Yehlisa Izindleko Zakho Zokumbopha Ezinezingqimba Eziyi-10 Nge-PCB
Okuqukethwe
- Yini Eyenza Izindleko Ze-HDI Ezinezingqimba Eziyi-10 Zidlule Ukubalwa Kwezingqimba
- Ukubhoboza: Isinqumo Sezindleko Zobuqotho Besignali Esiyingqayizivele Ku-HDI Enezingqimba Eziphezulu
- Ukwakhiwa Kwendiza Yamandla kanye Nomthelela Wayo Wezindleko Ezifihliwe
- Ukukhethwa Kokuqukethwe: Isu Lokuhlanganisa I-Hybrid Lezendlalelo Eziyi-10
- I-HDI Yezingqimba Eziyi-10 vs. Izinga Elijwayelekile Lezingqimba Eziyi-12: Lapho Ngayinye Iwina Ngezindleko
- Amanani Amanani Abhekiselayo kanye Nokuthi Yini Ewenza Ahambe
- Ukuthola Isilinganiso Esinembile Se-HDI Esinezingqimba Eziyi-10 esivela ku-Highleap
I -blind enezingqimba eziyi-10 efihliwe ngezindleko ze-PCB ivame ukungaqondwa kahle — izingxoxo eziningi zamanani ziphela “kubiza ngezingqimba eziyi-10 okungaphezu kwezingqimba eziyi-8” ngaphandle kokuchaza ukuthi yiziphi izinqumo zokuklama ezithile eziqhuba lowo mehluko. Empeleni, uhlobo olufihliwe nge-, ukubhoboza emuva kobuqotho besignali ye-SerDes, ukwakheka komzila wendiza yamandla, kanye nebanga lezinto ezingaphakathi kuyizinketho ezizimele ezingeza noma zisuse izindleko ezinkulu. Umklamo ovumelana nencazelo ephezulu kuzo zonke izindawo ezine ungabiza ama-2-3× ngaphezulu kunomklamo owenza izinqumo ezifanayo zomzila ngokulungiswa okuqondisiwe. Lo mhlahlandlela uhlukanisa umshayeli wezindleko ngamunye, uchaza ukushintshana kobunjiniyela, futhi ukhomba lapho kutholakala khona ukonga okukhulu — ngaphandle kokubeka engcupheni ukusebenza kukagesi.
Thola Isilinganiso Sakho Se-HDI Esinezingqimba Eziyi-10
1) Yini Eyenza Izindleko Ze-HDI Ezinezingqimba Eziyi-10 Zidlule Ukubalwa Kwezingqimba
1.1 Izinqumo Ezine Ezishukumisa Intengo
Ukubalwa kwezingqimba kuyisici sezindleko, kodwa hhayi esiyinhloko. Izinqumo ezine zokuklama ezithinta kakhulu intengo ye-HDI yezingqimba eziyi-10 — cishe ngokulandelana komthelela:
- Wangcwatshwa ngesinqumo (Uhlobo I vs. Uhlobo III): Ukwengeza ama-via agqitshwe enkabeni yangaphakathi kunezela imijikelezo ye-lamination engu-1-3 futhi kungandisa intengo ye-prototype ngo-40-100%+ ngaphezu kokulingana kohlobo I (isibalo sokubhekisela - umthelela wangempela uyahlukahluka). Iningi lemiklamo ye-HDI enezingqimba eziyi-10 ayidingi ama-via agqitshwe. Ukuqinisekisa lokhu ngaphambi kokwenziwa kuyindlela eyodwa yokwenza ngcono izindleko ze-ROI ephezulu kakhulu etholakalayo.
- Ukubhoboza emuva kwezimpawu zesivinini esikhulu: Ukubhoboza ngemuva kuwusizo kagesi kuphela kuma-interface e-SerDes angaphezu kwe-10 Gbps. Ukukucacisa ngemiklamo ye-PCIe Gen3 noma i-DDR4 kunezela izindleko zokukhiqiza ngaphandle kwenzuzo yesignali elinganisekayo. Isinqumo esifanele sidinga ukumodela nge-stub resonance yobukhulu bakho obuthile be-stackup — hhayi ukusebenzisa ukubhoboza emuva njengesinyathelo sokuqapha esizenzakalelayo.
- Izinga lezinto ezisetshenziswayo ezingqimbeni zangaphakathi: Ukucacisa i-laminate esezingeni eliphezulu ephansi (Megtron 6, I-Tera MT40) kuzo zonke izendlalelo eziyi-10 lapho izendlalelo zesignali zangaphandle kuphela eziphethe imvamisa ephezulu yikona okuvame kakhulu ukucaciswa ngokweqile ku-HDI enezendlalelo eziyi-10. I-hybrid stackup — izendlalelo zangaphandle zekhwalithi ephezulu, i-core yangaphakathi ye-Tg FR-4 ejwayelekile — ifinyelela ku-88–92% wokusebenza kukagesi okuphelele kwe-premium ngezindleko zezinto eziphansi kakhulu (ireferensi).
