Mocheso o Phahameng oa Arlon 85N PCB Kopano le Litšebeletso tsa ho Etsa
Highleap Electronics e fana ka kopano le tlhahiso ea Arlon 85N PCB e sebelisang Arlon Electronic Materials, e etselitsoeng lits'ebetso tsa mocheso o phahameng haholo le ts'epo ea boemo ba sefofane.
Tlhahiso ea PCB bakeng sa Merero e Sebelisang Arlon 85N
Arlon 85N ke sistimi e hloekileng ea polyimide laminate le prepreg e hlahisoang ke Arlon Electronic Materials. E na le mocheso oa phetoho ea khalase (Tg) oa 250°C 'me e etselitsoe meaho ea PCB moo ho lokelang ho nahanoa ka ho sebetsa kapa mocheso o phahameng oa ts'ebetso.
Highleap Electronics e hlahisa le ho kopanya li-PCB 'me ha e hlahise laminate ea Arlon 85N kapa prepreg. Bakeng sa merero ea PCB e kenyeletsang 85N, mosebetsi oa rona oa boenjiniere o shebane le kaho ea boto e felileng, ho kenyeletsoa palo ea lera, botenya ba koporo, ka sebopeho, lamination ea lera le nang le mekhahlelo e mengata, impedance e laoloang, qetello ea bokaholimo le litlhoko tsa kopano.
Bokgoni ba rona ba tlhahiso ya PCB bo akaretsa diboto tse thata tse nang le mealo e mengata, dibopeho tsa HDI, di-PCB tse nang le mealo e mengata, meralo ya impedance e laolwang, le meaho e meng e rarahaneng ya diboto. Tlhahiso ya PCB e ka boela ya hokahanngwa le ho fumana dikarolo, kopano ya SMT/THT, tlhahlobo le diteko ho tloha ho prototype ho ya tlhahisong.
Mehopolo ea Boenjiniere ba PCB
- Litlhoko tsa ho bokella li-PCB tse nang le mekhahlelo e mengata le tse nang le mekhahlelo e mengata
- Meaho e nang le masoba a phunyeletsang, e nang le tsela e foufetseng, le e patiloeng ka tsela e fetang
- Litlhoko tsa ho lamina le ho cheka bakeng sa meaho ea polyimide PCB
- Impedance e laoloang le kaho ea koporo
- Ts'ebetso ea tlhahiso ea PCB le ho hokahanya ts'ebetso ea kopano
Thepa ea thepa ea Arlon 85N, meaho e fumanehang, le tlhaiso-leseling ea mangolo li lokela ho netefatsoa ho sebelisoa litokomane tsa tekheniki tsa moetsi tsa hajoale pele kaho ea ho qetela ea PCB e lokolloa.
Litlhaloso tsa Teknoloji ea Arlon 85N Laminate
Litafole tse latelang li fana ka litlhaloso tse felletseng tsa tekheniki bakeng sa Arlon 85N polyimide laminate le lisebelisoa tsa prepreg. Litekanyetso tsohle ke thepa e tloaelehileng 'me li fanoe molemong oa litšupiso tsa boenjiniere.
Thepa ea Thermal
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Glass Transition Temperature (Tg) ka TMA | ≥250 | ° C | IPC-TM-650 2.4.24 |
| Glass Transition Temperature (Tg) ka DSC | - | ° C | IPC-TM-650 2.4.25 |
| Decomposition Temperature - Ea pele | 387 | ° C | IPC-TM-650 2.4.24.6 |
| Ho qhibiliha Mocheso - 5% tahlehelo ea boima ba 'mele | 407 | ° C | IPC-TM-650 2.4.24.6 |
| Nako ea ho Delaminate - T260 | > 60 | le 'na | IPC-TM-650 2.4.24.1 |
| Nako ea ho Delaminate - T288 | > 60 | le 'na | IPC-TM-650 2.4.24.1 |
| Nako ea ho Delaminate - T300 | > 60 | le 'na | IPC-TM-650 2.4.24.1 |
| CTE (X,Y) | 16 | ppm / ° C. | IPC-TM-650 2.4.41 |
| CTE (Z) - Pele ho Tg | 55 | ppm / ° C. | IPC-TM-650 2.4.24 |
| CTE (Z) - Post-Tg | 149 | ppm / ° C. | IPC-TM-650 2.4.24 |
| Katoloso ya Z-axis (50-260°C) | 1.2 | % | IPC-TM-650 2.4.24 |
Thepa ea Motlakase
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Dielectric Constant @ 1 MHz | 4.2 | - | IPC-TM-650 2.5.5.3 |
