Ubuqotho Besiginali ku-ATE PCB: Ukunemba Kwezobunjiniyela Bokuhlola I-High-Speed ​​Semiconductor

Isingeniso: Kungani Ubuqotho Besiginali ku-ATE PCB Design Inquma Ukunemba Kokuhlolwa

Ubuqotho besiginali ekwakhiweni kwe-ATE PCB bunquma ngqo ukunemba kanye nokuphindaphindeka kokuhlolwa kwedivayisi ye-semiconductor. Ezinhlelweni ze-Automatic Test Equipment, amabhodi okulayisha , amabhodi esibonisi , namakhadi e-probe akha indlela ebalulekile yesiginali phakathi kwabahloli namadivayisi ahlolwayo. Kumaza amaningi e-gigahertz anezikhathi zokuphakama kwezinga le-picosecond, ngisho nokungaqhubeki okuncane kwe-impedance noma imiphumela yokuxhumanisa kuhumushela emaphutheni okulinganisa abeka engcupheni imiphumela yokuhlolwa.

The primary challenges include reflection from impedance mismatches, crosstalk between adjacent test channels, and ukuncishiswa kwesignali through lossy transmission paths. These issues become particularly acute when test specifications demand sub-millivolt accuracy across hundreds of parallel channels. Unlike standard PCBs operating at lower frequencies, maintaining signal integrity in ATE PCB applications requires rigorous electromagnetic design discipline where every via, trace corner, and connector transition must preserve signal fidelity throughout the multi-gigahertz spectrum.

Izinselele Zobuqotho Besiginali Kuzicelo ze-ATE PCB ezinesivinini esikhulu

Idizayini ye-PCB yesivinini esiphezulu ye-ATE idinga ukulawulwa okuqinile kwe-impedance ukuze kuncishiswe ukubonakaliswa kanye nokuxoxa nge-crosstalk kuzo zonke iziteshi zokuhlola. Amadivayisi e-semiconductor anamuhla asebenza ngesivinini sewashi esingaphezu kwe-5 GHz, ngamazinga onqenqema lwesignali angaphansi kwama-picosecond ayi-100. Kulezi zivinini, imiphumela yomugqa wokudlulisa iyabusa, futhi konke ukungaqhubeki ngokomzimba kusebenza njengomthombo wokuboniswa okungenzeka noma indlela yokuxhuma.

Ukungaqhutsheki kwe-Reflection kanye ne-Impedance

Ukubukeka kwenzeka lapho i-impedance yesici ishintsha endleleni yesignali. Imithombo evamile yokubonisa kumiklamo ye-ATE PCB ihlanganisa:

• Izixhumi zokuxhuma - Ukushintsha phakathi komhloli kanye nebhodi lokulayisha kudala izinyathelo zokuvimbela ezibonisa izingxenye zesignali ezivame kakhulu.

• Ngokushintshashintsha - Izinguquko zezendlalelo zethula ukungaqhubeki kwe-capacitive ngaphandle kokuthi kuklanywe kahle nge-geometry yephedi elawulwayo.

• Ukwehluka kobubanzi bokulandelela - Ukubekezelelana kokukhiqiza kanye nemikhawulo yomzila kubangela ukuphambuka kwe-impedance ezindleleni zesignali.

• Ukungafani kokuphela - Amanethiwekhi okuphela angafanele ahluleka ukumunca amandla esignali yesigameko, okwenza amagagasi amile.

Ukuchezuka kokuphazamiseka okungu-10-ohm kufrikhwensi yesiginali engu-5 GHz kukhiqiza ukuboniswa okudlula u-10% wegagasi lesigameko, kudala ukucupha okungamanga nokungaqiniseki kokulinganisa.

I-Crosstalk Between Test Channels

I-Crosstalk kumiklamo ye-ATE PCB ivela ekuxhumaneni kwe-electromagnetic phakathi kwemikhondo yesignali eseduze. I-capacitive coupling ibusa kumafrikhwensi aphezulu, kuyilapho ukuhlangana kwe-inductive kuyaqina lapho amasiginali abelana ngezindlela zamanje zokubuya. Ezakhiweni zamabhodi omthwalo aminyene anezikhala zokulandela umkhondo ezingu-0.1mm, i-crosstalk eseduze ingafinyelela ku-−30 dB noma okubi nakakhulu ngaphandle kwamasu afanele wokuzihlukanisa, okubangela ukwehluleka okungamanga ezilinganisweni ezibucayi ze-analog.

