Umkhiqizi we-PCB Othuthukisiwe wama-PCB Ayinkimbinkimbi Nawezinqubo Ezikhethekile
Umfanekiso 1. Ukwenziwa kwe-PCB Okuthuthukisiwe Nokuyinkimbinkimbi Kakhulu
I-Highleap Electronics ikhiqiza ama-PCB aqinile, aqinile, aqinile, asheshayo, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile, aqinile kanye naqinile, kanye nokuhlanganiswa kwe-PCB okutholakala ngemuva kokwenziwa. Amakhono ethu okukhiqiza athuthukile amboza ama-via angaboni futhi agqitshwe, ama-microvia ahlanganisiwe nahlanganisiwe, i-resin nethusi ngokugcwalisa, i-VIPPO, ukubhoboza ngemuva, iminwe yegolide emfushane, i-electroplating ekhethiwe, izikhala ezijulile nezimboziwe ezilawulwayo, i-edge metallization, ama-laminate akhethekile aphansi, ama-stackups ahlanganisiwe, izinhlamvu zethusi, ukuqedwa okukhethekile kanye nezakhiwo ze-impedance ezilawulwa ngokuqinile.
Kumabhodi ahlanganisa izidingo eziningana ezithuthukisiwe, amaqembu e-CAM kanye nobunjiniyela bezinqubo ze-Highleap achaza umzila owodwa wokukhiqiza ohambisanayo ngaphambi kokukhishwa. Uchungechunge lwe-lamination, ukubhoboza, ukugcwalisa, ukufakwa kwethusi, i-selective plating, ukulungiswa kwezinto, i-solder mask, ukuqeda ubuso, ukuhlolwa kanye nomshini wokugcina kuhlelwe ngokuhambisana nezidingo ze-PCB eziqediwe ukuze inqubo eyodwa ekhethekile ingadali ukungqubuzana okungalawuleki nomunye.
Kusukela ebhodini elivamile elinezingqimba eziningi elinesici esisodwa esikhethekile kuya ekwakhiweni okunobuningi obukhulu okuhlanganisa i-HDI, ama-vias agcwele, i-backdrill, iminwe emide eqinile yegolide, izinto ezikhethekile ze-RF, imigodi kanye nokulawula ukuvimba okuqinile, i-Highleap ibukeza ukwakhiwa okuphelele njengomsebenzi owodwa wokukhiqiza. Umgomo ukulondoloza umklamo kagesi nowemishini okhishwe ngenkathi uwuguqula ube idatha yokukhiqiza, izinhlelo zomshini, amagatsha okucubungula kanye nezindawo zokuhlola ezingalawulwa phansi efektri.
I-Matrix Yokukhiqiza ye-PCB Ethuthukisiwe
Ukwenziwa kwe-PCB okuthuthukisiwe kuhlanganisa okungaphezu kokubalwa kwezingqimba, ububanzi obuncane bomugqa kanye nobubanzi bokubhoboza. Imindeni yamakhono alandelayo yizakhiwo nezinqubo ezingashintsha kakhulu indlela yokukhiqiza, ukulandelana kwemishini, izilawuli zenqubo noma uhlelo lokuhlola.
| Umndeni wamakhono | Izakhiwo nezinqubo | Umthelela wokukhiqiza |
|---|---|---|
| Kuthuthukisiwe ngezakhiwo | Ama-vias angaboni, ama-vias afihliwe, ama-vias angaboni ngomshini, ama-microvia e-laser, ama-microvia ahlanganisiwe/ahlanganisiwe/aweqiwe, ukuxhumana kwanoma yiluphi ungqimba, nge-via-in-pad. | Ishintsha incazelo yokwakha okungaphansi, imijikelezo ye-lamination, indlela yokubhoboza, isu lokwenza insimbi kanye nokubhalisa. |
| Ngokugcwalisa nokufaka iplagi | Ipulaki ye-resin, ukugcwalisa okungaholeli ekuqhumeni, ukugcwalisa ngethusi, ama-via agcwalisiwe futhi avaliwe, i-VIPPO, ukugcwalisa okufihliwe, ukugcwalisa nge-microvia, ukuxhuma nge-solder-mask. | Ingeza ukugcwalisa, ukupholisa, ukuhlelwa kabusha kanye/noma ukufakwa kwesivalo ezigabeni ezithile zokukhiqiza. |
| I-HDI kanye nokwakheka okulandelanayo | 1+N+1, 2+N+2, 3+N+3, i-HDI yanoma yiluphi ungqimba, imijikelezo eminingi yokwakha, ehlanganiswe ngezakhiwo. | Iphinda i-lamination, i-laser drilling, i-metallization, ngokugcwalisa kanye nokuthwebula izithombe kunokuthembela ku-lamination yokugcina enezingqimba eziningi. |
| I-SLP / mSAP | I-PCB efana ne-substrate, ukucubungula okuyingxenye okungeziwe okuguquliwe, ama-conductor amahle kakhulu kanye ne-BGA escape enciphile. | Isebenzisa ithusi elincane kanye nokuhlanganiswa komqhubi okhethiwe esikhundleni sokucubungula okuvamile kwethusi elijiyile. |
| Ukubhoboza okukhethekile | I-Backdrill, i-backdrill ejulile kakhulu, i-backdrill ephezulu/ephansi, i-controlled-depth drill, i-secondary drill, imigodi efakwa ngokucindezela, i-countersink kanye ne-counterbore. | Ingeza izinhlelo ze-CNC ezizinikele kanye nokulawula i-Z-axis/imbobo eqediwe. |
| Izikhala, imifantu kanye nemigodi | Izikhala ezimboziwe, izikhala ezingaboni, izikhala ezingaboni ezilawulwayo, imifantu yezinyathelo, amaphakethe, izikhala, izikhala ezimboziwe kanye nezakhiwo zokujula ezincishisiwe kancane. | Umshini wokugaya kungase kudingeke wenzeke ngaphambi kokwenziwa kwensimbi, ngemva kokufakwa kweplati, noma ezigabeni ezingaphezu kwesisodwa. |
| Amaphrofayela nokukhishwa kwephaneli | Izinhlaka eziyinkimbinkimbi, ukuqondisa ngokunemba, ukuqondisa nge-V-score +, amathebhu, i-bevel/chamfer, imiphetho yezinyathelo kanye nezakhiwo ezikhethekile zokuqhekeka. | Ishintsha ukwesekwa kwephaneli, indlela yamathuluzi kanye nendawo lapho uhlaka lokugcina lungakhululwa khona. |
| Iminwe yegolide | Iminwe emide emfushane, eqondile, ehlukaniswe, enezinhlangothi ezimbili kanye nobude obuhlukene; igolide eliqinile; igolide elikhethiwe; i-bevel/chamfer. | Kudinga i-electrolytic plating ekhethiwe, izindlela zamanje zesikhashana, ukufihla kanye nomshini wokugcina olawulwayo. |
| Ukwenziwa kwensimbi komphetho | Ukufakwa komngcele ogcwele/ongaphelele/okhethayo, udonga oluseceleni olufakwe ipulasitiki, unqenqema lomhlabathi/wesihlangu kanye nokuxhumana komphetho okukhethekile. | Imiphetho ekhethiwe kumele ihlanganyele ekwenzeni insimbi ngenkathi ibhodi lihlala lisekelwe kuphaneli. |
| Ama-Castellations nama-half hole afakwe | Izimbobo ezigobile, izimbobo zenyanga eyingxenye, izimbobo zenyanga ezingxenyeni ezibekwe ngepulasitiki kanye nezimbobo ze-module-edge. | Isebenzisa i-drill → ipuleti → ukulandelana komzila okunokuvezwa okulawulwayo kwebhareli kanye nekhwalithi yomphetho. |
| Ukufakwa kwethusi okukhethekile | Ithusi elikhethekile elinembobo eyengeziwe, ukunqwabelana kwethusi lendawo, i-copper plating ejiyile, ngokugcwaliswa kwethusi kanye nemizila ye-plating eqondene nephrojekthi. | Ilawula ukujiya kwethusi endaweni esikhundleni sokusebenzisa ukwakheka kwethusi okufanayo phezu kwendawo yonke. |
| Ukuqedwa kwendawo okuxubile | I-ENIG + igolide eliqinile, i-ENEPIG + igolide eliqinile, i-HASL + igolide eliqinile, igolide elikhethiwe kanye nezindawo eziningi zokuqeda. | Kudinga ukuvala/ukuvikela kwendawo kanye ne-oda elilawulwayo lokuqeda okufakwe ngogesi kanye namakhemikhali. |
