiselelwa kwe-microvia ehlanganisiwe lapho i-via esendlaleloni esisodwa sokwakheka ihlezi ngqo ngaphezu kwe-via esendlaleloni sangaphambilini. Ama-Via angewona ama-via-in-pad noma ahlanganisiwe awadingi ukugcwaliswa. Ukucacisa ukugcwaliswa kwethusi kuma-vias angagcwalisiwe kunezela u-$0.20–0.50 nge-via ngokungadingekile - elinye lamaphutha avame kakhulu ekucacisweni ngokweqile ekwakhiweni kwe-HDI.

Kungani intengo ye-prototype HDI iphakeme kangaka kunentengo yokukhiqiza?

Izindleko ze-NRE (ubunjiniyela obungaphindaphindi) zilayishwa ngokugcwele enanini le-prototype. Kwibhodi le-Type I HDI, i-NRE ifinyelela ku-$730–1,680 — isakazeke kumabhodi e-prototype ayi-10, okwengeza u-$73–168 ebhodini ngalinye. Kumabhodi okukhiqiza angu-500, i-NRE efanayo ingeza u-$1.46–3.36 kuphela ebhodini ngalinye. Intengo ye-prototype HDI ivame ukuba yintengo yokukhiqiza engu-3–4× ngenxa yalesi sizathu kuphela. Ungalokothi usebenzise izindleko zeyunithi ye-prototype ukulinganisa isabelomali sohlelo lokukhiqiza.

Iyiphi indlela engabizi kakhulu yokunciphisa i-HDI blind ngezindleko ze-PCB ngaphandle kokuklama kabusha?

Izinguquko ezintathu ziletha ukonga okuphezulu kakhulu ngaphandle kokuthinta i-schematic noma ukwakheka: (1) Shintsha kusuka ekubholeni nge-laser yonke uye ekubholeni nge-hybrid — ama-vias angu-≥0.20 mm abholiwe ngomshini abiza ngaphansi ngo-50-65% nge-via kune-laser-drilled; ebhodini elisebenzisa ama-600-via lokhu konga ~$92/ibhodi. (2) Guqula ama-microvias ahlanganisiwe abe yi-staggered — kususa u-$0.30-0.70 nge-pair ngayinye ekugcwaliseni nasekuhleleni izindleko. (3) Lungisa ubukhulu bebhodi ngo-1-3 mm ukuze uthuthukise ukusetshenziswa kwephaneli ngo-10-25%, okunciphisa izindleko ngebhodi ngalinye ngokulinganayo njengoba ukubhoboza nge-laser kukhokhiswa ngephaneli ngalinye.

Ingabe uhlobo lwe-HDI oluphezulu luhlala lusho ukusebenza kahle kukagesi?

Cha. Uhlobo lwe-HDI luyisigaba esiyinkimbinkimbi sokukhiqiza, hhayi ibanga lekhwalithi. Uhlobo I aluphansi ngogesi kunohlobo II lapho Uhlobo I luhlangabezana nezidingo zomzila. Ukucacisa Uhlobo II lwe-BGA yephimbo elingu-0.40 mm elingahamba njengoba Uhlobo I lungeza u-$22–35/ibhodi ngaphandle kwenzuzo kagesi. Uhlobo lwe-HDI olufanele luyinani eliphansi elihlangabezana nezidingo zakho zangempela ngobuningi, iphimbo, kanye noshintsho lwesendlalelo - olunqunywa ukuhlaziywa komzila, hhayi ngesigaba somkhiqizo.