Ukukhiqizwa kwe-PCB Yezingqimba Eziyi-12: Ukuhlanganiswa, Amandla kanye Nezindleko

I-Highleap Electronics ikhiqiza ama-PCB ayizingqimba ezingu-12 kusukela kuma-prototype lots ngokukhiqiza, emgqeni ofanayo oqinile owakha amabhodi afinyelela ezingqimbeni ezingu-60. Onjiniyela bavame ukuthuthela ezingqimbeni ezingu-12 lapho i-stackup enezingqimba ezingu-10 iphela egumbini lokuqondisa noma izindiza zokubhekisela zamabhasi anesivinini esikhulu, ama-BGA aminyene noma izizinda zamandla ezihlukanisiwe. Izingqimba eziyishumi nambili zengeza lelo gumbi ngenkathi zigcina ukwakheka okujwayelekile kwembobo, okuvame ukuba lula kunokuphoqelela umklamo ofanayo ezingqimbeni ezimbalwa ngama-microvia ahlanganisiwe.

Leli khasi lihlanganisa ama-stackup esiwakhayo kaningi, ikhono lethu lokukhiqiza elishicilelwe, ukukhetha kwezinto ezibonakalayo, izilawuli ezibalulekile kulesi sibalo sesendlalelo, nokuthi yini ethinta intengo. Uma usanquma ukuthi umkhiqizo wakho udinga izendlalelo eziyishumi nambili, bheka ukuthi kusetshenziswa amabhodi ezendlalelo eziyi-12 kuphi . Izimpendulo ezimfushane zemibuzo evamile yabathengi ziqoqwe ku- 12 layer PCB FAQ.

Izinketho Zokunqwabelana Kwe-PCB Ezingqimba Eziyi-12 ku-1.6 mm nangaphezulu

Ama-PCB amaningi anezingqimba ezingu-12 asebenzisa enye yezilungiselelo ezimbili: izendlalelo eziyisithupha zesignali ezinezingqimba eziyisithupha, noma izendlalelo eziyisishiyagalombili zesignali ezinezingqimba ezine. Inketho ihweba ngobuqotho besignali ngokumelene nesikhala somzila, futhi kufanele ilungiswe ngaphambi kokuqala kokuhlelwa ngoba ibeka yonke i-impedance yokubala ebhodini.

Inguqulo yezindiza eziyisithupha inikeza ungqimba ngalunye lwesignali indiza yokubhekisela eseduze, okwenza kube lula ukubamba i-impedance futhi igcine izindlela zokubuya zimfushane. Ifanela amabhodi anezixhumi eziningi zesivinini esikhulu. Inguqulo yezindiza ezine inezela izendlalelo ezimbili zokuqondisa ngokuhlanganisa izendlalelo zesignali phakathi kwezindiza. Ukuqondisa kwe-orthogonal kunganciphisa ukuxhumanisa okubanzi, kodwa ukuhlukaniswa okwanele kwe-dielectric, izindiza zokubhekisela kanye nokulingisa isiteshi kusadingeka. Lezi yizabelo zomsebenzi wezendlalelo, hhayi ama-stackup okukhiqiza akhishwe. Ubukhulu be-dielectric, izinsimbi zethusi kanye nokusatshalaliswa kwethusi kumele kulinganiswe mayelana nendiza ephakathi; amalebula wodwa awasunguli ukulingana kwemishini. Isibonelo sezibonakaliso eziyisishiyagalombili sihlanganisa izendlalelo zezibonakaliso ezilandelanayo ezidinga isikhala esiqaphile sendiza yokubhekisela kanye nokuhlaziywa kwe-crosstalk.

Imithetho ejwayelekile ngemuva kwalezi zinketho ikumhlahlandlela wethu wokuklama i-PCB stackup . Uma uqhathanisa ukubalwa kwezingqimba, ukuhlelwa kwe-stackup yezingqimba eziyi-10 kanye nekhasi lethu kumabhodi anezingqimba eziyi-16 kubonisa ukuthi yini eshintsha isinyathelo esisodwa phansi naphezulu.

Zingaki izendlalelo zesiginali i-PCB enezendlalelo ezingu-12 enazo?

