Umhlahlandlela Wokuklama Nokukhiqiza we-PCB Wokuhlola I-Semiconductor

Isingeniso

I -PCB yokuhlola i-semiconductor isebenza njengesixhumi esibalulekile phakathi kwamadivayisi e-semiconductor kanye nemishini yokuhlola ezenzakalelayo phakathi nezigaba ezahlukene zokuhlola. Lawa mabhodi wesekethe aphrintiwe akhethekile avumela uxhumano lukagesi, ukudluliselwa kwesignali, kanye nokuphathwa kokushisa kuzo zonke izinqubo zokuqinisekisa idivayisi.

Imakethe ye-PCB yokuhlola i-semiconductor ihlanganisa izigaba ezintathu eziyinhloko: Amabhodi Okushiswa Ngaphakathi ukuze kuhlolwe ukwethembeka ngaphansi kwamazinga okushisa aphakeme, I-Probe Card PCBs yokuhlolwa kweleveli ye-wafer, kanye namabhodi Okulayisha okuhlolwa kwephakheji kokugcina ezinhlelweni ze-ATE. Njengoba ukupakishwa kwe-semiconductor kuthuthukela ekuminyaneni okuphezulu kanye nesivinini esisheshayo, ukusebenza kwebhodi lokuhlola kuthinta ngokuqondile amanani esivuno, ukunemba kokuhlola, kanye nokusebenza kahle kokukhiqiza kukonke.

Izinhlobo zama-PCB okuhlola i-Semiconductor

Amabhodi Okushiswa Ngaphakathi (BIB)

I-Burn-In Boards ingaphansi kwamadivayisi e-semiconductor kuzimo ezisheshisiwe zengcindezi, ngokuvamile esebenza emazingeni okushisa aphakathi kuka-125°C no-150°C isikhathi eside. Lawa mabhodi okuhlola ama-semiconductor kufanele agcine ubuqotho bukagesi ngenkathi emelana nokuhamba ngebhayisikili okushisayo kanye nokucindezeleka komshini. Idizayini ibeka phambili ukufana kokunwetshwa okushisayo ngamadivayisi okuhlola, ukuzinza kwempahla yezinga lokushisa eliphezulu, namandla okuhlola amasayithi amaningi ukuze kukhuliswe ukuphuma ngesikhathi sokuhlolwa kokwethembeka.

I-Probe Card PCBs

Ama-PCB ekhadi le-Probe ahlinzeka ngesisekelo somshini kanye nomzila kagesi wezinaliti zokuhlola ezithinta ama-wafer we-semiconductor ngesikhathi sokuhlolwa. Lawa mabhodi adinga ukuzinza okukhethekile ukuze agcine ukuma okunembe kwe-probe, ngokuvamile ngaphakathi kokubekezelelana kwezinga le-micron. Idizayini igcizelela ukudluliselwa kwesignali elahlekelwa kancane ukuze kuhlolwe imvamisa ephezulu, izindlela ezilawulwayo zokuvimba, kanye nokwanda okuncane kokushisa ukuze kulondolozwe ukunemba kokuxhumana kwe-probe kukho konke ukuhlukahluka kwezinga lokushisa.

Layisha Amabhodi

Isixhumi esibonakalayo samabhodi okulayisha phakathi kwamadivayisi ahlanganisiwe we-semiconductor nezinto zokuhlola ezizenzakalelayo, ukuhumusha izinsiza zokuhlola ze-ATE kuya ekucushweni kwephinikhodi yedivayisi ethile. Lawa ma-PCB okuhlola i-semiconductor aphatha amasiginali edijithali anesivinini esikhulu, izilinganiso ezinembayo ze-analogi, kanye nokulethwa kwamandla ngesikhathi esisodwa. Idizayini igxile ekulondolozweni kobuqotho besignali, amanethiwekhi okusabalalisa amandla anele, ukwethembeka kokumbozwa kwezinkulungwane zemijikelezo yokufaka, nokuphathwa kokushisa kwamadivayisi akhiqiza ukushisa okubalulekile phakathi nokuhlolwa kokusebenza.

Imithetho Yokuklama Ye-PCB Yokuhlola I-Semiconductor

Izidingo Zobuqotho Besiginali

Idizayini ye-PCB yokuhlola i-semiconductor enesivinini esiphezulu idinga imigqa yokudlulisa ye-impedance enokubekezelela ngokuvamile phakathi kuka-±10%. Imizila emibili ehlukene igcina isikhala nokuhlangana kuyo yonke indlela yesignali, kuyilapho imikhondo yonogada noma izindiza eziphansi zinciphisa ukuxoxisana phakathi kwamashaneli aseduze. Amasignali abalulekile adinga ubude obufanayo phakathi kuka-0.5mm kuzinhlelo zokusebenza ezizwelayo nesikhathi, futhi ngoshintsho kufanele kugcinwe ukuqhubeka kokuphazamiseka ngokulinganisa okufanele kwe-anti-pad.