| Imaski ekhethekile yokusonga kanye nokuphrinta okusebenzayo | Imaski ehlubukayo, amadamu amancane anemaski e-solder, izikhala zemaski ezikhethiwe, ngokusebenzisa i-plugging/tenting, i-carbon inkino kanye nezindawo ezikhethekile zokuvikela. | Ingeza imisebenzi yobuciko ezinikele, ukuphrinta/ukugqoka, ukulungisa kanye nokuhlola. |
| Izinto ze-RF kanye ne-microwave | I-Rogers, i-PTFE/RT-duroid, i-Taconic, i-Arlon, i-PTFE egcwele i-ceramic kanye nezinye i-RF laminates eziphansi. | Ingashintsha ukubhoboza, ukusebenza kwe-plasma/surface, i-lamination, i-copper foil kanye nokulawula kwe-dielectric. |
| Izinto zedijithali ezisheshayo | I-Megtron, i-Isola/FR408HR-class, i-FR-4 enesivinini esikhulu, ama-laminate anokulahleka okuphansi kanye nama-laminate anokulahleka okuphansi kakhulu. | Kudinga ukwakhiwa kwe-dielectric okulawulwayo, ukukhethwa kobulukhuni bethusi kanye ne-lamination ezinzile esheshayo. |
| Izinto ezihlanganisiwe ezihlanganisiwe | I-Rogers + FR-4, i-PTFE + FR-4, i-RF + yedijithali, i-Megtron + Isola kanye nokwakhiwa kwe-dielectric okuxubile. | Izinto ezingafani kumele ziboshwe futhi zilawulwe ngokulingana esitokisini esisodwa esinezingqimba eziningi. |
| Impedance elawulwayo | Izakhiwo ezinesiphetho esisodwa, ezihlukile, ezibekezelelana ngokuqinile, amakhuphoni e-dielectric alawulwayo kanye ne-TDR. | Izinto ezixhumanisayo, i-dielectric ecindezelwe, ukujiya kwethusi, i-geometry yokulandelela umkhiqizo kanye nokuqinisekiswa kukagesi. |
| Ithusi elinzima / elixubile | Ithusi elinzima, ithusi elijiyile, izisindo zethusi ezixubile, ithusi elinzima + umugqa omncane kanye nezidingo zethusi elijiyile lendawo. | Ishintsha isinxephezelo se-etch, isikhala, isidingo se-resin kanye nebhalansi yethusi. |
| Izakhiwo ezishisayo ezifakiwe | Uhlamvu lwemali yethusi, ukufakwa kwethusi, i-slug yethusi ehlanganisiwe, i-heat spreader kanye ne-thermal ngokusebenzisa izakhiwo. | Ingeza imishini yokufakelwa kwe-cavity/inlay, ukufakwa kwensimbi, ukugcwaliswa kwe-resin, i-lamination kanye nokulawulwa kwe-planarity. |
| I-Metal-core PCB | Izakhiwo ze-aluminium-core, ithusi-core kanye ne-substrate yensimbi evikelwe. | Isebenzisa isisekelo sensimbi esihambisa ukushisa kanye ne-dielectric esikhundleni somzila ojwayelekile we-all-organic multilayer. |
| I-Ceramic PCB | I-Al₂O₃, i-AlN, i-Si₃N₄, i-DBC, i-DPC, i-AMB, ifilimu ejiyile, ifilimu encane, i-LTCC kanye ne-HTCC. | Isebenzisa ubuchwepheshe bokwenza insimbi kanye ne-substrate obuqondene ne-ceramic esikhundleni sokwenziwa okujwayelekile kwe-FR-4. |
| Ukugoba / ukugoba okuqinile | Ukugoba okunezingqimba eziningi, ukugoba kwe-HDI, ukugoba okuqinile, ukugoba okuncane, ukugoba okude kakhulu, okuthintana ne-ZIF, izinti zokuqinisa, ukumboza kanye nokuvikela. | Ishintsha uhlelo lwezinto ezibonakalayo, i-lamination, ukwakhiwa kwendawo yokugoba, ukuqinisa kanye nokuphathwa. |
| Ubukhulu obukhethekile | Amabhodi amancane kakhulu, ajiyile, amade, amakhulu, amade amancane, angajwayelekile futhi anomumo ongavamile. | Ishintsha amathuluzi, ukwesekwa, ukusetshenziswa kwephaneli, ukuphathwa kanye nokulawula okulinganayo. |
| Ukufakwa kwamaphaneli okukhethekile | Ama-array angokwezifiso, isinyathelo-nokuphindaphinda, i-V-score, iphaneli eqondisiwe, i-V-score/routing exubile, amathebhu aqhekekayo, imingcele yamathuluzi kanye nebhalansi yethusi. | Ukwakhiwa kwamaphaneli e-CAM kuba yingxenye yokukhiqiza, ukuphathwa kokuhlanganiswa kanye nokuzinza kwenqubo engezansi. |
| Izinqubo ze-laser | Ukubhoboza nge-laser, ama-microvia e-laser, ukusika/ukususa amaphaneli nge-laser, ukuvuleka kwe-laser kanye nokumaka nge-laser lapho kufanele khona. | Yethula izinhlelo ze-laser ezizinikele kanye nezilawuli zokushisa/zokubhalisa ezihlukile kumathuluzi okusebenza ngomshini. |
| Ukumaka okukhethekile | Ukumaka nge-laser, i-QR/ibhakhodi, inombolo yochungechunge, idethi/ikhodi yelothi kanye nokuhlonza unomphela. | Ingeza idatha yokulandelela ngenkathi ivikela oxhumana nabo, izindawo ezithengiswayo kanye nezakhiwo ze-RF. |
Izakhiwo Ezithuthukisiwe Ze-Via: Ama-Blind Vias, Ama-Buried Vias kanye nama-Microvias
I-A via iba isakhiwo sokukhiqiza esithuthukisiwe lapho izendlalelo zayo zokuqala/zokumisa noma indlela yokwakheka ishintsha ukulandelana kokwakha. Ama-vias angcwatshwe aqedwa ebhodini elincane langaphakathi ngaphambi kokulamination kamuva. Ama-vias ayizimpumputhe axhuma ungqimba lwangaphandle kungqimba lwangaphakathi oluqanjwe ngegama futhi angase abe ngowomshini noma abe nge-laser. Ama-Microvia asekela ukuxhumana okuqinile futhi angafakwa, ahlanganiswe, axhunywe noma asetshenziswe njengengxenye yokwakheka kwesakhiwo sanoma yiluphi ungqimba.
Ubunjiniyela be-CAM buhlanganisa iqembu ngalinye ngesigaba salo sokukhiqiza. I-stack equkethe ama-microvia e-laser e-L1-L2, ama-via agqitshwe yi-L2-L5 kanye nemigodi idinga idatha ehlukene kanye nezigaba zenqubo. Ngakho-ke incazelo ye-via-span ingeyendlela yokuhlanganisa kanye nokukhiqiza, hhayi nje ishadi lokubhoboza eliqediwe.
Amandla okukhiqiza e- Highleap e -HDI PCB ahlanganisa ama-vias angaboni/afihliwe, ama-microvia, ama-via-in-pad kanye nokwakhiwa kwe-lamination okulandelanayo.
Ngokugcwalisa Nokufaka: I-Resin Plug, I-Copper Fill, I-Fill & Cap kanye ne-VIPPO
Ngokufaka i-plug, ukugcwalisa kanye nokuvala i-cap kuchaza izimo ezahlukene eziqediwe. Ukufaka i-solder-mask kuvala noma ukumboza imbobo njengengxenye yenqubo ye-solder-mask. Ukufaka i-resin kugcwalisa i-via eyenziwe ngensimbi ngaphambilini nge-resin engahambisani nogesi eqinisiwe futhi ehlanganisiwe. Ukugcwalisa ithusi kwakha ithusi ku-via volume ngokusebenzisa i-electroplating. Ama-vias agcwalisiwe futhi amboziwe anezela indawo emboziwe phezu kwesakhiwo esigcwalisiwe.
I-VIPPO—efakwe ngaphakathi kwephedi—idinga indawo yengxenye ehlelwe kahle futhi efakwe ukuze i-BGA, i-QFN nezinye izingxenye ezincane zihlanganiswe ngqo phezu kwe-via ngaphandle komgodi ovulekile odonsa i-solder kude nejoyinti. Lapho i-VIPPO ivela ngaphakathi kwe-HDI noma ukwakhiwa kwe-lamination okulandelanayo, ngokugcwalisa kungaba yingxenye yomjikelezo wokwakha ngaphambi kokuba kungezwe izinga elilandelayo le-dielectric noma le-microvia. Ngemva kokuthi izidingo zokwakheka kanye nokugcwalisa nge-via sezichaziwe, inani lebhodi le-HDI kanye nokuhlolwa kuxhumanisa izindawo ezenziwe nge-stencil, ukubekwa kanye nokuqinisekiswa kwe-solder-joint.
