Iyini i-Integrated Circuit (IC) kanye nezinhlobo zayo

Yasungulwa ngokuzimela nguJack Kilby noRobert Noyce maphakathi nekhulu lama-20, isekethe ehlanganisiwe yaphawula intuthuko enkulu kwezobuchwepheshe. Ukwakhiwa ngempumelelo kukaKilby kwe -IC yokuqala esebenzayo ngo-1958 kwashukumisa ubuchwepheshe be-semiconductor ukuba bube yitshe lesisekelo lokusungula izinto ezintsha ngogesi. Lo mhlahlandlela ophelele uhlose ukuhlinzeka ngokuhlola okuningiliziwe kwamasekethe ahlanganisiwe, izinhlobo zawo, ukuhlukaniswa, izimiso zokuklama, izinqubo zokwakha, kanye nezinhlelo zokusebenza, okunakekela abantu abafuna ukuqonda okujulile lobu buchwepheshe obubalulekile.

Iyini Isekethe Edidiyelwe?

Isekethe ehlanganisiwe, evame ukubizwa ngokuthi i-microchip noma i-IC chip, iyisekethe encane kagesi equkethe izingxenye ezahlukahlukene ezifana nama-resistor , ama-diode , ama-transistors, nama -capacitor . Lezi zingxenye zihlelwe ngendlela eyinkimbinkimbi ezintweni ze-semiconductor, ngokuvamile i-silicon. Umklamo ohlangene wama-IC uvumela ukufezeka kokusebenza kwe-elekthronikhi okuyinkimbinkimbi ngaphakathi kwephakeji elincane, okwenza kube lula ukudalwa kwamadivayisi kagesi asebenza kahle futhi anamandla.

Izinhlobo Zesekhethi Ezihlanganisiwe

Amasekhethi ahlanganisiwe angahlukaniswa ngokuya ngemibandela ehlukahlukene, okuhlanganisa usayizi we-chip, ukujiya kwe-chip, umsebenzi, nokwakhiwa.

Ukuhlukaniswa ngosayizi we-Chip

1. Ukuhlanganiswa Kwezikali Ezincane (SSI): Isigaba sokuqala sokuthuthukiswa kwe-IC, esifaka inani elilinganiselwe lezingxenye (amasango angu-3 ukuya kwangu-30) ngaphakathi kwe-chip. I-SSI isetshenziselwa imiklamo yesekethe elula njengamasango e-logic ayisisekelo, amadekhoda, nama-multiplexer.
2. Ukuhlanganiswa Kwesikali Esimaphakathi (MSI): Ngomthamo wangaphakathi wamasango angu-30 kuya kwangu-300, i-MSI inika amandla amasekhethi ngamakhono afana nemisebenzi ye-arithmetic, ukucubungula idatha, nezinhlelo zokulawula. I-MSI ilungele izinhlelo zokusebenza ezifana nama-adder, subtractors, namarejista ahlukahlukene.
3. Ukuhlanganiswa Kwesikali Esikhulu (LSI): Imele ingqophamlando ebalulekile ekuthuthukisweni kwe-IC. I-chip ye-LSI ingabamba isistimu engaphansi ephelele (amasango angu-300 kuya kwangu-3000) ku-chip eyodwa, isiza ukukhiqizwa kwamayunithi ememori ye-microprocessor kanye nemisebenzi yedijithali eyinkimbinkimbi.
4. Ukuhlanganiswa Kwesikali Esikhulu (VLSI): Ingqikithi yobuchwepheshe be-IC, i-VLSI iletha uguquko ekwakhiweni nasekukhiqizeni amasistimu kagesi. Ivumela ukumisa amasango angaphezu kwezinkulungwane ezintathu ku-chip eyodwa, okubalulekile kumaphrosesa esignali athuthukile, ama-microcontrollers, kanye Neziyingi Ze-Application-Specific Integrated Circuits (ASICs).

