I-PCB ye-Semiconductor Load Board: Umhlahlandlela Wochwepheshe Wokuhlola Nokukhiqiza

Isingeniso

Ukuhlolwa kwe-PCB ye-Semiconductor Load Board kudlala indima ebalulekile ekuhloleni ukusebenza nokuthembeka kwamadivayisi e-semiconductor ngaphambi kokukhiqizwa ngobuningi. Njengokuxhumana phakathi kwama-chips nezinto zokuhlola ezizenzakalelayo (ATE), amabhodi okulayisha anika amandla ukuqinisekiswa okunembile kwamapharamitha kagesi, ukuziphatha okusebenzayo, nokuzinza kwesikhathi eside.

Lesi sigaba sokuhlola sinquma isivuno sokukhiqiza, sihlonza amayunithi anesici, futhi siqinisekisa imininingwane yedizayini kuzo zonke izimo zokusebenza ezihlukahlukene. Ngaphandle kokusetshenziswa okufanele kwebhodi lokulayisha, abakhiqizi abakwazi ukuqinisekisa ikhwalithi yedivayisi noma bahlangabezane namazinga omkhakha aqinile.

Iyini i-Semiconductor Load Board PCB?

Incazelo kanye Nomsebenzi Owumongo

I-semiconductor load board PCB iyibhodi lesekethe eliphrintiwe elikhethekile elixhuma idivayisi ehlolwayo (DUT) nezinto zokuhlola ezizenzakalelayo. Leli bhodi lesixhumi esibonakalayo lidlulisela amasignali okuhlola, amandla, nokuxhumana okuphansi phakathi komhloli nedivayisi ye-semiconductor ngokusebenzisa amasokhethi anembile.

Izingxenye Zesakhiwo

Isakhiwo sebhodi lokulayisha sihlanganisa izendlalelo eziningi zesignali zokudlulisa idatha ngesivinini esikhulu, izindiza zamandla ezizinikele zokusabalalisa i-voltage ezinzile, kanye nezendlalelo zomhlabathi zokunciphisa umsindo. Indawo yokuxhumana yokuhlola ixhuma kuma-contactor e-ATE, kuyilapho isifunda sesokhethi sihlanganisa izinhlobo ezahlukene zamaphakheji kusukela ku-QFN kuya kuzilungiselelo ze -BGA.

Ukuqhathanisa namanye amabhodi okuhlola

Ngokungafani namabhodi ashise ngaphakathi agxile ekubhayisikilini okushisayo emazingeni okushisa aphakeme, ama-PCB ebhodi lomthwalo we-semiconductor agcizelela ubuqotho besignali phakathi nokuhlolwa kokusebenza. Amakhadi e-probe athintana ngokuqondile namadivayisi weleveli ye-wafer, kuyilapho amabhodi okulayisha ahlola amayunithi apakishiwe, okuwenza abebalulekile ekuqinisekisweni kwezinga lokukhiqiza.

Isebenza kanjani ukuhlolwa kwe-PCB ye-Semiconductor Load Board

Isimiso Sokuhlola

I-ATE ikhiqiza ama-vectors okuhlola futhi idlulisele amasignali ngebhodi lomthwalo ukuya e-DUT. Izimpawu zokuphendula zibuya ngendlela efanayo ukuze ziqhathaniswe namanani alindelekile. Ubuqotho besignali nokumatanisa kokuphazamiseka kubalulekile ngesikhathi sokudlulisa ngesivinini esiphezulu ukuze kuvinjelwe ukubonakaliswa nokugcina ukunemba kokulinganisa.

Izinhlobo Zokuhlola Zenziwe

I-semiconductor load board PCB inika amandla izindlela eziningi zokuqinisekisa:

• Ukuhlolwa kokusebenza - Kuqinisekisa ukusebenza kwe-logic kanye nokucaciswa komklamo ngokumelene nokuziphatha okulindelekile.