Ngezakhiwo ezimbozwe nge-cribed-via, ukugcwaliswa kwe-resin kanye ne-planarization nakho kungaqedwa ngaphambi kokushiswa kamuva. Lokhu kudala ubuso obuphansi bebhodi futhi kuvimbela i-dielectric elandelayo ukuthi ivule imigodi eboshwe nge-plated.
I-HDI, i-Sequential Lamination, i-SLP kanye ne-mSAP PCB Production
I-HDI umndeni wezakhiwo ezakhiwe esikhundleni senqubo eyodwa. I-1+N+1, 2+N+2, 3+N+3 kanye nezakhiwo zezendlalelo ezisebenzisa umjikelezo owodwa noma ngaphezulu we-lamination, ukubhoboza nge-laser, i-metallization, ngokugcwalisa kanye nokuthwebula izithombe. Ama-microvia ahlanganisiwe adinga ukuthi isakhiwo esingezansi sigcwaliswe futhi sibekwe ngendlela eyanele ukuthwala izinga elilandelayo lokuxhumana, kuyilapho imiklamo ehlanganisiwe isebenzisa i-lateral offset phakathi kwezingqimba ezakhiwe.
I-Highleap iphinde isekele ukukhiqizwa kwe-PCB efana ne-Substrate yezakhiwo ezinobuningi obukhulu. I-mSAP iqala ngethusi lembewu elincane kakhulu kunenqubo evamile yokususa, yakha ngokukhetha umqhubi, bese isusa ithusi lembewu eliveziwe ngokuchoboza nge-flash. Lokhu kuvumela amaphrofayili omqhubi amahle kakhulu okuphuma kwe-BGA exinene kanye nobuningi bokuxhumanisa obufana nokupakisha.
Kokubili ukwenziwa kwesitayela se-HDI kanye ne-SLP, ukwakheka kokukhiqiza kuqhutshwa yi-stackup kanye ne-map. Ukubalwa kwezingqimba kukodwa akuchazi ubunzima benqubo edingekayo.
Izinqubo Zokubhoboza Ezingemuva Nezokubhoboza Ezikhethekile
Ukubhoboza emuva kanye nokubhoboza emuva okujulile
Ukudonsa ngemuva kususa umgqomo ongasetshenziswanga onamapulangwe ngale komsebenzi wokugcina ngokuxhumeka. I-via iqala idalwe futhi ihlanganiswe njengesixhumanisi esijwayelekile; i-drill ejulile elawulwayo bese isusa i-stub eqhubayo ohlangothini olucacisiwe. Amabhodi anesivinini esiphezulu anezinga eliphezulu angadinga amaqembu amaningana e-backdrill anokujula okuhlukile, okuhlanganisa imisebenzi eseceleni eliphezulu nesezansi.
Amandla okubhoboza i-PCB ngemuva kwe-Highleap asetshenziselwa iziteshi zesivinini esikhulu lapho ukulawulwa kwe-via-stub kuyingxenye yokusebenza kwesignali nobuqotho.
Ukubhoboza kwesibili / ngemuva kokufakwa kweplati
Eminye imigodi kumele idalwe kuphela ngemva kokusebenza kokucwebezela noma kokubhoboza kwangaphambilini. I-CAM ibeka lezo zici ohlelweni lokubhoboza kamuva ukuze zingahlanganyeli enqubweni okufanele yenzeke ngaphambi kokuba kube khona imbobo yokugcina. Umsebenzi wokubhoboza wesigaba sokugcina ungahlanganiswa nezici ezikhethekile zemishini noma ezingezona ezensimbi.
Izimbobo ezifakwe ngokucindezela kanye nezimbobo ezifakwe ngokunemba
Izimbobo zokuxhuma ezifakwa ngokucindezela zidinga ububanzi obuqediwe kanye nethusi eliseludongeni lwembobo ukuze zihlale ngaphakathi kwefasitela lokulingana ngomshini. Ngakho-ke usayizi wokubhoboza wokukhiqiza kanye nesibonelelo seplati kufanele kuhlanganiswe ndawonye kunokuba kuhlolwe ngokuzimela.
Isinki esiphikisayo, ibhobo eliphikisayo kanye nokubhoboza izitebhisi
Ama-countersink adala i-recess eyindilinga; ama-counterbore adala isinyathelo esiyisilinda. Ukubhoboza okuqondiswa ukujula kanye nesinyathelo kudinga uhlangothi olucacile lokubhekisela, ububanzi, i-engeli/ukujula kanye nokubekezelelana. Le misebenzi yenziwa njengezinhlelo ze-CNC ezizinikele kunokuba ihunyushwe kusuka kufayela elijwayelekile lokubhoboza elinembobo eyindilinga.
Izikhala Ezicwebezelisiwe, Izikhala Ezingaboni, Izikhala, Amaphakethe kanye Nomshini Olawulwa Ngokujulile
Izikhala ezifakwe insimbi / ezimboziwe
Isikhala esidinga ithusi ezindongeni zaso kumele sakhiwe ngaphambi kwesigaba esifanele sokwenza insimbi. Asinakuphathwa njengokunqunywa kokugcina kwephrofayili. I-CAM ihlukanisa idatha yesikhala esinamathelisiwe kusuka kuma-slots omshini anganamathelisiwe futhi ihlola ithusi elizungezile, i-geometry yamathuluzi kanye nomzila ongezansi.
Izikhala ezingaboni ezilawulwayo kanye nemisele yezinyathelo
Izikhala ezingaboni, izikhala ezijulile kancane kanye nezindawo ezinyathelwayo zichazwe ku-X/Y kanye no-Z. Umdwebo oqediwe kufanele usho uhlangothi lokubhekisela, uhlaka, ukujula noma ukujiya kwezinto ezisele kanye nokubekezelelana. I-groove yesinyathelo ingadala isihlalo somshini, ukuguquka kobukhulu bendawo, isinyathelo sokuvikela, isikhombikubona sokushisa noma indawo egobile kancane.
Izakhiwo ezilawulwayo ezijulile nezinensimbi/ezinensimbi encane
Uma isici esiqediwe sidinga kokubili indawo efakwe ipulasitiki kanye nokujula okungafakwanga ipulasitiki kamuva, umzila ungahlukanisa ngamabomu imishini ibe imisebenzi emibili. Isikhala/ukuvulwa kokuqala kuhlanganyela ekufakweni kwethusi; isinyathelo sokugaya esilawulwayo kamuva sidala i-geometry yokugcina enezinyathelo.
Imigodi ye-PCB kanye nemigodi ehlanganisiwe
Izimbobo zingavala ingxenye, i-die, isivikelo noma i-thermal element ngaphansi kobuso bebhodi. Imbobo engamboziwe ngokuyinhloko iwukusebenza komshini okunembile. Imbobo emboziwe idinga izindawo ezikhethiwe ukuze ihlanganyele ekwenzeni insimbi ngakho-ke ishintsha indlela ngaphambi komshini wokugcina. Amandla okukhiqiza i-PCB aphezulu e-Highleap ahlanganisa izakhiwo zembobo ezimboziwe zezinhlelo zokusebenza ze-RF.
Umzila Okhethekile, Ukulinganisa Ama-V, Ama-Bevel, Ama-Step Edges kanye namaphrofayili eBhodi Eliyinkimbinkimbi
Amaphrofayili e-PCB akhethekile angahlanganisa umzila we-CNC, ukugaya kwangaphakathi, ukufaka ama-V, amathebhu aqondiswe ku-routed, ukulunywa yigundane, ama-chamfer, ama-bevel kanye nemiphetho yesinyathelo sendawo. Ukufakwa kwephaneli kwe-CAM kugcina ukwesekwa okwanele komshini wokufaka ama-plating, ukuthwebula izithombe, ukuhlola kanye nokuphatha ngaphambi kokuba kukhishwe uhlaka lokugcina.
Amaphaneli ahlanganisiwe anamaphuzu angu-V + aqondiswe kahle ayasiza lapho amanye amaphethelo ebhodi eqondile kuyilapho amanye izindawo zidinga umzila ongajwayelekile. Amabhodi aneminwe yegolide angangeza i-bevel elawulwayo. Amabhodi athambile kancane noma anezitebhisi ezenziwe ngomshini anezela izidingo zokujula kwendawo ohlelweni lohlaka. Amabhodi amancane kakhulu, aqinile noma amade angadinga ukwesekwa okwengeziwe kanye nokuqondiswa kwephaneli okuhlukile ukuze kuncishiswe ukuphazamiseka ngesikhathi sokucubungula.
