I-Drone HDI PCB: Ukukhiqiza Okuthuthukile kwe-Compact UAV Control Systems

Isingeniso

Izimoto zasemoyeni zesimanje ezingenamuntu zifuna amasistimu kagesi ahlangene futhi angasindi ngaphandle kokuphazamisa ukusebenza kwawo. Isilawuli sendiza, imojula yokuzulazula, nezinzwa ezihlanganisiwe kufanele zisebenze ngaphakathi kwezikhala ezibonakalayo ezibambeke kakhulu kuyilapho kugcinwa ubuqotho besignali nokwethembeka kokusebenza.

Ubuchwepheshe be-High-Density Interconnect bubhekana nalezi zinselele ngezakhiwo ezithuthukisiwe ze-multilayer kanye nezindlela zokuxhumanisa ngokunemba. Ama-miniaturized drone HDI PCB avumela ukwakheka kwesilawuli sendiza esincane lapho ukuxhumana ngokunemba kanye nesakhiwo esilula kubaluleke kakhulu. Le ndlela yokukhiqiza isebenzisa ubuchwepheshe be-microvia, i-lamination elandelanayo, kanye nokukhiqizwa kwemigqa emincane ukuze kufezwe ubuningi bezingxenye kanye namakhono okuhambisa angenakwenzeka ngezindlela ezivamile ze-PCB.

Kungani Abalawuli Be-Compact Drone Badinga I-HDI PCB Technology

Izingqinamba zesikhala kumabhodi okulawula we-UAV

Izilawuli zezindiza zihlanganisa izinhlelo eziningi ezincane—i-MCU eyinhloko, izinzwa ze-IMU, izinzwa zokucindezela ze-barometric, amamojula e-GPS, kanye nezixhumanisi zokuxhumana—emabhodini ngokuvamile anobukhulu obungu-36×36 mm noma ngaphansi. Ubuchwepheshe be-PCB bendabuko abukwazi ukufeza ubuningi bokuxhumana obudingekayo ngaphakathi kwalezi zilinganiso ngenkathi kugcinwa umzila wesignali ofanele kanye nokuphathwa kokushisa. I-HDI PCB yezinhlelo zokusebenza zebhodi lokulawula i-UAV ixazulula lo mkhawulo ngokusebenzisa ukwenziwa ngcono kokubalwa kwezingqimba kanye nokusebenza kahle kwesakhiwo.

Izinselelo Zokuminyana Kwesiginali Yesivinini Esikhulu

Izinhlelo zesimanje zokulawula ama-drone zicubungula amasignali angaphezu kuka-100 MHz kuzivumelwano zokuxhumana kanye nokutholwa kwedatha yezinzwa. Ukudlula kwe-hole evamile kudala imiphumela ye-stub kanye nokunqanyulwa kwe-impedance eyehlisa ikhwalithi yesignali. Isidingo somklamo omncane we-PCB siphoqa ukuthi silandelele eduze, sikhulise ubungozi bokuphazamiseka kwe-crosstalk kanye nozibuthe kagesi. Ubuchwepheshe be-Drone HDI PCB bubhekana nalezi zinkinga ngokungcwatshwa nokungaboni ngezakhiwo eziqeda ama-stubs futhi zinciphise ukubalwa kongqimba.

Amakhono Omzila Omuhle

Ukukhiqizwa kwe-HDI kwenza ububanzi be-trace bufinyelele ku-75 µm ngesikhala esingu-75 µm, uma kuqhathaniswa no-150 µm okungenani ekwakhiweni kwe-PCB okujwayelekile. Lokhu kuphindaphindwa kobuningi be-routing kuvumela izindlela eziyinkimbinkimbi zesignali ngaphakathi kobukhulu bebhodi elincanyana. Ubuchwepheshe busekela amaphakheji e-BGA ane-pitch engu-0.4 mm, ebalulekile kuma-processor abalawuli bezindiza banamuhla kanye nama-IC okuphatha amandla asetshenziswa kakhulu ezinhlelweni zobungcweti ze-UAV.

