I-Copper Coin PCB yamamojula Amandla: Isixazululo Sokuphatha Okushisayo

Izinselelo Ezikhulayo Ezishisayo Kumklamo Wamandla we-PCBs Module

Amamojula we-power semiconductor asebenzisa ubuchwepheshe be-IGBT, SiC, kanye ne-GaN abe yizingxenye ezibalulekile ezimotweni zikagesi, kuma-inverter ezimboni, kanye nasezimpahleni zikagesi ezisebenzayo kakhulu. Njengoba amaza okushintsha anda futhi ubuningi bamandla bukhuphuka, ama-substrate endabuko njenge-metal-core PCB kanye ne-direct bonded copper alwela ukuphatha ukushisa ngempumelelo. Amazinga okushisa e-junction angadlula imikhawulo ephephile, okubeka engcupheni ukuthembeka kwedivayisi futhi anciphise isikhathi sokusebenza.

Inselele eyinhloko isekusunguleni izindlela zokukhipha ukushisa eziphumelelayo ezivela ku-semiconductor die ziye ohlelweni lokupholisa lwangaphandle. Amabhodi ajwayelekile asekelwe ku-FR4 anikeza ukuhanjiswa kokushisa okunganele, kuyilapho ama-substrate e-ceramic afana ne-DBC enikeza ukusebenza okuhle kakhulu ngezindleko eziphakeme kanye nobunzima bokukhiqiza. Ubuchwepheshe be-PCB bezinhlamvu zethusi bubhekana nalesi sikhala ngokufaka ama-via okushisa aphezulu asendaweni ngqo ngaphansi kwamadivayisi kagesi, okudala iziteshi zokushisa eziqondile ezisebenzayo ngaphakathi kwezakhiwo ezijwayelekile ze-PCB.

Izidingo Zedizayini Ezishisayo zamaMojula Amandla PCBs

Umzila Wokugeleza Kokushisa Kumamojula Amandla

Ama-PCB emojuli yamandla aklanywa ngokukhipha ukushisa endleleni echaziwe: i-semiconductor junction kuya ku-die attach ungqimba, i-substrate, i-baseplate, futhi ekugcineni ku-heatsink. I-interface ngayinye inikela ngokumelana nokushisa, futhi ungqimba lwe-substrate luvame ukumelela i-bottleneck ebalulekile. Kuzinhlelo zokusebenza ze-IGBT PCB kanye ne-SiC power PCB, ukunciphisa lokhu ukumelana kubalulekile ekugcineni amazinga okushisa e-junction ngaphakathi kwebanga lokusebenza eliphephile.

Izidingo Eziphakeme Zamandla Amandla

Amadivayisi we-SiC ne-GaN asebenza ngama-voltage aphezulu namafrikhwensi kunama-silicon IGBT, okuholela ekugubheni kokushisa okugxilile ezindaweni ezincane ezifayo. Ukuminyana kokushisa kungafinyelela ku-100-300 W/cm², okudinga ama-substrates anokubili ukuguquguquka okuphezulu kwe-thermal kanye nokuzinza kwemishini. Izinto zosiko ze-PCB azikwazi ukuphatha la mazinga ngaphandle kokufaka ingozi noma ukubaleka okushisayo.

Imibandela Ebalulekile Yokusebenza Kwe-substrate

Imiklamo yemojula yamandla ye-PCB kumele inelise izidingo ezintathu eziyinhloko:

• Ukumelana nokushisa okuphansi - Ukusebenza kahle kokushisa kusuka kumadivayisi asebenzayo kuya ezinhlelweni zokupholisa
• Ukuzinza okuphezulu kwemishini - Ukumelana nokuhamba ngebhayisikili okushisayo kanye nengcindezi yokudlidliza
• Ukufakwa kukagesi okuthembekile - Ukuvimbela ukuhlukana phakathi kokulandela i-high-voltage

Ubuchwepheshe be-PCB yemali yethusi buhlangabezana nalezi zidingo ngokuhlanganisa inqwaba yethusi yendawo nezinto ezijwayelekile ze-dielectric.

Isakhiwo se-PCB ye-Copper Coin for Power Module Applications

I-Embedded Copper Coin Architecture

I-PCB yezinhlamvu zethusi isebenzisa amasilinda noma amabhlogo ethusi amakhulu afakwe ngaphakathi kwesakhiwo sebhodi , abekwe ngqo ngaphansi kwamadivayisi e-semiconductor kagesi. Kunezindlela ezintathu zokukhiqiza: izinhlamvu zemali ezifakwa ngokucindezela ezifakwe emihumeni eqondile, izinhlamvu zemali ezifakwe ngokuphelele ezibekwe phansi ngesikhathi sokwenziwa kwebhodi, kanye nezakhiwo ezingaphakathi lapho izinhlamvu zemali zakha ingxenye yesitaki sengqimba yangaphakathi. Indlela ngayinye idala indlela yokushisa ephikiswa kancane ukusuka engxenyeni kuya ekushiseni.