- Ukwakhiwa komzila wendiza yamandla: Ukusebenzisa ama-via afihliwe phakathi kwezindiza zamandla kune-vias ezimbobo ezidlulayo kuphoqa ukushintshwa kusuka ekucutshungulweni kohlobo I kuya kohlobo III - noma ngabe konke ukuhanjiswa kwesignali kungafinyelelwa kuhlobo I. Ukubekwa kwendiza yamandla e-Symmetry kususa ngokuphelele lo mshayeli wezindleko.
1.2 Kungani Izindleko Zezingqimba Eziyi-10 Zingaphansi Kokuphakanyiswa Kokwanda Kwenani Lezingqimba
Ukwengeza izendlalelo ezimbili zangaphakathi kumklamo we-HDI onezingqimba ezingu-8 ngokuvamile kwandisa izindleko ngo-25–40% ngamanani e-prototype — ngaphansi kwemodeli yezindleko eziqondile ngesendlalelo ngasinye engasikisela. Isizathu: izishayeli zezindleko eziyinhloko ku-HDI ukubalwa komjikelezo we-lamination kanye nokusethwa kokubhoboza nge-laser, okungekho noyedwa kuzo oshintshayo uma ungeza izendlalelo zangaphakathi ezijwayelekile ngohlobo olufanayo lwe-HDI. Izindleko ezingaphansi kwesikhathi sezinto ezibonakalayo kanye nesikhathi sokuthwebula izithombe kuphela.
Umphumela oqondile: uma ubuningi bakho bomzila budinga ngempela umthamo owengeziwe, ukusuka ku-Type I enezingqimba ezingu-8 kuya ku-Type I enezingqimba ezingu-10 kuvame ukusebenza kahle kakhulu kunokusuka ku-Type I enezingqimba ezingu-8 kuya ku-Type II enezingqimba ezingu-8. Izingqimba eziningi ohlotsheni olufanayo lwe-HDI zibiza kancane kunesibalo esifanayo sezingqimba ohlotsheni oluphezulu lwe-HDI. Ukuze uthole ukuqhathanisa okuhlangene kwentengo ye-HDI enezingqimba ezingu-8 ngohlobo lwe-stackup, bheka i -blind enezingqimba ezingu-8 ebikwe nge-PCB price breakdown.
1.3 Uhlobo I vs. Uhlobo III: Isinqumo Esingcwatshwe Nge-HDI Enezingqimba Eziyi-10
Isinqumo sezindleko esisodwa esibaluleke kakhulu somklamo we-HDI onezingqimba eziyi-10 ukuthi ngabe ama-vias angcwatshwe ngaphakathi ayadingeka ngempela. Lesi yisinqumo sokwakhiwa komzila, hhayi isinqumo sekhwalithi - kufanele siqhutshwe ukuthi ngabe izindlela zakho zesignali zidinga ngempela ungqimba lwangaphakathi ngokushintshana phakathi kwezingqimba ezingezona eziseduze ezingenakufezwa ngama-vias angcwatshwe ngaphakathi.
| Ukucushwa | Imijikelezo Yokucwilisa | Kungcwatshwe nge-Capability | Izindleko vs. Uhlobo I (ireferensi) | Uma Kulungisiswa |
|---|---|---|---|---|
| Uhlobo I (1+8+1) | 2 | I-L1–L2 eyimpumputhe kanye ne-L9–L10 kuphela | Isisekelo | Iphimbo le-BGA ≥0.5mm; ingaphakathi elingaphakathi lingaguquguquka ngembobo edlulayo |
| Uhlobo II (2+6+2) | 3 | Izimpumputhe ezimbili ngamaleveli ohlangothini ngalunye | +40–55% (ireferensi) | Iphimbo le-BGA 0.40–0.45mm; inani eliphezulu le-I/O |
| Uhlobo lwesithathu (ipheya elilodwa elingcwatshwe) | 4 | Ipheya elilodwa elingcwatshwe ngesendlalelo esiphakathi | +60–90% (ireferensi) | Ukushintsha kwesendlalelo sangaphakathi akunakugwenywa ngokuhambisa umgodi odlulayo |
| Uhlobo III (amabhangqa amabili+ angcwatshwe) | 5-6 | Okuningi kungcwatshwe ngezendlalelo enkabeni | +90–130% (ireferensi) | Umzila wangaphakathi ogcwele kakhulu olingana nezinga elijwayelekile lezingqimba ezingu-14-16 |
Isisekelo sereferensi: iziphindaphindo zezindleko ziyalinganiselwa futhi ziyahlukahluka ngokwefektri, usayizi webhodi, kanye nemininingwane yomklamo. Zonke izibalo zingezokuqhathanisa okuhlobene kuphela — thumela i-Gerber yakho ukuze uthole amanani angempela.
Ngokwesipiliyoni se-DFM sika-Highleap, cishe ama-60-70% emiklamo ethunyelwe njengohlobo lwesithathu ingafinyelela izinhloso zayo zokuqondisa kuhlobo I noma uhlobo lwesibili ngemuva kokubuyekezwa kwe-stackup - ukususa imijikelezo ye-lamination engu-1-3 ngaphambi kokuba kuqale ukwenziwa.
