Ubuchwepheshe be-HDI PCB: Inika amandla Izixazululo Zokufaka Ezithuthukisiwe Ze-Semiconductor

Isingeniso: I-Evolution Toward Higher Density Interconnects

Ukupakishwa kwe-semiconductor yesimanje kudinga izixazululo zokuxhuma eziyinkimbinkimbi. Njengoba ama-chip geometries ancipha futhi nezibalo ze-I/O zikhuphuka, amabhodi esekethe aphrintiwe endabuko awakwazi ukusekela ngokwanele izakhiwo zokupakisha ezithuthukisiwe ezifana ne-system-in-package (SiP), amaphakheji we-chip-scale (CSP), kanye ne-fan-out wafer-level-packaging (FOWLP).

Ubuchwepheshe be-HDI PCB bubhekana naleli gebe ngokuletha ububanzi bomugqa ocolekile, obuncane ngezakhiwo, nokuminyana okuphezulu kwemizila okuqhathaniswa namaphakheji angaphansi. Lesi sihloko sihlola ukuthi ubuchwepheshe be-HDI kanye ne-Substrate-Like PCB (SLP) buhlanganisa kanjani ukukhiqizwa kwe-PCB evamile kanye nokwakhiwa kwe-IC substrate, ikakhulukazi kubathwali bokupakisha, izendlalelo zokusabalalisa kabusha, nokuxhumana kweleveli ye-chip.

Ichaza i-HDI PCB, SLP, ne-IC Substrate Technologies

I-High-Density Interconnect PCB Okuyisisekelo

I-HDI PCB isebenzisa ama-microvia akhiwe ngokubhoboza nge-laser, izendlalelo zokwakheka ngokulandelana, ama-via angaboni futhi agqitshwe, kanye nokulungiselelwa kwe-via-in-pad. Lawa mabhodi ngokuvamile afaka ububanzi bemigqa kanye nezikhala ezisukela ku-75/75 μm kuya ku-40/40 μm, kanye nobubanzi be-microvia obuphakathi kuka-100-150 μm. Inqubo yokwakheka inezela izendlalelo ezincane ze-dielectric nezethusi ngokulandelana, okuvumela ukuhanjiswa okuyinkimbinkimbi ezintweni ezihlanganisiwe ezibalulekile kumadivayisi eselula kanye nezinhlelo zokusebenza zekhompyutha ezisebenza kahle kakhulu.

I-PCB efana ne-Substrate: Ukuvala Imihlaba Emibili

I-PCB Efana Ne-Substrate ithatha isikhala sokuklama phakathi kwe-HDI ethuthukisiwe kanye ne-substrate yephakheji ye-IC yangempela. I-SLP igcina izinqubo zokukhiqiza ze-PCB ezingeni lephaneli ngenkathi ifinyelela amajiyometri omugqa/esikhala asondela ku-20/35 μm ngezinqubo ezingeziwe (i-SAP). Le ndlela inikeza ukuminyana kwe-substrate ngezindleko eziphansi kune-substrate yendabuko ye-IC, okwenza ikhange ezinhlelweni zokusebenza ezidinga ukuminyana okuphezulu kokuxhumana ngaphandle kokutshalwa kwezimali okugcwele kwe-substrate ezingeni.

Ukuma Ngokuqhathanisa kwe-HDI PCB Technologies

Ukuma phakathi kwalobu buchwepheshe kukhombisa amakhono ahlukene okukhiqiza kanye nezakhiwo zezindleko:

• I-HDI PCB - Ifanele izici ezingu-50-100 μm usebenzisa izinto ezivamile ze-PCB nezinqubo
• I-substrate-Njenge-PCB - Ifinyelela amajiyometri angu-20-35 μm ngokucubungula okuguquliwe kwe-SAP kumishini yamaphaneli
• I-IC Package Substrates - Iletha izici ezingaphansi kwe-20 μm ngezinto ze-BT/ABF ezikhethekile kodwa idinga ukutshalwa kwezimali okukhulu

I-SLP ihlinzeka ngesixazululo esimaphakathi, isetshenziswa imishini ye-PCB eguquliwe ukuze isondele ekusebenzeni kwe-substrate ngenkathi igcina umnotho we-PCB ngokucubungula iphaneli.