Ngokuvamile eziyisithupha noma eziyisishiyagalombili. Izendlalelo eziyisithupha zesignali ezinezindiza eziyisithupha ziyindlela ephephile yobuqotho besignali. Izendlalelo eziyisishiyagalombili zesignali ezinezindiza ezine zinikeza indawo eyengeziwe yomzila kodwa zibeka izendlalelo ezimbili zesignali phakathi kwezindiza ezimbili. Umklamo onezendlalelo eziyishumi zesignali kanye nezindiza ezimbili kuphela ungenzeka ephepheni, kodwa awuvami ukubamba izinhloso ze-impedance noma ze-EMI futhi ngokuvamile kusho ukuthi ibhodi kufanele liye ekubalweni kwezingqimba okuphezulu.

Ingabe i-PCB enezingqimba ezingu-12 ihlala iwubukhulu obungu-1.6 mm?

Inombolo engu-1.6 mm ubukhulu obuqediwe obuvame kakhulu ngoba bufanela izixhumi ezijwayelekile kanye neziqondiso zamakhadi, kodwa amabhodi anezingqimba ezingu-12 nawo akhiwe ngo-2.0 mm, 2.4 mm noma obukhulu uma ephethe izixhumi zethusi ezisindayo noma ezifanelana nokucindezela. Ububanzi obungu-0.2 kuya ku-8 mm ekhasini lethu lamandla buhlanganisa iphothifoliyo ye-PCB eqinile iyonke; akuyona ububanzi bobukhulu obuqinisekisiwe bokwakhiwa kwezingqimba ezingu-12. Ibhodi elikhudlwana liphakamisa isilinganiso sesici sembobo encane kakhulu, ngakho-ke usayizi wokubhoboza kanye nobukhulu kufanele kuhlolwe ndawonye.

Amandla Okukhiqiza e-PCB Ezingqimba Eziyi-12

Izendlalelo eziyishumi nambili zimi kahle ngaphakathi komugqa wethu we-PCB oqinile, olinganiselwe ezingqimbeni ezingama-60. Izibalo ezingezansi zithathwe ekhonweni lethu le-PCB eliqinile elishicilelwe. Ziyimingcele yenqubo, ngakho-ke ibhodi elilodwa elihlanganisa eziningana zazo kufanele libuyekezwe ngaphambi kokuba licashunwe.

Ebhodini elinezingqimba ezingu-12, imikhawulo iyasebenzisana. Ukusebenzisa ububanzi bembobo ebholiwe, u-1.6 / 0.15 cishe u-10.7:1, kuyilapho u-3.2 / 0.15 cishe u-21.3:1 futhi udlula umkhawulo oshicilelwe ongu-20:1. I-drill encane noma isilinganiso esiphezulu akufanele kucatshangelwe ukuthi kungenzeka ndawonye ngaphandle kokubuyekezwa kwe-plating. Ukulandelela okuncane kanye nesikhala kulula ukubamba kuthusi oluncane olungaphakathi kunothusi olusindayo. Uhlu oluphelele lokubekezelelana lusetafuleni lethu lamandla e-PCB aqinile.

Ingabe ibhodi elinezingqimba ezingu-12 lingasebenzisa ama-via angaboniwe nafihliwe?

Yebo. Ama-vias ayizimpumputhe axhuma ungqimba lwangaphandle ezingqimbeni zangaphakathi, ama-vias agqitshiwe axhuma izingqimba zangaphakathi kuphela, kanti ama-microvia e-laser ehla afike ku-0.075 mm. Ukulandelana kwe-lamination kanye nokubhoboza okudingekayo kuncike ekwakhiweni kwe-via; ama-span amaningana angabelana ngesigaba senqubo. Ukwakhiwa okulandelanayo kunganezela izindleko kanye nesikhathi sokuhola. Imiklamo eminingi yezingqimba eziyi-12 ihamba njengokwakhiwa okucacile okudlula emgodini. Sebenzisa ukwakhiwa okungaboni nokugqitshiwe lapho indawo yebhodi noma ye-BGA idinga khona.

