Ukuhlolwa Nokuhlolwa Kokuthembeka Kwe-PCB Ye-Copper Coin

Kuma-elekthronikhi anamandla amakhulu, ama-PCB ezinhlamvu zethusi kumele amelane nokucindezeleka okukhulu kokushisa kanye nokwemishini okungalimaza imiklamo yamabhodi evamile. Lawa mabhodi wesekethe akhethekile afaka izinhlamvu zemali zethusi ezijiyile ngqo ezakhiweni zemigodi ukuze kuthuthukiswe ukusatshalaliswa kokushisa ekusetshenzisweni kwe-semiconductor yamandla.

Ukuhlolwa kokwethembeka kwe-PCB yohlamvu lwemali yethusi sekuyinqubo yokuqinisekisa ebalulekile yabakhiqizi abaqondise amamojula wamandla ezimoto, ama-inverter ezimboni, kanye nezinhlelo zokusebenza zokushintsha zamanje. Ngaphandle kokuhlola okunzima, ukukhubazeka okufihliwe okufana nokungahlangani kobuso noma ukuhlangana okunganele kungaholela ekuhlulekeni kwenkambu ngaphambi kwesikhathi ngaphansi kwezimo zamabhayisikili ashisayo.

Kungani I-Copper Coin PCB Test Test ibalulekile

Isakhiwo sohlamvu lwemali yethusi sihluke ngokuyisisekelo ku-copper foil lamination evamile. Esikhundleni sezendlalelo zethusi eziqhubekayo, amadiski ethusi aminyene ashunyekwa ngomshini emigodini egayiwe futhi ahlanganiswe nezinhlelo ze-resin. Lokhu kufakwa kwensimbi okwenziwe kwasendaweni kudala ukuxhumana okubalulekile okuningi lapho i-coefficient yokungezwani kokunwebeka okushisayo kanye nekhwalithi yebhondi kuthinta ngokuqondile ukusebenza kwesikhathi eside.

Izindlela Zokwehluleka Ezivamile ku-Copper Coin PCBs

Izindlela ezine zokwehluleka eziyinhloko zisongela ukwethembeka kwe-PCB yemali yethusi:

• I-interfacial voids - Amaphakethe omoya phakathi kwe-resin nethusi anciphisa indawo yokuxhumana eshisayo futhi adale izindawo zokugxilisa ingcindezi
• Ukukhipha uhlamvu lwemali - Amandla okubopha anganele abangela ukuhlukana ngaphansi kwamandla okwanda okushisayo
• Ukuqhekeka kwe-resin - Ukugcwaliswa kwe-cavity okungaphelele noma amaphrofayili okwelapha angahambelani enza imifantu ngesikhathi sokugeleza kabusha
• I-oxidation ebusweni -Izindawo zokuxhumanisa ezingcolile zilimaza amandla okunamathela kanye nokuhanjiswa kwe-thermal

Izinqubo Zokuhlola Ezibalulekile Ekwenziweni Kwe-Copper Coin PCB

Ukuhlolwa kwesiteji sokukhiqiza kuhlonza amaphutha esakhiwo ngaphambi kokuthi amabhodi angene ekuhlolweni kokwethembeka noma ukufaneleka kwekhasimende. Ukuhlolwa kwekhwalithi okuhlelekile ezinyathelweni zokwenziwa ezibalulekile kuvimbela amayunithi anesici ukuthi athuthuke ngokukhiqiza.

Leli khasi liqondene ngqo nezakhiwo zokushisa ze-copper coin kanye nokuhlolwa kokuthembeka kwazo. Ukuze uthole umbono jikelele wokuhlolwa kwebhodi, sebenzisa umhlahlandlela wokuhlola ibhodi lesifunda ; ukuze uthole ukuqhubeka kwebhodi elingenalutho, ukuhlukaniswa, kanye nokuhlela izinto, bheka ukuhlolwa kukagesi kwe-PCB.