I-HDI PCB Structure and Process Technology

I-Build-Up Architecture Variants

Izakhiwo ze-PCB ze-HDI zanamuhla zisebenzisa ukucushwa okuningi kuye ngezidingo zobuningi. Ama-microvia ahlanganisiwe adala ukuxhumana okuqondile ngokusebenzisa izendlalelo eziningi zokwakha, okunciphisa ibanga lomzila wesignali yesivinini esikhulu. Imiklamo yama-microvia ahlanganisiwe isabalalisa ukucindezeleka komshini futhi ithuthukise ukuthembeka ngaphansi kokujikeleza kokushisa, kuyilapho ama-via afihliwe ngaphakathi kwesendlalelo esiyinhloko evumela i-topology yomzila eyinkimbinkimbi.

I-Laser Microvia Formation ku-HDI PCB

Ukubhola ngelaser kusetshenziswa amalaser e-CO₂ noma ama-UV kudala ama-microvias ajule alawulwayo anobubanzi obuncane obungango-75-100 μm. Inqubo ishisa okubalulekile kwe-dielectric ukuze kuvezwe amaphedi ethusi angaphansi, abese ekhishwa futhi enziwe insimbi ngokufakwa kwethusi elingena-electro kulandelwa ukucwecwa kwephethini. Amapharamitha e-laser afaka amandla okushaya kwenhliziyo, imvamisa, nokugxila kufanele kulawulwe ngokunembile ukuze kuvinjwe ukulimala kwe-substrate ngenkathi kuqinisekiswa ukuthi kuhlanzekile ngokukwakheka.

Izinqubo ezingeza kancane kanye nezengeza Ngokugcwele

Izinqubo ze-semi-additive zinika amandla ukwakheka komugqa ocolekileyo kakhulu ezinhlelweni ze-SLP ngokufaka izendlalelo zembewu yethusi elincanyana, ukusebenzisa i-photoresist, namaphethini kakhondatha wokucwenga ngaphambi kokukhipha ithusi lembewu eleqile. Le ndlela ifinyelela ububanzi belayini obungu-20-30 μm uma iqhathaniswa no-75-100 μm ojwayelekile wokukhipha okukhiphayo. Izinqubo ze-SAP (mSAP) ezilungisiwe ziqhubeka zenza ngcono leli khono, zisondela kumajometri weleveli ye-substrate kuyilapho kugcinwa ukuhambisana nezinto ezijwayelekile ze-PCB.

Amasistimu Wezinto Ezisetshenziswayo ze-HDI Ethuthukisiwe

Izinhlelo zokusebenza ze-HDI PCB ezisebenza kahle zidinga izinto ezisetshenziswayo ezine-coefficient elawulwayo yokwanda kwe-thermal (CTE), ukungaguquki kwe-dielectric ephansi, kanye nezinga lokushisa eliphezulu lokuguqulwa kwengilazi (Tg). Amafomu e-FR-4 ashintshiwe ane-Tg engaphezu kuka-170°C ahlinzeka ngokusebenza okwanele kwezinto zikagesi zabathengi, kuyilapho amafilimu e-polyimide enikeza ukuqina okushisayo okuphakeme kokwakhiwa kwe-rigid-flex. Izinto ze-BT ne-ABF zenza imiklamo ye-SLP ifinyelele izakhiwo ezishisayo nezikagesi ezisondela kuma-substrates ephakheji.

Ukucatshangelwa kwe-HDI PCB Design for Manufacturing Success

Ukucaciswa kweJiyomethri kanye nokusebenza kukagesi

Imithetho yokuklama ye-HDI PCB kumele ibheke ububanzi bomugqa kanye nesikhala esingafinyeleleka uma kuqhathaniswa nesisindo sethusi kanye namakhono enqubo. Imiklamo ehlose amajiyometri angu-40/40 μm idinga ithusi eliyisigamu se-ounce elinezilawuli zokuqopha eziqinile, kuyilapho imiklamo ye-SLP esondela ku-25/25 μm idinga ukucutshungulwa kwe-SAP.