Izinto Zokwenza Amabhodi Esekethe Anezingqimba Eziyi-12

Ukukhetha izinto zebhodi elinezingqimba ezingu-12 kuncike ezintweni ezimbili: ukushisa ibhodi elikubonayo ngesikhathi sokuncibilikisa kanye nokuhlanganiswa okungenalo i-lead, kanye nokulahlekelwa yisignali okukwazi ukubekezelela ama-interface akho asheshayo. I-Laminate iyisabelo esikhulu sezindleko zebhodi, ngakho-ke kufanelekile ukukhetha izinto kulezi zimfuneko ezimbili esikhundleni sokushintsha okubiza kakhulu.

• Phezulu Tg FR-4 yindawo evamile yokuqala amabhodi anezingqimba ezingu-12. Ukuze uthole ukuthembeka kokugeleza kabusha, hlola i-Tg kanye ne-Z-axis CTE, izinga lokushisa lokubola (Td), izilinganiso zesikhathi sokuhlukanisa, ukuphathwa komswakama kanye nephrofayili yokuhlanganisa; i-Tg yodwa ayiqinisekisi ukuthembeka kwemigodi ehlanganisiwe. Bheka amanothi ethu ku- high Tg laminates.
• Ama-laminate alahleka kancane futhi alahleka kancane kakhulu zisetshenziswa lapho iziteshi ezinde zesivinini esikhulu zingalahlekelwa isignali eningi kakhulu ku-FR-4 ejwayelekile. Izinketho kanye nokushintshana kuhlanganisiwe izinto zokwakha ama-PCB anenani eliphezulu.
• Ama-stackup e-hybrid faka i-RF laminate ezingqimbeni ezidingayo kanye ne-FR-4 kwenye indawo, okugcina izindleko ziphansi kumabhodi ezignali ezixubile. Sakha Ama-stackup e-hybrid kaRogers no-FR-4 uma umklamo udinga wona.

Iyiphi i-Tg okufanele isetshenziswe yi-PCB enezingqimba ezingu-12?

Ibanga le-high-Tg FR-4 elihambisanayo elingenalo i-lead liyindawo evamile yokuqala, kodwa inani lezingqimba lodwa alibeki i-Tg edingekayo. Buyekeza i-Tg, i-Td, i-Z-axis CTE kanye nokusebenza kwe-delamination ngokumelene nobukhulu bebhodi, nge-geometry, imijikelezo yokugeleza kabusha kanye nokushisa kwesevisi. Chaza iphrofayili yokuhlanganisa kanye nokusebenza kabusha uma ucela i-stackup.

Indlela Esilawula Ngayo Ukubhalisa, Ukuvinjelwa kanye Nokuthembeka Ezingqimbeni Eziyi-12

Iningi lamaphutha ezingqimba ezingu-12 avela emithonjeni emithathu: izingqimba zangaphakathi ezingaqondile, ukukhukhuleka kwe-impedance kanye nezimbobo ezibuthaka ezifakwe amapulangwe. Izilawuli zethu zenqubo zihlose ngayinye yalezi.

Izindleko ze-PCB Zezingqimba Eziyi-12: Yini Eshukumisa Intengo

Intengo ye-PCB enezingqimba ezingu-12 incike kakhulu endleleni eyakhiwe ngayo kunasekubalweni kwezingqimba. Amabhodi amabili anezingqimba ezingu-12 anobukhulu obufanayo angahluka izikhathi eziningana ngentengo, kuye ngokuthi umdwebo udingani.

• Lamination cycles: ukwakhiwa kwembobo edlulayo kucindezelwa kanye. Ukufiphazwa nokugqitshwa ngezakhiwo kungadinga izigaba ezengeziwe zenqubo; inani lomjikelezo lincike ochungechungeni lokwakhiwa oluphelele, hhayi nje inani le-via spans.
• Material: Ama-laminate aphansi kanye nama-RF abiza kakhulu kune-Tg FR-4 ephezulu, kanye nemikhawulo ye-hybrid stackup ebiza izingqimba ezizidingayo.
• Izici zokushayela kanye nokusetshenziswa: ukubhola okuncane, izilinganiso eziphezulu zobukhulu, ukubhola ngemuva, kanye nokugcwaliswa noma ukuvalwa nge-in-pad ngayinye yezinyathelo zenqubo yokwengeza.
• Ububanzi bokuvinjelwa kanye nokuhlolwa: Izakhiwo eziningi ezilawulwayo ezivimbela ukuvimba zisho ukwakheka kwekhuphoni kanye nokulinganisa okwengeziwe.
• Ukuqeda, ukusetshenziswa kwephaneli kanye nobuningi: I-ENEPIG negolide eliqinile kubiza kakhulu kune-ENIG. Ukuthi uhlaka lugcwalisa kahle kangakanani iphaneli yokukhiqiza, kanye nenani le-oda, kusetha izindleko ngeyunithi ngayinye.