I-Attenuation kanye Nokulahlekelwa Kwe-Dielectric

Ukuncishiswa kwesignali kukhuphuka ngakho kokubili imvamisa nobude bokulandelela. Izinto ezijwayelekile ze-FR-4 zibonisa izici zokulahla eduze kuka-0.02, okuholela ekulahlekeni kokufakwa kwe-1-2 dB iyintshi ngayinye ku-5 GHz. Kuzinhlelo zokusebenza ze-ATE ezidinga izindlela zesignali ezingama-intshi angu-24 ukusuka esibonakalayo somhloli ukuya ekuxhumaneni nedivayisi, ukuncipha okukhulayo kwehlisa ukuphakama kwesignali futhi kuhlanekezele imiphetho ye-waveform, kube nomthelela ngokuqondile emamajini esikhathi kanye nemikhawulo kagesi.

Ground Bounce kanye Return Indlela Ubuqotho

Idizayini yendiza yaphansi enganele kanye nezindlela zokubuya eziphazamisile kudala ukugxuma komhlaba okwenza imibhangqwana izwakale eziteshini zesignali. Ngokushintsha phakathi kwezendlalelo zesignali kufanele kugcine izindlela zamanje ezibuyayo ezidlulayo ngokusebenzisa ama-ground aseduze. Ngaphandle kwalokhu kuqhubeka, ama-currents abuyayo aphambukela ezindleleni ezinde, akhulisa i-loop inductance futhi akhiphe umsindo wemodi evamile kuwo wonke amashaneli amaningi.

Amasu Okudizayina Obuqotho Besiginali ku-ATE PCB Izakhiwo

Idizayini yebhodi yokuhlola ephumelelayo ihlanganisa ukulawulwa kwe-impedance, izindlela zokubuya ezilungiselelwe, nezinto ezilahlekelwa kancane ukuze kugcinwe ubuqotho besignali. Imikhuba elandelayo yobunjiniyela ibhekana nezindlela ezibalulekile ezehlisa ikhwalithi yesiginali ezindaweni ezinesivinini esikhulu se-ATE.

I-Impedans elawulwayo kanye ne-Trace Geometry

Umklamo we-impedance olawulwayo ugcina i-impedance enezici ezihlala njalo kuyo yonke indlela yesignali. Kuma-trace angu-50-ohm anesiphetho esisodwa, i-geometry ye-microstrip idinga ukulawulwa okunembile kobubanzi be-trace, ukujiya kwe-dielectric, kanye nesisindo sethusi. Ukusetshenziswa okujwayelekile kusebenzisa ama-trace angu-5-mil ngaphezu kwesikhala se-dielectric esingu-5-mil ukuya ezindizeni zomhlaba, ngokubekezelelana kwe-impedance okungu-±10%.

Ukulungiswa kwe-stripline kunikeza ukuhlukaniswa okuphezulu kwezimpawu ezibalulekile kodwa kudinga isikhala se-dielectric esilinganayo phakathi kwezindiza zokubhekisela. Ukukhethwa kwezinto kuthinta kakhulu ukuzinza kwe-impedance. Ama-laminate aphansi okulahlekelwa njenge-Panasonic Megtron 6 (Dk=3.6, Df=0.002 ku-5 GHz) noma i-laminate ekhethekile ephansi okulahlekelwa (Dk=3.48, Df=0.0037) agcina izakhiwo ze-dielectric ezihambisanayo kuzo zonke izinhlobo zokushisa kanye nemvamisa.

Crosstalk Suppression Strategies

Ukucindezelwa kwe-Crosstalk kuzakhiwo ze-ATE PCB kuhlanganisa ukuhlukaniswa kwejometri, amasu okuvikela, nokubonisa umehluko. Ukugcina isikhala sobubanzi bokulandelela obungu-3× phakathi kwamasignali aseduze kunciphisa ukuhlangana kwe-capacitive ngezansi −40 dB ekucushweni kwe-stripline evamile. Izindlela zokuqapha eziphansi phakathi kwamashaneli azwelayo zinikeza ukuhlukaniswa okwengeziwe kodwa kudla isikhala somzila esibalulekile emiklamo yebhodi yomthwalo ocinene.

Ukubhanqa okuhlukile komzila kunikeza ukwenqatshwa ngokwemvelo komsindo kumasiginali wedijithali anesivinini esikhulu. Ukuhlanganisa okuqinile phakathi kokulandela okuhlukile (isikhala ≤ ububanzi bokulandelela) kukhulisa ukwenqatshwa kwemodi evamile kuyilapho kunciphisa ukuhluka kokuvinjwa okuhlukile. Emabhodini okulayisha ezendlalelo eziningi, ukushintshana kwezendlalelo zesignali kunciphisa i-crosstalk ekude ngokusebenzisa imiphumela yokukhansela insimu phakathi kwezingqimba eziseduze.