2) Ukubhoboza: Isinqumo Sezindleko Zobuqotho Besignali Esiyingqayizivele Ku-HDI Enezingqimba Eziphezulu
2.1 Kungani i-Via Stubs Ibaluleke Kakhulu Ezingqimbeni Eziyi-10
Uma imbobo edlulayo ixhuma i-L1 ku-L5 ebhodini elinezingqimba eziyi-10, ibhereli iyaqhubeka idlule ku-L6–L10 njenge-stub engasetshenziswanga. Le stub isebenza njenge-resonator yomugqa wokudlulisa, ikhombisa amandla ngemvamisa lapho ubude be-stub bulingana nobude be-quarter-wave. I-stub engu-0.8mm ku-FR-4 (εr ≈ 4.3) ine-null yayo yokuqala ye-resonant cishe ku-28 GHz.
Inkinga iba nkulu kakhulu ezingqimbeni eziyi-10 ngoba ibhodi lijiyile ngokomzimba, izingcezu zinde, futhi amaza okuzwakalayo ehla — eduze nobubanzi bokusebenza kwezixhumi zesimanje ezisheshayo:
| Interface | Isilinganiso sedatha | Imvamisa Eyisisekelo | I-Harmonic yesi-3 | Isinqumo Sokubhoboza Ingemuva |
|---|---|---|---|---|
| I-PCIe Gen3 | I-8 GT / s | I-4 GHz | I-12 GHz | Akudingeki — i-stub resonance ingaphezu komkhawulokudonsa wesignali |
| I-PCIe Gen4 | I-16 GT / s | I-8 GHz | I-24 GHz | Hlola — kuncike kubude be-stub; imodeli ngaphambi kokuzibophezela |
| I-PCIe Gen5 / DDR5 | 32–38 GT/s | 16-19 GHz | - | Drila emuva noma usebenzise ama-vias angaboni ezindleleni ezibalulekile zesignali |
| Ama-serve e-PAM4 angu-28 Gbps | I-28 Gbps | I-14 GHz | I-42 GHz | Kudingeka ukubhoboza ngemuva kwezinti >0.4mm |
| I-PAM4 engu-56 Gbps (400G Ethernet) | I-56 Gbps | I-28 GHz | - | Vula wonke ama-vias >0.3mm stub, noma sebenzisa ama-vias angaboni kuyo yonke indawo |
2.2 Ukubhoboza Umgogodla vs. Indlela Engaboni: Ukukhetha Indlela Efanele
Kunezindlela ezimbili zokususa nge-stub resonance ebhodini le-HDI elinezingqimba eziyi-10. Ukukhetha okulungile kuncike ku-geometry yendlela yesiginali:
- Ukungaboni ngendlela yokusondela: Akukho stub edalwe ngoba i-via iphelela kungqimba eqondiwe. Isebenza ekushintsheni kusuka kungqimba engaphandle kuya ngaphakathi (L1→L2, L1→L3, L9→L8, njll.). Ayikwazi ukufinyelela ekushintsheni kwengqimba engaphakathi kuya ngaphakathi. Kungcono kakhulu uma uklama kusukela ekuqaleni — akukho sinyathelo senqubo esengeziwe, futhi ukuhlelwa kabusha komzila kunganciphisa inani ngokubala. Bheka izimpumputhe futhi zingcwatshwe ngemithetho yokuklama ngemikhawulo yokujula kanye nezidingo zendandatho ehlanganisiwe.
- Indlela yokubhoboza emuva: Isebenza ekushintsheni kwangaphakathi kuya kwangaphakathi lapho ama-vias angaboni engakwazi ukufinyelela khona. Ingeza umsebenzi wesibili wokubhoboza olawulwa ukujula ngemva kokwenziwa okuyinhloko. Ingeza izindleko ngebhodi ngalinye (ireferensi: cishe $8–$22 ngobuningi bezingcezu ezingu-50 — iyahlukahluka kakhulu ngokubalwa, ukubekezelelana, kanye nefektri). Kudinga ukulinganiswa kokujula kanye nokuqinisekiswa kwe-X-ray. Kuyadingeka kumadizayini avinjelwe yifa ane-fixed through placement.
Kumabhodi e-400G Ethernet, ukuhambisa amasignali esivinini esiphezulu kusetshenziswa ama-vias angaboni noma ngabe yikuphi ukushintsha kusuka ngaphandle kuya ngaphakathi - kanye nokugcina ukubhoboza emuva kuphela kokushintsha kwangaphakathi kuya ngaphakathi - ngokuvamile kunciphisa ukubalwa kokubhoboza emuva ngo-40-60% uma kuqhathaniswa nokuhambisa yonke imigodi. Bheka umhlahlandlela wobuchwepheshe bokubhoboza emuva kwe-PCB ukuze uthole imininingwane yokulawula ukujula kanye nokubekezelelana kwe-stub okusele.