Iminwe Yegolide Emifushane Emide, Oxhumana Nabo Abangazinzile kanye Negolide Elikhethiwe Le-Electrolytic
Iminwe yegolide emide emfushane, ehlukaniswe noma ehlanganisiwe idinga ubunjiniyela obuningi kunokuxhumana komphetho okulinganayo ngoba i-electrolytic hard-gold plating isadinga indlela yamandla kagesi eya kuwo wonke umunwe ocacisiwe. I-CAM ingasebenzisa amabhasi e-panel-side plating, izandiso zesikhashana noma enye indlela yokuxhuma evunyelwe kuye ngokuthi i-geometry isiqediwe.
Lokho kuxhumana kwesikhashana kufanele kuhlale phakathi nokusebenza kokufaka i-plating ekhethiwe bese kususwa noma kuhlukaniswe ngesikhathi sokugcina sokuhambisa/ukubeka ngaphandle kokushintsha ubude bokuxhumana kwekhasimende. Iminwe enezinhlangothi ezimbili, izindawo ezahlukene zobukhulu begolide kanye nemikhawulo kuma-plating leads abonakalayo kungangeza ukucubungula okukhethayo okwengeziwe.
Ukukhiqizwa kwe-PCB yeminwe yegolide ye-Highleap kusekela ukuxhumana okuqinile kwegolide kanye nokwakhiwa okuneziphetho ezimbili njenge-ENIG body + igolide eliqinile le-electrolytic.
Igolide eliqinile, igolide elithambile kanye negolide lokucwiliswa azikwazi ukushintshaniswa
Igolide eliqinile le-electrolytic lisetshenziselwa ukuxhumana kwezixhumi okumelana nokuguguleka. Igolide elithambile le-electrolytic lisetshenziswa lapho kusebenza khona ukuhlanzeka okuhlukile noma isidingo sokubopha. I-ENIG ne-ENEPIG ziyizinhlelo zokuqeda ngamakhemikhali futhi akufanele ziphathwe njengezifana ne-electrolytic hard-gold finger plating. Umdwebo wokukhiqiza kufanele ukhombe uhlobo lokuqeda, indawo ekhethiwe kanye nesidingo sobukhulu lapho kubalulekile khona.
Ukufakwa Kwezingqimba Zomphetho, Izindawo Ezifakwe Izingqimba kanye Nokukhiqiza Imigodi Engaphelele Ehlanganisiwe
Izici ezimbozwe ngomphetho kanye nezimbozwe nge-castelle ziyingxenye yenqubo kagesi neyemishini. Umphetho noma umgqomo kumele ube khona kusenesikhathi ukuze wenziwe ngensimbi, kuyilapho iphaneli yokukhiqiza isadinga ukwesekwa okwanele ukuze isinde ekusebenzeni kamuva.
Ukuze kufakwe umphetho ophelele noma okhethiwe, i-CAM idala izimbobo eziveza kuphela imiphetho yebhodi ecacisiwe ekufakweni kwethusi ngenkathi igcina amathebhu noma imigqa yokusekela. Amamojula e-RF angahlanganisa imiphetho yomphetho ehlanganisiwe kanye nothango kanye nezimbobo ezihlanganisiwe zokuvikela nokusekela.
Izimbobo ezigobile zilandela indlela ebalulekile yokubhoboza → ipuleti → umzila odlula emgqonyeni ogobile . Umzila wokugcina uveza uhlangothi olugobile njengoxhumano lwemojuli olugobilekayo. Ukukhiqizwa kwe-PCB egobile ye-Highleap kuhlanganisa izakhiwo ezigobile ezinezimbobo ezisetshenziswa kumamojula e-RF, i-Bluetooth, i-Wi-Fi, ukuxhumana kanye ne-sensor.
I-Copper Plating Ekhethiwe kanye Nemizila Ehlanganisiwe Yokuqeda Ububanzi
Ithusi elikhethekile elingeziwe lembobo
Lapho izimbobo ezikhethiwe ezifakwe ipulasitiki zidinga ithusi elengeziwe ngaphandle kokwengeza ithusi elifanayo elingeziwe kuyo yonke indawo yangaphandle, umzila wokukhiqiza ungafaka ukumelana kwesikhashana okuzinikele. Iqembu lemigodi eliqondiwe lihlala liveziwe ukuze lifakwe i-electroplating eyengeziwe kuyilapho indawo esele ivikelwe, ngemva kwalokho ukumelana kuyasuswa bese inqubo yongqimba lwangaphandle iyaqhubeka.
Ukwakheka kwethusi kwendawo / okujiyile
Ukwakhiwa kwethusi kwendawo kungasetshenziswa nalapho izici zethusi ezichaziwe zidinga ukujiya okwengeziwe. Lokhu kuhlukile ekuchazeni ukwakhiwa kwethusi elisindayo okufanayo kulo lonke ungqimba oluphelele ngoba i-selective plating ishintsha ukusatshalaliswa kwamanje, ukumelana nencazelo kanye ne-geometry yokugcina.
Ukuqeda okuxubile nokukhethiwe kobuso
I-PCB eyodwa ingahlanganisa ukuxhumana kwegolide eliqinile ne-ENIG, ENEPIG, HASL, OSP, ithini lokucwilisa noma isiliva lokucwilisa kwezinye izindawo. Lawa mabhodi adinga ukufihla okukhethiwe kanye nochungechunge lokuqeda olulawulwayo ukuze indawo yokuqala eqediwe ihlale ivikelekile ngenkathi kusetshenziswa ukwelashwa kwesibili.
Umthombo wokuqeda ubuso be-PCB we-Highleap uhlanganisa i-ENIG, i-ENEPIG, isiliva lokucwilisa, ithini lokucwilisa, i-HASL, i-OSP, igolide elikhanyayo kanye ne-hard-gold plating.
Imaski Ekhethekile Yokudayisela, Imaski Ekwazi Ukucoleka, Uyinki Wekhabhoni Nezinqubo Zokuvikela
Izakhiwo zemaski ezisongelwayo ezinhle
Imiklamo ye-BGA ephihliwe kahle kanye ne-dense SMT ingadinga amadamu amancane anemaski e-solder, izimbobo ezikhethiwe futhi zilawulwe ngokufaka amatende noma ukuxhuma. Izakhiwo ze-Via-in-pad ziphathwa ngokwehlukana ngokuya ngokuthi i-via ivulekile, imaski imboziwe, igcwele i-resin noma i-VIPPO.
Imaski ye-solder ecwengeka
Imaski yokusoda evulekayo iyisendlalelo sokuvikela esisuswayo esisetshenziswa ezindaweni ezikhethiwe kuphela. Ingavikela oxhumana nabo noma izindawo zokugcina ngaphandle ngesikhathi sokusoda ngamagagasi/okukhethayo, ukumbozwa kwe-conformal noma enye inqubo engezansi bese isuswa ngemuva kwalokho.
Uyinki wekhabhoni kanye noxhumana nabo abaphrintiwe abasebenzayo
Uyinki wekhabhoni ungakha oxhumana nabo bekhiphedi abasebenzayo, izindawo zokushintsha ezingabizi kakhulu noma ezinye izici zokuhambisa/zokumelana. Icutshungulwa njengesendlalelo sokuphrinta esisebenzayo kunokuba yinganekwane evamile. Umdwebo kufanele uchaze indawo yekhabhoni, futhi izidingo zephrojekthi zingafaka ukumelana nokuxhumana, ukujiya okuphrintiwe noma ukuhambisana nethusi/ukuphela okungaphansi.
Itheyiphu yokuvikela / imaski yeKapton
Itheyiphu evikelayo ingafakwa ngaphambi kokusebenza kokushisa, kwamakhemikhali noma kokuhlanganisa ukuze kuvikelwe oxhumana nabo abaqediwe noma izindawo ezikhethiwe. Indawo yokufaka kanye nendawo lapho itheyiphu ifakwa khona, ihlolwe futhi isuswe khona kuchazwe kumhambi wokukhiqiza.
Ama-Laminate Akhethekile kanye Nezinto Ezihlanganisiwe Ezihlanganisiwe
I-Highleap ikhiqiza ama-PCB isebenzisa i-RF/microwave, i-digital esheshayo, i-Tg ephezulu, i-polyimide nezinye izinhlelo ze-laminate ezichazwe ngamakhasimende. I-laminate ingashintsha indlela yokubhoboza, ukugeleza kwe-resin, ukunyakaza kobukhulu, ukunamathela kwethusi, ukusebenza kwendawo kanye nezimo ze-lamination ngisho noma umsebenzi wobuciko wethusi ungashintshi.
