I-Probe Card PCB: Ukunemba Kobunjiniyela Bokuhlolwa Kwezinga Le-Wafer

Isingeniso

Ekuhloleni izinga le-wafer, ikhadi le-PCB lokuhlola lisebenza njengesixhumi esibonakalayo esibalulekile phakathi kwesistimu ye-ATE kanye ne-wafer ye-semiconductor, iqinisekisa ukuthintana kukagesi okunembile kanye nobuqotho besignali. Njengoba ama-chip geometries aqhubeka nokuncipha futhi izidingo zokuhlola ziba ziqinile, izixhumanisi zokuhlola ezikhethekile sezibaluleke kakhulu. Ikhadi le-PCB le-probe livala igebe phakathi kwezinaliti ze-probe kanye nezinto zokuhlola ezizenzakalelayo, livumela abakhiqizi ukuthi baqinisekise ukusebenza kwe-die ngaphambi kokudayiswa kwe-wafer kanye nokupakishwa.

Iyini i-Probe Card PCB?

Incazelo kanye Nomsebenzi Owumongo

I-PCB yekhadi le-probe iyibhodi yokuhlola ekhethekile exhumanisa uhla lwezinaliti ze-probe nemishini yokuhlola ezenzakalelayo. Isiza ekudlulisweni kwesignali, ukusatshalaliswa kwamandla, kanye nokumisa isisekelo ngenkathi igcina ukuzinza kwesignali yokuhlola kumakhulu noma izinkulungwane zamaphoyinti okuxhumana. Ibhodi isebenza njengesakhiwo sokusekela ngomshini kanye nenethiwekhi yokusabalalisa kagesi yokuhlola i-parametric kanye nokusebenza kwezinga le-wafer.

Izingxenye Ezibalulekile ze-Probe Card PCB

Ukuhlanganiswa kwekhadi le-PCB le-probe elijwayelekile lihlanganisa izinto ezine eziyinhloko: uhlu lwenaliti ye-probe yokuthintana ne-wafer, isendlalelo esibonakalayo se-PCB esinezinsalela ze-impedance ezilawulwayo, isistimu yesixhumi se-ATE, kanye nohlaka lokusekela lomshini. Ingxenye ngayinye kufanele isebenze ekhonsathini ukuze kuzuzwe ukuthintana kukagesi okuphindaphindwayo nama-die pads anesilinganiso esingaphansi kwama-micrometer ayi-100 ngephimbo.

I-Probe Card PCB vs. Ibhodi Lokulayisha i-PCB

Idizayini Yesakhiwo ye-Probe Card PCB

I-Multi-Layer Stack-Up Architecture

Imiklamo ye-PCB yamakhadi e-probe ivame ukusebenzisa izendlalelo eziyi-6 kuya kwezingama-20 noma ngaphezulu ukuze ivumelane nezidingo eziyinkimbinkimbi zokuhambisa isignali kanye nokuvikela. I-stack yesendlalelo ihlukanisa izindiza zesignali nokusatshalaliswa komhlaba kanye namandla, ngezingqimba zokulawula ezizinikele ezilawula izimpawu zokulandelana kokuhlola. Ukukhethwa kwezinto kufaka phakathi i-high-Tg FR-4, i-BT resin, noma ama-laminate ochungechunge lwe-laminate olune-low-loss ekhethekile ngokusekelwe ezidingweni zemvamisa kanye nezidingo zokuzinza kokushisa.

Okuthuthukisiwe Ngezobuchwepheshe

Ama-fine-pitch probe array adinga izixazululo eziyinkimbinkimbi zokuxhumanisa:

• Ama-microvias atholwe nge-laser - Nika amandla umzila ominyene onamadayamitha amancane njengama-micrometer angu-75 ukuze uthole ukusabalalisa kwesignali ephezulu.
• Izimpumputhe futhi wangcwatshwa vias - Xhuma izendlalelo zangaphakathi ngaphandle kokusebenzisa indawo engaphezulu, wandise ukuminyana kwephedi lokuhlola.
• Ukwakhiwa ngephedi - Yehlisa usayizi wephedi ngenkathi igcina ukusebenza kukagesi, okubalulekile ezinhlelweni ze-sub-100µm pitch.

Ukulawula Impedance ku-Probe Card PCB

Idizayini ye-impedance elawulwayo iyisisekelo ekusebenzeni. Ukulandelela amasignali kwenzelwe ukucaciswa okuhlukene okungu-50-ohm okukuphela-kodwa noma okungu-100-ohm, nokubekezelela ukujiya kwesendlalelo kuya kungqimba okugcinwe ngaphakathi ku-±10% ukuze kugcinwe ukuvumelana. Izindiza eziphansi ezibekwe eduze kwezendlalelo zesignali zinikeza izindlela ezibuyayo ezine-inductance ephansi ezinciphisa ukuphazamiseka kozibuthe.

Izinselelo ze-Fine-Pitch kanye ne-High-Frequency Design

Izidingo ze-Ultra-Fine Pitch

Inkumbulo yesimanje kanye namadivayisi anengqondo ngokuvamile adinga ama-probe pitches angaphansi kwama-micrometer angu-50, ecindezela imikhawulo yokukhiqiza. Lokhu kudinga ukunemba kokubhalisa okungcono kunama-micrometer angu-25 kulo lonke iphaneli, okutholwa ngamasistimu ezithombe athuthukisiwe kanye nesinxephezelo esishisayo ngesikhathi sokwenziwa. Noma yikuphi ukungaqondi kahle kuhumusha ngokuqondile amaphutha okubeka ithiphu kanye nokulimala okungaba khona.

High-Frequency Signal Ubuqotho

Lapho kuhlolwa amadivayisi anesivinini esikhulu asebenza ngaphezu kuka-10 GHz, idizayini ye-PCB yekhadi le-probe kufanele ibhekane nokulahlekelwa komphumela wesikhumba, ukumuncwa kwe-dielectric, kanye nokunqanyulwa kwe-impedance. Ama-laminates okulahlekelwa okuphansi anezici zokulahla ngaphansi kwe-0.004 kudingekile. Ukubhanqa okuhlukile komzila kudinga ukulawula kwesikhala okunembile, ngobude obufanisiwe obubanjwe phakathi kwemilimitha engu-1 ukuze kuvinjelwe amaphutha enziwe i-skew.

Amasu okunciphisa i-Crosstalk

Ama-probe array aminyene adala ingozi enkulu ye-crosstalk phakathi kwezindlela zesignali eziseduze:

• Umzila ophansi wesignali - Ihlukanisa amasiginali abalulekile ngokulandela umkhondo ozinikele phakathi kwama-conductor asebenzayo.
• Izinto ezishumekiwe ze-capacitance - Nikeza ukuhlukaniswa okusabalalisiwe ngaphandle kokusebenzisa i-real estate yebhodi.
• Izindiza eziyisithenjwa eziqinile – Vikela izingqimba zesignali yangaphakathi ekuhlanganeni kwe-electromagnetic nhlangothi zombili ze-dielectric.

I-ATE System Interface ye-Probe Card PCB

I-Platform-Specific Connection

Imihlangano ye-PCB yekhadi le-Probe kufanele ihambisane nemininingwane yemishini nekagesi echazwe abakhiqizi be-ATE njenge-Advantest V93000 noma i-Teradyne UltraFlex platforms. Izixhumi zesixhumi esibonakalayo zenziwe ngendlela oyifisayo ukuze zifane nezibalo zamaphini kusukela kumakhulu kuya emashumini ezinkulungwane, ngokuchazwa kwemephu yesignali eqondanisa iziteshi zokuhlola ukuze kuphenywe izindawo. Izici zokubhaliswa kwemishini ziqinisekisa ukulungiswa kwedokhi okuphindaphindayo.

Grounding Architecture Integration

Ukubekwa phansi okusebenzayo phakathi kwekhadi lokuhlola i-PCB nohlelo lwe-ATE kubalulekile ekuvikeleni umsindo nokunemba kokulinganisa. Izikhonkwane eziningi zaphansi ezisatshalaliswa kuso sonke isixhumi esibonakalayo zinciphisa i-impedance futhi zivimbela ukuminyana kwamanje. Izindiza zaphansi ezisabalalisiwe zinikeza amandla okubhekisela afanayo kuyo yonke indawo yokuhlola, esusa izihibe zaphansi ezibeka engcupheni ikhwalithi yesignali.

Imininingwane Yokuqina Kwe-interface

Izixhumanisi ze-ATE zithola izinkulungwane zemijikelezo yokuxhumana phakathi nempilo yazo yesevisi. Amasistimu okuxhuma kufanele amelane nokuguga kwemishini ngenkathi egcina imininingwane yokusebenza kukagesi. Okuxhunywe ngegolide okunamathiselwe ngamandla avamile acacisiwe kuqinisekisa ukumelana okungaguquguquki okungaphansi kwama-milliohm angu-50 iphini ngalinye, kuyilapho izikhonkwane zomhlahlandlela zivimbela ukunyakaza okuhlangene okungase konakalise amathiphu okuhlola athambile.