I-Vertical Thermal Conductivity Enhancement

Imikhondo yethusi evamile ye-PCB ihambisa ukushisa ngaseceleni ngokudluliswa kokushisa okuqondile okulinganiselwe kusetshenziswa izendlalelo ze-dielectric ezincane. Izinhlamvu zemali zethusi zisungula iziteshi eziqondile eziqondile ezinezindawo eziphambanayo ezifanayo noma ezeqa i-semiconductor footprint. Lokhu kukhishwa kokushisa okugxilile kunciphisa ukumelana nokushisa kwe-junction-to-case ngo-40-60% uma kuqhathaniswa nezakhiwo ezivamile ze-MCPCB, okuvumela ukuminyana okuphezulu kwamanje kumamojula wamandla we-PCBs.

Ukuqhathaniswa Kwesakhiwo Nama-substrates Endabuko

Amabhodi e-FR4 ancike ezendlalelo zethusi ezizacile ezihlukaniswe yi-low-conductivity epoxy resin, okudala ukumelana nokushisa okuphezulu. I-MCPCB yengeza ingqikithi yensimbi kodwa igcina isendlalelo sokuhlukaniswa kwe-dielectric esikhawulela ukudluliswa kokushisa. I-DBC ibopha ithusi ngokuqondile ku-ceramic, isusa izendlalelo eziphakathi kodwa idinga ukucutshungulwa okukhethekile. I-PCB yohlamvu lwemali yethusi ihlanganisa ukuguquguquka kokukhiqiza kwe-FR4 nokusebenza okushisayo okusondela kuma-substrates e-ceramic.

I-Power Module PCBs Substrate Comparison: Copper Coin vs DBC and MCPCB

Isixazululo Sokushisa Esingabizi kakhulu

Ama-substrates e-DBC aletha ukusebenza okushisayo okuphakeme kodwa adinga izinto zobumba nezinqubo zokubopha izinga lokushisa eliphezulu ezikhuphula izindleko ngo-3-5× uma kuqhathaniswa nezixazululo ezisekelwe ku-PCB. I-PCB yohlamvu lwemali yethusi ifinyelela ku-70-80% wokusebenza okushisayo kwe-DBC cishe ku-40-50% wezindleko, okuyenza isebenze ezinhlelweni zokusebenza zamandla amaphakathi lapho amamajini e-DBC engenakuthethelelwa. Kumadizayini we-SiC amandla e-PCB angaphansi kuka-50 kW, izinhlamvu zemali zethusi zivame ukuhlinzeka ngebhalansi yokusebenza kwezindleko.

Izinzuzo Zokukhiqiza kanye Nokuthengwa Kwempahla

Izinto zokwakha ezijwayelekile ze-PCB zisingatha ukucutshungulwa kohlamvu lwemali yethusi ngezithasiselo ezincane zamathuluzi omshini wokugaya kanye nokubeka uhlamvu lwemali. Lokhu kuhambisana kunciphisa ukutshalwa kwezimali okukhulu futhi kuvumela abakhiqizi be-PCB abakhona ukuthi bangene emakethe yemojula yamandla. Ukukhiqizwa kwe-DBC kudinga imigqa ekhethekile yokucubungula i-ceramic enamandla alinganiselwe womhlaba wonke, okudala izingqinamba ze-supply chain ngesikhathi sokwanda kwesidingo.

Ukuthembeka Nokucatshangelwa Kokuhlola Kwemojula Yamandla PCBs

I-Thermal Cycling ne-Interface Integrity

Amamojula wamandla athola ukushisisa nokupholisa okuphindaphindiwe ngesikhathi sokusebenza okuvamile, okudala ukucindezeleka komshini endaweni yokusebenzelana. Ibhondi ye-copper-to-FR4 kuhlamvu lwemali yethusi i-PCB kufanele imelane nokungezwani kokunwetshwa okushisayo ngaphandle kokuncipha. Ukuhlolwa okusheshisiwe kokuhamba ngebhayisikili okushisayo ngakunye okujwayelekile kwe-IPC-9701 kuvamise ukusebenzisa -40°C kuya ku-+125°C imijikelezo engu-1000-2000 ukuze kuqinisekiswe ukuzinza kokusebenzelana kwezinhlelo zokusebenza zezimoto nezezimboni.