Ukuhlukaniswa ngokuqina kwe-chip

1. I-Thin Film IC: Kwenziwe ngokufaka ungqimba oluncane lwempahla ekwazi ukumelana nengcindezi kanye ne-conductive ku-substrate kusetshenziswa amasu afana ne-sputtering noma i-Chemical Vapor Deposition (CVD). Inikeza ukunemba okuphezulu, okufanelekile kumaphrojekthi afaka ama-resistors anembile nama-capacitor.
2. Ifilimu Eminyene IC: Ngezendlalelo ezidiphozithi ezijiyile, kulula ukwakha futhi konga kakhulu ngaphansi kwezimo ezifanayo. Ingakwazi ukuphatha amazinga aphezulu wamandla, iyenze ifaneleke kangcono amaphrojekthi afana nezilawuli zikagesi kanye nezikhulisi.
3. I-Monolithic IC: Ihlanganisa izingxenye ezihlukene njengezimelaphi, ama-capacitor, ama-transistors, nama-diode ku-substrate eyodwa ye-semiconductor eyenziwe nge-silicon. Ngenxa yezingxenye ezixhumene ngokuqinile, ithuthukisa ukusebenza, ukwethembeka, futhi inciphisa ukusetshenziswa kwamandla.
4. IHybrid noma i-Multi-Chip IC: Isebenzisa izindlela zokubopha izintambo noma i-flip-chip, ixhuma ama-chips amaningi. Abaklami bangathuthukisa amakhono engxenye ngayinye ngokusekelwe ezidingweni, bathuthukise kakhulu ukwenziwa ngokwezifiso kwephrojekthi kanye nokuvumelana nezimo.

Ukuhlukaniswa nge-Chip Function

1. I-Digital Integrated Circuit: Icubungula idatha kanambambili futhi isebenzise amasignali ngamavelu amabili angaba khona, u-0 no-1. Izibonelo zifaka ama-microprocessors, ama-digital signal processors, nama-microcontrollers. Lezi ziwumgogodla wezinhlelo zesimanje zekhompyutha nezokuxhumana.
2. I-Analog Integrated Circuit: Isetshenziselwa ukucubungula amasignali aqhubekayo ashintsha kahle ngokuhamba kwesikhathi. Izibonelo ama-amplifiers okusebenza, izilawuli zikagesi, nama-Analog-to-Digital Converters (ADCs).
3. Umjikelezo Ohlanganisiwe Wesiginali: Inhlanganisela yezingxenye ze-analog nedijithali ebhodini elilodwa, okuvumela ukusebenzisana phakathi kwezizinda zedijithali nezomhlaba wangempela. Idinga ukulawula okunembile kanye nezinhlelo zokusebenza ezibandakanya ukuguqulwa kwe-analog kuya kwedijithali kanye nedijithali-kuya-analogi.
4. Power Management IC: Ilawula futhi isabalalise amandla ngaphakathi kwamasistimu kagesi, iqinisekisa ukusebenza kahle kwamandla ngenkathi inweba impilo yebhethri. Izibonelo zifaka izilawuli zikagesi, iziguquli zamandla, nama-IC wokushaja ibhethri.
5. I-RF IC: Yakha umnyombo wezinhlelo zokuxhumana ezingenantambo, ezihlome ngama-oscillator, izikhulisa-msindo ze-RF, ama-transceiver, nezixube ukuze kucutshungulwe amasignali amaza aphezulu, okugqugquzela ukuthuthukiswa kwe-Wi-Fi, omakhalekhukhwini, nezinhlelo zokuxhumana ngesathelayithi.
6. I-Microcontroller: Ifakwe inkumbulo, iyunithi yokucubungula emaphakathi, nezindawo zokufaka/okukhiphayo, yakha isistimu yekhompuyutha ephelele efanele amadivayisi we-inthanethi Yezinto, amasistimu ashumekiwe, namaphrojekthi ezishintshayo.
7. I-Memory IC: Ihlanganisa inkumbulo ye-flash, Inkumbulo Yokufinyelela Ngokungahleliwe (i-RAM), Inkumbulo Yokufunda Kuphela (i-ROM), ne-EEPROM, ehlinzeka ngemisebenzi yokugcina nokuthola ulwazi lwedijithali.
8. Inzwa ye-IC: Iguqula izenzakalo zomhlaba wangempela ezifana nezinga lokushisa, ukukhanya, ukucindezela, nokunyakaza kube amasignali kagesi.
9. I-Application-Specific Integrated Circuit (ASIC): Izingxenye ezidizayinelwe ngokwezifiso zezinhlelo zokusebenza ezithile, ukuthuthukisa ukusebenza nokusebenza kahle ngokunciphisa izingxenye ezingadingekile. Isetshenziswa kakhulu ekubhalweni kwemfihlo, ekucubunguleni izithombe, nasekucubunguleni izignali imisebenzi.
10. I-Field-Programmable Gate Array (FPGA): I-IC yenhloso evamile esetshenziselwa ukwenza imisebenzi ethile ngemva kokukhiqiza. Izibonelo zifaka phakathi ukucutshungulwa kwesignali yedijithali, i-PCB prototyping, kanye nokusheshisa ihadiwe.
11. Isistimu-on-Chip (SoC): Ihlanganisa imisebenzi ehlukahlukene ku-chip eyodwa, njengokuxhumana, inkumbulo, ukucubungula, nezixhumi ezibonakalayo ze-I/O.
12. I-Voltage Regulator Module (VRM): Ibalulekile kumadivayisi azwelayo, ukulawulwa kwe-VRM kunikeza amandla kagesi ezingxenyeni ze-elekthronikhi ukuze kuqinisekiswe ukuhlinzekwa kwamandla okusebenzayo nokuzinzile.
13. Ijeneretha yewashi: Ikhiqiza amasignali esikhathi anembayo ukuze ivumelanise izingxenye ezihlukene ngaphakathi kwezinhlelo ze-elekthronikhi, ingxenye ebalulekile yokugcina ukuvumelanisa nobuqotho bedatha.
14. Bonisa Umshayeli IC: Ilungiselela idatha ye-pixel kanye nezilinganiso zokuvuselela, ilawula ukusebenza kwesibonisi kwamadivayisi afana neziqapha namaselula, iqinisekisa okulungile nokubushelelezi okukhiphayo okubukwayo.
15. Isihlelamsindo: Isetshenziselwa ukukhulisa nokucubungula amasiginali omsindo, asetshenziswa kakhulu ku-PCBA ye-electronics yabathengi njengama-headphone, izidlali zomsindo, nezipikha.