Umzila Wokubuyisela Nokuphathwa Kwaphansi

Ukuqhubeka kwendlela yokubuyisela kunquma ubukhulu bokugxuma komhlaba kanye nobuqotho besignali yemvamisa ephezulu kumadizayini we-ATE PCB. Zonke izingqimba zesignali zidinga indiza yaphansi eseduze, engaphazamiseki ukuze inikeze izindlela zamanje ezibuyayo ezinezihibe eziphansi. Ngokushintsha phakathi kwezendlalelo zesignali kufanele kufake phakathi umhlabathi ngokuthunga phakathi kwesikhala esingu-λ/20 ukuze kugcinwe ukuqhubeka kwendlela yokubuyisela kuzo zonke izinguquko zesendlalelo.

Ukuhlukana kwendiza ephansi ngaphansi kwamasignali anesivinini esikhulu kudala ukuchezuka kwamanje okubuyayo okwandisa i-loop inductance futhi kukhanye ukuphazamiseka kazibuthe. Amadizayini webhodi lokulayisha kufanele ahambise amasignali aqonde ngqo kokuhlukana kwendiza yaphansi okudingekayo noma anikeze ama-capacitor okuthunga aphansi ukuze ahlukanise izifunda.

Ukuthuthukisa Isixhumi nesixhumi esibonakalayo

Ukuxhumana kwe-ATE phakathi komhloli nebhodi lokulayisha kumelela ukungaqhubeki okubalulekile okudinga ukulungiselelwa ngokucophelela. Izixhumi ezinesivinini esikhulu kumele zigcine i-impedance elawulwayo ngesifunda sokuxhumana, ngokuvamile zisebenzisa imiklamo yokuxhumana ye-coaxial noma ye-twinaxial. Ukwenziwa ngcono kwesixhumi esibonakalayo kufaka phakathi ukunciphisa ubude be-stub kusuka kumaphedi okuxhuma, ukusebenzisa ukubhoboza emuva ukuze uthole ama-pass-hole, kanye nokuqhathanisa ukuthinteka komkhondo ekucacisweni kwesixhumi.

Izinhlelo zesimanje zokuhlola zisebenzisa izixhumi zokuminyanisa eziphakeme kakhulu ezinokuxhumana okuhlanganisiwe komhlabathi. Idizayini yokusebenzelana efanele yokukhwelana idinga ijiyomethri yephedi elawulwayo, incazelo yemaski ye-solder, kanye nokuqedwa kwendawo eyigolide ukuze kuqinisekiswe ukumelana nokuxhumana okungaguquki kanye ne-impedance.

Ukulingisa Nokuqinisekisa Kobuqotho Besiginali ye-ATE PCB

Ukulingisa kwe-SI/PI kusiza onjiniyela baqinisekise ukuthi i-impedance, i-crosstalk, nokusebenza kokuzindla ngaphambi kokwenziwa kwebhodi lokuhlola. Izixazululi zensimu ye-Electromagnetic ezifana ne-Ansys HFSS, i-Keysight ADS, ne-Siemens HyperLynx zikhipha amapharamitha womugqa wokudlulisela oncike kumafrikhwensi kujometri ye-PCB ebonakalayo.

I-Pre-Layout Electromagnetic Analysis

Ukulingisa kwesakhiwo sangaphambili kusungula ukulungiselelwa kwesitaki okunokwenzeka kanye nempokophelo ye-impedance. Izixazululi zenkambu enezinhlangothi ezimbili zihlola ngokushesha i-trace geometries, zibala i-impedance yesici, ukungaguquguquki kwe-dielectric okusebenzayo, nokulibaziseka kokusabalalisa ekucushweni kwezingqimba ezihlukahlukene. Lokhu kuhlaziya kuqondisa ukukhethwa kwezinto futhi kunquma ububanzi bokulandelela okusebenzayo ngaphambi kokuqala komzila onemininingwane.

Ukuqinisekiswa kwe-post-Layout

Ukulingiswa kwe-post-layout kuqinisekisa izindlela zesignali eziphelele ezihlanganisa izixhumi, i-vias, namanethiwekhi wokunqanyulwa. Imodeli ye-geometry enemininingwane yesixazululi sensimu enezinhlangothi ezintathu ehlanganisa ngokushintsha kwemiphongolo, izakhiwo zephedi, nezifunda zokuqalisa izixhumi. Ukulingisa umdwebo wamehlo wembula ukuthi amasiginali atholiwe agcina amamajini esikhathi anele namazinga kagesi ngemva kokusabalala ngesiteshi esiphelele.