Amandla e-Peel kanye nekhwalithi yokubopha

Ukunamathiselwa kohlamvu lwethusi kuncike ekugcinweni kokulingana komshini noma ekubopheni okunamathelayo ngesikhathi sokulayina. Imiklamo yokulingana kokucindezela ifinyelela amandla okuhlubuka angu-15-25 N/mm ngokulingana kokuphazamiseka kanye nokukhiya kokunwetshwa kokushisa. Izinhlamvu zemali ezilayishiwe ezisebenzisa i-epoxy prepreg yokushisa okuphezulu zifinyelela ku-20-30 N/mm, okuqhathaniswa nezibopho ze-PCB ze-module yamandla ezijwayelekile ze-PCB. Izinqubo zokuhlola zilandela izidingo ze-IPC-6012 Class 3 zezinhlelo zokusebenza ezinokwethenjelwa okuphezulu.

Ukuqinisekisa Ukusebenza Kwesikhathi Eside Esishisayo

I-PCB yohlamvu lwemali yethusi ukumelana nokushisa kungakhula ngokuhamba kwesikhathi uma ukuwohloka kwesixhumi esibonakalayo kwenzeka ngenxa ye-oxidation noma ukuguga okunamathelayo. Ukuhlolwa okunwetshiwe kokuchayeka kwezinga lokushisa ku-125-150°C amahora angu-2000-3000 kuhlola ukuzinza kwesikhathi eside. Izakhiwo zohlamvu lwemali yethusi eziklanywe kahle zibonisa ukukhula okungaphansi kuka-5% kokumelana nokushisa ngemva kokuguga, kugcina ukusebenza kuyo yonke iminyaka yokuphila yomkhiqizo weminyaka eyi-10-15 ezinhlelweni ze-IGBT PCB.

Imihlahlandlela Yokuklama Nokukhiqiza yama-PCB weMojula ye-Copper Coin Power Module

Uhlamvu lweJiyomethri kanye nesu lokubeka

Ububanzi bohlamvu lwemali yethusi kufanele bufane noma budlule kancane isigxivizo sedivayisi yamandla, ngokuvamile sibe ngu-10-30 mm kuma-IGBT ahlukene kanye no-20-50 mm kumamojula wamandla. Ugqinsi lwemali lusukela ku-1.5-3.0 mm kuye ngobukhulu be-PCB ukujiya kanye nesisindo esishisayo esidingekayo. Ukubeka izinhlamvu zemali ngokuqondile ngaphansi kwezindawo ezinamathiselwe ze-semiconductor die kunciphisa izimfuneko zokusabalalisa ukushisa kwangasemuva futhi kunciphisa izinga lokushisa lokuhlangana ngo-10-20°C uma kuqhathaniswa nokubekwa kwe-offset.

Ukulawulwa Kwenqubo Yokukhiqiza

Imingcele yokukhiqiza ebalulekile yamamojula wamandla we-PCB anezinhlamvu zemali zethusi ihlanganisa:

• Ukubekezelelana kwemishini ye-Cavity - ± 0.05 mm ukunemba kuqinisekisa uhlamvu lwemali olufanelekile ngaphandle kwezikhala zomoya
• Ukulungiswa kwendawo – Ukuhuzuka ngomshini noma ukwelashwa kwe-plasma kunciphisa isixhumi esibonakalayo ukumelana nokushisa ukusuka ku-0.3-0.5 K·cm²/W kuye ku-0.1-0.2 K·cm²/W
• Ukulawulwa kwe-lamination - Ukucindezela okulungiselelwe kanye namaphrofayili okushisa afinyelela ukuthintana okugcwele ngaphandle kwe-warpage yebhodi

I-Interface Thermal Resistance Optimization

Umzila oshisayo ophelele uhlanganisa ukuxhumana kohlamvu lwemali yethusi kukho kokubili i-PCB laminate nezingxenye zangaphandle. Ukumelana nokushisa kwe-Die attach layer ngokuvamile kubusa ku-0.2-0.5 K/W kumamojula e-IGBT, kuyilapho uhlamvu lwemali oluya ku-PCB ukusebenzelana lunikela ngo-0.1-0.3 K/W. Ugqinsi lwesendlalelo se-solder phakathi kwengxenye nendawo yemali yemali kufanele luncishiswe lube ngu-50-100 μm ukuze lusebenze kahle.

Izinhlelo zokusebenza: I-SiC ne-GaN Power Module PCBs Solutions

Amamojula we-Inverter yemoto kagesi

Amamojula wamandla we-SiC kuma-inverters e-EV traction asebenza ku-400-800V ngokushintsha ama-frequencies ka-10-20 kHz, akhiqiza imithwalo yokushisa egxilile ye-150-300W idivayisi ngayinye. I-PCB yohlamvu lwemali yethusi inika amandla imiklamo ye-inverter enezigaba ezintathu ehlangene enama-SiC MOSFET amaningi abelana ngendiza evamile eshisayo. Amazinga okushisa e-Junction ahlala engaphansi kuka-150 ° C ngisho nangesikhathi sokusheshisa okuphezulu, okuqinisekisa ukusebenza okuthembekile esikhathini sokuphila kwemoto engu-200,000 km.