Ukuhlolwa kobukhulu

Ukulinganisa ukujula komgodi kuqinisekisa indawo eyanele yokushumeka uhlamvu lwemali ngaphandle kogqinsi lweresin eningi ngaphezu kwendawo yethusi. Ububanzi bezinhlamvu zemali kanye nobukhulu kufanele buhambisane nokubekezelela kwedizayini ukuze kugcinwe ukulingana okufanele ngaphakathi kwemigodi egayiwe. Ukuhleleka komphezulu kuyo yonke indawo eshumekiwe kuthinta ikhwalithi yokucwala okulandelayo nokufana kogqinsi lwethusi.

Ukuhlola Ukuhlanzeka Komhlaba

Izingxenye zezinhlamvu zemali yethusi zihlanzwa ngamakhemikhali kanye ne-micro-roughening ukukhuthaza ukunamathela kwe-resin. Amaphrothokholi okuhlola aqinisekisa ukususwa okuphelele kwe-oxide kanye namazinga afanele wokurhabaxa ngaphambi kokushumeka. Noma yikuphi ukungcoliswa okusele noma i-oxidation eyeqile kudala izixhumanisi ezibuthakathaka ezihlulekayo phakathi nengcindezi yokushisa.

Ukuhlolwa kwe-X-ray

Ukuhlaziywa kwe-X-ray okungacekeli phansi kwembula izikhala zangaphakathi phakathi kwezinhlamvu zemali ezishunyekiwe kanye nenhlaka ezungezile ngaphandle kokuhlukaniswa ngokomzimba. Le nqubo iphinde iqinisekise ukunemba kokuqondanisa kohlamvu lwemali ngaphakathi kwezimbotshana futhi ithola ukugcwaliswa kweresin engaphelele ezakhiweni ezinesilinganiso esiphezulu. I-X-ray ethuthukisiwe ye-computed tomography inikeza imephu engenalutho enezinhlangothi ezintathu ezinhlelweni ezibucayi.

I-Cross-Section Microsection Analysis

Ukwehlukaniswa kwezigaba okulimazayo ngezifunda ezishumekiwe kuveza ukujiya kwangempela kongqimba lwebhondi kanye nekhwalithi yokugcwalisa inhlaka. Ukuhlolwa kwe-Microscopic kuveza ukukhubazeka kokuhlangana kobuso, ukungena kwe-resin ezicini ezimahhadlahhadla, kanye nanoma yikuphi ukuhlukana ezindaweni ezibalulekile. Lokhu kuhlaziya kusebenza njengendlela yokuqinisekisa yokuhlola ikhwalithi yebhondi.

Ukuhlola Okubonakalayo kanye ne-AOI

Izinhlelo zokuhlola okuzenzakalelayo ze-optical ziqinisekisa ukuhambisana kwemaski ye-solder ezindaweni ezifakiwe futhi zithole ukungalingani kobuso okungase kubonise amaphutha angaphansi komhlaba. Ukuhlolwa okubonakalayo kuqinisekisa ukujula okufanele kokushumeka kwezinhlamvu zemali futhi kukhomba noma yimuphi umonakalo womshini emaphethelweni emigodi noma ezindaweni zethusi eziveziwe.

I-Copper Coin PCB Izindlela Zokuhlola Ukuthembeka

Ukuhlolwa kokwethembeka kuqinisekisa ukuthi ama-PCB ohlamvu lwekhopha agcina ukusebenza ngaphansi kwezimo zengcindezi eshisayo neyomshini emele izindawo zokusebenza zangempela. Lokhu kuhlola kusheshisa izindlela zokwehluleka ukubikezela ukusebenza kwenkambu kanye nokuqinisekisa amamajini edizayini.