Rogers, PTFE, Taconic kanye no-Arlon
Izinto ze-PTFE kanye ne-RF ezigcwele i-ceramic zingadinga ukubhoboza izinto ezithile kanye nokusebenza kodonga lwemigodi ngaphambi kokuba ithusi elingena-electro. Okuqukethwe kokukhiqiza i-RF ye-Highleap kuhlanganisa ukwelashwa kwe-plasma kanye nokulungiswa kobuso bohlobo lwe-sodium lapho kufanele khona. Amabhodi e-Hybrid RF angahlanganisa lezi zinto ne-FR-4 noma enye i-laminate yedijithali elahlekelwa kakhulu.
I-Megtron, i-Isola / FR408HR-class kanye ne-FR-4 ephansi yokulahlekelwa
Izinto zedijithali ezisheshayo zikhethwa ukuze kutholakale ukulahlekelwa okuphansi kokudlulisela, izakhiwo ze-dielectric ezilawulwayo kanye nokusebenza okuthuthukisiwe kokushisa. Ukuvumelana kwe-lamination, iphrofayili yethusi-foil kanye nobukhulu be-dielectric kuba yinto ebalulekile lapho ibhodi liphethe iziteshi ze-multi-gigabit kanye ne-impedance elawulwayo.
I-N4000-series, i-IT-150DA, ama-laminate angenawo ama-halogen futhi afanele amakhasimende
Izinhlelo zezinto ezivunyelwe amakhasimende zingadinga izindlela zokulungisa noma zokukhiqiza ezivunyiwe. Ukutholakala kwebanga eliqondile, okulingana okuvunyelwe kanye nenqubo efanelekile kuqinisekiswa ngaphambi kokukhishwa kunokuba kucatshangwe ukuthi yonke i-laminate ene-Tg ephezulu noma elahlekelwa kancane ingasebenzisa uchungechunge olufanayo lwe-FR-4.
Ukuze uthole ukwenziwa kwe-RF okuqondene, bheka inqubo yokwenziwa kwe-Rogers PCB ka-Highleap.
Umkhiqizi we-RF, i-Microwave kanye ne-PCB evame kakhulu
Ukukhiqizwa kwe-PCB okuvame kakhulu kuhlanganisa ukulawulwa kwezinto, i-geometry yomqhubi kanye nezakhiwo ezikhethekile zemishini. I-Highleap isekela amabhodi e-RF/microwave/mmWave esebenzisa izinto ezilahlekelwa kancane, ama-stackups e-hybrid, i-impedance elawulwayo, i-backdrill, i-via-in-pad, i-edge plating kanye ne-plated cavities.
Ukuze kulawulwe ukulahleka kwe-RF, iphrofayili yethusi ingabaluleka njengobukhulu bethusi obujwayelekile. I-VLP, i-HVLP kanye namanye ama-foil ethusi aphansi anciphisa ukulahleka komqhubi okuhlobene nobulukhuni kumaza aphezulu. Izakhiwo ze-Antenna, isihlungi kanye ne-coupler nazo zenza ukubekezelelana kokukhiqiza kube yingxenye yokusebenza kwesekethe ngoba ubukhulu bomqhubi kanye nobukhulu be-dielectric obucindezelwe kuthinta ngqo impendulo kagesi.
Amabhodi e-RF angahlanganisa nezakhiwo zemigodi eboshwe nge-plated, i-perimeter edge plating kanye ne-dense ngokusebenzisa ucingo lokuvikela/ukubeka phansi. Lezi zici kumele zihlelwe ngaphambi komzila wokugcina ngoba izindawo ezenziwe ngensimbi zidinga ukufinyelela ezinqubweni zokufakwa kwethusi.
Umkhiqizi we-PCB yedijithali yesivinini esiphezulu: i-Backdrill, i-Low-Loss Stackup kanye ne-Tight Impedance
Amabhodi edijithali asheshayo angahlanganisa izinto zokulahlekelwa okuphansi ze-Megtron/Isola-class, ama-stackup anezingqimba eziphezulu, i-VIPPO, izixhumi ezifanelana nokucindezela, i-backdrill kanye ne-impedance elawulwayo. Indlela yokukhiqiza kufanele ilawule ukujiya kwe-dielectric, ukujiya kwethusi, i-trace geometry, ubudlelwano be-reference-plane kanye nobude be-stub njengesakhiwo esisodwa sikagesi.
Amandla kaHighleap aqinile ashicilela ukulawulwa kwe-impedance okungu-±5 Ω kwama-targets angu-50 Ω noma ngaphansi kwawo kanye no-±7% kwama-targets angaphezu kuka-50 Ω, kuyilapho ukwakheka kwe-RF okusekelwayo kungasebenzisa ukulawulwa okuqinile kwephrojekthi ethile. I-target eyamukelekile iqinisekiswa nge-stackup yokukhiqiza kunokuba ithathwe kuphesenti elilodwa elijwayelekile.
Amakhuphoni e-TDR kanye nezakhiwo zokuhlola ziqinisekisa umphumela we-impedance okhiqiziwe. Kwakhiweni okuthuthukisiwe, ikhuphoni limelela izinto zangempela zephaneli, ithusi kanye nomzila wenqubo kunokuba kube yi-geometry yegama le-CAD kuphela. Bheka ukukhiqizwa kwe-PCB yokulawula i-impedance ye-Highleap.
Ukukhiqizwa Kwethusi Elinzima, Ithusi Elixubile, Uhlamvu Lwethusi kanye ne-PCB Yokushisa
Ithusi elisindayo kanye nezisindo zethusi ezixubile
Amandla aqinile amanje e-Highleap abonisa ithusi langaphakathi nelangaphandle elifinyelela ku-10 oz lezakhiwo ezifanele. Ukushintsha kwethusi elisindayo, isikhala esincane, ibhalansi yethusi kanye nenani le-resin elidingekayo ukugcwalisa i-topography yomqhubi ngesikhathi sokulamina. I-stack exubile ingasebenzisa izendlalelo zamandla ezijiyile kanye nezendlalelo zesignali ezincane ukuze izidingo zamandla aphezulu kanye nomzila omuhle zihambisane.
Bheka ikhasi lokukhiqiza le-Highleap le-PCB yethusi elisindayo ukuze uthole izinto ezibaluleke kakhulu okufanele uzicabangele.
Uhlamvu lwemali yethusi, ukufakwa kwethusi kanye nezisakazo zokushisa ezifakiwe
Ubuchwepheshe bezinhlamvu zemali zethusi budala indlela yokushisa yendawo eqhuba ukushisa okuphezulu ngaphansi kwedivayisi enamandla aphezulu. Indlela ingafaka phakathi ukucubungula ngokunemba imigodi, ukufakwa kwezingcezu zethusi, ukugcwaliswa kwe-resin, ukuncibilikisa kanye nokuhlelwa kabusha. Ukukhiqizwa kwe -PCB yezinhlamvu zethusi ye-Highleap kuhlanganisa izakhiwo zokushisa ezifakiwe nezingenayo.
I-Metal-core PCB
Ama-PCB e-aluminium-core kanye ne-copper-core asebenzisa i-substrate yensimbi evikelwe ukufudumala ukuze asakaze ukushisa. Lawa yimindeni yokwakha ehlukene evela kumabhodi e-FR-4 ethusi elisindayo kanye nezingqimba eziningi ze-copper-coin. Ubuqotho be-dielectric bokushisa, ukuhlukaniswa kukagesi, ukwenziwa kwe-base-metal kanye nokugeleza kokushisa kwenhlangano kulawulwa njengengxenye yokwakha.
Umkhiqizi we-PCB ye-Ceramic: Al₂O₃, AlN, Si₃N₄, DBC, DPC, AMB, LTCC kanye ne-HTCC
I-Highleap ikhiqiza ama-PCB e-ceramic isebenzisa i-alumina (Al₂O₃), i-aluminium nitride (AlN) kanye ne-silicon nitride (Si₃N₄). Indlela yokwenza insimbi ikhethwa ngokuya ngobukhulu bethusi, umthwalo wokushisa, ubuningi bomqhubi, isidingo sokuthembeka kanye nokwakheka kwezingqimba eziningi.