2.3 Izingxenye Zezindleko Zokubhoboza Emuva
Izindleko zokubhoboza emuva zincike kakhulu kumthamo ngenxa yezindleko zokusetha ezingaguquki (izibalo zokubhekisela — izindleko zangempela ziyahlukahluka kuye ngefektri kanye nomklamo):
- Ukusethwa kwephaneli (ukulinganiswa kokujula, ukubhoboza ikhuphoni yokuhlola): cishe u-$35–$80/iphaneli — ingxenye egxilile eyenza ukubhoboza emuva kubize kakhulu ngobuningi obuphansi
- Ukubhoboza ngakunye: cishe u-$0.012–$0.028/nge-drill yomshini olawulwa ngokujula
- Ukuqinisekiswa kokujula kwe-X-ray: cishe u-$4–$9/ukuhlolwa okwengeziwe kwephaneli
- Ukubekezelelana kwe-stub okusele okuqinile: +/−0.05mm uma kuqhathaniswa no-+/−0.1mm kwandisa izindleko zokusetha nokulinganisa
Kumabhodi ama-5, ukuncishiswa kokusethwa kwamaphaneli kubusa izindleko zokubhoboza ngemuva kwebhodi ngalinye. Kumabhodi ama-500, izindleko ze-per-via ziqhuba isamba. Kumadizayini anesivinini esikhulu adinga ngempela ukususwa kwe-stub, izindleko ziyafaneleka - kodwa ukulingisa isignali ngaphambi kokuzibophezela ekubhobozeni emuva kuhlale kufanele isikhathi sokumodela.
3) Ukwakhiwa Kwendiza Yamandla kanye Nomthelela Wayo Wezindleko Ezifihliwe
3.1 Indlela Umzila Wamandla Ongaphoqa Ngayo Ukucubungula Uhlobo Lwesithathu
I-HDI enezingqimba eziyi-10 evame ukunganakwa: indlela amandla nezindiza zomhlabathi ezixhunywe ngayo phakathi kwezingqimba. Lapho abaklami behambisa amandla phakathi kwezingqimba zangaphakathi ezingezona eziseduze besebenzisa ama-via angcwatshwe (isb., angcwatshwe ngokuxhuma i-L4 ku-L7 ukuze basabalalise isitimela samandla), badinga ukucutshungulwa kohlobo lwe-III — ngisho noma yonke indlela yokuhambisa isignali ingafinyelelwa kuhlobo lwe-I.
Okunye okukhethwa kukho ukwakhiwa kwendiza yamandla ehambisanayo enezimbobo ezidlulayo, okufeza ukulethwa kwamandla okulinganayo ngaphandle kwesijeziso sokucubungula Uhlobo III:
| Ungqimba | Ukwabiwa Kwezindleko Okuhle Kakhulu (Uhlobo I) | Umsebenzi | Uhlobo lwe-Power |
|---|---|---|---|
| L1 (phezulu) | Isignali (i-BGA fanout) | Umzila onesivinini esikhulu | Impumputhe nge-L1–L2 |
| L2 | Isignali (umzila wokuphunyuka) | Ukuqhubeka kokuqhekeka kwe-BGA | - |
| L3 | Indiza ye-GND | Ireferensi ye-L1, L2, L4 | Ngembobo nge |
| L4 | Isignali | Umzila wangaphakathi | Ngembobo nge |
| L5 | Indiza yamandla | Ukusatshalaliswa kwe-VCC | Indlela yokungena ngembobo — akukho ndlela yokungena efihliwe edingekayo |
| L6 | Indiza yamandla | Ukusatshalaliswa kwesitimela sesibili | Indlela yokungena ngembobo — akukho ndlela yokungena efihliwe edingekayo |
| L7 | Isignali | Umzila wangaphakathi | Ngembobo nge |
| L8 | Indiza ye-GND | Ireferensi ye-L7, L9, L10 | Ngembobo nge |
| L9 | Isignali (umzila wokuphunyuka) | Ukuphuma kwe-BGA engezansi | - |
| L10 (ngezansi) | Isignali (i-BGA fanout) | Umzila onesivinini esikhulu | Impumputhe nge-L9–L10 |
3.2 Kungani Umzila Wamandla Osebenzisa Imigodi Engangeni Ukwanele Emiklamo eminingi ye-HDI enezingqimba eziyi-10
Ama-vias anezimbobo ezidlulayo ashibhile ngo-3–5× nge-via kunama-vias agqitshiwe futhi awadingi umjikelezo owengeziwe we-lamination. Ngokusatshalaliswa kwamandla, alingana ngogesi nama-vias agqitshiwe emiklamo eminingi ye-HDI enezingqimba eziyi-10 ngezizathu ezintathu:
- Ukuphazamiseka kwendiza yamandla kulawulwa yi-capacitance yendiza kanye nokubekwa kwe-capacitor ehlukanisayo — hhayi ngohlobo
- Ama-vias asebenzisa imigodi axhumanisa izindiza zamandla kuma-capacitor ahlukanisayo anomthamo owanele wokuthwala ugesi wemiklamo ejwayelekile ye-HDI enezingqimba eziyi-10
- I-Via stub resonance (eqhuba izinqumo zokubhoboza emuva zezibonakaliso zesivinini esikhulu) akuyona inkinga yezindiza zamandla — ukulethwa kwamandla kuyinkinga yemvamisa ephansi
Okuhlukile ukulethwa kwamandla kagesi aphezulu emabhodini aminyene kakhulu lapho ama-via angena ngembobo edla isikhala esiningi kakhulu sokuhambisa izingqimba zesignali. Lo mkhawulo uvame ukuvela ekubalweni kwezingqimba okungaphezu kuka-16, hhayi ezingqimbeni eziyi-10 ezinesabelo sendiza esilinganayo.