Idizayini Yesekhethi Edidiyelwe

Ukwakhiwa kwamasekethe ahlanganisiwe kuhlanganisa kokubili izizinda ze-analog nedijithali, ngasinye sinesethi yaso yezimiso, izingxenye, kanye nezindlela.

I-Analog Design

Idizayini ye-analogi ibandakanya ukucutshungulwa nokusetshenziswa kwamasignali aqhubekayo, njengevidiyo, okomsindo, nokokufaka kwenzwa. Ekwakhiweni kwe-analog IC, onjiniyela basebenza ngamasignali ashintsha kahle ngokuhamba kwesikhathi futhi angabamba amanani ngaphakathi kwebanga elithile. Inhloso eyinhloko ukukhulisa ngokunembile, ukuhlunga, nokuguqula lawa masignali ukuze kuzuzwe imiphumela oyifunayo.

Itshe legumbi lomklamo we-analog ama-amplifiers asebenzayo, asebenza njengezici eziyinhloko zokukhulisa kanye nesimo sesignali. Izingxenye ze-Passive ezifana nama-capacitor, ama-resistors, nama-inductors nazo ziyasetshenziswa ekwakhiweni kwe-analog ukuqinisekisa ukusebenza okunembile kwesekethe ye-analog.

Idizayini ye-analogi ephumelelayo idinga ukuqonda okuphelele kokuhlaziywa komsindo, ukuziphatha kwe-semiconductor, nokuzwela kwesekethe. Onjiniyela kufanele bacubungule ngokucophelela amapharamitha ahlukahlukene afana nokusetshenziswa kwamandla, ikhwalithi yesiginali, nokungavikeleki komsindo ukuze benze amasekethe e-analog athembekile.