I-DBC ibopha ngqo ithusi elijiyile ku-ceramic ukuze kusetshenziswe i-electronics enamandla. I-DPC isebenzisa imbewu/i-metallization yefilimu encane kanye ne-electroplating ukuze kutholakale izici ezinhle kakhulu. I-AMB isebenzisa i-active-metal brazing ukuze kuhlanganiswe insimbi ne-ceramic eqinile. Imizila yefilimu encane kanye nefilimu encane isekela ubuchwepheshe obuhlukene bomqhubi, kuyilapho i-LTCC kanye ne-HTC zakha izakhiwo ze-ceramic ezisebenzisa ungqimba olunezingqimba eziningi.
Amandla okukhiqiza i-PCB ye-ceramic ye-Highleap asekela nezinqubo zokuhlanganisa ezingezansi njenge-SMT, i-die attach kanye ne-wire bonding kumaphrojekthi afanele.
Umkhiqizi we-PCB oguquguqukayo, oqinile, oguquguqukayo, oguquguqukayo, oguquguqukayo kancane kanye nowe-Ultra-Long Flexible
I-flexible PCB kanye ne-HDI flex
Amasekethe aguquguqukayo angasebenzisa ukwakheka kwe-polyimide okukodwa, okuphindwe kabili noma okunezingqimba eziningi okune-coverlay, oxhumana nabo be-ZIF, izinti zokuqinisa kanye nokuvikela. I-HDI flex yengeza ama-microvia e-laser, ukwakheka okulandelanayo kanye nokugcwalisa ku-flexible stack.
I-Rigid-flex
Ukwenziwa kwe-PCB okuqinile kuhlanganisa izingxenye eziqinile neziguquguqukayo ebhodini elilodwa. Indlela ilawula ukuguquguquka okuqinile, ukumbozwa, ukubopha okukhethiwe, izindawo zokugoba kanye nokuphathwa kokugcina. I-HDI rigid-flex ingahlanganisa futhi ama-vias angaboni/angcwatshwe, ama-microvia kanye ne-impedance elawulwayo.
I-semi-flex
Ukukhiqizwa kwe-PCB okuguquguqukayo kudala indawo egobile elinganiselwe ngokugaya okujulile okulawulwayo kwesakhiwo esiqinile se-FR-4. Ubukhulu obusele, indlela yethusi kanye nokujula kokugaya kunquma ukusebenza komshini kwesifunda sokugoba.
Ukuzivumelanisa nezimo okude kakhulu
Ukukhiqizwa kwe -PCB eguquguqukayo ende kakhulu ye-Highleap kubhekana nezifunda eziguquguqukayo zesikali samamitha lapho ukuphathwa, ukubhaliswa, ukwehla kwamandla kagesi, ukubopha kanye nokuthunyelwa kuba yizithiyo ezibalulekile zenqubo.
Umfanekiso 2. I-PCB eqinile, i-PCB yobumba, i-PCB evame kakhulu
Usayizi Okhethekile, Ukufakwa Kwamaphaneli, Ukucutshungulwa Nokumakwa Nge-Laser
Amabhodi amancane kakhulu, aqinile, amade futhi anefomethi enkulu
Ubukhulu bebhodi obukhethekile bungashintsha amathuluzi, ukwesekwa kwezinto ezibonakalayo, ukwakheka kwephaneli, isinxephezelo sobukhulu kanye nokupakishwa. Amaphaneli amancane adinga ukwesekwa okwengeziwe kokuphatha; amabhodi amakhulu andisa izidingo zokubhoboza/isilinganiso; amabhodi amade namancane angadala izinselele zomnsalo/ukujika kanye nokubhalisa.
Ukufakwa kwamaphaneli ngokwezifiso
Ukufakwa kwephaneli kwe-CAM kungafaka phakathi ama-array esinyathelo nokuphindaphinda, ukufaka ama-V, ama-breakaway aqondiswe ku-routed, ama-breakaway tabs, ama-assembly rails, imigodi yamathuluzi, ama-fiducials, amakhuphoni okuhlola kanye nokulinganisa kwethusi. Ukuqondiswa kwebhodi kungavinjelwa futhi yisiqondiso sokugoba esiguquguqukayo, i-gold-finger plating, i-material grain noma i-machining ekhethekile.
Ukubhoboza nge-laser, ukusika kanye nokususa amaphaneli
I-Laser isetshenziselwa ama-microvia futhi ingasekela nemisebenzi yokusika ekhethiwe, yokuvula noma yokususa amaphaneli lapho umklamo nezinto ezisetshenziswayo zifaneleka khona. Izinhlelo ze-Laser zidinga ukubhaliswa okuzinikele kanye nokulawulwa kwendawo ethintekile ukushisa futhi akufanele zididaniswe ne-LDI, okuwubuchwepheshe bokuthwebula izithombe kunokuba ukubhoboza nge-laser.
Ukumaka nge-laser kanye nokwaphakade
Amakhodi e-QR, amabhakhodi, izinombolo zochungechunge, izihlonzi zosuku/izindawo kanye nezinye izimpawu ezihlala njalo zingangezwa ukuze kulandeleke lapho kuhambisana nezinto kanye nokuphela kwazo. Indawo yokumaka iyabuyekezwa ukuze ingaphazamisi oxhumana nabo abaveziwe, izakhiwo ze-RF noma izindawo ezithengiswayo.
Izakhiwo ze-PCB Ezifakiwe Neziqondene Nephrojekthi
Eminye imikhiqizo ethuthukisiwe isebenzisa ithusi elihlanganisiwe, izisabalalisi zokushisa, izakhiwo ezingasebenzi noma ezinye izici ezingezona ezijwayelekile ngaphakathi kokwakhiwa kwe-PCB. I-Highleap ingabuyekeza izakhiwo ezihlanganisiwe eziqondene namakhasimende kanye nezidingo ze-laminate, i-cavity, i-plating kanye ne-assembly.
I-resistor ehlanganisiwe, i-capacitor, i-inductor noma imiqondo ye-active-component idinga ukuqinisekiswa kwephrojekthi ethile ngoba uhlelo lwezinto ezibonakalayo, ubunikazi benqubo, indlela yokufaneleka kanye nezidingo zokuthembeka ziyahlukahluka kakhulu. Akufanele ziphathwe njengezilingana ngokuzenzakalela nokwakhiwa okujwayelekile kwezingqimba eziningi ngoba nje isici singamelwa ku-CAD.
Ukuqinisekiswa Okukhethekile kanye Nokulawulwa Kokuthembeka kwama-PCB Athuthukile
Ukukhiqiza okuthuthukisiwe kuvame ukudinga ukuqinisekiswa ngale kokuhlolwa okuvamile okubonakalayo. Ukuhlolwa noma ukuhlolwa kubekwa lapho kungahlola khona isakhiwo esifanele ngaphambi kokuba inqubo elandelayo isifihle noma isishintshe.
| Ukuqinisekiswa kwe- | Lokho ekuhlolayo | Ukusetshenziswa okujwayelekile |
|---|---|---|
| I-AOI yengqimba yangaphakathi | Ukuvula komqhubi wangaphakathi, ama-short kanye neziphambeko zesithombe | Ngaphambi kokulamina, izingqimba zangaphakathi ziyagcwala. |
| Ungqimba lwangaphandle lwe-AOI | I-geometry yokugcina yomqhubi wangaphandle | Ngaphambi kokufaka imaski, mboza ingxenye yethusi. |
| Ukuqinisekiswa kokubhaliswa/ukulungiswa | Ukubhaliswa kwe-layer-to-hole kanye ne-conductor | Idizayini enezingqimba eziphakeme, i-HDI kanye nemigodi eqinile ephuma kuthusi. |
| Ukumelana nemigodi / okukhethekile ngokuqinisekiswa | Ukusebenza kukagesi kwezixhumanisi ezifakwe amapulangwe ezithile | Izidingo ezibalulekile zokuxhumanisa imbobo noma i-interface ekhethekile. |
| Ukuhlolwa kwe-TDR impedance | Impedance elawulwayo eqediwe | Izakhiwo zomugqa wokudlulisela wesivinini esiphezulu kanye ne-RF. |
| Isigaba esincane / isigaba esinqamulayo | Ithusi elinodonga olunemigodi, ngokugcwalisa, ukuhlangana kwezingqimba kanye nokwakhiwa kwe-dielectric | I-HDI, ama-via agcwele, isilinganiso se-aspect ratio ephezulu kanye nokwakhiwa kweziqu. |
| Ukuqhubeka kukagesi / ukuhlukaniswa | Ubuqotho obuphelele obuqediwe | I-PCB engenalutho eqediwe. |
| Ukuhlolwa kwe-X-ray / isakhiwo esifihliwe | Ukubhaliswa kwangaphakathi noma izici ezifihliwe lapho kufanele khona | Ukuqinisekiswa okuthuthukisiwe kwezingqimba eziningi/ukuhlanganiswa. |
| Ukucindezeleka kokushisa / ukujikeleza kokushisa / IST / CAF | Ukuthembeka ngaphansi kokucindezeleka kokushisa noma kukagesi | Kusetshenziswa uma kudingeka ngokomkhiqizo, ikhasimende noma uhlelo lokufaneleka. |
Ukuhlolwa kukagesi kwe-PCB kwe-Highleap kanye nezinsiza zokuqinisekisa ikhwalithi ye-PCB zihlanganisa uhlelo olubanzi lokuhlola nokuhlola.