Ukuqinisekiswa Komzimba Nokuhlolwa

Ukuqinisekisa okuphathekayo kuqinisekisa ukuqagela kokulingisa ngezilinganiso zokuhlaziya inethiwekhi ye-vector kanye nokuchazwa kwezinhlamvu ze-oscilloscope ezinesivinini esikhulu. Izilinganiso zepharamitha ye-S zamabhodi okuhlola akhiwe ziqinisekisa isilawuli sokuvimbela futhi zilinganise ukulahleka kokufakwa kuwo wonke amafrikhwensi okusebenza. Ukuhlolwa kokubuyela emuva ngeziteshi ze-ATE kuqinisekisa ubuqotho besignali yesistimu ngaphansi kwezimo ezingokoqobo zokusebenza.

Okucatshangelwayo Okubalulekile kanye Nesitaki Kobuqotho Besiginali ye-ATE PCB

Ukukhetha i-laminate efanele kanye nesakhiwo sokunqwabelanisa kubalulekile ekwakhiweni kwe-ATE PCB ukuze kudluliselwe isignali enesivinini esiphezulu. Izakhiwo zezinto ezibonakalayo zinquma ngokuqondile izici zokusabalalisa isignali, nge-dielectric ehlala ithinta i-impedance kanye nokulibaziseka kokusabalalisa kuyilapho isici sokusabalalisa sibusa ukuncishiswa kwesignali.

Izinto Zokusebenza Ze-Dielectric Ezokulahlekelwa Okuphansi

Ama-laminates alahlekelwa kancane anciphisa ukuncishiswa kwesignali ezindleleni zokudlulisa ezinde ezijwayelekile zemiklamo yebhodi lomthwalo. Izinto ezijwayelekile ze-FR-4 ezinezici zokulahla ezizungeze u-0.02 ku-1 GHz zikhiqiza ukulahlekelwa okungamukeleki kumasignali e-multi-gigahertz. Izinto ezithuthukisiwe ezifana ne-Isola Astra MT77 (Df=0.0017 ku-10 GHz) noma i-Panasonic Megtron 7 (Df=0.0014 ku-28 GHz) yehlisa ukulahlekelwa kokufaka ngo-50% noma ngaphezulu uma kuqhathaniswa nama-substrates avamile.

I-Stack-up Architecture

Idizayini yesitaki ye-multilayer yobuqotho besignali ezinhlelweni ze-ATE PCB ilandela izimiso ezithile zezakhiwo. Izendlalelo zesignali zidinga izindiza eziyisithenjwa eziseduze ezinezikhala ezincane ze-dielectric ukuze kuncishiswe i-impedance yesici futhi kukhuliswe ukuqukatha kwenkundla. Izitaki ezijwayelekile zesivinini esikhulu ezinye izingqimba zesignali nezendlalelo zendiza, zigcina ukulingana ukuze kunqandwe i-warpage ngenkathi kunikeza izendlalelo zomzila eziningi.

Izendlalelo zamasignali abalulekile zisebenzisa ukucushwa kwe-stripline phakathi kwezindiza eziqinile zaphansi ukuze zihlukaniseke kakhulu ekuphazamisekeni kwangaphandle. Amandla namabhanoyi endiza yaphansi kufanele agcine isikhala esiseduze ngokusebenzisa izinto eziwumgogodla omncane ukuze kuncishiswe ukuvinjelwa kwenethiwekhi yokusabalalisa amandla.

Isisindo Sethusi kanye Nokwelashwa Kwangaphandle

Ukuqina kwethusi kuthinta kokubili ukulawulwa kwe-impedance kanye nezindlela zokulahlekelwa kwe-high-frequency. Ikhopha yehalf-ounce (17 μm) ihlinzeka ngokusebenza okwanele kuyilapho inika amandla amajiyometri okulandelela acinene ukuze kuvinjwe amandla okulawula. Kumafrikhwensi angaphezu kuka-5 GHz, umphumela wesikhumba uhlanganisa okwamanje endaweni yekhondatha, okwenza ubulukhuni obungaphezulu bube nomthelela omkhulu wokulahlekelwa.

I-foil ehlanekezelwe enephrofayili encishisiwe yokuba roughness yehlisa ukulahleka kwe-conductor ngo-20-30% uma kuqhathaniswa nethusi elijwayelekile eline-electrodeposited. Ukwehluka kogqinsi lwe-Dielectric kuhumusha ngokuqondile ukuchezuka kwe-impedance kumiklamo elawulwayo ye-impedance, edinga ukulawulwa okuqinile kokubekezelelana okungu-±10% noma okungcono.