4) Ukukhethwa Kwezinto: Isu Lokuhlanganisa I-Hybrid Lezendlalelo Eziyi-10
4.1 Kungani Ibanga Lezinto Ezingaphakathi Ezibalulekile Libaluleke Kancane Kunokuba Onjiniyela Becabanga
Ebhodini le-HDI elinezingqimba eziyi-10 eline-symmetric stackup echazwe kuSigaba 3, izingqimba zangaphandle ezakhiwe (L1–L2 kanye ne-L9–L10) ziphethe imikhondo ebaluleke kakhulu yemvamisa ephezulu. I-L3–L8 yizindawo zokubhekisela noma izingqimba zesignali zangaphakathi ezisebenza kumaza aphansi. I-dielectric loss tangent (Df) ibaluleke kakhulu ezingqimbeni lapho izimpawu zemvamisa ephezulu zihamba khona amabanga amade kakhulu - okuyi-buildup yangaphandle, hhayi i-core.
Ukucacisa i-Megtron 6 (Df ~0.002 ku-10 GHz) kuzo zonke izendlalelo eziyi-10 lapho i-L1–L2 kuphela ephethe amasignali angaphezu kwe-5 GHz kukhokhela iphrimiyamu yezinto ezibonakalayo ngaphandle kwenzuzo kagesi elinganisekayo ku-8 kwezingu-10. Indlela elungiselelwe izindleko:
| Uhlobo Lokusebenza | I-Max Signal Frequency | Izendlalelo Zangaphandle (L1–L2, L9–L10) | Ingaphakathi Lomgogodla (L3–L8) | Izindleko Ezilinganiselwe vs. Zonke i-FR-4 |
|---|---|---|---|---|
| Ukulawulwa kwezimboni, isango le-IoT | <1 GHz | I-High-Tg FR-4 | I-High-Tg FR-4 | Isisekelo — akukho phrimiyamu edingekayo |
| Iseva ye-NIC, i-PCIe Gen5 FPGA | 16-32 GHz | Isola I-Tera MT40 or I-Megtron 6 | I-High-Tg FR-4 | +40–65% (ireferensi, i-hybrid) |
| I-ADAS yezimoto, i-radar front-end | 10-77 GHz | I-Megtron 6 noma i-laminate ekhethekile ephansi yokulahlekelwa | I-High-Tg FR-4 efanelekile yi-IATF | +55–80% (ireferensi, i-hybrid) |
| Umsakazo we-5G mmWave, i-optical engu-400G | > 28 GHz | I-Megtron 6 noma i-laminate ekhethekile ephansi yokulahlekelwa (ingadingeka kuyo yonke indawo) | I-Megtron 6 uma izimpawu zangaphakathi nazo ziphindaphinda kakhulu | +80–130% (ireferensi, i-premium yonke) |
Zonke izilinganiso zezindleko ziyizibalo zokubhekisela zokuqhathanisa okuhlobene. Amanani angempela ancike ku-Gerber yakho ethile, ubukhulu, kanye nokutholakala kwezinto zamanje. Thumela umklamo wakho ukuze uthole isilinganiso esinembile.
4.2 Ukungaguquguquki Kwe-Copper Foil: Ukuthuthukiswa Okuqondiwe Kwemiklamo ye-5–25 GHz
Kumadizayini akububanzi be-5–25 GHz lapho ukuthuthukiswa kube yi-laminate ye-premium kusemkhawulweni, ukucacisa i-foil yethusi ephansi (LP) ezingqimbeni zesignali zangaphandle kuyindlela ehloselwe izindleko kakhulu kunokuthuthukisa zonke izingqimba. Ithusi elijwayelekile elifakwe i-electrode linobulukhuni bomphezulu i-Rz ~3.5–5µm; ithusi le-LP linciphisa lokhu kube ~1.5–2.5µm, okunciphisa ukulahlekelwa kokufakwa ngo-8–15% ku-10 GHz ezingqimbeni zesignali ezibalulekile.
Ithusi le-LP ezingqimbeni zangaphandle lengeza cishe u-12-18% ezindleleni zezinto ezingaphandle — ingxenye encane yentengo yebhodi — uma kuqhathaniswa nokuthuthukisa yonke i-laminate stack ethinta zonke izingqimba eziyi-10. Kumadizayini anesabelomali sesixhumanisi esingaphansi kwe-10-15 GHz, ithusi le-LP ezingqimbeni zangaphandle ezihlanganisiwe kanye ne-FR-4 ejwayelekile enkabeni ngokuvamile kuyinhlanganisela yezindleko/ukusebenza efanelekile. Bheka ukukhethwa kwezinto ze-PCB okusheshayo kwe-Df kanye nedatha yokuqhathanisa ubulukhuni bethusi kuwo wonke amamaki.