Thermal Cycling Test

Ngokulandela izimiso ze-IPC-9701, izibonelo zokuhlolwa kokwethembeka kwe-PCB yezinhlamvu zemali yethusi zithola uhambo oluphindaphindiwe lokushisa phakathi kuka--40°C no-125°C ubuncane bomjikelezo oyinkulungwane. Lokhu kuhlolwa kokukhathala okushisayo kugcizelela izixhumanisi zezinhlamvu zemali ezishumekiwe namajoyinti e-solder ngasikhathi sinye. Izilinganiso zokumelana nokuxhumana ngaphambi nangemuva kokuhamba ngebhayisikili zilinganisela ukuwohloka kokusetshenziswa kubonwa, kuyilapho ukuhlaziya okunqamula izingxenye ezithile ngemva kokuhlola kuveza noma yikuphi ukuhlukana kobuso noma ukusakazeka kokuqhekeka.

I-Peel Amandla Test

Ukuhlolwa kwe-mechanical peel kulinganisa amandla okubopha adingekayo ukuze kuhlukaniswe izinhlamvu zemali zethusi ezihlanganisiwe ezintweni ezizungezile ze-substrate. Imiphumela yokuhlolwa iqhathaniswa namanani ajwayelekile okuqina kwe-copper foil peel ukuqinisekisa ukunamathela okwanele. Amandla okunciphisa kwe-peel abonisa ukulungiswa okunganele kwendawo, ukwelashwa kwe-resin okungaphelele, noma ukungcola ezindaweni zokubopha.

I-Cross-Section kanye nokuhlaziywa kwe-SEM

Ukuskena ukuhlolwa kwe-electron microscopy kwezingxenye eziphambanayo ezipholishiwe kunikeza isithombe sokucaca okuphezulu kwezixhumanisi ze-resin-copper futhi kwembule amaphutha amancane angabonakali ekuhlolweni kokubona. Lokhu kuhlaziya kukhomba ukungena kwe-resin okungaphelele ekuqineni kwendawo, i-interfacial void populations, kanye nanoma yikuphi ukwakheka kwenhlanganisela ye-intermetallic ezendlalelo ezibophayo.

Thermal Shock kanye Power Cycling Test

Ukushintsha kwezinga lokushisa okusheshayo phakathi kwezimo ezishisa kakhulu nezibandayo kulingisa izenzakalo zangempela zokuvula nokucisha ugesi kumishini yokusebenza. Ukuhlolwa kokuhamba ngebhayisikili kwamandla kusebenzisa amandla kagesi ngokusebenzisa izakhiwo zezinhlamvu zemali yethusi ngenkathi kuqapha ukunyuka kwezinga lokushisa kanye nezinguquko zokumelana nokushisa. Lezi zivivinyo ziqinisekisa ukuhambisana kwe-thermomechanical phakathi kwezinto zethusi ezishumekiwe kanye ne-substrate ngaphansi kwamaphrofayili omthwalo wangempela.

I-IPC Standards for Copper Coin PCB Test Test

Izindinganiso zemboni zinikeza izindlela zokwamukela eziqondile zezinhlelo zokuhlola ukuthembeka kwe-PCB yezinhlamvu zethusi. I-IPC-6012 isungula izidingo zokusebenza kwamabhodi aprintiwe aqinile okuhlanganisa ukubekezelelana kobukhulu, isikhala somqhubi, kanye nemininingwane yobuqotho besakhiwo. I-IPC-9701 ichaza izindlela zokuhlola ukuthembeka ikakhulukazi ekusebenzeni kwejoyinti le-solder ngaphansi kwezimo zokujikeleza kokushisa.