• Ukuhlolwa kwe-Parametric - Kulinganisa izici zikagesi kufaka phakathi imikhawulo ye-voltage, ukusetshenziswa kwamanje, kanye nemingcele yesikhathi.

• Ukuhlolwa kokushiswa ngaphakathi - Kufaka amadivayisi ekusebenzeni isikhathi eside ngaphansi kwezimo zokucindezeleka ukuze kutholakale ukwehluleka kwasekuqaleni.

• Ukuhlolwa kwe-RF - Kuhlola impendulo yemvamisa kanye nekhwalithi yesiginali yezinhlelo zokusebenza ze-semiconductor ezingenantambo.

I-Signal Path Architecture

Ukulandelana kokuhlola kulandela indlela echaziwe lapho izigaba zokuphuma kwe-ATE zixhuma ekulayisheni imikhondo yebhodi, amasiginali omzila ngezixhumi ezinembayo kuya kothintana nabo basesokhethi. I-DUT ithola izikhuthazo zokuhlola futhi ikhiqize izimpendulo ezibuyela emuva ngengqalasizinda efanayo ukuze kutholwe idatha yezinga le-nanosecond kanye nokuhlaziya.

Ukucatshangelwa Okubalulekile Kwedizayini yama-PCB eBhodi Lomthwalo weSemiconductor

High-Frequency Signal Ubuqotho

Umzila wokungena okulawulwayo ugcina ikhwalithi yesiginali kuyo yonke imigqa yokudlulisela, ngokuvamile edizayinelwe ukuba ibe ngamapheya ahlukene angu-50Ω noma angu-100Ω. Ubude bokulandela umkhondo obufushane bunciphisa ukubambezeleka kokusabalalisa kuyilapho izingqimba ezivikelayo zivimbela ukukhuluma phakathi kwamashaneli aseduze, okubaluleke kakhulu kumadizayini webhodi lomthwalo we-PCB asebenza ngaphezu kuka-1 GHz.

Izidingo Zokulawula Okushisayo

Ukuhlolwa kwe-semiconductor yamandla kukhiqiza ukushisa okukhulu okudinga amasu okusabalalisa asebenzayo . Ama-vias okushisa adlulisa ukushisa kusuka ezindaweni zezingxenye kuya ezingqimbeni zethusi zangaphandle kuyilapho izinto ezisebenzisa ukushisa okuphezulu zisabalalisa izinga lokushisa ngokulinganayo, zivimbela izindawo ezishisayo ezithinta ukunemba kokulinganisa.

Idizayini Yenethiwekhi Yokusabalalisa Amandla

Izindiza zamandla angasebenzi kahle zinciphisa ukwehla kwamandla kagesi ngesikhathi sezikhathi ezihamba phambili zamanje. Ama-Decoupling capacitor abekwe eduze nezindawo zase-DUT ahlinzeka ngamadamu okushaja endawo kuyilapho izizinda zamandla eziningi zidinga ukuhlukaniswa ukuze kuvinjelwe ukuphazamiseka phakathi kwamasekhethi e-analog nedijithali ngesikhathi sokuhlolwa kwebhodi le-PCB le-semiconductor yokulayisha.

Ukukhethwa Kwezinto Ezithuthukile

Izinhlelo zokusebenza ze-RFIC kanye ne-IC zamandla zidinga ama-substrate akhethekile njenge-laminate ekhethekile ephansi yokulahlekelwa noma i-Isola FR408HR. Lezi zinto zinikeza ama-dielectric constant azinzile kuwo wonke amazinga okushisa kanye nama-tangent okulahlekelwa aphansi amasignali aphezulu. Ukwakhiwa kwezingqimba eziningi okunama-vias angaboni futhi afihliwe kuvumela ukujikeleza okuxineneyo ngenkathi kugcinwa ukulawulwa kwe-impedance.

