Bokhoni ba SMT
Lumela bokhoni ba kopano ea Highleap SMT ho fihlela PCB ea hau ea boleng bo holimo.
TŠEBELETSO TS'OANE
2 lihora khotheishene
12 lihora tsa thomello
Litšebeletso tsa tekheniki tsa lihora tse 7X24
HLAHLANG
Ho feta lilemo tse 10 sehlopha sa boenjiniere se nang le boiphihlelo
SEBELETSO SA TŠEBELETSO
E laoloa ka thata ka litekanyetso tsa IPC tsa boleng ba sehlahisoa ho feta 99.5%
THEKISO LENETE
Marang-rang a thekiso a akaretsa linaha le libaka tse fetang 200
Sheba bokhoni bo eketsehileng ba Highleap:
Bokhoni ba Highleap's SMT
Tafoleng e ka tlase ho na le lethathamo le felletseng la bokhoni ba kopano ea SMT ea Highleap.
Items
SMT/PTH e nang le lehlakore le le leng le habeli
Likarolo tse kholo ka mahlakoreng ka bobeli, BGA ka mahlakore ka bobeli
Li-Chips tse nyane ka ho fetisisa
Min BGA le Micro BGA palo le lipalo tsa bolo
Likarolo tsa Min Leaded pitch
Kopano ea boholo ba likarolo tsa Max ka mochini
Kopano holim'a thaba lihokelo
Likarolo tsa mofuta o sa tloaelehang: Resistor ea LED le capacit kapa marang-rang Li-electrolytic capacitors tse fapaneng le li-capacitor (lipitsa) Sockets
Wave soldering
Boholo ba PCB
Min PCB Botenya
Matšoao a Fiducial
PCB Qetella:
Sebopeho sa PCB
PCB e hlophisitsoeng
tlhahlobo
Mosebetsi o mocha
Min IC Pitch
Mochine oa khatiso oa solder
POP Manufacturing bokhoni
bokgoni
E
E
01005
0.008 in. (0.2mm) palo, palo ea bolo e kholo ho feta 1000
0.008 ho. (0.2 limilimithara)
2.2 ka. X 2.2 ka. X 0.6 ka.
E
E
E
14.5 ho. X 19.5 ho.
0.02
E ratoa empa ha e hlokehe
SMOBC / HASL / Electrolytic khauta / Khauta e se nang motlakase / Silevera e se nang motlakase / khauta e qoelisoang / tin / OSP
leha e le efe
Li-tab tse tsamaisoang/Tlhahiloe li-tab/V-Scored/Routed+ V lintlha
Tlhahlobo ea X-ray / microscope ho 20X
Seteishene sa ho tlosa le ho nkela sebaka sa BGA/SMT IR rework station/Thru-hole rework station
0.2mm
0.2mm
POP *3F
Nka Qotso e Potlakileng
Re boloka nako le litšenyehelo bakeng sa kopano ea hau ea boto ea potoloho e hatisitsoeng.