Metal Core PCB Manufacturing | Umhlahlandlela Ophelele Wenqubo

Isingeniso seMetal Core PCB Manufacturing

I-Metal Core PCB Manufacturing imele ingxenye ekhethekile yokukhiqizwa kwebhodi lesifunda eliphrintiwe elenzelwe ngqo izinhlelo zokusebenza ezifuna ukuphathwa kokushisa okuphezulu. Ngokungafani namabhodi endabuko e-FR-4 , ama-metal core PCB ahlanganisa i-aluminium, ithusi, noma insimbi enikeza amakhono akhethekile okusatshalaliswa kokushisa abalulekile kuma-electronics anamandla amakhulu.

Lo mehluko oyisisekelo ekwakheni wenza ama-MCPCB abaluleke kakhulu ezinhlelweni zokukhanyisa ze-LED, amamojula okuguqulwa kwamandla, kanye ne-elekthronikhi yezimoto lapho ukusebenza kahle kokushisa kuthinta ngqo ukusebenza kanye nokuphila isikhathi eside. Inqubo yokukhiqiza idinga ukulawulwa okunembile kuzo zonke izigaba ukuze kulondolozwe ibhalansi ebucayi phakathi kokuhlukaniswa kukagesi kanye nokuqhuba kokushisa.

Ukuqonda lezi zinqubo zokwenziwa kwe-PCB eziyisipesheli ze-metal core kunikeza amandla onjiniyela nabaklami ukuthi bathuthukise izakhiwo zabo zesekethe ukuze basebenze ngokushisa okushisayo nogesi. Lo mhlahlandlela uhlola isinyathelo ngasinye esibalulekile enqubweni yokukhiqiza, unikeza imininingwane emicabangweni yobuchwepheshe ehlukanisa ukukhiqizwa kwekhwalithi ye-MCPCB.

Ukulungiselela Material in Metal Core PCB Fabrication

Ukukhetha kanye Nokulungiselela I-substrate

Isisekelo sokusebenza ngempumelelo kwe-Metal Core PCB Manufacturing siqala ngokukhetha nokulungiselela izinto ezibonakalayo ngokucophelela. Ama-metal substrates asikwa abe yizilinganiso ezinembile ngokusekelwe ezidingweni zephaneli, ngokukhethwa kwezinto ezibonakalayo okuthonya ngokuqondile ukusebenza okushisayo kanye nokusebenza kahle kwezindleko.

Izinto ezintathu eziyinhloko ze-substrate zinikeza izici ezihlukile:

• Ama-aluminium alloys inikeze ibhalansi ephelele ye-thermal conductivity (kusukela ku-1.0 kuye ku-2.5 W/m·K), isisindo esilula, nokusebenza kahle kwezindleko, okuwenza kube ukukhetha okuvamile kwe-LED kanye nezinhlelo zokusebenza ezivamile zokushisa.
• I-Copper substrates ukuletha ukuchithwa kokushisa okuphakeme (kufika ku-400 W/m·K) ngezidingo ezishisayo kakhulu kodwa ngezindleko zempahla nesisindo esiphezulu kakhulu
• Izinto ezisekelwe ensimbi nikeza izakhiwo ezithile ze-electromagnetic kanye ne-coefficient yokuqhathanisa okushisayo okukhulayo kwezinhlelo zokusebenza ezikhethekile ezidinga ukuzinza kobukhulu

Ukulungiswa Kwengqimba Ye-Dielectric

Isendlalelo se-dielectric insulation sidinga ukunakwa okulinganayo ngesikhathi sokulungiswa kwezinto kunqubo yokukhiqiza ye-mcpcb. Le nto ebamba ukushisa kodwa evalela ugesi ngokuvamile iqukethe izinhlaka ze-epoxy ezikhethekile ezigcwele izinhlayiya zobumba ezivumela ukudluliswa kokushisa kuyilapho kugcinwa ukuhlukaniswa kukagesi.

Ukukhethwa kwe-foil ye-copper ukujiya kuncike ezidingweni zokuthwala okwamanje kanye nekhono lokunamathisela. Izinketho ezijwayelekile zisukela ku-1 oz kuye ku-3 oz wesisindo sethusi kuzinhlelo zokusebenza eziningi zokwenza i-PCB ewumgogodla wensimbi, nethusi elisinda kakhulu elisetshenziselwa ugesi wamanje wamandla aphezulu.

