Bokhoni ba PCB bo thata-flex
Multilayer Rigid-Flex PCB e na le bokhoni bakeng sa li-prototype tse potlakileng le bongata ba tlhahiso.
Sheba bokhoni bo eketsehileng ba Highleap:
Matla a PCB a Highleap's Rigid-flex
Tafoleng e ka tlase ho na le lethathamo le felletseng la bokhoni ba tlhahiso ea PCB ea Highleap. Lenane lena le etselitsoe ho u thusa ho utloisisa hore na bokhoni ba Highleap bo tsamaisana le moetso oa hau. E tla boela e u lumelle ho rera esale pele le ho etsa moralo oa hau ka har'a bokhoni bona e le hore u ka ba le bonnete ba hore Highleap e ka hlahisa PCB ea hau.
Items
Max Layer
Inner Layer Min Trace/Space
Out Layer Min Trace/Space
Lera le ka Hare Max Koporo
Out Layer Max Copper
Min Mechanical Drilling
Min Laser Drilling
Aspect Ratio(Mechanical Drilling)
Aspect Ratio(Ho Drilling Laser)
Tobetsa Fit Hole Tolerance
Mamello ea PTH
NPTH Mamello
Mamello ea Countersink
Botenya ba Boto
Mamello ea Botenya ba Boto(<1.0mm)
Mamello ea Botenya ba Boto(≥1.0mm)
Mamello ea Impedance
Mini Board Size
Boholo ba Boto
Mamello ea Contour
Min BGA
Min SMT
Phekolo ea bokaholimo
Mask ea solder
Min Solder Mask Clearance
Letamo la Mask la Min Solder
Litaba
Min Legend Bophara/Botelele
Senya Bophara ba Fillet
Bow & Sotha
bokgoni
36L
2/2 mil
2/2 mil
xnumxoz
xnumxoz
0.1mm
0.075mm
12:1
1:1
± 0.05mm
± 0.075mm
± 0.05mm
± 0.15mm
0.4-3mm
± 0.1mm
± 10%
Qetello e le 'Ngoe: ±5Ω(≤50Ω),±10%(>50Ω)
Phapano: ± 5Ω(≤50Ω) ± 10%(>50Ω)
10 * 10mm
22.5 * 30inch
± 0.01mm
7 sekete
7*10mil
ENIG,Monoana oa Khauta,Silivera ea ho qoelisoa,Tin ea ho qoelisoa,HASL,OSP,ENEPIG,Khauta ea Flash;Potling ea khauta e thata
Botala, Botsho, Boputsoa, Bofubedu, Matt Green
1.5 sekete
3 sekete
Bosoeu, Botsho, Bokhubelu, Bosehla
4/23 mil
1.5 ± 0.5mm
0.05%
Nka Qotso e Potlakileng
Fumana hore na boitseanape ba rona bo ka u thusa joang ka projeke ea hau e latelang ea PCB.