Ukuthembeka Nokucatshangelwa Okushisayo kwe-Probe Card PCB

Izidingo Zokulawula Okushisayo

Imisebenzi yokuhlola i-probe ingakhuphula izinga lokushisa lekhadi le-PCB le-probe ngaphezu kuka-125°C ngenxa yokuhlakazwa kwamandla avela kukho kokubili umjikelezo wokuhlola kanye namadivayisi angaphansi kokuhlolwa. Ukukhethwa kwempahla kumele kubhekelele i-coefficient yokumataniswa kokunwetshwa okushisayo phakathi kwe-PCB substrate, i-probe substrate, ne-silicon wafer ukuvimbela ukucindezeleka komshini. I-Polyimide nezinhlelo ze-epoxy eziphezulu ze-Tg zigcina ukuzinza kobukhulu kuwo wonke amazinga okushisa amabhayisikili.

Ukufaniswa kwe-CTE Material

Ukungezwani kokwanda okushisayo phakathi kwezinto kudala ingcindezi ezindaweni zokuxhumana nakumajoyinti e-solder:

• Ukuqondiswa kwe-CTE – Ama-substrate e-PCB ekhadi le-probe akhethwa ukuze afane nokwandiswa kokuhlanganiswa kwe-probe, ngokuvamile angu-12-17 ppm/°C.

• Ukuqina kobukhulu - Kuvimbela ukuzulazula kokubeka i-probe ngesikhathi sokuvakasha kokushisa futhi kwandise impilo yokusebenza kokuhlanganiswa.

• Ubuqotho be-interface - Igcina ukuthembeka kokuxhumana kukagesi noma ngabe ukujikeleza kokushisa kubangela ukucindezeleka kwezinto.

I-Probe Xhumana Nokuphila Okude

Ukuthembeka kukagesi imibhangqwana ngqo nge probe inaliti ukukhathala mechanical. Njengoba ama-probe ethintana ngokuphindaphindiwe ezindaweni ezingaphezulu, amamaki okukhuhla ayakhula futhi ukumelana nokuxhumana kuyanda. Ikhadi lokuhlola i-PCB kumele ligcine ukusebenza kukagesi njengoba amathiphu ophenyo ehla, atholwa ngamanethiwekhi okusabalalisa amelana kancane kanye nokuxhumana okungafuneki phansi.

Izindlela Zokukhiqiza ze-Probe Card PCB

Precision Drilling and Layer Registration

Amasistimu wokumba ama-laser adala ama-microvias anobubanzi obuncane obungama-micrometer angu-75, okuvumela ukuxhumanisa okuminyanisayo okudingekayo kuma-array e-fine-pitch probe. Ukubhaliswa kwesendlalelo kuya kwesendlalelo kufanele kuzuze ukunemba phakathi kwama-micrometer angu-25 kuphaneli yonkana, okudinga amasistimu okuqondanisa okuthuthukisiwe kanye nesinxephezelo soshintsho lobukhulu obubalulekile phakathi nokucubungula.

Ukukhethwa Kokuqeda Ubuso

Ukuthembeka kokuxhumana kwe-Probe kudinga ukuqedwa kwendawo okumelana ne-oxidation ngenkathi kuhlinzeka ngezakhiwo zikagesi ezingaguquki. I-ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) inikeza ukumelana nokugqwala okuhle kakhulu nekhono lokugeleza kabusha okuningi. Iziphetho zegolide zokucwiliswa zinikeza indawo eyisicaba ukuze kuhlale i-probe, nakuba izithiyo zokusabalalisa i-nickel zidingeka ukuvimbela ukumbozwa kwegolide.

Izindlela Zokuqinisekisa Ikhwalithi

Abahloli be-flying probe baqinisekisa ukuqhubeka kukagesi kanye nokuhlukaniswa ngaphandle kokudinga izinto zokuhlola ezizinikele, ikakhulukazi eziwusizo ekwakheni amakhadi e-prototype probe PCB. Ubuningi bokukhiqiza bungase buvumele izinto zokuhlola ezenziwe ngokwezifiso ezihlola amapharamitha e-impedance, ukulayisha amandla, kanye nokumelana nokuxhumana ngasikhathi sinye. Izinhlelo zokuhlola ze-Optical ziqinisekisa ubukhulu bephedi kanye nokunemba kokubhaliswa ngaphambi kokuhlanganiswa.