Izinselelo Zokukhiqiza zama-PCB eBhodi Lomthwalo weSemiconductor

Izidingo Zokwenziwa Ngokunembayo

Ukwenziwa kwebhodi lokulayisha i-PCB kudinga ukubekezelelana okuqinile ngobubanzi bokulandelela kanye nesikhala esivame ukufika ku-3 mil noma kakhudlwana. I-Laser drilling kufeza ama-microvias amancane kunobubanzi obungu-6 mils ekuxhumekeni okuminyanisa kakhulu kuyilapho ukubhaliswa kongqimba kuya kwesendlalelo kufanele kuhlale phakathi kwamamitha angu-2 ukuze kuqinisekiswe ukuthi ukuqondana kufanele kuhambe kahle.

Izicaciso Zokuqeda Okuphezulu

I-ENIG noma i-ENEPIG plating imelana nezinkulungwane zemijikelezo yokufaka esuka kumasokhethi wokuhlola ngaphandle kokuwohloka. Lawa maqeda ahlinzeka ngezindawo eziyisicaba ukuze kuthintwane okuthembekile futhi amelane ne-oxidation phakathi nesitoreji, ngezicaciso zokujiya kwegolide ezilinganisa izindleko ngokumelene nezidingo zokuqina zendawo yokukhiqiza.

Izinqubo Zokuhlola Ugesi

Ukulawulwa kwekhwalithi yama-PCB ebhodi lomthwalo we-semiconductor kufaka phakathi ukuqinisekiswa okuphelele:

• Ukuhlolwa kwe-Flying probe - Kuqinisekisa ukuxhumana kuma-prototypes angenazo izinto ezinikezelwe ukuze kulungiswe ngokushesha.

• Ukuhlolwa kwe-in-circuit - Kuhlola ukubekwa kwezingxenye kanye nokuqondiswa kwazo ukuqinisekisa ukunemba kokuhlanganiswa.

• Ukulinganiswa kwe-Impedance - Kuqinisekisa izici zomugqa wokudlulisela zihambisana nemininingwane yomklamo ngaphakathi kokubekezelelana okungu-±10%.

• Ukuqinisekiswa kokuqhubeka - Kuqinisekisa zonke izindlela zesignali kanye nokuxhumeka kwamandla ngaphambi kokufakwa kwesokhethi.

Izicelo Zokuhlolwa kwe-PCB ye-Semiconductor Load Board

I-IC kanye ne-ASIC Production Ukuqinisekiswa

Ukukhiqizwa kwevolumu ephezulu kuncike kumabhodi okulayisha ukuze ahlole amadivayisi ngesivinini esingaphezu kwamayunithi ayi-10,000 ngehora. Ukulungiselelwa kwamasayithi amaningi kuhlola ama-chips amaningi ngesikhathi esisodwa, kukhulisa ukusebenza ngenkathi kugcinwa ukunemba kokulinganisa kwedizayini yedijithali, ye-analog, neyesiginali exubile.

I-RF Module kanye ne-5G Chip Testing

Amaza ama-Millimeter-wave adinga amadizayini akhethekile webhodi lokulayisha lesemiconductor ye-PCB enokuphazamiseka okulawulwa ngokunemba. Izakhiwo zokulinganisa zinxephezela imiphumela ye-parasitic, evumela ukulinganiswa okunembile kwenzuzo, isibalo somsindo, kanye nomugqa kusuka kumabhendi angaphansi kwe-6 GHz kuya ku-40 GHz.

Ukuthembeka kweSemiconductor Yezimoto

Ukuhlolwa kwezinga lokushisa okunwetshiwe kusuka ku -40°C kuya ku-150°C kuqinisekisa ukusebenza kuwo wonke amabanga okusebenza. Amabhodi okulayisha ahlanganisa amagumbi ashisayo namasokhethi akhethekile agcina ingcindezi yokuxhumana ngaphansi kokunwetshwa okushisayo, okuqinisekisa ukuthobelana nezindinganiso zezimoto ze-AEC-Q100.

Idivayisi Yamandla kanye Nohlamvu lwe-IC lwe-Analog

Ukuhlola okuphezulu kwamanje kukala ukumelana nokumelana, ukulahlekelwa kokushintsha, nezici zokushisa. Ukuxhumeka kwe-Kelvin kuqeda ukwehla kwamandla kagesi ezindleleni zamanje kuyilapho umklamo webhodi lomthwalo we-semiconductor we-PCB uhlanganisa izendlalelo zethusi esindayo nemikhondo ebanzi yokusingatha imisinga engaphezu kwama-ampere ayi-100 ngokuphepha.

Ukukhetha Umkhiqizi Olungile wama-PCB ebhodi le-Semiconductor Load

Imibandela Yokuhlola Okubalulekile

Ukukhiqiza amandla okubekezelela athinta ngokuqondile ukunemba kokuhlolwa. Qinisekisa ukuthi umphakeli ugcina izilawuli zenqubo zokuthikamezeka phakathi kuka-±10% nogqinsi lwesendlalelo phakathi kuka-±0.5 mil. Ukuhambisana kwezinto kuwo wonke -55°C kuya ku-125°C izinga lokushisa kuvimbela i-warpage phakathi nemijikelezo yokuhlola engase ibeke engcupheni ukuthintana kwesokhethi.

Isipiliyoni se-ATE Integration

Ubuchwepheshe bokufaka isokhethi buqinisekisa ukuqondanisa okufanele kanye nokusabalalisa kwamandla okuxhumana. Ukujwayelana nezinkundla ezihlukahlukene ze-ATE ezivela ku-Teradyne, Advantest, ne-Cohu kunika amandla ukuhlanganiswa okungenamthungo kuyilapho ukuqinisekiswa kokusebenza kwemvamisa ephezulu ngezilinganiso zepharamitha ye-S kuqinisekisa ubuqotho bomklamo ngaphambi kokuthunyelwa kokukhiqiza.

Isiphetho

Ukuhlolwa kwe-PCB ye-Semiconductor load board kuhlala kubalulekile ekuqinisekisweni kwedivayisi nokulawula ikhwalithi yokukhiqiza. Idizayini efanele ibhalansisa isignali yobuqotho ngokusebenzisa umzila olawulwayo we-impedance, ukuphathwa kwe-thermal ngokubeka ithusi kwamasu, nokuthembeka ngokukhethwa kwezinto ezifanele. Njengoba ubunkimbinkimbi be-semiconductor bukhula ngama-node athuthukile namafrikhwensi aphezulu, amandla ebhodi lokulayisha kufanele aguquke ngokufanele.

I-Highleap Electronics iletha izixazululo zokuhlola eziphelele ze-semiconductor:

• Ukukhiqizwa kwe-PCB okunembe kakhulu – Ukulawula ukubekezelelana kuya kuma-trace angu-3 mil ngokuhambisana kwe-impedance ngaphakathi kuka-±10% ukuze kube nobuqotho besiginali.

• Ubuchwepheshe bezinto ezithuthukisiwe – i-laminate ekhethekile elahlekelwa kancane, i-Isola, kanye ne-laminate evame kakhulu yezinhlelo zokusebenza ze-RF kanye namandla.

• Amakhono e-multilayer - Kufika ezingqimbeni ezingu-30 ezine-vias ezingaboni futhi ezifihliwe zezidingo eziyinkimbinkimbi ze-interface ye-ATE.

• Iphothifoliyo ephelele yebhodi lokuhlola - Amabhodi okulayisha, amabhodi okushisa, namakhadi e-probe asekela izidingo ezahlukahlukene zokuqinisekiswa kwe-semiconductor.

Ukuze uthole ukubonisana ngobuchwepheshe mayelana nezidingo ze-PCB zebhodi lakho lomthwalo we-semiconductor noma ukuxoxa ngezixazululo zokuhlola ezenziwe ngokwezifiso zezinhlelo zakho ze-ATE, xhumana ne-Highleap Electronics ukuze usebenzise ubuchwepheshe bethu bokukhiqiza ibhodi lokuhlola ngokunemba.