Imisebenzi Yokubhoboza Ekwenziweni Kwe-Metal Core PCB

Ukwakhiwa Kwembobo Eqondile

Imisebenzi yokumba ngokunemba enqubweni yokukhiqiza ye-mcpcb idinga okokusebenza okukhethekile okukwazi ukuphatha ama-substrates ensimbi aqinile ngaphandle kokubeka engcupheni ikhwalithi yembobo. Ukumba ngomshini nge-carbide noma izingcezu ezimbozwe ngedayimane kuseyindlela evamile yezimbobo eziphumela, kugcina ukunemba kobukhulu naphezu kokuqina kwe-substrate.

Ukubhola nge-laser kunikeza izinzuzo ezincane ngokusebenzisa ukwakheka kwemiklamo ephezulu kakhulu lapho ukulinganiselwa komshini kukhawulela osayizi bebhithi yokubhoboza. Imingcele yokumba kufanele ibhekane nobulukhuni bomgogodla wensimbi ukuze kuvinjwe ukwakheka kwe-burr futhi kuqinisekiswe izindonga ezihlanzekile zembobo ezisiza ukucwenga okuthembekile noma ukufakwa kwengxenye.

Ukwelashwa Kwangemva Kokubhoboza

Izinqubo zokuhlanza ngemva kokubhoboza ziba zibaluleke kakhulu ku-Metal Core PCB Manufacturing ukuze kususwe imfucumfucu yensimbi engase ibeke engcupheni ukuhlukaniswa kukagesi. Ukuxhumeka kwemigodi edlulayo kuma-MCPCB ngokuvamile kusebenza imisebenzi kagesi kunezindlela zokushisa, njengoba i-substrate yensimbi isingatha ukushabalaliswa kokushisa okuyinhloko.

Lo mehluko unomthelela ngamasu okubeka futhi uqinisekisa ukuthi izindlela ezishisayo nezikagesi zilungiswa ngokuzimela. Ukususwa kwemfucumfucu ngendlela efanele kuvimbela izikhindi ezingaba khona phakathi kongqimba lwesekethe kanye nengqikithi yensimbi phakathi nezinyathelo zokucubungula ezilandelayo.

Inqubo Ye-Lamination in Metal Core PCB Manufacturing

I-High-Pressure Bonding

I-Lamination imelela isigaba esibaluleke kakhulu enkambisweni yokukhiqiza i-mcpcb, lapho i-substrate yensimbi, ungqimba lwe-dielectric, kanye nethusi lesekethe kuhlangana unomphela ngaphansi kokushisa okulawulwayo kanye nengcindezi. Amapharamitha e-lamination anquma ngqo ikhwalithi yokuxhumana kokushisa phakathi kwezingqimba, okuthinta ukuqhutshwa kokushisa okuphelele kusuka ezingxenyeni kuya enkabeni yensimbi.

Amazinga okushisa okucindezela ngokuvamile asukela ku-170°C kuya ku-210°C kuye ngohlelo lwempahla ye-dielectric, nezingcindezi ezilinganisiwe ukuze kuqedwe i-void ngaphandle kokonakalisa i-substrate yensimbi. Ubude benqubo kanye nephrofayili yokucindezela kufanele kulungiselelwe inhlanganisela yezinto ezibonakalayo ngayinye ukuze kuzuzwe amandla ebhondi aphezulu nokusebenza okushisayo.

Ukuphathwa Okushisayo Ngesikhathi Sokupholisa

Umjikelezo wokupholisa olandela i-lamination udinga ukuphathwa ngokucophelela ukuvimbela i-delamination noma ukuthuthukiswa kokucindezeleka kwangaphakathi. Ukwakhiwa kwe-PCB yensimbi yesimanje kusebenzisa amaphrofayili okupholisa ahleliwe abangela ukwandiswa kokushisa okuhlukile phakathi kwezendlalelo zethusi, i-dielectric, nezensimbi.

Lokhu kunakekela ekulawuleni okushisayo ngesikhathi sokukhiqiza kuhumusha ngqo ekuthembekeni okuthuthukisiwe endaweni yokusebenza yomkhiqizo oqediwe. Amazinga okupholisa alawulwayo avimbela i-warpage futhi aqinisekisa ukuzinza kwe-dimensional kuwo wonke umjikelezo wokuphila webhodi.