Imikhuba Engcono Kakhulu Yobuqotho Besiginali Yebhodi Lokulayisha

Layisha amadizayini ebhodi obuqotho besignali ezinhlelweni zokusebenza ze-ATE PCB kufanele abhekane neketango lesignali eliphelele elivela kusixhumi esibonakalayo somhloli ngokusebenzisa abathintwayo bedivayisi. Ukuqaliswa okuyimpumelelo kudinga:

• Izindiza zokubhekisela eziqhubekayo - Izindiza zomhlaba ezingaphazanyiswa ngaphansi kwezibonakaliso zesivinini esikhulu zigcina izindlela zamanje ezibuyayo ezihambisanayo.

• Kulawulwa ngomklamo - Ama-vias abhobozwe ngemuva asusa izingcezu ezidala ukubonakaliswa okungaphezu kwamaza angu-5 GHz.

• Ukungaqhubeki okuncishisiwe - Ukushintshashintsha kwe-trace okuncishisiwe kuma-connector pads kuqinisekisa ukulayisha kwe-capacitive.

• Ukubekwa kwamaphuzu okuhlola amaqhinga - Ubude obuncishisiwe be-stub buvimbela ukuphazamiseka kwe-impedance ezindleleni zokulinganisa.

Idizayini ye-Via idinga ukunakwa okukhethekile ekwakhiweni kwebhodi lomthwalo ominyene. Ngezimbobo zembobo dala ama-stubs ngezansi kwesendlalelo sesignali esizwakala kumaza ngokuphambene ngokulingana nobude be-stub. Izimpumputhe nezingcwatshiwe zigwema izinkinga ze-stub ngokuphelele kodwa zandisa inkimbinkimbi yokukhiqiza.

Izifunda zokuqalisa isixhumi zidinga idizayini ecophelelayo ukuze kuncishiswe ukungaqhubeki kokuphazamiseka kusixhumi esibonakalayo somhloli. I-Ground nge-array ezungezile isignali nge-vias inikeza izindlela zokubuya ezivimbela kancane futhi inciphise ukugxuma komhlaba ngesikhathi sokushintsha ngesivinini esikhulu.

Isiphetho: Ukuqinisekisa Ukuhlolwa Okunokwethenjelwa Okushesha Ngesivinini Ngobuqotho Besiginali

Ubuqotho besignali ekwakhiweni kwe-ATE PCB kunquma ukunemba kwesilinganiso namandla esistimu yokuhlola kuzo zonke izimfuneko ezikhulayo zokusebenza kwe-semiconductor. Ukuqaliswa okuyimpumelelo kuhlanganisa imigqa yokudlulisela elawulwayo kwe-impedance, ukunqwabelaniswa kwesendlalelo okulungiselelwe, izinto ezilahlekelwayo kancane, kanye nokulingisa kozibuthe kagesi okuphelele kuyo yonke inqubo yokuklama.

Ukukhethwa kwezinto, ukwakheka kwezitaki, nezixhumi zokuxhumana kufanele kusebenze ndawonye njengohlelo oluphelele kunezimpokophelo ezizimele zokuthuthukisa. Ukulingisa kuqinisekisa imiklamo ngaphambi kokwenziwa, kuyilapho ukuhlola ngokomzimba kuqinisekisa ukusebenza kwangempela kufana nezibikezelo.

I-Highleap Electronics iletha izixazululo ze-ATE PCB ezithuthukisiwe nge:

• Ukwenziwa kwe-impedance elawulwayo - Ukubekezelelana kwe-impedance okuqinisekisiwe ngaphakathi kwe-±10% kuyo yonke ingxenye yomugqa wokudlulisela.

• Ubuchwepheshe bezinto ezilahlekelwa kancane - Usekelo oluphelele lokukhetha i-laminate oluhlanganisa i-Megtron, i-Isola, kanye ne-substrates ekhethekile ye-laminate elahlekelwa kancane kakhulu.

• Amakhono okuhlola aphelele - Ukuqinisekiswa kwepharamitha ye-S kanye nokuhlolwa kukagesi kuqinisekisa ukusebenza kobuqotho besiginali ngaphambi kokulethwa.

• Ukubambisana kobunjiniyela - Ukusekelwa okuqondile kobuchwepheshe ukuze kuthuthukiswe ubuqotho besiginali yezidingo ezithile zokuhlolwa kwe-semiconductor.

Xhumana nethimba lethu lobunjiniyela ukuze nixoxe ngendlela esingathuthukisa ngayo ubuqotho besiginali kuphrojekthi yakho elandelayo ye-ATE PCB, siqinisekise ukunemba kokulinganisa kuyo yonke imvamisa yokusebenza.