| Dielectric Constant @ 1 GHz | 4.0 | - | - |
| Sehlahisoa sa Dissipation @ 1 MHz | 0.01 | - | IPC-TM-650 2.5.5.3 |
| Sehlahisoa sa Dissipation @ 1 GHz | N / A | - | - |
| Ho hanyetsa Molumo - C96/35/90 | 1.5 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Ho hanyetsa Molumo - E24/125 | 3.0 × 10¹⁰ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Ho hanyetsa ha sefahleho - C96/35/90 | 1.6 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Ho hanyetsa ha sefahleho - E24/125 | 1.6 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Matla a Motlakase | 1450 (57.1) | Li-volts/mil (kV/mm) | IPC-TM-650 2.5.6.2 |
| Karohano ea Dielectric | > 40 | kV | IPC-TM-650 2.5.6 |
| Arc Resistance | 143 | ommeng | IPC-TM-650 2.5.1 |
Mechanical Properties
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Matla a Peel ho Koporo (1 oz / 35 micron) - Ka mor'a Khatello ea Thermal | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8 |
| Matla a Peel ho Koporo (1 oz/35 micron) - Ka Mocheso o Phahameng | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8.2 |
| Matla a Peel ho Koporo (1 oz / 35 micron) - Ka mor'a Tharollo ea Ts'ebetso | 6.4 (1.1) | lb/in (N/mm) | IPC-TM-650 2.4.8 |
| Young's Modulus – CD/MD | 3.6/4.1 (24.8 / 28.2) | Mpsi (GPA) | ASTM E111 |
| Matla a Tensile - CD/MD | 48/64 (330 / 440) | kpsi (MPa) | ASTM D3039 |
| Boemo ba Poisson | 0.18 | - | ASTM E13204 |
Matlo a 'mele
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Ho Monyeha ha Metsi (0.062″) | 0.27 | % | IPC-TM-650 2.6.2.1 |
| segokanyipalo | 1.6 | g / cm³ | ASTM D792 Mokhoa oa A |
| Ho khanna ho chesang | 0.2 | W / mK | ASTM E1461 |
| Ho tsuba | HB | sehlopha sa | UL 94 |
Thepa e Eketsehileng & Tumellano
| Property | ga tlhaloso | Details | Notes |
|---|---|---|---|
| IPC Compliance Standards | IPC-4101/40, IPC-4101/41 | Lethathamo la Lihlahisoa tse Tšoanelehang | Arlon EMD ke laminator ea pele ea US e amoheloang tlasa IPC QPL |
| Tumellano ea Tikoloho | RoHS/WEEE E lumellana | Khemistri e se nang Halogen | Sebopeho se se nang bromine |
| Sistimi ea Resin | Polyimide e hloekileng | Ha ho na resin ea bobeli | Ha ho epoxy e kentsoeng, e kopantsoeng kapa e sebetsang |
| Mocheso oa Phetoho ea Khalase | ≥250 ° C | Libaka tse ntle ka ho fetisisa tsa mocheso oa mocheso | E phahame ho feta li-epoxies tse tloaelehileng tse sebetsang hantle |
| Tšebeliso e lumellanang | Solder e se nang loto | E lumellana le HASL, IR Reflow | Khemistri e thata e hanana le ho robeha ha resin |
Lintlha tsa Bohlokoa tsa Tekheniki:
- Boleng bo bontšitsoeng kaholimo bo fanoe bakeng sa litšupiso tse akaretsang tsa boenjiniere ba PCB. Bakeng sa thepa ea hona joale ea thepa ea 85N, meaho e fumanehang, tataiso ea ts'ebetso, le tlhaiso-leseling ea mangolo, ka kopo sheba litokomane tsa morao-rao tsa tekheniki tse fanoeng ke Arlon Electronic Materials.
- 85N ke sehlahisoa sa laminate le prepreg sa Arlon Electronic Materials. Highleap Electronics e hlahisa le ho kopanya li-PCB 'me ha e hlahise laminate ea 85N kapa prepreg.
- Bakeng sa tlhahiso ea PCB, boitsebiso ba thepa le litokomane tse sebetsang tsa ho sala morao li laoloa ho latela litlhoko tsa projeke tse amohetsoeng le litokomane tse fumanehang tsa ketane ea phepelo.
Hobaneng ha Baenjiniere ba Khetha Arlon 85N bakeng sa Merero ea PCB e Phahameng ka ho Fetisisa
Ho Highleap Electronics, re khothaletsa Arlon 85N laminates bakeng sa lits'ebetso tse hlokang ho qetela ts'ebetsong ea mocheso le ts'epo ea nako e telele. Thepa ena e hloekileng ea polyimide e hlahella ka lebaka la botsitso ba eona bo ikhethang ba mocheso, matla a mochini, le ts'epahalo ea ts'ebetso maemong a boima haholo. Arlon 85N e netefatsa botšepehi bo ikhethang ba matšoao le mamello ea mocheso, e e etsa khetho e nepahetseng bakeng sa lits'ebetso tse hlokang ho hanyetsa mocheso o phahameng haholo le bophelo bo bolelele ba tšebeletso.
Melemo ea Bohlokoa ea Arlon 85N
Tshebetso e Phahameng ya Thermal: Arlon 85N e fana ka botsitso ba mocheso bo sa bapisoeng ka mocheso wa phetoho ya khalase ≥250°C le mocheso wa ho bola wa 407°C, e netefatsa tshebetso e ntle haholo esita le dibakeng tse batlang mocheso o phahameng, e leng se etsang hore e lokele disebediswa tsa elektroniki tsa mocheso o phahameng haholo le tsa sefofane.
Khemistri e Hloekileng ea Polyimide: E le polyimide e hloekileng e se nang resin ea bobeli, metsoako ea epoxy, kapa liketso, Arlon 85N e fana ka ts'ebetso e tsitsitseng le khanyetso e phahameng ea lik'hemik'hale. E na le k'hemistri e se nang bromine bakeng sa ho latela tikoloho 'me e boloka thepa e tsitsitseng ho pholletsa le maemo a fapaneng a mocheso.
Tšepo e Hlollang ea PTH: Katoloso e tlase ea axis ea Z ea 1.2% feela (50-260°C) e fokotsa kotsi ea ho hloleha ha masoba a poleiti nakong ea potoloho ea mocheso le ts'ebetso ea mocheso o phahameng. Botsitso bona bo ikhethang ba litekanyo bo netefatsa ts'ebetso e tšepahalang ea khokahano nakong eohle ea ts'ebeletso.
Kananelo le ho Latela Melao ya Indasteri: Arlon 85N e fihlela litlhaloso tsa IPC-4101/40 le IPC-4101/41, e latela RoHS, mme e na le k'hemistri e se nang bromine bakeng sa polokeho ya tikoloho le ho latela melao. E fumaneha ka mefuta ya laminate le prepreg, Arlon 85N e fana ka tenyetseho bakeng sa meralo e rarahaneng ya mekhahlelo e mengata.
Ho tloha ho Prototype ho ea ho Tlhahiso ka Highleap Electronics
Highleap Electronics e fana ka lits'ebeletso tsa tlhahiso ea PCB le kopano ea PCB bakeng sa merero ea PCB ea mekhahlelo e mengata, HDI, mocheso o phahameng le e rarahaneng, ho kenyeletsoa meralo e sebelisang Arlon 85N e le karolo ea pokello ea thepa e amohetsoeng.
Lihlopha tsa rona tsa boenjiniere le tlhahiso li hokahanya kaho e felletseng ea PCB ho tloha tlhahlobong ea DFM le netefatso ea ho bokella ka ho etsa, ho qeta bokaholimo, ho kopanya, ho hlahloba le ho leka. Sena se thusa ho boloka moralo oa boto, litlhoko tsa tlhahiso, le ts'ebetso ea PCBA li tsamaellana ho tloha nts'etsopele ea mehlala ho ea tlhahisong ea bophahamo.
- Tlhahiso ea PCB e nang le mekhahlelo e mengata, HDI, le e rarahaneng
- Ho laoloa-impedance le ho tswela pele ka meaho
- ENIG, ENEPIG, OSP, le liphetho tse ling tse boletsoeng tsa bokaholimo
- Kopano ea SMT/THT, ho fumana likarolo le ho etsa liteko
- Tšehetso ea tlhahiso ea mohlala, sehlopha se senyenyane le bophahamo ba modumo
Haeba projeke ea hau ea PCB e kenyelletsa Arlon 85N kapa laminate e 'ngoe ea mocheso o phahameng, re romelle lifaele tsa hau tsa Gerber, li-stack-up, BOM, le litlhoko tsa kopano bakeng sa tlhahlobo ea tlhahiso le khotheishene.
Ikopanye le Highleap Electronics ho buisana ka projeke ea hau ea tlhahiso le kopano ea PCB.