Iseva ne-Telecom Power Supplies

Amamojula wamandla we-GaN weziguquli ze-48V DC-DC kuzikhungo zedatha adinga ama-substrates asekela ukusebenza kwemvamisa ephezulu ku-500 kHz-1 MHz. I-Copper coin power module PCBs inikeza ukumelana nokushisa okuphansi ngenkathi igcina inductance ephansi ye-parasitic ngokusebenzisa izakhiwo zokulandelela ezithuthukisiwe. Ukuminyana kwamandla okudlula u-60 W/in³ kuyafinyeleleka, kunciphisa isigxivizo samandla eseva ngo-30-40% uma kuqhathaniswa namadizayini asekelwe ku-silicon ku-MCPCB.

Ama-Industrial Motor Drives kanye nama-Solar Inverters

Amadrayivu ezimboni ezigaba ezintathu asebenzisa amamojula e-IGBT asuka ku-5-50 kW azuza ekuphathweni okushisayo kwe-PCB yemali yethusi ngaphandle kwezindleko ze-substrate ye-DBC. Ama-Solar inverters asebenza ku-97-99% ukusebenza kahle asakhipha i-50-200W njengokushisa kuma-semiconductors amandla. Izakhiwo zohlamvu lwemali yethusi zinika amandla ukusebenza okungenamdlandla ezindaweni ezivalekile ngokuqhuba kahle ukushisa kumaheatsink e-aluminium extrusion.

Esebenza kahle futhi Ethembekile Power Module PCBs Platforms

Ubuchwepheshe be-PCB ye-Copper coin iletha ukusebenza okushisayo okulinganiselwe kanye nokwenza okusebenzisekayo kwamamojula wesimanje amandla semiconductor. Ngokwenza izindlela zasendaweni ze-high-conductivity ngaphakathi kwezakhiwo ezijwayelekile ze-PCB, le ndlela ifinyelela u-70-80% wokusebenza okushisayo kwe-DBC ngezindleko eziphansi kakhulu kanye nokuvumelana nezimo okukhulu kokukhiqiza. Ubuchwepheshe bubonakala busebenza kahle kakhulu kuzinhlelo zokusebenza zamandla e-SiC PCB kanye ne-GaN ebangeni lika-5-50 kW, lapho ezomnotho ze-DBC zihlala ziyinselele kuyilapho izimfuno ezishisayo zidlula amandla e-MCPCB.

Njengoba ukuminyana kwamandla kuqhubeka nokwanda ngama-semiconductors e-wide-bandgap, i-PCB yemali yethusi inikeza inkundla eyingozi abakhiqizi be-PCB abangayisebenzisa ngaphandle kokutshalwa kwezimali kwemishini ekhethekile. Inhlanganisela yokwethembeka okuqinisekisiwe ngokuqinisekiswa kokuhamba ngebhayisikili elishisayo, ukuhambisana nezinqubo zokuhlanganisa ezijwayelekile, kanye nokusebenza ngempumelelo kwezindleko kubeka ubuchwepheshe bohlamvu lwemali yethusi njengesixazululo esisebenzayo sogesi wezimoto, wezimboni, namandla avuselelekayo.

Highleap Electronics Amandla Amandla PCBs Amakhono

Njengoba ineminyaka engaphezu kwengu-15 yobuchwepheshe ekukhiqizweni kwe-PCB okuthuthukisiwe kanye nokuhlanganiswa kwamamojula kagesi, i-Highleap Electronics inikeza izixazululo ze-PCB zemali yethusi eziphelele:

• Ukulingisa okushisayo kanye nokwenza kahle komklamo - Ukumodela kwe-FEA ukuze kuqinisekiswe ukusebenza okushisayo ngaphambi kokukhiqiza
• Ukushumeka uhlamvu lwemali yethusi olunembe - Ukubekezelelana komshini we-Cavity kuya ku-± 0.05 mm ngezinqubo ezilawulwayo zokugaya
• Izinsizakalo ezigcwele zomhlangano we-turnkey - Ukuthola ingxenye, ukubekwa kwe-SMT, nokuhlolwa kokugcina kwamamojula we-IGBT, SiC, kanye ne-GaN
• Ukuhlolwa kokuqinisekisa ikhwalithi - Ukuhamba ngebhayisikili okushisayo nge-IPC-9701 ngayinye, ukuhlolwa kwamandla we-peel, nokuhlola ukwethembeka kwesikhathi eside

Xhumana nethimba lethu lobunjiniyela ukuze nixoxe ngendlela ubuchwepheshe be-PCB bemojula yamandla ethusi obungathuthukisa ngayo ukuphathwa kokushisa kwesicelo sakho esilandelayo samandla aphezulu.