5) Izinga le-HDI Elinezingqimba Eziyi-10 vs. Izingqimba Eziyi-12: Lapho Ngayinye Iwina Ngezindleko
5.1 Iphuzu Lokunqamula Ubuningi Bendlela Yomzila
Uhlaka oluvamile — “i-HDI enezingqimba eziyi-10 ibiza ngaphezu kwezingqimba eziyi-12” — lunembile kuphela kuhlu oluthile lwezindawo zokubeka ze-BGA. Uhlaka oluwusizo kakhulu: i-HDI enezingqimba eziyi-10 ibiza kakhulu ngebhodi ngalinye kodwa ivumela ukuminyana kwe-routing kanye nokunciphisa usayizi webhodi okungafinyelelwa yizinga elinezingqimba eziyi-12 ngaphandle kokwengeza izingqimba.
Ukugoqa kwenzeka lapho ibhodi elijwayelekile elinezingqimba ezingu-12 lidinga izingqimba ezingu-14 noma ezingu-16 ukuze kufezwe ubuningi bomzila obunikezwa yi-HDI enezingqimba ezingu-10 - lapho izindleko zebhodi elijwayelekile zidlula izindleko zebhodi le-HDI. Iphimbo le-BGA linquma ukuthi ukugoqa kuwela kuphi:
- Iphimbo le-BGA ≥0.8mm: Imbobo ejwayelekile enezingqimba ezingu-12 ngokuvamile ingabizi kakhulu. Ithambo lenja elisebenzisa umzila linikeza i-feniout eyanele ngaphandle kokubhoboza nge-laser.
- Iphimbo le-BGA 0.5–0.65mm: Umngcele — kuncike ekubalweni kwe-I/O kanye nosayizi webhodi. Sebenzisa womabili amadizayini nge-DFM ukuze unqume ukuthi iyiphi efinyelela imigomo ngezingqimba ezimbalwa eziphelele.
- Iphimbo le-BGA 0.4–0.5mm: I-HDI yohlobo lwe-I enezingqimba eziyi-10 ngokuvamile ibiza kakhulu kunebhodi elijwayelekile elinezingqimba eziyi-14 elidingekayo ukuze kube nobuningi obulinganayo be-feniut.
- Iphimbo le-BGA <0.4mm: I-HDI iyadingeka. Ukugeleza kwe-through-hole nge-dogbone akunakwenzeka kuleli pitch; ukuqhathanisa okujwayelekile kwe-PCB akusasebenzi.
5.2 Izindleko Zesistimu Eziphelele Uma Ziqhathaniswa Nentengo Yebhodi
Emikhiqizweni lapho ukuncishiswa kwendawo yebhodi kunenani — amadivayisi eselula, izinto ezigqokwayo, amamojula ezimoto lapho isikhala sokupakisha silinganiselwe — ukuqhathanisa intengo yebhodi ngalinye kugcizelela inzuzo ye-HDI. Ibhodi le-HDI elinezingqimba eziyi-10 elincane ngo-20% kunelilingana elijwayelekile elinezingqimba eziyi-12 livumela indawo encane ebiyelwe, ivolumu yokuhlanganisa encishisiwe, kanye nesici somkhiqizo ibhodi elijwayelekile elingenakukwazi ukulifaka.
Intengo yeprimiyamu ngebhodi ngalinye yenketho ye-HDI ingatholakala ngokugcwele ekongeni amathuluzi okuvala, ukunciphisa isisindo sokuthumela, noma ukwahlukaniswa komkhiqizo okusekela intengo yokuthengisa ephezulu. Izindleko zesistimu iyonke - hhayi into yomugqa we-PCB - ukuqhathanisa okulungile.
5.3 Uma Indinganiso Yezingqimba Eziyi-12 Iyindlela Ecacile Yokukhetha
Izinga elijwayelekile elinezingqimba ezingu-12 lidlula i-HDI enezingqimba ezingu-10 uma konke okulandelayo kusebenza:
- Zonke izingxenye zine-pitch engu-≥0.8mm futhi i-faneout ejwayelekile ye-dogbone iyenzeka
- Usayizi webhodi awunqunyelwe yi-enclosure yomkhiqizo
- Amaza esignali angaphansi kwe-5 GHz (akukho nzuzo yesignali evela kubude be-stub obuncishisiwe be-HDI)
- Azikho izingxenye ze-BGA ezidinga ukubhobozwa nge-laser nge-fine-pitch ngokusebenzisa indawo yokuhlala
Uma lezi zimo zihlangatshezwana nazo, ukucacisa i-HDI yohlobo lwe-I olunezingqimba eziyi-10 kunezela izindleko zokukhiqiza ngaphandle kokuhambisa umzila, ubuqotho besiginali, noma inzuzo yosayizi. Ukukhiqizwa kwe-PCB enezingqimba eziningi ngokwencazelo ejwayelekile yembobo kuyindlela ebiza kakhulu.