Izidingo zokufaneleka

Kuma-PCB emali yethusi asetshenziswa kumamojula wamandla, ukuhambisana ne-IPC-6012 Class 3 kanye ne-IPC-9701 kuqinisekisa ukukhuthazela okudingekile okushisayo nokomshini. Imibandela ebalulekile yokufaneleka ihlanganisa:

• Ubude besikhathi sokuhamba ngebhayisikili - Ubuncane bemijikelezo eyi-1000 kulo lonke ibanga elishiwo lokushisa ngaphandle kokukhuphuka kokumelana okulinganisekayo
• Peel umkhawulo wamandla – Amandla okubopha kufanele adlule ku-1.0 N/mm ezifundeni zethusi ezishumekiwe
• Ukwamukelwa okubonakalayo - Zero interfacial voids noma imifantu ebonakalayo ekuhlaziyweni kwezigaba ezihlukene
• Ukuzinza kobukhulu – I-Warpage kufanele ihlale ngaphansi kuka-0.75% ngemva kokuchayeka okushisayo ngokwe-IPC-6012 Class 3 ngayinye

Ukuqinisekiswa Kokwethenjelwa kanye Nokuthuthukiswa Okuqhubekayo

Izinhlelo zokuhlola ukwethembeka kwe-PCB yohlamvu lwemali yethusi olubanzi zihlanganisa ukuhlaziya izibalo nokuhlaziya ukwehluleka kwezihibe zempendulo ukuze kuthuthukiswe idizayini nezinqubo zokukhiqiza. Imodi yokwehluleka ngayinye ekhonjwe ngesikhathi sokuhlolwa kokufaneleka yazisa izenzo zokulungisa ekulungiseleleni umgodi, ukukhethwa kwe-resin, noma imingcele yenqubo yokubopha.

Abakhiqizi abanolwazi benza izivivinyo ezijwayelekile ze-cross-section kanye ne-bonding ukuze bagcine ikhwalithi yokushumeka yemali yethusi ezinzile kuwo wonke amaqoqo okukhiqiza. Ukuhlolwa kokuqinisekisa ngezikhathi ezithile kumasampula okukhiqiza kuqinisekisa ukuhambisana kwenqubo futhi kuthola noma yikuphi ukukhukhuleka kumapharamitha abalulekile ngaphambi kokuthunyelwa kwamakhasimende. Abakhiqizi abathuthukile basebenzisa idizayini yezindlela zokuhlola ukuze bathuthukise izinqubo zokushumeka ngokusekelwe kudatha yokwethembeka yobuningi.

Isiphetho

Ukuhlolwa kokuthembeka kwe-PCB yohlamvu lwemali yethusi kuqinisekisa kokubili ikhwalithi yokukhiqiza esheshayo kanye nokuqina kokusebenza kwesikhathi eside ngaphansi kwengcindezi eshisayo. Amaphrothokholi okuhlola okuhlelekile ahlanganiswe nokuhlola okuphelele kwemvelo anikeza ithemba lokuthi izakhiwo zethusi ezishumekiwe zizosebenza ngokwethembeka kukho konke ukuphila kwazo kokusebenza ekufuneni izicelo zama-electronics amandla.

Highleap Electronics Copper Coin PCB Amakhono

• Izinhlelo zokuhlola ezithuthukile - I-X-ray computed tomography kanye nokuhlaziywa okuzenzakalelayo kwe-cross-section ukuze kuqinisekiswe ikhwalithi ephelele
• Ukuhlola okuthobela i-IPC - Ukuhamba ngebhayisikili okushisayo okugcwele, amandla e-peel, namandla okuhlola ukuhamba ngebhayisikili ngokwezinga ngalinye le-IPC-6012 Class 3 kanye ne-IPC-9701
• Inqubo yokwenza ngcono - Ukulawulwa kwenqubo yezibalo kanye nezinhlelo zokuthuthukisa okuqhubekayo ziqinisekisa ikhwalithi yokushumeka engaguquki
• Usekelo lobunjiniyela - Ithimba lonjiniyela abathembekile elizinikele lisiza ekuthuthukisweni kwephrothokholi yokuhlola nokuhlaziya ukwehluleka

Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngezidingo zokuhlolwa kokwethembeka kwe-PCB yezinhlamvu zethusi kanye nezinqubo zokufaneleka zomklamo wakho wemojuli yamandla. I-Highleap Electronics inikeza izixazululo zokuphathwa kokushisa eziqinisekisiwe ezisekelwa idatha ephelele yokuthembeka.