Ukulawulwa kokuphazamiseka kuya ngokuya kuba bucayi njengoba ubukhulu bokulandelela buncipha, obudinga ukulawulwa okuqondile kogqinsi lwe-dielectric kanye nokuphathwa kwephrofayili yethusi. Ukubhanqa okuhlukile kwemizila kufanele kubangele ukuhlangana okuqinile kanye nokuba sengozini okukhulayo ku-crosstalk yesendlalelo esiseduze njengoba ukuminyana kwemizila kukhuphuka.

Ukwethenjelwa Kwe-Thermal kanye Nemishini

Ukusatshalaliswa kwethusi kuthinta kakhulu ikhasi le-warpage lebhodi ezakhiweni ze-HDI ngenxa yokungafani kwe-CTE phakathi kwezinto. Amasu okuklama ukuqinisekisa ukwethembeka afaka:

• I-Symmetrical copper balancing - Isabalalisa isisindo sethusi kuwo wonke umugqa webhodi ukuze unciphise i-warpage
• Inyakaziswa ngamaphethini - Yehlisa ukugxila kwengcindezi futhi ithuthukise ubuqotho bemishini
• Izindlela ezishisayo ze-Via-in-pad - Ihlinzeka ngokugeleza kokushisa okuqondile kusuka ezingxenyeni kuya ezindizeni zamandla zangaphakathi
• Ama-microvias agcwele ithusi - Inika amandla imijikelezo yokugeleza kabusha eminingi ngaphandle kokucekelwa phansi ezinhlelweni ze-BGA

Izithiyo Zokucubungula Zezinga Lephaneli

Ukwenziwa kwamaphaneli kunika amandla ukukhiqizwa kwe-HDI PCB engabizi kakhulu kodwa kwethula izinselelo zokufana ezingekho ekwenziweni kwe-substrate. Ukunemba kokumba nge-laser kuyahlukahluka endaweni yonke yamaphaneli, okudinga izilawuli zenqubo yezibalo kanye nokulinganiswa kokuma. Ukusatshalaliswa kogqinsi kwe-Copper plating kuwo wonke amaphaneli amakhulu kuthinta ukungaguquguquki kwe-impedance, kudinga izakhiwo zedizayini ezicophelelayo ezibeka izici ezibalulekile ukuze kuncishiswe imiphumela esemaphethelweni.

Ukuhlangabezana Nezidingo Zokupakisha Semiconductor nge-HDI PCB

Ukuhlanganiswa Kwephakheji Okuthuthukile

Ubuchwepheshe be-HDI PCB busebenza njengenkundla evumela ukuhlanganiswa okuhlukahlukene ekwakhiweni kokupakisha okuthuthukile. Ekuphakhenisweni kweleveli yephaneli yokuphuma, amabhodi e-HDI ahlinzeka ngendawo engaphansi yesendlalelo sokusabalalisa kabusha ngomzila oxhumanisayo wokufa ekuxhumekeni kwezinga lephakheji.

Ngokuhlanganiswa kwe-2.5D, izihlanganisi ezinobukhulu obuphezulu ezakhiwe kusetshenziswa ubuchwepheshe be-SLP zinikeza izinzuzo zezindleko ngaphezu kwezihlanganisi ze-silicon zezinhlelo zokusebenza ezibekezelela ukuminyana kwesignali okumaphakathi. Amamojula angaphansi ahlanganisa ukufa okuningi, izingxenye ze-passive, nezakhiwo ezivikelayo zithembele emandleni e-HDI ukuze afinyelele ukuminyana kwe-I/O okudingekayo ngaphakathi kwezinyathelo ezihlangene.

Iselula kanye Nezicelo Ezigqokekayo

Amabhodi amakhulu ama-smartphone ayisibonelo sezidingo zokuminyana kwe-HDI PCB, ngokuvamile afaka izendlalelo zokwakha ezingu-8-12 ezinomugqa ongu-50/50 μm/amajiyometri yesikhala asekela izingxenye zezingxenye ezifika ku-0.35 mm. Izakhiwo ze-HDI zesendlalelo zanoma iyiphi i-HDI zinika amandla okungalawuleki ngokubeka, zikhulise ukusebenza kahle komzila kumadizayini abamba isikhala. Ukwakhiwa kwe-HDI eguquguqukayo eqinile kuhlanganisa ukuxhuma okuguquguqukayo ngaphakathi kwezakhiwo zokwakha, ukususa izixhumi futhi kunciphise ukushuba komhlangano kumadivayisi agqokekayo nama-smartphones asongekayo.