6) Amanani Amanani Abhekiselayo kanye Nokuthi Yini Ewenza Ahambe
6.1 Indlela Yokufunda Lezi Zigaba Zokubhekisela
Izibalo ezingezansi ziyizinkomba ezibonisa ibhodi elijwayelekile elingu-100×100mm ngaphansi kwezimo ezijwayelekile zemakethe. Zikhona ukusiza onjiniyela baqonde umthelela wezindleko ezihambisanayo zezinqumo zokuklama — hhayi ukufaka esikhundleni sesilinganiso sefektri. Intengo ye-PCB inqunywa yi-Gerber yakho ethile, hhayi ngezincazelo zesigaba. Ibhodi le-HDI elinezingqimba eziyi-10 elinobukhulu obungavamile, ukuqedwa okukhethekile, noma izidingo ezincane kakhulu zokulandelela/isikhala lingase libe nentengo ehluke kakhulu kulawa mabanga kunoma iyiphi indlela.
| Ukucushwa | Imijikelezo Yokucwilisa | ~10 ama-pcs (ireferensi) | ~50 ama-pcs (ireferensi) | ~500 ama-pcs (ireferensi) | Izici ezibalulekile ezenza intengo ibe phezulu |
|---|---|---|---|---|---|
| Uhlobo I (1+8+1), FR-4, ENIG | 2 | ~$82–$118 | ~$65–$92 | ~$38–$56 | Usayizi webhodi, ngokubala, ukubekezelelana kwe-impedance, i-IPC Class 3 |
| Uhlobo II (2+6+2), FR-4, ENIG | 3 | ~$118–$175 | ~$92–$138 | ~$56–$86 | Ama-vias ahlanganisiwe, isikhala esiqinile semigqa, indawo enkulu yamabhodi |
| Uhlobo III (umgogodla ongcwatshwe), FR-4, ENIG | 4-6 | ~$165–$290 | ~$128–$225 | ~$78–$140 | Amaningi angcwatshwe ngamabili, angenawo umkhawulo ngokubeka |
| Engeza: ukubhoboza emuva | - | +$15–$40 | +$8–$22 | +$4–$12 | Ngokubala, ukubekezelelana kwe-stub esele, izinga lokuhlola i-X-ray |
| Engeza: izingqimba zangaphandle ze-hybrid Megtron 6 | - | +40–65% | +40–65% | +35–55% | Ibanga elithile le-laminate, ukutholakala kwangaphambilini, usayizi wephaneli |
Izibalo ezibonisa amabhodi ajwayelekile angu-100×100mm, ama-via ahlanganisiwe, i-IPC Class 2. Intengo yakho yangempela izoncika kumafayela akho okuklama kanye nemininingwane. Thumela i-Gerber yakho ukuze uthole isilinganiso esinembile.
6.2 Izindlela Ezinhlanu Ezivame Kakhulu Onjiniyela Abakhokhela Ngazo Ngokweqile Ku-HDI Enezingqimba Eziyi-10
Ngokusekelwe ekubuyekezweni kwe-DFM kwemiklamo ye-HDI enezingqimba eziyi-10, lezi zincazelo ezidlulele zivela kaningi futhi zinomthelela omkhulu wezindleko:
- Ukucacisa Uhlobo III lapho ukuhanjiswa kungafinyelelwa khona ku-Type I: Iphutha elivame kakhulu nelibiza kakhulu. Alinakuqinisekiswa ngaphandle kokubuyekezwa kwe-DFM okuhlola ukugcwala kwangempela ngesidingo - okungathathwa ngokuxinana kwezingxenye kuphela.
- Ukubhoboza emuva kwe-PCIe Gen3 noma i-DDR4: Akudingeki kulezi zivinini zesikhombimsebenzisi ebhodini elinezingqimba eziyi-10 lapho i-stub resonance iwela ngaphezu kwebanga lemvamisa yesiginali. Ingeza izindleko zokukhiqiza ngaphandle kokuthuthukiswa kwesiginali okulinganiselwe.
- I-Megtron 6 kuzo zonke izendlalelo eziyi-10 lapho izendlalelo ezimbili zangaphandle kuphela eziphethe amasignali asebenzisa imvamisa ephezulu: I-hybrid stackup ifinyelela ukusebenza kukagesi okucishe kufane ngezindleko zezinto eziphansi ngo-35-55% (ireferensi).
- Ukufakwa ngezitezi ngezakhiwo lapho ama-via ahlanganisiwe angahambisa umklamo: Ama-vias ahlanganisiwe adinga ukugcwaliswa kwe-resin kanye nokuhlelwa phakathi kwemijikelezo ye-lamination. Ukuguqula kube ukubekwa kwe-staggered via kususa leso sinyathelo senqubo futhi kubiza ngokuphelele.
- I-IPC Class 3 yamabhodi okukhulisa amamodeli: Isigaba sesi-3 sengeza amadokhumenti, izingxenye ezihlukene, kanye nezidingo zokuhlola ezifanele iziqu zokukhiqiza — hhayi ukuqinisekiswa kwephrothokholi yokuqala.