Ingabe i-PCB enezingqimba ezingu-12 ibiza kakhulu kune-PCB enezingqimba ezingu-10?

Ngokuvamile hhayi kakhulu, uma kokubili kwakhiwe ngemigodi edlulayo. Ukusuka ezingqimbeni eziyi-10 kuya kweziyi-12 kunezela ukucutshungulwa kwethusi kanye ne-dielectric okunephethini; ukuhlelwa okuyinhloko, ukubhoboza kanye nokulandelana kwe-lamination kuncike ekwakhiweni. Ukwenyuka okukhulu kwezindleko kuvela ekufakweni kwe-lamination okulandelanayo kanye nezinto ezikhethekile. Ngakho-ke, ibhodi elinezingqimba eziyi-12 elidlulayo lingabiza ngaphansi kwebhodi elinezingqimba eziyi-10 elidinga ama-vias angaboni ukuze lilingane nomzila ofanayo.

Okufanele Ukuthumele Ukuze Uthole Isilinganiso Se-PCB Esinezingqimba Eziyi-12

Iphakheji yedatha ephelele isekela ukucaphuna okusheshayo futhi inciphisa imijikelezo yokucacisa. I-Highleap ikhangisa isevisi yokucaphuna yamahora amabili; ama-stackup ayinkimbinkimbi, izinto ezikhethekile noma idatha engaphelele kungadinga ukubuyekezwa okwengeziwe kobunjiniyela ngaphambi kokuba intengo nokulethwa kuqinisekiswe. Izinto ezingekho, ngokuvamile ithebula lokuvinjelwa noma i-stackup, ziyimbangela evamile yokucaphuna okulibazisekile.

• Idatha yokukhiqiza: I-Gerber noma i-ODB++, bhoboza amafayela anethebula lesakhiwo elisebenzisa i-via, kanye nohlaka lwebhodi.
• Isitaki umdwebo wakho we-stackup, noma ukujiya okuqediwe kanye nokuhlelwa kwezingqimba ukuze sikwazi ukuphakamisa owodwa.
• Ithebula le-Impedance: amanani aqondiwe, ukubekezelelana, ububanzi bokulandelela kanye nezendlalelo zokubhekisela zesakhiwo ngasinye esilawulwayo.
• Impahla nokuqedwa: i-laminate noma i-Tg edingekayo kanye nesigaba sokulahlekelwa, izisindo zethusi kanye nokuqedwa kobuso.
• Ukwamukela: Ikilasi le-IPC, noma yikuphi ukubhoboza ngemuva noma isidingo se-via-in-pad, kanye nobuningi nezinsuku ze-prototype kanye nokukhiqizwa.

Uma isakhiwo singakaqandisi, sithumele noma kunjalo. Ukubuyekezwa kwe-DFM kulesi sigaba kungabona i-stackup engalingani noma indandatho ehlanganisiwe eqinile kakhulu ngenkathi kusashibhile ukuyilungisa.

Ingabe iHighleap ingahlanganisa amabhodi anezingqimba ezingu-12?

Yebo. I-SMT kanye nokuhlanganiswa kwembobo edlulayo, ukutholakala kwezingxenye kanye nokuhlolwa kungafakwa. I-Package pitch, usayizi wezingxenye kanye ne-AOI/X-ray scope kuqinisekiswa ngokumelene nedatha ye-BOM kanye nokuhlanganiswa. Ngokuhlanganiswa kwe -turnkey , umhlinzeki oyedwa ungumnikazi webhodi elingenalutho, ukutholakala kwezingxenye kanye nokuhlanganiswa, ngakho-ke inkinga yenzuzo ilandelwa imbangela yayo ngaphandle kokuhamba phakathi kwabathengisi.