Ukuqinisekiswa Kwekhwalithi Nokuqinisekiswa Kwenqubo ye-HDI PCB

Izindlela Zokuhlola Ezibucayi

Ukulawulwa kwekhwalithi kokukhiqizwa kwe-HDI PCB kusebenzisa amasu amaningi okuqinisekisa ezigabeni ezahlukene zenqubo:

• Ukuhlola okuzenzakalelayo (AOI) - Iqinisekisa ubuqotho bephethini yomqhubi, ngokunemba kokubhalisa, kanye nekhwalithi yokuqeda phezulu
• Ukuhlolwa kwe-X-ray - Yembula ingaphakathi ngekhwalithi yokubunjwa, okuhlanganisa ukuqhubeka komgqomo kanye nokungabi bikho okungaba khona
• Ukuhlaziywa kwezigaba - Iqinisekisa ukubhaliswa kwesendlalelo, ukujiya kwe-dielectric, ukufana kwe-copper plating, nangekhwalithi yokwakheka

Lawa masu asungula izisekelo zekhono lenqubo ezibalulekile ekukhiqizeni umthamo othembekile wezakhiwo eziyinkimbinkimbi ze-HDI.

Ukuhlola Ugesi Nokuthembeka

Izilinganiso zokumelana namaphoyinti amane ziqinisekisa ngokuqhubeka kweketango kanye nokumelana ne-conductor ngaphakathi kwemikhawulo ebekiwe. I-Time-domain reflectometry (TDR) iqinisekisa amaphrofayili e-impedance emigwaqweni yesignali ebalulekile, ihlonza ukungaqhubeki okuvela ngokushintsha noma ukuhluka kwejometri.

Ukuhamba ngebhayisikili okushisayo okuphakathi kuka -55°C kanye no-125°C emijikelezweni engu-500-1000 kugcizelela ukuxhumana, ukuveza amaphutha acashile ngokunamathela komgqomo noma ukuxhumana kwe-pad-to-via. Ukuhlolwa kwe-Stress Accelerated Highly (HAST) kumazinga okushisa aphakeme kanye nomswakama kuveza ukuthambekela ekwakhekeni kwe-conductive anodic filament (CAF) kumajiyometri e-fine-pitch.

Ukwakheka Kwezindleko kanye Nezici Zochungechunge Lokuhlinzeka

Ukuma Kwezomnotho Kwezixazululo Ze-HDI PCB

I-Substrate-Like PCB izuza ukuncishiswa kwezindleko okungu-30-50% uma kuqhathaniswa nama-substrates avamile e-IC ngokucubungula amaphaneli, izinto ezijwayelekile ze-PCB, nengqalasizinda ekhona yokukhiqiza enokuthuthukiswa kwemishini ehlosiwe. Nokho, izindleko ze-SLP zidlula i-HDI evamile ngo-20-40% ngenxa yezidingo ezikhethekile zokumba i-laser, ukucutshungulwa kwe-SAP, nokulawula inqubo eqinile. Ukukhiqizwa kwevolumu kunciphisa ukutshalwa kwezimali okukhulu kuwo wonke amanani ephaneli, okwenza i-HDI ne-SLP ihehe ngokwezomnotho ezinhlelweni ezidinga izinkulungwane kuya ezigidini zamayunithi ngonyaka.

Izidingo Zekhono Lokukhiqiza

Ukukhiqiza i-HDI PCB ethuthukisiwe kudinga amasistimu okubhola nge-laser anokulawula ukujula okunembayo nokunemba kokubeka indawo, ukushumeka komugqa we-ultra-fine noma amakhono we-SAP, kanye nezinhlelo zokuhlola ezizenzakalelayo ezikwazi ukubona amaphutha angaphansi kwe-50 μm. Ukucatshangelwa kochungechunge lokuhlinzekwa kwempahla kuhlanganisa ukutholakala kwezinto ezifanele ze-dielectric, amafoil ethusi amancane angaphansi kuka-12 μm ukujiya, kanye nokuqedwa okukhethekile okuhambisana nokuhlanganiswa kwephimbo elihle. Izikhathi zokuhola ngokuvamile zisukela emavikini angu-2-4 ku-HDI PCB uma kuqhathaniswa namaviki angu-6-10 kumaphakheji angaphansi.