Izicelo namathrendi ku-Probe Card PCB Technology

Izizinda Zokusebenza Eziyinhloko

Imihlangano ye-PCB yekhadi le-Probe isatshalaliswa ekuhlolweni kwenkumbulo (i-DRAM, i-NAND flash), ukuqinisekiswa kwe-logic ye-IC (amaphrosesa, ama-GPU), kanye nokulinganisa kwedivayisi ye-RF (izikhulisamandla, ama-transceivers). Isizinda sohlelo lokusebenza ngasinye sibeka izidingo ezithile: ukuhlolwa kwenkumbulo kugcizelela ukuthintana okuhambisanayo kumakhulu abantu abafa ngesikhathi esisodwa, kuyilapho ukuhlola kwe-RF kubeka phambili ukulondolozwa kobuqotho besignali kumaza amaza ama-milimeter.

Ukwandisa Izidingo Zenani Lephini

Imiklamo yesimanje ivamise ukudlula izindawo zokuhlola eziyi-10,000 njengoba ubunkimbinkimbi befa bukhula kanye namasu okuhlola afanayo anda. Lokhu kushayela ikhadi le-PCB le-probe libheke ekubalweni kwesendlalelo esiphezulu, ububanzi bomugqa ocolekile obungaphansi kwama-micrometer angu-50, kanye namanethiwekhi okusabalalisa amandla ayinkimbinkimbi aletha ama-voltage azinzile kuwo wonke ama-arrays amakhulu.

I-HDI kanye Nokuhlanganiswa Okuthuthukile

Ubuchwepheshe be-PCB obuhlanganisa ubuningi obukhulu kanye nobuchwepheshe be-PCB obufana ne-substrate buyashintshwa kusukela kuzinhlelo zokusebenza zamadivayisi eselula kuya ekukhiqizweni kwe-PCB yamakhadi e-probe. Lezi zinqubo zivumela izici ezinhle kakhulu ezinama-microvia ahlanganisiwe, kunciphisa ubude bendlela yesignali kanye nokuthuthukisa ukusebenza kukagesi. Amanye amadizayini athuthukile ahlanganisa i-substrate ye-probe ngqo ne-PCB, asuse izinga elilodwa lokuxhumana futhi athuthukise ukuhleleka.

Isiphetho

Ikhadi lokuhlola i-PCB limelela indawo esemqoka yokuhlangana ekukhiqizeni i-semiconductor, lapho ubunjiniyela obunembayo buvumela ukuhlola okuzenzakalelayo kwamasekhethi ahlanganisiwe athuthukile. Izidingo zedizayini zifaka phakathi ukuxhumanisa kwephimbo elihle, umzila wesiginali wemvamisa ephezulu, ukuzinza kwe-thermal, nokunemba kokukhiqiza okuphonsela inselelo amandla avamile e-PCB. Njengoba ama-semiconductor node eqhubeka nokuncipha kanye nobunzima bokuhlola bukhuphuka, ubuchwepheshe bekhadi lokuhlola le-PCB kufanele buguquke ngezinto ezithuthukisiwe nezinqubo ezicolisisiwe.

Kwa-Highleap Electronics, sihlinzeka ngokukhiqiza i-PCB ngokunemba kwezicelo zokuhlola i-semiconductor:

• Amandla we-HDI wephimbo elihle – Ukunemba kokubhalisa ku-25µm kuma-probe pitches angaphansi kuka-50µm ngama-microvias adotshwe nge-laser.
• Idizayini ye-impedance elawulwayo – 50Ω kanye no-100Ω imigqa yokudlulisela enezitaki eziningi ezivela ku-6 kuye kwezingu-20+.
• Indawo ethuthukisiwe iyaqedwa - I-ENEPIG kanye negolide lokucwiliswa ukuze uthole ukuthintana okuthembekile kwe-probe kanye nempilo eyandisiwe yesevisi.
• Ubuchwepheshe benkundla ye-ATE - Imiklamo yesixhumi esibonakalayo evumelana ne-Advantest, Teradyne, nezinye izinkundla zokuhlola ezinkulu.

Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngokuthi amakhono ethu okukhiqiza i-PCB yamakhadi e-probe angazisekela kanjani izidingo zakho zokuhlola ezingeni le-wafer.