I-Digital Design

Emkhakheni wedizayini yedijithali, amasiginali kanambambili anamanani anguziro noma oyedwa ayasetshenziswa. I-Digital ICs icubungula lawa masignali isebenzisa amasango anengqondo ukwenza imisebenzi ehlukahlukene njengokugcinwa kwedatha, ukusebenza kwe-arithmetic, kanye nokwenza izinqumo. Le nqubo yokuklama iqinisekisa ukudluliswa kwesignali okunembile, ukusetshenziswa kwamandla okuphansi, nokucubungula idatha okuphumelelayo.

Abaklami bedijithali bagxile ezingxenyeni ezinjengamasango anengqondo, ama-flip-flops, amarejista, nama-multiplexers. Izindlela ezifana ne-Boolean algebra kanye nemishini ye-finite state isetshenziswa ukudala amasistimu edijithali ayinkimbinkimbi. Ukuhlaziya isikhathi kudlala indima ebalulekile ekuqinisekiseni ukusebenza okuvumelanayo kanye nokuvimbela izinkinga ezifana ne-signal skew nezimo zomjaho.

Idizayini yedijithali inikezela ngezinzuzo njengokungavikeleki komsindo okuphezulu, ukulawula okunembayo, nokuphindaphinda kalula. Isekelwe kumayunithi enkumbulo, ama-microprocessors, nama-digital signal processors, ashayela imisebenzi yamadivayisi edijithali namakhompyutha.

Ukwakhiwa Kwesekethe Edidiyelwe

Ukwakhiwa kwamasekhethi ahlanganisiwe kuhilela uchungechunge lwezinqubo eziyinkimbinkimbi ezihloselwe ukwenza izingxenye ze-elekthronikhi ezincane kuma-semiconductor substrates.

Ukulungiswa kweSilicon Wafer

Ukwenziwa kwamasekethe ahlanganisiwe kuqala ngokwenziwa kwama-wafers e-silicon. Lena impahla ye-semiconductor ekhethelwe izakhiwo zayo zikagesi ezinhle kakhulu kanye nobuningi. Ama-wafer e-silicon acutshungulwa ukuze afinyelele izinga eliphezulu lokuhlanzeka nokufana.

I-Photolithography

Ungqimba lwe-photoresist lusetshenziswa ku-wafer ye-semiconductor, kulandelwa ukusetshenziswa kwe-solder mask. Le nqubo idala iphethini isebenzisa ukukhanya kwe-ultraviolet ku-photoresist. Le phethini ichaza ukwakheka kwesekethe eyinkimbinkimbi ye-microchip. Izindawo ezivezwe ku-photoresist zisebenza ngamakhemikhali njengemaski ebambayo.

Ukuhlala

Ngesikhathi senqubo yokunamathisela, izingxenye ezithile zezinto ze-silicon ku-wafer zisuswa ngokukhetha ngokusekelwe kuphethini edalwe ngesikhathi se-photolithography. Izindlela ezihlukene, ezifana nokucwiliswa okumanzi noma ukucwiliswa okomile (i-plasma etching), zisetshenziswa ukuze kuqoshwe izakhi zesekethe ezidingekayo.

Ukufakwa kwe-ion

Yethula ukungcola okuthile noma ama-dopants kusiluli se-silicon, ishintsha izici zikagesi ze-silicon, okuholela ezindaweni ezinezici ezihlukile zokuqhuba.

Ukuxhuma

Isetshenziselwa ukwakha izendlalelo zokuvikela ku-silicon wafer. Ngokubeka iwawa emazingeni okushisa aphezulu endaweni enomoya-mpilo, kwakheka ungqimba oluncane lwe-silicon dioxide. Lezi zingqimba ezivikelayo zivimbela ukuxhumana kukagesi okungahlosiwe phakathi kwezingxenye ezahlukene.

Isimo

Enqubweni yokubeka, amafilimu amancane ezinto ezihlukahlukene asetshenziswa ebusweni be-wafer. I-Chemical vapor deposition kanye ne-Physical Vapor Deposition (PVD) izindlela zokubeka ezivame ukusetshenziswa.

Ukwenziwa kwensimbi

Kubandakanya ukubekwa kwezingqimba zensimbi ukuze kusungulwe ukuxhumana phakathi kwezingxenye ezihlukahlukene zesekethe. Lezi zendlalelo zensimbi zenza izindlela ezivumela amasignali ukuthi ageleze phakathi kwezingxenye ezihlukene ezixhunywe kuma-microchips, njengama-diode, ama-transistors, nokuningi.

Izicelo Zesekhethi Edidiyelwe

Amasekethe ahlanganisiwe anezinhlelo zokusebenza eziningi emikhakheni eyahlukene, okuhlanganisa ukubala, ukuxhumana, izinto zikagesi zabathengi , izimoto, ezempilo, kanye nokwenza izinto ngokuzenzakalela kwezimboni.

Ikhompyutha Nokuxhumana

Ama-IC angumgogodla wezinhlelo zesimanje zekhompuyutha nezokuxhumana. Ama-Microprocessors, ama-memory chips, nama-digital signal processors ayingxenye ebalulekile kumakhompyutha, ama-smartphone, namadivayisi enethiwekhi. Lawa ma-IC anika amandla ukucutshungulwa, ukugcinwa, kanye nokudluliswa kwenani elikhulu ledatha, okuqhuba ukusebenza komhlaba wedijithali.

Consumer Electronics

Kuma-electronics abathengi, ama-IC asetshenziswa kumadivayisi amaningi, kufaka phakathi amathelevishini, izinhlelo zomsindo , amakhamera , kanye nezinto zasekhaya . Lawa ma-IC athuthukisa ukusebenza, ukusebenza kahle, kanye nokusebenza kwemikhiqizo yabathengi, ahlinzeka abasebenzisi ngezici ezithuthukisiwe kanye nokuhlangenwe nakho okuthuthukisiwe komsebenzisi.

Izithuthi

Imboni yezimoto ithembele kakhulu kuma-IC ezinhlotsheni ezahlukahlukene zokusebenza, njengeyunithi yokulawula injini, izinhlelo zokuzijabulisa, izinhlelo zokusiza abashayeli ezithuthukisiwe (i-ADAS), kanye nokuphathwa kwamandla ezimoto zikagesi . Ama-IC anegalelo ekuphepheni, ekusebenzeni kahle, kanye nokuxhumana kwezimoto zesimanje.

Ukunakekela impilo

Kwezokunakekelwa kwempilo, ama-IC asetshenziswa kumadivayisi ezokwelapha kanye nemishini yokuxilonga. Izibonelo zifaka phakathi ama-pacemaker, amaphampu e-insulin, izinhlelo zokuthwebula izithombe, kanye neziqaphi zezempilo ezigqokwayo. Lawa ma-IC avumela ukulawula okunembile, ukuqapha, kanye nokucubungula idatha, ukuthuthukisa ukunakekelwa kweziguli kanye nemiphumela yezokwelapha.

Ukuzenzekela kweZimabhizinisi

Ama-IC adlala indima ebalulekile ekusebenzeni ngokuzenzakalela kwezimboni, lapho asetshenziswa khona kubalawuli be-logic abahlelekayo (ama-PLC), izinzwa, kanye nezinhlelo zokulawula izimoto . Lawa ma-IC akhuthaza ukuzenzekela, ukuqapha, kanye nokulawula izinqubo zezimboni, okuthuthukisa umkhiqizo kanye nokusebenza kahle.

Amathrendi Akusasa Kusekhethi Edidiyelwe

Njengoba ubuchwepheshe buqhubeka nokuthuthuka, amasekethe ahlanganisiwe kulindeleke ukuthi athuthuke ngokuqhubekayo, aqhutshwa amathrendi asafufusa kanye nezinto ezintsha.

I-Miniaturization kanye nokukala

Umkhuba wokwenza izinto ezincane kanye nokukala uzoqhubeka, nama-IC aba mancane futhi abe namandla kakhulu. Amasu okukhiqiza athuthukile, afana ne-extensive ultraviolet (EUV) lithography, azokwenza ukukhiqizwa kwama-IC anokuminyana okuphezulu nakakhulu kwe-transistor.

Ubuhlakani Bokwakha kanye Nokufunda Komshini

Ama-IC enzelwe ubuhlakani bokwenziwa (AI) kanye nezinhlelo zokusebenza zokufunda komshini (ML) azobaluleke kakhulu. Lawa ma-IC akhethekile, aziwa ngokuthi ama-AI accelerators noma ama-neural processing units (NPUs), azothuthukisa ukusebenza nokusebenza kahle kwama-algorithms e-AI ne-ML, ukuthuthukiswa kokushayela emikhakheni eyahlukene, okuhlanganisa amarobhothi, izimoto ezizimele, namadivayisi ahlakaniphile.

I-Quantum Computing

I-Quantum Computing imele ukweqa okubalulekile kwamandla wokubala. Ngenkathi kusezigabeni zakho zokuqala, ukuthuthukiswa kwama-quantum ICs nama-quantum processors kunamandla okuguqula izinkambu ezifana ne-cryptography, isayensi yezinto ezibonakalayo, kanye nokulingiswa okuyinkimbinkimbi.

Inthanethi Things (IoT)

Ukwanda kwamadivayisi e-IoT kuzoqhuba isidingo samandla aphansi, ama-IC asebenza kahle kakhulu. Lawa ma-IC azonika amandla ukuxhumana okungenamthungo, ukucutshungulwa kwedatha, nokuxhumana kumanethiwekhi e-IoT, kukhuthaze ukukhula kwamakhaya ahlakaniphile, amadolobha ahlakaniphile, nezinhlelo zokusebenza ze-IoT yezimboni.

5G futhi Ngaphandle

Ukufakwa kwamanethiwekhi e-5G kanye nokuthuthukiswa kobuchwepheshe obungenantambo besikhathi esizayo kuzodinga ama-IC e-RF athuthukile kanye nama-IC e-mixed-signal. Lawa ma-IC azosekela amazinga aphezulu edatha, ukubambezeleka okuphansi, kanye nokuxhumeka okwandisiwe, okuvumela izinhlelo zokusebenza ezintsha ku-augmented reality (AR), i-virtual reality (VR), nangale kwalokho.

Semiconductor functions, packages and sourcing

A device family, package and manufacturer name do not identify an interchangeable part. Use the approved device function, pin assignment, ratings and component documentation.

Isiphetho

Amasekhethi ahlanganisiwe aguqule umhlaba wezogesi, avumela ukuthuthukiswa kwemishini eyinkimbinkimbi namasistimu angena kuzo zonke izici zempilo yesimanje. Ngokuqonda okuphelele kwezinhlobo zamasekethe ahlanganisiwe, izimiso zokuklama, nezinqubo zokwakha, abantu bangangena bajule emkhakheni wobuchwepheshe be-semiconductor, bavule amathuba amasha okusungula izinto ezintsha nentuthuko. Kungakhathaliseki ukuthi ungunjiniyela ongumakadebona noma umshisekeli olangazelele, uhambo lokudlula ebunkingeni bamasekhethi ahlanganisiwe luthembisa ukuthi luzokhanyisela futhi luvuze.

I-FAQ Yezifunda Ezihlanganisiwe

1. Amasekhethi adidiyelwe akuthinta kanjani ukusebenza kahle kwamandla emishini kagesi?

Amasekhethi ahlanganisiwe athuthukisa kakhulu ukusebenza kahle kwamandla kwemishini kagesi ngokuhlanganisa izingxenye eziningi ze-elekthronikhi zibe chip eyodwa. Lokhu kuhlanganiswa kunciphisa ukusetshenziswa kwamandla sekukonke uma kuqhathaniswa nemiklamo yezingxenye ezihlukene. Ama-IC athuthukile ahlanganisa izici zokuphatha amandla ezilungisa ngokuguqukayo ukusetshenziswa kwamandla ngokusekelwe ezidingweni zokusebenza, okuthuthukisa ukusebenza kahle kwamandla nokwelula impilo yebhethri kumadivayisi aphathekayo.

2. Yiziphi izinselele ezibalulekile ekuklameni amasekhethi ahlanganisiwe e-RF anemvamisa ephezulu?

Ukuklama ama-high-frequency RF (ifrikhwensi yomsakazo) ehlanganisiwe inikeza izinselele ezimbalwa, okuhlanganisa ukuphatha ubuqotho besignali, ukunciphisa umsindo, nokuqinisekisa ukuzinza okushisayo. Ama-RF ICs kufanele aklanywe ngokucophelela ukuze aphathe amasignali amaza aphezulu ngaphandle kokulahlekelwa okukhulu noma ukuphazamiseka. Ukuthola ukufanisa okunembile kokuphazamiseka, ukulondoloza ukukhuliswa kwesignali okungaguquki, kanye nokukhipha ukushisa ngokuphumelelayo kubalulekile ekusebenzeni okuthembekile kwe-RF ICs ezinhlelweni ezifana nezinhlelo zokuxhumana ezingenazintambo nobuchwepheshe besathelayithi.

3. Izici zemvelo zikuthinta kanjani ukusebenza kwamasekethe ahlanganisiwe?

Izici zemvelo ezifana nezinga lokushisa, umswakama, kanye nokuphazamiseka kazibuthe kagesi (EMI) kungaba nomthelela omkhulu ekusebenzeni kwamasekethe ahlanganisiwe. Amazinga okushisa aphezulu angabangela ukubaleka okushisayo futhi kwehlise isithunzi se-semiconductor, okuholela ekuhlulekeni kwesekethe. Umswakama ungaholela ekungeneni komswakama, okungabangela amasekhethi amafushane kanye nokugqwala kwezingxenye zensimbi. I-EMI ingaphazamisa ukusebenza okuvamile kwama-ICs ngokuyenga imisinga engafuneki nama-voltage, okuthinta ubuqotho besignali kanye nokunemba kwedatha.

4. Yiziphi intuthuko eyenziwayo ukuze kuthuthukiswe ukuvikeleka kwamasekethe ahlanganisiwe?

Ukuze kuthuthukiswe ukuphepha kwamasekethe ahlanganisiwe, abacwaningi nonjiniyela bathuthukisa ubuchwepheshe obuhlukahlukene, okuhlanganisa ukubethela okusekelwe ku-Hardware, izinqubo zokuqalisa ezivikelekile, nemisebenzi engavuleki ngokomzimba (ama-PUF). Ukubethela okusekelwe ku-hardware kuqinisekisa ukuthi idatha ecutshungulwayo futhi egcinwe ngaphakathi kwe-IC ivikelekile ekufinyeleleni okungagunyaziwe. Izinqubo zokuqalisa ezivikelekile ziqinisekisa ubuqotho be-firmware nesofthiwe ngaphambi kokubulawa, kuvimbela ikhodi enonya ekusebenzeni. Ama-PUF aphakamisa ukuhlukahluka kokukhiqiza okungokwemvelo ukuze adale izihlonzi ezihlukile nezimelana nokuphazamiseka kwe-IC ngayinye, ehlinzeka ngokuvikeleka okuqinile ekwenziweni komgunyathi nokwenza ama-cloning.

The memory-device manufacturing landscape is useful supply-chain background, but it does not determine whether two parts are interchangeable. A memory BOM still needs the approved part number, organization, interface, package and operating limits.

5. Amasekhethi ahlanganisiwe enziwa kanjani ngendlela efanele izinhlelo zokusebenza ezithile ku-inthanethi Yezinto (IoT)?

Amasekhethi ahlanganisiwe ezinhlelo zokusebenza ze-IoT aklanywe ngezici ezenzelwe ukuhlangabezana nezidingo ezihlukile zamadivayisi e-IoT, njengokusetshenziswa kwamandla okuphansi, ukuminyana okuphezulu kokuhlanganiswa, nokuxhumana okuqinile. Lawa ma-IC ngokuvamile ahlanganisa amamojula akhethekile afana nezindawo zokuxhumana ezingenazintambo (i-Wi-Fi, i-Bluetooth, i-Zigbee), ukuhlanganiswa kwezinzwa, namayunithi okuphatha amandla. Futhi zenzelwe ukusekela izivumelwano namazinga e-IoT ahlukahlukene, ukuqinisekisa ukusebenzisana okungenamthungo namanye amadivaysi e-IoT namanethiwekhi. Ukugxila ekusebenzeni kahle kwamandla nokusebenza kancane kwenza lawa ma-IC afaneleke kumadivayisi asebenza ngebhethri, ahlangene e-IoT afakwe ezindlini ezihlakaniphile, ezishintshayo zezimboni, nobuchwepheshe obugqokekayo.