Ukuphathwa Okushisayo Ukubhekelwa

Imiklamo yebhodi eshisiwe ihlanganisa ukulingisa okushisayo ukubikezela izindawo ezishisayo nokuqinisekisa ukuhambisana kokwanda okushisayo namasokhethi. Ukukhethwa kwezinto kuqondise i-coefficient ephansi yokunwetshwa kokushisa, ngokuvamile okungaphansi kuka-16 ppm/°C, ukuze kuncishiswe i-warpage ngesikhathi sokusebenza kwezinga lokushisa eliphezulu. I-Thermal vias ngaphansi kwemishini enamandla amakhulu ithuthukisa ukuncishiswa kokushisa, kuyilapho ukujiya kwethusi kukhuphuka kuye ku-2-3 oz ezendlalelo zokusabalalisa amandla kuthuthukisa umthamo wamanje wokubamba kanye nokusebenza okushisayo.

Imibandela Yokukhetha Okubalulekile

Amabhodi okuhlola e-semiconductor asebenzisa ama-laminate asebenza kahle kakhulu anamazinga okushisa okushintsha kwengilazi angaphezu kuka-170°C ukuze kusetshenziswe ukusha. Izinto ezilahlekelwa kancane njenge-Megtron, i-laminate ekhethekile elahlekelwa kancane, noma ama-substrate e-Isola asekela ukudluliswa kwesignali okuvama kakhulu ngezinto zokusaphazeka ezingaphansi kuka-0.01 kuma-frequency e-GHz. Ukulungiswa kwe-layer stackup kulinganisela izidingo zesendlalelo sesignali, ukusatshalaliswa kwendiza yamandla, kanye nemikhawulo yobukhulu bebhodi iyonke ngenkathi kugcinwa izilinganiso zesici ezikhiqizwayo.

Ukucatshangelwa Kokukhiqiza Kwe-Semiconductor Test PCBs

Izidingo Zokucubungula Ngokunemba

Ukukhiqizwa kwe-PCB yokuhlola i-semiconductor kudinga ukubekezelelana okuqinile kunamabhodi ajwayelekile okuhweba. Izikhungo ezithuthukisiwe zisebenzisa izithombe eziqondile ze-laser ukwenza iphethini yomugqa ocolile kanye nencazelo yesici enembile. Amakhono okukhiqiza abalulekile afaka:

• Ukucaciswa komkhondo okuncane - Ububanzi bomugqa nesikhala esifika ku-75 μm sisekela izidingo zomzila eziminyana kakhulu.
• Ngokunemba kokumba - Ukunemba kokuma phakathi kuka-±50 μm kuqinisekisa ukuxhumana okuthembekile kuzitaki zezendlalelo eziningi.
• Ukulawula ukubhaliswa kwesendlalelo - Ukubekezelelana kokuqondanisa phakathi kuka-75 μm kugcinwa ngobuqotho kuyo yonke imikhakha engu-12+ yokwakha.

Ukukhethwa Kokuqeda Ubuso

Ukukhethwa kokuphela kobuso kulinganisela ukushintshwa kwe-soldering, ukumelana nokuxhumana, kanye nezidingo zokuqina kwezicelo zokuhlola ze-semiconductor. I-Electroless Nickel Immersion Gold inikeza ukuthamba okuhle kakhulu kwezingxenye ze-fine-pitch kanye nemijikelezo eminingi yokuphinda igeleze. I-Organic Solderability Preservative inikeza izinzuzo zezindleko zokuhlanganiswa okulula, kuyilapho i-hard gold plating eminweni yokuxhumana iqinisekisa ukumelana nokuguguleka kwama-load board sockets, ngokuvamile icacisa ama-microinches angu-30-50 egolide phezu kwe-nickel underplate.

Izindlela Zokulawula Ikhwalithi

Amaphrothokholi okuhlola abanzi aqinisekisa ikhwalithi ye-PCB yokuhlolwa kwe-semiconductor ngaphambi kokuthunyelwa. Ukuhlola okuzenzakalelayo kwe-optical kuqinisekisa i-trace geometry, ukubhaliswa kwemaski ye-solder, kanye nekhwalithi yokuqedwa kwendawo. Ukuhlolwa kwe-X-ray kuhlola kwangaphakathi ngokusebenzisa ukwakheka nokuqondanisa kwesendlalelo kumabhodi ayinkimbinkimbi anezendlalelo eziningi, kuyilapho ukuhlolwa kophenyo olundizayo kuqinisekisa ukuxhunywa kukagesi ngaphandle kokulungisa ngokwezifiso. Izilinganiso zokuhlaziya inethiwekhi ziqinisekisa ukulawulwa kokuphazamiseka ezindleleni zesignali ezibalulekile, futhi ukufaneleka kokuhamba ngebhayisikili elishisayo kulingisa izimo zokushiswa ukuze kuqinisekiswe ukwethembeka kwesakhiwo.