Izibonelo Zokwakhiwa Kwe-PCB Okuthuthukisiwe Okunezinqubo Eziningi Ezikhethekile
Inselele yokukhiqiza iyanda lapho izakhiwo eziningana ezithuthukisiwe zabelana nge-stackup efanayo. I-Highleap ibukeza lezi zinhlanganisela njengendlela eyodwa yenqubo ukuze isikhathi sokucwebezela, ukugcwalisa, ukuncibilikisa, ukuqeda kanye nokusebenza kwemishini sihlale sihambisana.
| Ukwakhiwa kwe-PCB | Izinqubo okumele zihlanganiswe | Ukuthembela okubalulekile ekukhiqizeni |
|---|---|---|
| Iminwe emide eqinile negolide elifushane + ama-via angcwatshwe nge-resin + ama-via angaboni/angcwatshwe + isikhala se-blind esilawulwayo | Ama-vias ebhodi elingaphansi, ukugcwaliswa kwe-resin/ukuhlela, i-lamination elandelanayo, igolide eliqinile elikhethiwe, izindlela ze-plating-current kanye nomzila olawulwa ukujula. | Ama-vias angcwatshwe kumele agcwaliswe ngaphambi kokufakwa kwe-lamination efanele; isimo se-plating se-slot sibeka indawo yaso yokugaya; iminwe yegolide emifushane idinga indlela ye-plating esebenzayo ngaphambi kokukhishwa kwephrofayili kokugcina. |
| I-Rogers/PTFE hybrid + ama-microvia ahlanganisiwe + umgodi ohlanganisiwe + i-edge plating + impedance eqinile | Ukulungiswa kwe-PTFE, i-hybrid lamination, ukwakheka kwe-laser, ithusi ngokugcwaliswa, i-cavity/edge metallization kanye nokuqinisekiswa kwe-TDR. | Izinto zokwakha, insimbi engaphakathi, insimbi enqenqemeni kanye ne-geometry ye-impedance konke kuncike ekwakhiweni okufanayo okucindezelwe. |
| I-Megtron enezingqimba eziningi zesivinini esiphezulu + i-VIPPO + i-backdrill ejulile kakhulu + izixhumi ezifanelana nokucindezela | I-stackup elahlekelwa kancane, ama-via agcwalisiwe/avaliwe, ama-drill ajulile alawulwayo, imigodi efakwe ngokunemba kanye nokulawula ukuvinjelwa. | I-Backdrill kumele igcine uxhumano lwesendlalelo olusebenzayo kuyilapho imigodi yokucindezela igcina ububanzi obuqediwe obudingekayo kanye nethusi lebharele. |
| Izendlalelo zamandla ethusi ezisindayo + izendlalelo zesignali zomugqa ocolekile + uhlamvu lwemali lwethusi + ama-via agcwele | Izisindo zethusi ezixubile, ukulawulwa kokugeleza kwe-resin, ukufakwa kwezinhlamvu zethusi kanye nokugcwalisa/ukuhlela. | I-topography yethusi elinzima kanye nokulingana kohlamvu lwemali kuthinta i-lamination kuyilapho izendlalelo zomugqa oqondile zidinga inqubo eqinile yomqhubi. |
| I-HDI rigid-flex + stacked microvias + VIPPO + ENEPIG + i-impedance elawulwayo | I-lamination eqinile neguquguqukayo, i-coverlay, i-laser buildup, nge-fill/cap, i-finish kanye ne-impedance stackup. | Ama-connection aphezulu kumele ahlale ehambisana nezindawo ezigobile futhi aqhubeke ehlinzeka ngama-flat assembly pads. |
| Imodyuli ye-RF ehlanganisiwe + ama-ENIG pads + oxhumana nabo abaqinile begolide + i-edge plating | I-Castellation drill/plate/umzila, igolide eliqinile elikhethiwe, ukuqeda ngamakhemikhali, i-edge metallization kanye nephrofayili yokugcina. | Ukusekelwa kwamaphaneli kanye nezici zesikhashana zokumboza kumele zihlale kuze kube yilapho zonke izakhiwo ezisemaphethelweni ezenziwe ngensimbi seziqediwe. |
| I-SLP/mSAP + ama-microvia ahlanganisiwe + i-BGA ecolekile kakhulu + izinto ezilahlekelwa kancane | Ukwakheka komqhubi ongeziwe kancane, ama-via e-laser amahle, ngokugcwalisa, i-stackup elahlekelwa kancane kanye nokubhaliswa kokunemba. | I-geometry yomqhubi, ubukhulu be-dielectric kanye nokubhaliswa kwe-microvia kusebenza ngaphakathi kwefasitela elifanayo lenqubo yokuxinana okuphezulu. |
| Imigqa emincane ye-AlN ceramic + DPC + ukuqeda okuboshelwe ngocingo + i-die attach | Ukwenziwa kwensimbi yobumba, ukwakheka okuhle komqhubi, ukuqeda okukhethiwe kanye nokuhlanganiswa kobumba. | Ukwenziwa kwensimbi nge-ceramic kanye ne-stack yensimbi eqediwe kumele kuhambisane nenqubo yokugcina ye-die/wire-bond. |
Indlela Ubunjiniyela be-CAM Obuhlanganisa Ngayo Izinqubo Ezikhethekile ze-PCB
Ikhono elikhethekile liba usizo kuphela uma libekwe endaweni efanele emzileni wokukhiqiza. I-vía efihliwe ingena ngaphakathi kwesakhiwo esincane. I-microvia ehlanganisiwe incike esimweni sokugcwalisa ngaphansi kwayo. Isikhala esihlanganisiwe kumele sibe khona ngaphambi kokwenziwa kwensimbi. I-backdrill yenzeka kuphela ngemva kokuba i-vía ehlanganisiwe ikhona. Umunwe wegolide omude omfushane udinga indlela yawo yamanje yokuhlanganisa i-electroplating ngaphambi kokuba umzila wokugcina ususe izici zesikhashana.
| Imfuneko eqediwe | Incazelo yokukhiqiza edalwe yi-CAM / ubunjiniyela bezinqubo |
|---|---|
| Impumputhe / ingcwatshwe nge | Nge-span, i-sub-build, isigaba sokubhoboza, isigaba sokucwebezela kanye nomjikelezo we-lamination. |
| I-microvia ehlanganisiwe | Yehlisa ngokugcwalisa/ukuhlelwa ngaphambi kwezinga elilandelayo le-laser-via. |
| I-VIPPO | Indlela yokugcwalisa, ukwelapha, ukuhlelwa kabusha, ithusi lesivalo kanye nesimo sephedi yokugcina. |
| I-Backdrill | Uhlangothi lokubhoboza, ukujula/isigxobo esiqondiwe, ububanzi bamathuluzi kanye nesendlalelo sokuxhuma esivikelwe. |
| Iminwe yegolide emide emifushane | Indawo ekhethiwe, indlela yesikhashana yokucwebezela, isivikelo, indlela yokubeka i-bevel kanye nendlela yokususa umthofu. |
| Isikhala/umgodi ojulile olawulwayo | Uhlangothi olubhekisela kulo, i-geometry ye-XY, ukujula kwe-Z/ubukhulu obusele kanye nesimo se-plating. |
| I-slot/edge plating ehlanganisiwe | Ukuvulwa kwangaphambi kokufakwa kweplati kanye nesu lokugcina lokusekela iphaneli/iphrofayili. |
| Ithusi elikhethekile elingeziwe lembobo | Ukumelana kwesikhashana kanye nesigaba sokufaka iplati esizinikele seqembu lembobo elikhethiwe. |
| I-PTFE / RF laminate | Imiyalelo yokubhoboza, ukubhaka, ukulungiswa kwe-plasma/ubuso kanye ne-lamination yezinto ezithile. |
| I-hybrid stackup | Izixhumi ezibonakalayo, uhlelo lokubopha, isinxephezelo sobukhulu kanye nesakhiwo se-impedance. |
| Ithusi elinzima | Isinxephezelo sokusika, ukubuyekezwa kwesikhala, ibhalansi yethusi kanye nesu lokugcwalisa i-resin. |
| Uhlamvu lwemali yethusi | I-geometry yomgodi/yokufakwa, isigaba sokufakwa, ukugcwaliswa kwe-resin, i-lamination kanye ne-planarization. |
| Ukuqeda okuxubile | Ukuvala/ukuvikela okukhethiwe kanye nohlelo lokuqeda. |
| Impedance elawulwayo | Ukuhlanganiswa komkhiqizo, i-geometry yomqhubi okhokhelwayo, idatha yekhuphoni/yokuhlola kanye nomgomo wokwamukelwa. |
| Ukuguquguquka okuqinile / okuguquguqukayo okuncane | Ukuguquka kwezinto, ukumboza/ukuqinisa, indawo yokugoba noma ukulandelana kokugaya okujulile okulawulwayo. |
Ikhasi lenqubo yokukhiqiza ye-PCB ye-Highleap lichaza ukudluliselwa okubanzi kokuklama kuya ku-CAM, kuyilapho umhambi wokukhiqiza elawula indlela umsebenzi okhishwe ngayo odlula efektri.
Ukuthola Isilinganiso se-PCB Kulula
Akudingeki ukuthi ulungiselele iphakheji yokukhiqiza eyinkimbinkimbi ngaphambi kokuxhumana ne-Highleap. Uma usuvele unamafayela e-Gerber noma amafayela okuklama/umthombo we-PCB , wathumele kithi futhi ithimba lethu lingaqala ukubuyekezwa. Uma umklamo usathuthukiswa, noma ungaqiniseki ukuthi yimaphi amafayela adingekayo, mane uxhumane nathi bese uthumela noma yiluphi ulwazi onalo njengamanje.
Ithimba lethu lokuthengisa nobunjiniyela lizosiza ekuboneni ulwazi olungekho futhi libuze imibuzo edingekayo kuphela ukuze kuqhutshekwe phambili iphrojekthi. Ekuhlanganisweni kwe-PCB, ulwazi lwe-BOM kanye nokubekwa luwusizo uma lutholakala, kodwa ungaxhumana nathi ngaphambi kokuba lawo mafayela aqedwe.
- Unamafayela e-Gerber? Bathumele.
- Ingabe unamafayela okuklama e-PCB esikhundleni salokho? Thumela lezo.
- Udinga i-PCB + ukuhlanganiswa? Engeza i-BOM kanye nedatha yokubekwa uma sezilungile.
- Amafayela awaphelele noma awazi ukuthi uzothumela ini? Xhumana ne-Highleap kuqala. Ithimba lethu lizokuqondisa esinyathelweni esilandelayo.
Ngezakhiwo ezithuthukisiwe njenge-vias ezingaboni/ezingcwatshwe, izici ezijulile ezilawulwayo, izinto ezikhethekile noma ukuqedwa okukhethiwe, onjiniyela bethu bangacela umdwebo owengeziwe noma ukucaciswa ngemva kokubukeza amafayela. Awudingi ukuqonda inqubo yokukhiqiza kusengaphambili; ithimba lobunjiniyela lizohumusha imfuneko eqediwe ibe yindlela yokukhiqiza.
Ukuxhumana Okuzinikele Kwephrojekthi Nokulandelela Ukuhleleka
Kumaphrojekthi asebenzayo, i-Highleap ingahlela iqembu lokuxhumana lephrojekthi elizinikele ukuze abantu abanomthwalo wemfanelo wokwenza i-oda bakwazi ukusebenza ngolwazi olufanayo. Ukuthengisa, i-CAM/ubunjiniyela, ukukhiqiza, ikhwalithi, amalungu eqembu le-PCB kanye nelokuhlela angajoyina njengoba kudingeka yiphrojekthi.
Lokhu kunikeza ikhasimende indawo eyodwa yokulandela imibuzo yobunjiniyela, ukuqinisekiswa kwamafayela, isimo sezinto ezibonakalayo, inqubekela phambili yokukhiqiza, ulwazi lwekhwalithi, izinkinga zokuhlanganisa kanye nezibuyekezo zokuthunyelwa. Uma kuvela umbuzo ngesikhathi sokubuyekezwa kwe-CAM noma ukukhiqiza, ithimba lobuchwepheshe elifanele lingafakwa engxoxweni esikhundleni sokudlulisa umlayezo kubantu abaningana abahlukene.
Ukuxhumana kobunjiniyela
Imibuzo ye-CAM/DFM, ukuqinisekiswa kwe-stackup, ukucaciswa kwenqubo ekhethekile, ukushintshaniswa kwezinto kanye nokuvunyelwa kwamakhasimende.
Ukulandelela ukukhiqiza
Ukulungiswa kwezinto, inqubekela phambili yokukhiqiza, isimo senqubo esiyinhloko kanye nokuhlanganiswa kwesheduli.
Ukulandelela kwekhwalithi
Okutholakele ekuhlolweni, ukulungiswa kobunjiniyela, ulwazi lokuhlolwa kanye nemibhalo yekhwalithi uma kudingeka.
Ukuhlanganiswa nokulethwa kwe-PCB
Ukuhlanganiswa kwezingxenye/ukuhlanganiswa, isimo sokukhiqiza, ukuhlolwa kokugcina, ulwazi lokupakisha kanye nokuthunyelwa.
Umlando wephrojekthi ofanayo uhlala ubonakala eqenjini kulo lonke i-oda, okusiza izinqumo zobunjiniyela, ukuvunyelwa kanye nezibuyekezo zokukhiqiza ukuthi zihlale zixhumene nokubuyekezwa okulungile kanye nesidingo samakhasimende.
Umkhiqizi we-PCB kanye ne-PCB Assembly Factory Ngaphansi Komsebenzi Owodwa
I-Highleap inikeza kokubili ukwenziwa kwe-PCB engenalutho kanye nokuhlanganiswa kwe-PCB . Lokhu kuwusizo ikakhulukazi kumabhodi athuthukile ngoba imininingwane yokwenziwa ingathinta ngqo i-SMT, i-through-hole kanye ne-mechanical assembly. I-VIPPO ithinta ukushintshwa kwe-BGA; imigodi yokulingana ngokucindezela ithinta ukufakwa kwesixhumi; i-flex kanye ne-rigid-flex zidinga ukwesekwa okufanele; amabhodi e-ceramic kanye ne-copper-coin ashintsha ukuziphatha kokushisa; izixhumi zomphetho kanye nokuqedwa okukhethekile kuthinta i-interface yokugcina ye-mechanical.
Uma ukwenziwa nokuhlanganiswa kuhlanganiswa, ama-panel rails, ama-fiducials, ngokwelashwa, ukuqeda ubuso, ukususwa kwamapaneli, ukugcinwa kanye nesu lokuhlola kungabuyekezwa ngaphambi kokuba kukhishwe ukukhiqizwa kwe-PCB. Amaphrojekthi adinga ukutholakala kwezingxenye, i-SMT/THT, uhlelo noma ukuhlolwa okusebenzayo angaqhubeka ngokusebenzisa ukuhamba komsebenzi kwe-PCB okuvulekile kwe-Highleap.
Ukuqinisekiswa Okuqondile Kwephrojekthi Kwezakhiwo Ezingajwayelekile
Eminye imiklamo isebenzisa izingxenye ezihlanganisiwe ezingavamile, ama-laminate angavamile anikezwa amakhasimende, izici ezikhethekile ezakhiwe nge-laser, ubukhulu obungavamile noma inhlanganisela ngaphandle kwefasitela lamakhono ashicilelwe ajwayelekile. I-Highleap ibuyekeza la maphrojekthi ngaphambi kokukhiqiza futhi iqinisekisa izinto ezifanele, amathuluzi, imishini kanye nendlela yokufaneleka yomklamo wangempela.
Thumela amafayela akho e-PCB ku-Highleap
Amafayela e-Gerber noma amafayela okuklama e-PCB anele ukuqala. Uma amafayela akho engaphelele noma ungaqiniseki ukuthi yini ongayinikeza, xhumana nathi futhi ithimba lethu lizoqondisa iphrojekthi kusukela ekubuyekezweni kobunjiniyela kuya ekukhiqizweni kwe-PCB, ukuhlanganiswa, ukulawulwa kwekhwalithi kanye nokulethwa.
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Izinsizakalo Zokukhiqiza Nokuhlanganisa ze-PCB
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Ungasithola kanjani isilinganiso sama-PCB
Masikwenzele ukuhlaziya kwe-DFM/DFA futhi sibuyele kuwe ngombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunikeze isaphulelo:
-
- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.