7) Ukuthola Isilinganiso Esinembile Se-HDI Esinezingqimba Eziyi-10 esivela ku-Highleap
7.1 Yini Eshukumisa Ukunemba Kwezingcaphuno — kanye Nalokho Okungatholakali Kumareferensi
Ububanzi bokubhekisela kulesi sihloko buyasiza ngokuqhathanisa izindleko ezihambisanayo kanye nokuhlela — akuzona izinto ezithatha indawo yesilinganiso ngokumelene nomklamo wakho wangempela. Izinguquko ezithinta kakhulu amanani anembile e-HDI ayizingqimba eziyi-10 azithathwa yizincazelo zesigaba:
- Ubukhulu bebhodi kanye nokusetshenziswa kwephaneli: Ibhodi elingu-120×100mm elilingana namabhodi angu-16 ngephaneli libiza kancane ngebhodi kunebhodi elingu-82×115mm elilingana namabhodi angu-20 ngephaneli endaweni efanayo yephaneli. Ukusebenza kahle kwephaneli, hhayi indawo yebhodi yodwa, kuqhuba izindleko zezinto zokwakha.
- Ngokuhlukaniswa kokubala nohlobo: Ukufiphaza ngokubala, ukubhoboza ngembobo ngokubala, nokuthi ngabe kukhona yini ukucushwa okuhlanganisiwe okudinga ukugcwaliswa kwe-resin phakathi kwemijikelezo ye-lamination.
- Imininingwane yokubhoboza emuva: Ngezindawo ezidinga ukubhobozwa ngemuva, ubude be-stub eseleyo eqondiwe, kanye nesigaba sokubekezelela ukujula.
- Izidingo ze-impedance ezilawulwayo: Amanani okuvimba okuqondiwe, ukubekezelelana (±10% vs. ±5%), nokuthi yiziphi izendlalelo ezithile eziphethe imikhondo yokuvimba okulawulwayo.
- Uhlelo lobuningi: Inani le-oda lokuqala kanye nevolumu yonyaka elindelwe — ivolumu yonyaka inquma ukuthi intengo yezinto ezisezingeni lokukhiqiza iyasebenza yini ku-oda lokuqala.
7.2 Ukubuyekezwa kwe-DFM Ngaphandle Kwenkokhelo
Ukuthunyelwa ngakunye kwesilinganiso se-Highleap esinezingqimba eziyi-10 ze-HDI kufaka phakathi isibuyekezo se-DFM esihlola ngqo amaphethini amahlanu okucaciswa ngokweqile kuSigaba 6.2. Uma umklamo wakho ungafinyelelwa ku-Type I esikhundleni se-Type III, noma uma ukubhoboza emuva kungadingeki kumaza akho esignali, isibuyekezo se-DFM sikhomba lokho ngaphambi kokwenziwa - hhayi ngemuva. Isibuyekezo siqedwa zingakapheli amahora angama-24-48. Lapho ushintsho lomklamo luzonciphisa izindleko, imali eyongiwe ibalwa njengenani elithile ledola ukuze ukwazi ukuhlola ukuhweba ngaphambi kokuzibophezela.
7.3 Izilinganiso Zokukhiqiza
Izilinganiso zokukhiqiza ze-Highleap ze-HDI enezingqimba eziyi-10: Isivuno sohlobo I singu-95–97%; Isivuno sohlobo II singu-92–95%; Isivuno sohlobo III singu-88–93%. Wonke amabhodi e-HDI anezingqimba eziyi-10 athola ukuhlolwa kukagesi okungu-100% (i-probe endizayo yama-prototype, ukuhlolwa kwe-fixture yokukhiqiza), ukuhlolwa kwe-X-ray ngesilinganiso sokusampula sohlobo I/II kanye no-100% wohlobo III, kanye nedatha yekhuphoni ye-TDR ngakho konke ukuthunyelwa okulawulwayo kwe-impedance.
Ukuze uthole ukuhlela isikhathi sokuhola kuzinhlelo ze-HDI ezinezingqimba eziyi-10, bheka umhlahlandlela wesikhathi sokuhola we-blind buried nge-PCB . Ukuze uthole uhlaka oluphelele lwezindleko ze-HDI oluhlanganisa ukukhokhelwa kwe-NRE, imodeli yokulahlekelwa yinzuzo, kanye nezindleko zohlelo oluphelele, bheka ukuhlaziywa kwezindleko ze-blind buried nge-PCB.
Thumela i-Gerber yakho ukuze uthole intengo enembile ye-HDI enezingqimba ezingu-10
Posts Kunconywe
Ukukhiqizwa kwe-PCB Yesihlungi se-TMM6
Okuqukethwe Kungani Abaklami Bezihlungi Ze-Microwave Besebenzisa...
I-Taconic RF 35 vs RO4350B PCB
Uhlu lokuqukethweRF-35 vs RO4350B Ukuthengwa kanye...
Ukukhiqizwa kwe-PCB Yesihlungi se-TMM4
Ukukhiqizwa kwe-PCB yesihlungi se-TMM4 kulawulwa yi...
Ukukhiqizwa kwe-TMM3 PCB kwamaModule e-RF
Ukukhiqizwa kwe-TMM3 PCB kuwusizo kakhulu lapho imodyuli ye-RF...
Ungasithola kanjani isilinganiso sama-PCB
Masikwenzele ukuhlaziywa kwe-DFM/DFA futhi sibuyele kuwe ngombiko.
Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu.
Sidinga ulwazi olulandelayo ukuze sikunikeze isaphulelo:
-
- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha