Idizayini ye-PCB yeBhodi Yokushisa Yokuhlola Ukuthembeka

Isingeniso

I-Burn-in Board PCB iyinkundla yokuhlola ebalulekile esetshenziswa ekuhloleni ukwethembeka kwe-semiconductor, eklanyelwe ukumelana nezimo ezinde zezinga lokushisa eliphezulu kanye nezimo zomthwalo omkhulu ngesikhathi sokuhlolwa kokushiswa. Lawa mabhodi esekethe akhethekile enza abakhiqizi bakwazi ukuhlonza ukwehluleka kwempilo yangaphambi kwesikhathi kumasekethe ahlanganisiwe ngokuwafaka ngaphansi kwezimo zengcindezi ezisheshayo ezilingisa iminyaka yokusebenza okuvamile.

Ngesikhathi sokuhlolwa kokushiswa, ama-chips asebenza ngokuqhubekayo emazingeni okushisa aphakeme ngenkathi engaphansi komthwalo ogcwele kagesi, eveza amaphutha angenzeka ngaphambi kokuba amadivayisi afinyelele amakhasimende ekugcineni. Le athikili ihlola ukucatshangelwa kwedizayini ebalulekile, izidingo zezinto ezibonakalayo, namazinga okukhiqiza aqinisekisa ukuthi ama-PCB e-Burn-in Board PCB aletha imiphumela yokuhlola enembile nephindaphindwayo.

Iyini i-Burn-in Board PCB?

I-Burn-in Board PCB isebenza njengendawo yokuhlola ezinikele eklanyelwe ukuhlola ukwethembeka ekushiseni ekukhiqizeni ama-semiconductor. Ngokungafani namabhodi okuhlola avamile, lezi zinkundla kufanele zigcine uzinzo kagesi nemishini ngenkathi zisebenza ngokuqhubekayo ezindaweni ezishisa kakhulu.

Izimo ezijwayelekile zokuhlola ukusha zisuka ku-125°C ukuya ku-150°C ezikhathini ezisuka ku-72 kuya ku-168 amahora. Umsebenzi oyinhloko walawa mabhodi ukuthola ukwehluleka kokufa kwezinsana ngokufaka ingcindezi kagesi eqhubekayo emazingeni okushisa aphakeme, okuvumela abakhiqizi ukuthi bahlole amadivayisi anesici ngaphambi kokuthunyelwa.

Ama-PCB eBhodi Lokushisa ahluke kakhulu kumabhodi okulayisha kanye namakhadi e-probe . Ngenkathi amabhodi okulayisha egxile ekuhlolweni okusebenzayo emazingeni okushisa azungezile kanye namakhadi e-probe ebeka phambili ubuqotho besignali yemvamisa ephezulu ngesikhathi sokuhlolwa kwezinga le-wafer, amaBhodi Okushisa agcizelela ukukhuthazela kokushisa kanye nokuzinza kwesikhathi eside ngaphansi kokucindezeleka okuqhubekayo kokushisa.

Imvelo Yokuhlola Ukushiswa Nezimfuneko ze-PCB

Ukuhambisana Kwehhavini Lokushisa Okuphezulu

I-Burn-in Board PCBs isebenza ngaphakathi kwamagumbi okuhhavini akhethekile aklanyelwe ukugcina ukulawulwa kwezinga lokushisa okunembile kuwo wonke amavolumu amakhulu okuhlola. Lawa mabhodi kufanele alingane namarack kahhavini ajwayelekile ngenkathi evumela ukunwetshwa okushisayo ngesikhathi sokuhamba ngebhayisikili. Ukuhambisana kweChamber kudinga ukunakwa ngokucophelela kobukhulu bebhodi, izindawo zembobo ezikhuphukayo, kanye nokucaciswa kokugeleza komoya eduze kwamadivayisi anabantu abaningi.

I-Thermal Cycling kanye ne-Mechanical Stress

Ukujikeleza okuphindaphindiwe kokushisa okukhona ekuhlolweni kokushiswa kudala ukucindezeleka okukhulu komshini ngenxa yokungalingani kokukhula kokushisa. Amabhodi ahlangabezana nemijikelezo eminingi yokushisa nokupholisa kuyo yonke impilo yawo yesevisi, kanti umjikelezo ngamunye ungase ubangele ukuqhekeka okuncane emajoyintini e-solder noma ukuhlukanisa ama-trace. Umklamo kumele ubhekele lezi zingcindezi eziqongelelekayo ngokusebenzisa ukunqwabelana kwezingqimba ezilinganayo kanye nokubeka amasu ngendlela efanele.

Ukukhetha Okubalulekile Kwama-PCB Ebhodi Le-Burn-in

Ukukhethwa kwezinto kumelela isinqumo esibaluleke kakhulu ekwakhiweni kwe-Burn-in Board PCB, okunquma ngokuqondile ukusebenza okushisayo nempilo yokusebenza. I-laminate kufanele igcine ubuqotho bemishini kanye nezakhiwo zikagesi phakathi namakhulu amahora emazingeni okushisa aphezulu.

Leli khasi ligxile kwi-PCB kanye nehadiwe ye-fixture esetshenziswa ngesikhathi sokuhlolwa kokucindezeleka kokuthembeka. Ukuze uthole indlela ebanzi yokuhlola kanye nokugeleza kwenqubo, buyekeza ukubuka konke kokuhlolwa kokushiswa ; ukuze uthole ukuqinisekiswa kwebhodi elihlanganisiwe, xhuma uhlelo lwe-fixture nokusekelwa kokuhlola okusebenzayo.

I-Polyimide Laminates

Izinto ezisekelwe ku-polyimide zinikeza ukuzinza okuphezulu kokushisa ngamazinga okushisa okuguquka kwengilazi adlula ama-250°C, okwenza zibe zilungele ukusetshenziswa okudinga kakhulu kokushiswa. Lezi zinto zibonisa ukuzinza okuhle kakhulu kanye ne-coefficient ephansi yokwanda kokushisa ku-30-50 ppm/°C, okunciphisa ukugoba kwebhodi ngesikhathi sokuvezwa isikhathi eside kokushisa.

FR-408HR kanye nezinye izindlela eziphakeme ze-Tg

I-FR-408HR evela ku-Isola inikeza esinye isisombululo esinezinga lokushisa lengilazi lokushintsha elingu-180°C kanye nokumunca umswakama ophansi uma kuqhathaniswa nezinto ezijwayelekile ze-FR-4. Le laminate igcina izakhiwo zikagesi ezinokwethenjelwa emazingeni okushisa afinyelela ku-150°C kuyilapho inikeza izinzuzo zezindleko ngaphezu kokwakhiwa kwe-polyimide kwezicelo ezingadingi kakhulu.

Metal Core Solutions

Ngezinhlelo zokusebenza ezidinga ukushabalaliswa kwamandla ngokweqile, ukwakheka kwensimbi okuyisisekelo noma okuqiniswe ngokushisa kuhlanganisa i-aluminium noma i-copper substrates ezithuthukisa ukusabalala kokushisa. Lezi zinto zihlinzeka ngokushisa okungu-1-5 W/mK uma kuqhathaniswa no-0.3 W/mK kuma-laminate ajwayelekile, okuqinisekisa ukufana kokushisa kulo lonke ubuso be-Burn-in Board.

Onjiniyela kufanele bacele imibiko yokuguga okushisayo kubahlinzeki be-PCB ebhala ukusebenza kwe-laminate ngemva kwamahora angu-500 kuya kwangu-1000 okuchayeka okuqhubekayo emazingeni okushisa okusebenza ahlosiwe.

I-High-Power Trace kanye ne-Pad Design yamabhodi ashiswe ngaphakathi

Landelela Ububanzi kanye Nesisindo Sethusi

I-Burn-in Board PCBs kumele ilethe okwamanje kumadivayisi amaningi asebenza ngesikhathi esisodwa kumazinga aphezulu wamandla. Ukucatshangelwa kwedizayini yokusabalalisa amandla kufaka phakathi:

• Ukwakhiwa kwethusi esindayo - 2-ounce noma 3-ounce izisindo zethusi zinciphisa ukulahlekelwa okuphikisayo kanye nokukhuphuka kwezinga lokushisa ngesikhathi sokusebenza okuqhubekayo.
• Izibalo zokulandelela ezibanzi – Amazinga okushisa e-ambient eduze kuka-150°C adinga amakhondakta abanzi kakhulu kunemiklamo elinganayo yezinga lokushisa legumbi.
• I-Thermal nge-arrays - Ukubekwa kwamaqhinga ngaphansi kokulandela amandla kusiza ukudluliswa kokushisa ezindizeni zethusi zangaphakathi.
• Izendlalelo ezisakaza ukushisa - Izindiza zethusi zangaphakathi zenza izindlela eziphansi zokumelana nokushisa ezivimbela izindawo ezishisayo zendawo.

Ukukhethwa Kokuqeda Ubuso

Ukuqedwa kwendawo yephedi kufanele kumelane ne-oxidation futhi kugcine ukuthengiselana ngemijikelezo eminingi yokushisa. Igolide lokucwiliswa le-nickel elingenagesi linikeza ukuqina okuhle kakhulu ngogqinsi olujwayelekile lwe-nickel lwama-microns angu-3-6 kanye ne-flash yegolide engu-0.05-0.1 microns. Ukufakwa kwegolide eliqinile kumaphedi okuxhuma kuqinisekisa ukumelana nokuxhumana okuthembekile ngamakhulu emijikelezo yokufaka endaweni enezinga lokushisa eliphezulu.

Izilondolozi ze-Organic solderability zinikeza izinzuzo zezindleko kodwa zidinga ukuhlolwa kwezici zokuzinza kokushisa, njengoba ukwakheka okuningi kwe-OSP kuqala ukuwohloka ngaphezu kuka-130°C ngesikhathi sokuchayeka okunwetshiwe.

Idizayini yesixhumi nesokhethi yama-PCB ebhodi le-Burn-in Board

Amasistimu okuxhunywa okushisa okuphezulu amelela izinto ezibalulekile ezinokwethenjelwa ekwakhiweni kwe-Burn-in Board. Izindlu zokuxhuma kufanele zisebenzise ama-thermoplastics asebenza kahle kakhulu njenge-polyphenylene sulfide noma i-liquid crystal polymer egcina amandla okusebenza angaphezu kuka-150°C.

I-metallurgy yokuxhumana idinga ukufakwa kwegolide phezu kwe-nickel noma izinto eziyisisekelo zethusi ze-phosphor ukuze kuqinisekiswe ukumelana nokuxhumana okuzinzile kulo lonke uhambo lokuhamba ngebhayisikili elishisayo. Othintana nabo abajwayelekile be-tin-plated benza i-oxidize ngokushesha emazingeni okushisa ashisayo, okuholela ekuxhumekeni kwezikhawu kanye nemiphumela yokuhlolwa okungamanga.

Amasistimu okugcina amakhenikha avikela amabhodi okushiswa kuhhavini kusetshenziswa izingxenyekazi zensimbi engagqwali ezilinganiselwe ukusetshenziswa okuqhubekayo kokuthi 200°C. Ukuqondanisa ibhodi nesokhethi kudinga ukunemba ukuze kuvinjelwe ukulimala kokuxhumana phakathi nokwanda kokushisa, ngokuvamile kusebenzisa imiklamo yesixhumi esintantayo esivumela ukunyakaza okuhlukile.

Idizayini Yokuthembeka Kokushisa Kuma-PCB Ebhodi Le-Burn-in

Ukulingisa Okushisayo Nokuhlaziya

Ukulingisa ukushisa ngesikhathi sesigaba sokuklama kukhomba izindawo ezingaba khona ezishisayo futhi kuqinisekisa amasu okuphatha ukushisa ngaphambi kokwenziwa kweprototype. Amamodeli okuhlaziya izakhi eziphelele abikezela ukusatshalaliswa kwezinga lokushisa kulo lonke i-Burn-in Board PCB ngaphansi kokulayisha okugcwele kwamandla, okuvumela abaklami ukuthi bathuthukise ukusatshalaliswa kwethusi kanye nesikhala sezingxenye.

Ukuphatha i-CTE Mismatch

I-coefficient yokungezwani kokunwetshwa okushisayo phakathi kwezinto ze-PCB namaphakheji wedivayisi kudala ingcindezi ye-shear kumajoyinti e-solder ngesikhathi sokuhamba ngebhayisikili. Izakhiwo zokupakisha ezilinganayo zinciphisa ikhasi le-warpage lebhodi ngokulinganisa ukusatshalaliswa kwethusi kusakhiwo songqimba, ngebhalansi yethusi evamile egcinwa ngaphakathi kuka-10% phakathi kwezendlalelo.

Imithetho yedizayini kufanele ikhawulele ukuhluka kokugxilwa kwethusi ukuze kuvinjelwe ukunwetshwa okuhlukile okukhuthaza ukusonteka kwebhodi. Sebenzisa i-symmetrical stack-up ukuze unciphise i-warpage yebhodi ngesikhathi sokuchayeka okushisayo kwesikhathi eside, ubeke amandla nezindiza eziphansi ngokulinganayo mayelana nomugqa omaphakathi webhodi.

Ukukhiqiza Nokulawula Ikhwalithi yama-PCB ebhodi le-Burn-in Board

Izilawuli Zenqubo Ekhethekile

Ukukhiqizwa kwe-PCB ye-Burn-in Board kudinga izilawuli zenqubo ezedlula izidingo ezijwayelekile zokukhiqiza:

• Imijikelezo ye-lamination eyandisiwe - Amaphrofayili wokuchayeka okushisayo aqinisekisa ukwelashwa okuphelele kwe-resin futhi anciphise ingcindezi eyinsalela ebhodini eliqediwe.
• Ukususwa komswakama Ukubhaka ngemva kokuhlanganiswa ku-120°C amahora angu-4-8 kunciphisa umswakama ongaphansi kuka-0.2% ukuvimbela ukubola.
• Ukuqinisekiswa kwe-impedance okulawulwayo - Ukuhlola kuqinisekisa ukucaciswa kuhlangatshezwana nayo kulo lonke ibanga lokushisa lokusebenza.
• Ukuhlola okunamandla amakhulu - Ukuqinisekiswa kokumelana nokushisa emazingeni okushisa aphakeme kuqinisekisa ubuqotho be-dielectric.

Ukuhlolwa Kwangemva Kokukhiqiza

Ukuhlolwa kukagesi kuqinisekisa ukulandelwa kwe-impedance okulawulwayo kanye nezilinganiso zokumelana nokuxhumana ziqinisekisa ukuxhumana okuthembekile ngaphambi kokuthi amabhodi angene enkonzweni. Ukuhlola ngemva kokushiswa kuhlola amabhodi ukuze ashintshe umbala, anciphe, noma ashintshe usayizi obonisa ukonakala kwezinto ezidinga ukushintshwa kwebhodi.

Izicelo ze-Burn-in Board PCBs

Amadivayisi Enkumbulo Nanengqondo

Amasekhethi ahlanganisiwe enkumbulo afaka amadivayisi e-DRAM kanye neFlash ahlolwa kabanzi ukuze kuqinisekiswe ukugcinwa kwedatha okuthembekile. I-Burn-in Board PCBs yokuhlola inkumbulo ivamise ukuthatha amadivayisi angu-64 kuya kwangu-256 ngesikhathi esisodwa, edinga amanethiwekhi okusabalalisa amandla ayinkimbinkimbi ukuze kugcinwe amazinga okushisa afanayo kuwo wonke amabhodi agcwele abantu.

Amandla Semiconductors

Amadivayisi we-semiconductor yamandla afana nama-MOSFET nama-IGBT adinga ukuhlolwa kokushiswa kumazinga okushisa aphakeme e-junction ngenkathi enza amaza alinganisiwe. Lezi zinhlelo zokusebenza zifuna Amabhodi Okushiswa anesisindo esikhulu sethusi esiphatha ukuchithwa kwamandla ukusuka ku-5W ukuya ku-50W indawo ngayinye yedivayisi.

I-Automotive and Aerospace Electronics

I-Automotive and Aerospace electronics igunyaza ukuhlolwa okunwetshiwe kokushiswa ukuze kuhlangatshezwane nezimfuneko zokwethenjelwa ze-AEC-Q100 ne-MIL-STD-883 zezinhlelo zokusebenza ezibucayi zokuphepha. Lezi zimboni zisebenzisa ama-PCB e-Burn-in Board adizayinelwe izinkulungwane zemijikelezo eshisayo, esekela ukuhlolwa kokufaneleka kukho konke ukuphila okunwetshiwe kokusebenza.

Ama-IC wezimboni ezinokwethenjelwa okuphezulu

Amasekhethi adidiyelwe okulawula izimboni athembeke kakhulu ahlolwa ukuze afinyelele izinga lokuhluleka elingaphansi kuka-10 FIT (ukwehluleka ngesikhathi ngamahora ayibhiliyoni edivayisi). I-Burn-in Board PCBs esetshenziswa kulezi zinhlelo zokusebenza kumele inikeze ukuzinza okukhethekile kwesikhathi eside kuzo zonke izindawo zokukhiqiza ezithatha izinyanga noma iminyaka.

Isiphetho

Idizayini ye-PCB ye-Burn-in Board ephumelelayo ihlanganisa ukuphatha okushisayo, ukukhetha kwezinto ezibonakalayo, nezimiso zedizayini zikagesi ezithuthukiselwe ukusebenza okunwetshiwe kwezinga lokushisa eliphezulu. Ukukhetha izinto ezifanele ze-laminate ezinezici zokuguga ezishisayo ezifakazelwe kusungula isisekelo sokusebenza okuthembekile, kuyilapho amanethiwekhi okusabalalisa amandla aqinile kanye nezinhlelo zokuxhuma ziqinisekisa ubuqotho obungaguquki bakagesi kulo lonke ukusebenza okuqhubekayo.

Highleap Electronics Burn-in Board PCB Amakhono

Kwa-Highleap Electronics, sihlinzeka ngezixazululo ezikhethekile zokukhiqiza zokufuna izicelo zokuhlola zokushiswa:

• Ubuchwepheshe bezinto ezisezingeni eliphezulu - I-Polyimide kanye ne-high-Tg FR-408HR i-laminate processing ngokusebenza okuqinisekisiwe kokuguga okushisayo.
• Ukwakhiwa kwethusi esindayo – 2-ounce kuya ku-6-ounce izisindo zethusi ezinokulawula okunembayo kobubanzi bokulandelela ukuze kusatshalaliswe amandla.
• Indawo ethuthukisiwe iyaqedwa - Izinqubo ze-ENIG neziqinile zegolide ezilungiselelwe ukwethembeka kwezinga lokushisa eliphezulu.
• Ukusekelwa kokulingisa okushisayo - Ukuqinisekiswa kwedizayini yangaphambi kokukhiqiza ukuze kuthuthukiswe ukusebenza okushisayo nokuhlonza izinkinga ezingaba khona.
• Amadokhumenti ekhwalithi - Ukulandelelwa okuphelele kwezinto ezibonakalayo kanye nemibiko yokuhlola ukuguga okushisayo kwezinhlelo zokusebenza ezibucayi.

Xhumana nethimba lethu lobunjiniyela ukuze uxoxe ngezidingo zakho zokuhlola ezishisayo futhi ufunde ukuthi izinqubo zethu zokukhiqiza ezikhethekile zingasekela kanjani izinhlelo zakho zokuthembeka kwe-semiconductor.