I-Solder Mask Application in Metal Core PCB Manufacturing

I-Coating and Curing Process

Ukumbozwa kwemaski e-Solder ku-Metal Core PCB Manufacturing kusebenzela izinjongo ezimbaxambili zokuhlinzeka nge-insulation kagesi nokuchaza izindawo ezithengiswayo zokuhlanganisa izingxenye. Indlela yohlelo lokusebenza, noma ngabe ukuphrinta kwesikrini noma ukumbozwa kwamakhethini, kufanele kufinyelele ukushuba okufanayo endaweni eqinile yensimbi engaphansi.

Amashejuli okwelapha imaski ye-solder adinga ukulungiswa uma kuqhathaniswa namabhodi e-FR-4, njengoba i-thermal mass ye-metal core ithonya ukusatshalaliswa kokushisa phakathi nenqubo yokwelapha. Amaphrofayili okwelapha ajwayelekile asebenzisa amazinga okushisa aphakathi kuka-140°C no-160°C anezikhathi zokuhlala ezinwetshiwe ukuze kuqinisekiswe ukugcwaliswa kwe-polymerization okuphelele.

Ukuthuthukisa Ukuqina

Ugqinsi lwemaski ye-solder luthinta ngokuqondile ukusebenza kokugcina kokushisa kwebhodi nokuthembeka kwenhlangano. Amamaski azacile ahlinzeka ngokuncishiswa kokushisa okungcono okuvela ezingxenyeni ezithile kodwa anikeza ukuvikeleka komshini okuncane, okudinga ukulungiselelwa ngokucophelela okusekelwe ezimfuneko zohlelo lokusebenza.

Ukunamathela kahle kwemaski kungqimba lwe-dielectric kanye nokunemba kobukhulu bokuvuleka kuqinisekisa i-soldering ethembekile kanye nokumelana nemvelo isikhathi eside. Ukuphrinta i-legend yokuhlonza ingxenye kulandela uhlelo lwemaski ye-solder, kusetshenziswa oyinki abelapheka nge-UV abamelana namazinga okushisa ahlanganisiwe.

I-Surface Qeda Ukukhethwa Kwe-Metal Core PCB Fabrication

Izinketho zokuqeda ubuso kunqubo yokukhiqiza ye-mcpcb zithonya ngokuphawulekayo kokubili ukwethembeka komhlangano nokusebenza okushisayo. Okukhethiwe kufanele kulinganisele ukuthengiselana, impilo yeshalofu, ukuqhutshwa kokushisa, nokucatshangelwa kwezindleko eziqondene nezidingo zohlelo lokusebenza.

Izinketho ezijwayelekile zokuqeda indawo zihlanganisa:

• I-ENIG (Electroless Nickel Immersion Gold) inikeza flatness enhle kakhulu yezingxenye ze-pitch-pitch, impilo yeshalofu ephakeme ngaphezu kwezinyanga eziyi-12, namandla okubopha ngocingo okuthembekile, okuyenza ilungele imihlangano ye-MCCBB enokwethenjelwa kakhulu edinga isitoreji esinwetshiwe.
• I-HASL (Hot Air Solder Leveling) inikeza ukuthengiselana okuqinile kanye nezinzuzo zezindleko kodwa ingase idale ukuhlukahluka kogqinsi okuthinta isixhumi esibonakalayo esishisayo, ngezinguqulo ezingenamthofu ezikhethelwa ukuthobela i-RoHS.
• I-OSP (I-Organic Solderability Preservative) iletha izindawo eziyisicaba kanye nokuhambisana nemvelo nempilo yeshalofu emfushane, ilungele amaphrojekthi aphenduka ngokushesha lapho amabhodi eqhubeka ngokushesha ukuze ahlanganiswe

Ukukhetha kokuqeda phezulu akuthinti kuphela ukuthengiselana kodwa futhi nokuhlangana okushisayo phakathi kwezingxenye ezihlanganisiwe ne-PCB. Okunye okuqedwayo kunikeza izici ezingcono zokumanzisa ezithuthukisa ukudluliswa kokushisa kusuka kungxenye yomkhondo ngokusebenzisa amajoyinti e-solder kuya emithonjeni yethusi ku-Metal Core PCB Manufacturing.

Ukuhlola Nokulawula Ikhwalithi Ekwenziweni Kwe-Metal Core PCB

Ukuqinisekiswa Kogesi

Izinqubo zokuhlola eziphelele zihlukanisa Ukukhiqiza kwe-Metal Core PCB okuphrofeshinali ekukhiqizeni okusezingeni eliphansi. Ukuhlolwa kukagesi nge-probe endizayo noma izindlela ezisekelwe endaweni kuqinisekisa ukuqhubeka kwesekethe nokuhlukaniswa, kugxilwe ngokukhethekile ku-voltage wokuqhekeka kwe-dielectric phakathi kwezingqimba zesekethe kanye nomongo wensimbi.

Lezi zivivinyo ziqinisekisa ukuthi ungqimba lokuvikela lugcina ubuqotho balo naphezu kokucindezeleka kokushisa nokomshini kwenqubo yokukhiqiza. Izidingo ezijwayelekile ze-voltage yokuqhekeka zidlula u-2500V kwezicelo eziningi ze-MCPCB , kanye nemingcele ephezulu yezimoto noma i-electronics yezimboni ebalulekile ekuphepheni.

Ukuhlola Okushisayo Nemishini

Ukuhlolwa kokusebenza okushisayo kuqinisekisa izici zokulahla ukushisa ezibalulekile ekusebenzeni kwe-MCPCB. Lokhu kuhlola kungase kuhlanganise izilinganiso ze-impedance eshisayo noma isithombe esishisayo ngaphansi kwezimo ezinikwe amandla ukuze kuqinisekiswe ukuthi ukushisa kugeleza njengoba kuklanywe kusuka ezindaweni ezishisayo kuya engxenyeni engaphansi yensimbi.

Ukuhlolwa kwemishini kuhlola i-delamination, amandla okunamathela ethusi, nokunemba kobukhulu kulo lonke iphaneli. Ukuhlolwa kwamandla e-peel kuqinisekisa ukuthi ibhondi ye-dielectric-to-metal ihlangabezana nokucaciswa okuncane, okuvamise ukudlula u-8 N/mm ngokusebenza okuthembekile.

Ukunamathela kumazinga we-IPC-6012 Class 2 noma Class 3 kuqinisekisa ikhwalithi engaguquki efanele izidingo zohlelo lokusebenza. Ukubhalwa kwezilawuli zenqubo nemiphumela yokuhlolwa kunikeza ukulandeleka okubalulekile ekwenziweni kwe-PCB ewumgogodla wensimbi enokwethenjelwa kakhulu.

Thermal paths and metal-based board constructions

Heat must travel from the component through the board and into the surrounding structure. Substrate, dielectric, copper and attachment details should be considered as one thermal path.

Isiphetho: Ubuhle Ekwenziweni Kwe-Metal Core PCB

Ukukhiqizwa kwe-Metal Core PCB kuhilela izinqubo ezikhethekile eziningi, ngayinye ebalulekile ekuzuzeni ukusebenza kahle kwe-thermal, ugesi, nemishini. Ukusuka ekukhethweni kwezinto ezibonakalayo kuye ekuhlolweni kokugcina, ukulawulwa kwenqubo okunembayo kuqinisekisa ukuthi ama-MCPCB ahlangabezana nezidingo ezidingekayo zama-electronics anamandla amakhulu.

Amakhono we-Highleap Electronics

• Ukukhiqiza Okubanzi kwe-MCPCB - Izinqubo ezithuthukisiwe ezihlanganisa ukubhoboza, ukucwiliswa, ukufakwa kwe-lamination, ukuqedwa kwendawo, nokuhlola.
• Ukuthuthukisa Okushisayo Nogesi - Ukulinganisa ukuchithwa kokushisa, ukuhlukaniswa kukagesi, nokwethembeka kwemishini ngokulawula inqubo enembile.
• Ukusekela kokuphela kuya ekupheleni - Kusukela ku-prototype kuya ekukhiqizeni okukhulu, ukuqinisekisa ukuklama-ukukhiqiza ukusebenzisana kanye nekhwalithi engaguquki.
• Ithimba Lonjiniyela Lochwepheshe - Isiqondiso sobuchwepheshe sokubhekana nezinselele eziyinkimbinkimbi zokushisa ezinhlelweni zamandla aphezulu.

Ukubambisana ne-Highleap Electronics kunikeza onjiniyela nabathuthukisi bemikhiqizo ukufinyelela amakhono akhethekile e-MCPCB kanye nobuchwepheshe obuqinisekisiwe. Xhumana nethimba lethu namuhla ukuze uxoxe ngokuthi singayisekela kanjani iphrojekthi yakho elandelayo ye-elekthronikhi enamandla amakhulu ngezixazululo ze-PCB zensimbi ezithembekile.