I-Microvia kanye Nezimpumputhe / Zangcwatshwa Ngezobuchwepheshe ku-Drone HDI PCB

Isakhiwo se-Microvia kanye nezinzuzo

Ama-Microvia alinganisa ububanzi obungu-150 µm noma ngaphansi, axhumanisa izendlalelo eziseduze ngokusebenzisa izikhala ezimbozwe nge-laser. Ngokungafani nokubhoboza ngomshini, ukubhoboza nge-laser kufinyelela ukunemba kwendawo ngaphakathi kuka-±20 µm, okubalulekile ekubekweni kwezingxenye ezixineneyo. Lawa ma-via anobubanzi obuncane athatha indawo encane kakhulu yebhodi futhi angafakwa ngqo kuma-component pads (nge-in-pad), asuse izindlela zokudlulisela umzila futhi anciphise usayizi webhodi iyonke ngamaphesenti angama-30 uma kuqhathaniswa nemiklamo yendabuko.

Laser Drilling Process Control

Inqubo ye-laser ablation isusa izinto ze-dielectric ngokusebenzisa ama-pulses amandla alawulwayo, idale izimbobo ezihlanzekile ze-cylindrical ngaphandle kokucindezeleka kwemishini. Amalaser e-CO2 (ubude begagasi obungu-10.6 µm) noma amalaser e-UV (i-wavelength 355 nm) akhethwa ngokusekelwe ekwakhiweni kokubalulekile kanye nobubanzi bembobo obudingekayo. I-desmear elandelayo kanye ne-electroless copper deposition kulungiselelwa ngezindonga ze-electroplating. Izikhungo zokukhiqiza ziqapha amapharamitha we-laser ngokuqhubekayo ukuze kugcinwe ukuvumelana kuwo wonke amaqoqo okukhiqiza.

Okulandelanayo Ngezakhiwo

Ukungaboni oku-oda okuningi ngemiklamo kunika amandla ukuxhumana okuqondile phakathi kwezendlalelo ezingasondelene ngaphandle kokungena kuwo wonke ugqinsi lwebhodi:

• 1+N+1 isitaki - Ungqimba olulodwa lwe-microvia buildup endaweni ngayinye yangaphandle enomongo wendabuko
• 2+N+2 isitaki - Izendlalelo ezimbili zokuhlanganisa ohlangothini ngalunye ukuze uthole ukuminyana okuphezulu kwezakhi
• Kustakiwe nge - I-Microvias ibekwe phezu komunye nomunye ngemijikelezo elandelanayo yokukhipha amanzi
• Ukusebenza kahle komzila wesiginali - Ukuxhumana okuqondile kusuka kwezendlalelo zangaphandle kuya ezindizeni zangaphakathi ezinokusetshenziswa okuncane kwesikhala sangemuva

Lesi sakhiwo sibonakala sibalulekile lapho uhambisa ama-BGA wokubala okuphezulu kumabhodi okulawula ama-drone ahlangene lapho kubalulekile khona yonke imilimitha yesikwele.

I-HDI Stackup Nokucatshangelwa Kwempahla Yamabhodi e-UAV

I-Common Drone HDI PCB Stackup Architectures

Isakhiwo esingu-1+N+1 sisebenzisa ungqimba olulodwa lwe-microvia buildup endaweni ngayinye engaphandle enomongo wendabuko, ofanele amabhodi e-drone anokuminyana okumaphakathi. Ukulungiselelwa okuyinkimbinkimbi kakhudlwana kwe-2+N+2 kwengeza izendlalelo ezimbili zokwakha uhlangothi ngalunye, okusekela ukuminyana kwezingxenye eziphakeme ezidingekayo kuzilawuli zendiza ezithuthukisiwe. Isendlalelo ngasinye sokwakha sandisa ubunkimbinkimbi bokukhiqiza kodwa sinikeza izinsiza ezengeziwe zomzila.

I-Dielectric Material Selection

Izinto eziyinhloko nezilungiselelwe kusengaphambili zithinta ngqo ubuqotho besiginali ngokusebenzisa izakhiwo zazo ze-dielectric constant kanye ne-loss tangent. I-FR-4 ejwayelekile yanele izimpawu zokulawula imvamisa ephansi, kuyilapho izixhumi zokuxhumana ezisheshayo zizuza ezintweni eziphansi ze-Dk njenge- Panasonic Megtron 6 (Dk 3.6 ku-1 GHz) noma i-laminate ekhethekile ephansi yokulahlekelwa (Dk 3.48). Izendlalelo ezincane ze-dielectric—ngokuvamile ezingama-50-100 µm phakathi kwezingqimba zesignali—zinciphisa ngezilinganiso zesici futhi zithuthukise ukusebenza kwemvamisa ephezulu yamamojula wokuxhumana we-RF we-GHz-range.

Izidingo Zokulawula Impedance

Imiklamo yokulawula izindiza ichaza impedance elawulwayo yamanethi esignali abalulekile—ngokuvamile i-50Ω yama-single-end noma i-100Ω yama-differential pairs. Ukufeza impedance eqondiwe kudinga ukulawulwa okunembile kwe-trace geometry, ukujiya kwe-dielectric, kanye nesisindo sethusi. Amafasitela okubekezelela ukukhiqiza ancipha kakhulu ngama-dielectric amancane asetshenziswa kuma -stackups e-drone HDI PCB . Izikhungo zokukhiqiza ezithuthukisiwe zisebenzisa amakhuphoni okuhlola impedance futhi zilungisa amapharamitha okuqopha ukuze kugcinwe ukubekezelela impedance okungu-±10%.

Inqubo Yokukhiqiza Nokulawula Ikhwalithi

Sequential Lamination Process

Ukwenziwa kwe-HDI kuqhubeka ngemijikelezo ephindaphindayo ye-lamination, i-laser drilling, kanye ne-copper plating. I-substrate eyinhloko iqhutshwa ekuqaleni, bese ithola izendlalelo ze-prepreg neze-copper foil emjikelezweni we-lamination olawulwayo wokushisa. Ngemva kwe-lamination ngayinye, i-laser drilling idala ama-microvia ngaphambi kwe-copper plating kanye ne-circuit patterning. Lokhu kulandelana kuyaphindaphinda kwesendlalelo ngasinye sokwakheka. Ukunemba kokuvumelanisa phakathi kwezingqimba ezilandelanayo kumele kuhlale ngaphakathi kwama-µm angu-75 ukuvimbela ukubhaliswa okungalungile kwe-via-to-pad.

Izindlela Zokuhlola Nokuqinisekisa

Amasistimu okuhlola okuzenzakalelayo ahlola yonke i-laser-drilled nge-diameter efanele, indawo, kanye nokuhlanzeka ngaphambi kokwenziwa kwensimbi. Ukuhlolwa kwe-X-ray kuqinisekisa ukuthi kugqitshwe ngendlela yokwakheka kanye nokuqondanisa kwesendlalelo sangaphakathi kumabhodi aqediwe. Ukuhlolwa kukagesi nge-probe endizayo noma izindlela zokulungisa kuqinisekisa ukuqhubeka nokuhlukaniswa. Lawa masango ekhwalithi avimbela amabhodi anesici ukuthi angafiki emhlanganweni, okubaluleke kakhulu uma kubhekwa ukuminyana okuphezulu kwemiklamo ye-drone HDI PCB.

Plating Uniformity kanye Via Fill

Ukufana kwe-Copper plating kuthinta ngqo ngokuthembeka namandla okuthwala kwamanje:

• Ukufakwa kwe-Sidewall - Ukuqina kwethusi okungaguquki ngezindonga kuqinisekisa ukuxhumana okuthembekile
• Ubukhulu obungezansi - Ukufakwa kwethusi okwanele ngesisekelo kuvimbela amasekhethi avulekile
• Ngokugcwalisa - Ukugcwaliswa okuphelele kwe-copper kuqeda ama-voids angabamba ukungcola
• Ukulawulwa kwenqubo - I-Plating chemistry, ukuminyana kwamanje, kanye nokuyaluza kwephaneli kunomthelela ekugcineni ngekhwalithi

Ama-microvias agcwele akhombisa ukwethembeka okuphezulu uma kuqhathaniswa nemiklamo engagcwalisiwe ngaphansi kokuhlolwa kwengcindezi eshisayo neyomshini.

Ukuthembeka nokusebenza Ezimweni Eziqinile Ze-Drone

Mechanical Stress Resistance

Ukusebenza kwe-Drone kungaphansi kokudlidliza kwe-electronics okuqhubekayo okuvela ezimotweni nama-propeller, kanye nemithwalo yokushaqeka ngesikhathi sokufika. Izakhiwo ze-HDI ezinezingqimba eziningi ezincane ze-dielectric zakha ukuxhumana lapho i-delamination ingenzeka ngaphansi kwengcindezi yomjikelezo. Ukukhethwa okufanele kwe-resin nokucindezela okulawulwayo kwe-lamination kuqinisekisa ukubopha okuqinile kwe-interlayer. Ama-microvias agcwele amelana nokulayishwa kokukhathala ngaphandle kokuqhekeka ngaphansi kokuhlolwa kokudlidliza ngokwezindinganiso ze-IPC-9701.

I-Thermal Cycling Ukuqina

Ukushintshashintsha kwezinga lokushisa kusuka -40°C kuya +85°C kwenzeka phakathi nokusebenza kwendiza. I-coefficient ye-thermal expansion dismatch phakathi kwethusi (17 ppm/°C) nezinto ze-dielectric (imvamisa engu-14-16 ppm/°C ye-FR-4) idala ingcindezi ngezixhumi ezibonakalayo. Ukukhiqizwa kwe-Drone HDI PCB kukhulisa ukujiya kwe-copper plating futhi kusebenzisa izinto eziphansi ze-CTE ukuze kuncishiswe lokhu kucindezeleka. Ukuhlolwa kokuhamba ngebhayisikili okushisayo ngemijikelezo engu-500-1000 kuqinisekisa ngobuqotho ngaphambi kokuqinisekiswa komklamo.

Ukuvikelwa kwemvelo

Izingozi zokungena komswakama ziyanda ngezakhiwo eziningi ezitholakala kumabhodi e-HDI. Ukusetshenziswa kwesembozo esivumelanayo ngemva kokuhlanganiswa kunikeza isivikelo esiyinhloko, kodwa ukukhetha izinto ngesikhathi sokwenziwa nakho kubalulekile. Ukugcwalisa kahle kususa imigodi lapho umswakama unganqwabelana khona, kuyilapho ukumbozwa kwemaski ye-solder phezu kwe-vias egqitshwe kuvimbela izindlela zokugqwala. Lokhu kucabangela kubalulekile kuma -drones asebenza ezindaweni ezinomswakama noma zasolwandle.

Izibonelo zohlelo lokusebenza ku-Drone Systems

Amabhodi Ayinhloko Okulawula Indiza

Amabhodi okulawula indiza ayisisekelo ahlanganisa amaphrosesa ayinhloko, izixhumanisi zenzwa, namamojula okuxhumana kuzici zefomu elihlangene. I-HDI PCB yemiklamo yebhodi yokulawula ye-UAV ngokuvamile isebenzisa izitaki zezingqimba ezingu-6-8 ezinezendlalelo eziningi ze-microvia, ezisekela amaphakheji e-BGA ehle aze afike ku-0.4 mm. Ubuchwepheshe buvumela ukubekwa kwama-gyroscopes, ama-accelerometers, nama-magnetometers ngaphakathi kwamamilimitha eprosesa ngenkathi kugcinwa izindlela zesignali ze-analog ezihlanzekile ezihlukanisiwe nomsindo wokushintsha kwedijithali.

Amamojula Wokudluliswa Kwevidiyo

Ukudluliswa kwevidiyo enencazelo ephezulu kudinga amasekhethi e-RF e-GHz-frequency kanye nezokuxhumana zedijithali ezinesivinini esikhulu. I-PCB yesilawuli sendiza ye-Drone idizayina amasistimu e-FPV isebenzisa ubuchwepheshe be-HDI ukuze kugcinwe umugqa wokudlulisela ongu-50Ω kuzo zonke izindlela ezihlangene. I-Vis eyimpumputhe ixhuma izingxenye ze-RF ezindizeni eziphansi ngaphandle kokuphazamisa izendlalelo zesignali eziseduze, okubalulekile ekugcineni ukulahlekelwa kokufaka kungaphansi kwe-1 dB kanye nokulahlekelwa kokubuyisela ngaphansi -15 dB imininingwane.

I-Electronic Speed ​​Controller Integration

Imiklamo ethuthukisiwe ye-ESC ihlanganisa ukushintsha kwamandla, ukulawula kwe-MCU, kanye nezindawo zokuxhumana kumabhodi ahlangene owodwa:

• Ukuhlukaniswa kwendlela yamandla - Izindiza zethusi ezingcwatshiwe zibamba ama-motor currents afika ku-50A kuyilapho amasiginali wokulawula umzila wezingxenye ezingaphezulu
• Ukuphathwa kwe-Thermal - Isakhiwo sesendlalelo se-HDI sivumela ukubekwa kwamasu kwe-vias eshisayo ngaphansi kwezingxenye zamandla
• Ukuhlanganiswa kwesistimu - I-ESC ehlanganisiwe nezakhiwo zesilawuli sendiza kunciphisa isisindo sesistimu ngamaphesenti angama-20-30
• Ubuqotho besignali - Izindiza ezisemhlabeni ezihlukene zamasekhethi e-analog nedijithali kunciphisa ukushintshaniswa komsindo

Lokhu kuhlanganiswa kufakazela ukuthi kubaluleke kakhulu ekugijimeni nasekukhuthazeleni isikhathi eside kwezinhlelo zokusebenza ze-UAV lapho isisindo nesikhala sibucayi.

Isiphetho

Ubuchwepheshe be-Drone HDI PCB buvumela ngokuyisisekelo ukwakheka kwe-elekthronikhi okuhlangene, okuminyanisayo okudingekayo ezinhlelweni zesimanje zasemoyeni ezinganamuntu. Inhlanganisela yokuxhumana kwe-microvia, izinqubo zokulandelana kwe-lamination, kanye nokwakheka kwe-impedance okulawulwayo kuletha izixazululo zezinga lebhodi ezihlangabezana nosayizi oqinile, isisindo, kanye nezidingo zokusebenza.

Ngokunemba kwe-laser drilling, izinto ezincane ze-dielectric, kanye nokulawulwa kwekhwalithi okuqinile, lezi zindlela zokukhiqiza zifinyelela ukuminyana kwezingxenye namandla omzila wesignali ubuchwepheshe obujwayelekile be-PCB obungakwazi ukuhlinzeka. Ukuthembeka okuboniswa ngokuhamba ngebhayisikili elishisayo, ukuhlola ukudlidliza, nokuqinisekiswa kokuchayeka kwemvelo kuqinisekisa ukufaneleka kwe-HDI yezinhlelo zokusebenza zokulawula indiza ezibalulekile.

Njengoba imiklamo ye-UAV iqhubeka nokuqhubekela phambili ezintweni ezincane zefomu ngokusebenza okwandisiwe, amakhono okukhiqiza atholakala ezinqubweni ze-HDI ahlala ebalulekile ekuthuthukiseni ukusebenza kwe-elekthronikhi yezindiza.