I-Future Trajectory ye-HDI PCB Technology

Umngcele phakathi kwe-PCB ne-IC substrate technologies uyaqhubeka nokufiphala njengoba amakhono okukhiqiza ehlangana. Izinqubo zokwengeza kancane zidlulela ekukhiqizweni kwezinga lephaneli yezici ezingaphansi kwe-20 μm, inselele yesizinda se-substrate esivamile. Izingxenye eziyinhloko zengilazi ezivela kuzinhlelo zokusebenza zekhompuyutha ezisebenza kahle ziphakamisa ukucubungula iphaneli yesitayela se-PCB kuyilapho iletha ukusebenza kukagesi webanga eliphansi kanye nokuzinza kobukhulu.

I-HDI PCB ethuthukisiwe ehlanganisa ukufa okushumekiwe, izingxenye ze-passive, namadivayisi asebenzayo ngaphakathi kwezendlalelo zokwakha kumelela umngcele olandelayo, ukuguqula amabhodi esekethe aphrintiwe asuke ezisekelweni ze-passive interconnect abe izimoto ezihlanganisa isistimu esebenzayo. Njengoba ukupakishwa kwe-semiconductor kuguqukela ekwakhiweni kwe-chiplet nokuhlanganiswa okungafani, ubuchwepheshe be-HDI ne-SLP buzodlala indima ebaluleke kakhulu ekunikezeni amandla izixazululo zokuxhumanisa ezingabizi kakhulu, ezisebenza kahle kakhulu.

Isiphetho

Ubuchwepheshe be-HDI PCB buye bavela ekubeni namandla okukhethekile baya kusixazululo esivamile sokupakishwa kwe-semiconductor ethuthukisiwe kanye nezinhlelo zikagesi eziminyana kakhulu. Ukuhlangana kwe-PCB nezinqubo zokwenziwa kwe-substrate kusetshenziswa izindlela ezifana ne-Substrate-Like PCB kunikeza abaklami izinketho eziguquguqukayo ezihlanganisa ukuqhubeka ukusuka ku-HDI evamile kuya kumazinga okusebenza aseduze ne-substrate. Njengoba ububanzi belayini buqhubeka buncipha kanye nezakhiwo zokupakisha ziba nzima kakhulu, i-HDI PCB izohlala ibalulekile ekusetshenzisweni okungabizi kakhulu kwemikhiqizo ye-elekthronikhi yesizukulwane esilandelayo.

I-Highleap Electronics: Uzakwethu Wokukhiqiza Okuthuthukisiwe kwe-HDI PCB

I-Highleap Electronics inikeza izixazululo eziphelele ze-HDI PCB kanye ne -assembly ezenzelwe izinhlelo zokusebenza zokupakisha ze-semiconductor:

• Amakhono e-HDI athuthukile - I-Laser microvia drilling, ukwakhiwa kongqimba, kanye nanoma yisiphi isendlalelo se-HDI izakhiwo ezisekela ijometri kuze kufike ku-30/30 μm
• Ubungcweti be-Substrate-Njenge-PCB - Ukuqaliswa kwenqubo ye-semi-additive ukuze kwakhiwe umugqa we-ultra-fine osondela ekuminyana kwe-substrate-grade
• Amasevisi omhlangano ahlanganisiwe - Ukubekwa kwe-BGA ye-Fine-pitch, ukushumeka kwengxenye, kanye nokuhlanganiswa okuqinile okuguquguqukayo ngaphansi kophahla olulodwa
• Ukuqinisekisa ikhwalithi - Izivumelwano zokuhlola ezigcwele ezihlanganisa i-AOI, i-X-ray, ukuhlaziywa kwezingxenye ezihlukene, nokuhlolwa kokwethembeka
• Ukwesekwa kwedizayini - Ukuhlaziywa kwe-DFM nokwenza kahle isitaki ukuze kuqinisekiswe ukwenziwa kanye nokusebenza

Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngokuthi amakhono ethu okukhiqiza i-HDI PCB angasheshisa kanjani intuthuko yomkhiqizo wakho futhi athuthukise uchungechunge lwakho lokuhlinzeka ngezinhlelo zokusebenza zokupakisha ezithuthukisiwe.