Izinselelo Ezivamile Nezixazululo Kumklamo We-PCB Ye-Semiconductor Test

Ukulawula Ukucindezeleka Okushisayo

Ukusebenza kwezinga lokushisa eliphezulu kubangela ukwanda okuhlukile phakathi kwezinto zebhodi, izingxenye, kanye nokuhlanganiswa kwezisekelo, okuholela ekuqhekekeni nasekucindezelekeni komshini. Izixazululo zifaka phakathi ukwakheka kwe-stackup okulinganayo, ukukhethwa kwezinto ezinama-coefficients okwanda kokushisa afanayo, kanye nokuqina komshini ngokusebenzisa ama-cores amakhulu noma ama-stiffeners ensimbi. Ukulungiswa kobukhulu bebhodi kulinganisela izidingo zokuqina ngokumelene nokucatshangelwa kobunzima bokushisa kokujikeleza kwezinga lokushisa okusheshayo ekusetshenzisweni kokushiswa.

Leli khasi lingelehadiwe ye-PCB yokuhlola i-semiconductor, izindawo zesokhethi, izinto zokwakha, kanye namanothi okukhiqiza. Ukuze uthole izindlela zokuhlola ezijwayelekile, sebenzisa umhlahlandlela wokuhlola ibhodi lesifunda ; ukuze uthole ukuqhubeka, ukuhlukaniswa, kanye nokuqinisekiswa kwebhodi elingenalutho, faka izidingo zokuhlola ugesi ze-PCB.

Ukuthuthukiswa Kwesiginali Yobuqotho

Ukudluliswa kwesignali yesivinini esikhulu kubhekene nokulahlekelwa okuvela ekumunceni kwe-dielectric, umphumela wesikhumba, nokunqanyulwa kokuphazamiseka ekushintsheni kwengxenye. Amasu okunciphisa idizayini ama-PCB okuhlolwa kwe-semiconductor afaka:

• Izindlela ezimfishane zomzila - Ubude bokulandela umkhondo obuncishisiwe bunciphisa ukuncishiswa kwesignali kanye nokutsheka kwesikhathi.
• Ukuqinisekiswa kokulawulwa kwe-impedance - Ukulingiswa kwe-electromagnetic kuqinisekisa ukusebenza komugqa wokudlulisela ngaphambi kokwenziwa.
• Ngezindlela zokuthuthukisa - Ukubhola emuva kususa ama-stub resonances ehlisa ikhwalithi yesiginali yamafrikhwensi aphezulu.
• Ukuqaliswa kokusayina okuhlukile - Yehlisa ukuzwela komsindo wemodi evamile kuwo wonke amabanga amade omzila.

I-Socket Interface Reliability

Imihlangano yesokhethi yebhodi yokulayisha ihlangabezana nokuguga kokusebenza, ukuwohloka kokumelana nokuxhumana nabantu, kanye nezinkinga zokuqondanisa phakathi kwezinkulungwane zemijikelezo yokuhlola. Izixazululo zihlanganisa abathengisi besokhethi ekuqaleni kwenqubo yokuklama futhi banikeze ukujiya okwanele kwebhodi ngaphansi kwezindawo zokukhweza isokhethi.

Izici zokuqondanisa okunembayo ziqinisekisa ukuma kwedivayisi okuphindaphindekayo kuyilapho ihadiwe yokuthwebula ivikela amadivayisi phakathi nokuhlolwa. Amaphrothokholi okugcinwa njalo okuhlanza othintana naye kanye nokushintshanisa anweba impilo yokusebenza yesokhethi ezindaweni zokukhiqiza.

Isiphetho

Idizayini nokukhiqiza kwe-PCB yokuhlola i-semiconductor kudinga ubungcweti obukhethekile obuhlanganisa ukwakheka kwesekethe yemvamisa ephezulu, ukuhlaziya okushisayo, kanye nezinqubo zokwenziwa ngokunemba. Impumelelo incike ekuqondeni izidingo ezihlukile zamabhodi ashiswayo, ama-PCB ekhadi le-probe, namabhodi okulayisha kuyilapho kusetshenziswa imithetho yokuklama efanele kanye nezilawuli zokukhiqiza zezixazululo ezithembekile zokuhlola i-semiconductor.

I-Highleap Electronics iletha amakhono aphelele we-PCB wokuhlolwa kwe-semiconductor:

• Usekelo lobunjiniyela - Ukubonisana kwedizayini yobuqotho besignali, ukuphathwa kwe-thermal, kanye nokwenza kahle kokukhetha izinto.
• Ukukhiqiza okunembayo kwe-PCB - Izinqubo zokwenziwa ezithuthukisiwe zihlangabezana nokubekezelelana okuqinile kobubanzi bomugqa, ngokubhalisa, nokulawulwa kokuvimbela.
• Ukuqinisekisa ikhwalithi - Gcwalisa izinqubo zokuhlola ezihlanganisa i-AOI, i-X-ray, ukuhlolwa kukagesi, kanye neziqu ezishisayo.
• Izinsizakalo ze-PCB Assembly - Ukubekwa kwengxenye, ukuhlanganiswa kwesokhethi, nokuhlolwa okusebenzayo kwezixazululo ze-turnkey.

Xhumana ne-Highleap Electronics ukuze uxoxe ngezidingo zakho ze-PCB zokuhlola i-semiconductor futhi uthole ukuthi ubuchwepheshe bethu busekela kanjani izinhlelo zokusebenza zokuhlola ezidinga amandla.