One-Stop Heavy Copper PCB Manufacturing and Assembly Service

Highleap Electronics e fana ka tharollo e le 'ngoe ea lefats'e bakeng sa tlhahiso ea koporo e boima ea PCB le kopano bakeng sa indasteri ea lisebelisoa tsa elektroniki.

Bokhoni ba Highleap ho li-PCB tse Thick Copper

Highleap Electronics e sebetsa ka ho khetheha tlhahisong ea li-PCB tse teteaneng tsa koporo tse etselitsoeng ho sebetsana le meroalo e phahameng ea hajoale, e fana ka ts'ebetso e ntle ea mocheso, le ho boloka matla a mochini lits'ebetsong tse hlokang. Bokhoni ba rona ba ho etsa tlhahiso bo tšehetsa botenya ba koporo bo fihlang ho 10oz likarolong tse ka hare le kantle, ho re etsa balekane ba tšepahalang bakeng sa lisebelisoa tsa motlakase tsa motlakase, lisebelisoa tsa likoloi, matla a tsosolositsoeng le lisebelisoa tsa indasteri.

Re ka fihlela bophara bo fokolang ba sebaka sa 2/2mil, ho lumella meralo e nepahetseng le e phahameng haholo ea lipotoloho esita le ka koporo e boima. Theknoloji ea rona e tsoetseng pele ea ho phunya e ts'ehetsa tekanyo ea mochini oa ho cheka ho fihla ho 20: 1, le laser ea ho cheka ho fihla ho 0.075mm, e nolofalletsang meaho ea PCB e kopaneng le e rarahaneng e nang le khokahanyo e ntle ea motlakase le ho ts'epahala.

Li-PCB tsa koporo tse teteaneng tsa Highleap li ka etsoa ka botenya ba boto ho tloha ho 0.4mm ho isa ho 8mm, le boholo ho tloha ho 10mm x 10mm ho isa ho 22.5 ″ x 30 ″ (571.5mm x 762mm). Re fana ka mefuta e mengata e fapaneng ea ho qeta bokaholimo, ho kenyelletsa ENIG, HASL, OSP, Silver Immersion, Immersion Tin, ENEPIG, Flash Gold, Hard Gold Plating, le Gold Finger, ho fihlela litlhoko tse fapaneng tsa ts'ebetso le botle.

Bakeng sa ho feto-fetoha ha moralo, re ts'ehetsa mebala e mengata ea mask a solder joalo ka Botala, Botsho, Boputsoa, ​​Bokhubelu le Matte Green, e nang le tumello ea mask ea solder e nyane joalo ka 1.5mil le bophara ba letamo bo tlase ba 3mil. Silkscreen (legend) e fumaneha ka White, Black, Red, and Yellow, ka bophara ba bonyane ba 4/23mil. Taolo ea rona e tiileng ea boleng e boetse e netefatsa seqha le ho sotha ≤ 0.3%, ho fana ka botsitso bo botle ba sebopeho le ts'ebetso ea boto ka kakaretso.

Mehlala ena ea lefatše la 'nete e bontša ho nepahala, ho ts'epahala, le ho tšoarella ha li-PCB tsa koporo tse boima tsa Highleap ha li sebetsa. Ho tloha ho mesaletsa e pharaletseng ea koporo bakeng sa phetisetso ea hajoale ho ea ho liboto tse ngata tse nang le sebaka se lekaneng le se rarahaneng ka meaho, PCB ka 'ngoe e bonts'a mekhoa ea rona e tsoetseng pele ea ho etsa le boitlamo ba boleng.

Litšoantšo tse latelang li totobatsa lits'ebetso le litlhophiso tse fapaneng tsa li-PCB tsa koporo tse boima, tse bonts'ang bokhoni ba rona ba ho fihlela litlhoko tse fapaneng tsa moralo le ts'ebetso:

Compact high-density high-density koporo e boima ba PCB e nang le qetello ea ENIG le mekhoa e rarahaneng ea potoloho.

Global Heavy Copper PCB Manufacturing and Sourcing

1. Ke Hobane'ng ha Khetha Highleap bakeng sa Litlhoko tsa Hao tse boima tsa Koporo ea PCB

Highleap Electronics ke moetsi ea ka sehloohong oa Heavy Copper PCB naheng ea China, e sebetsanang le ho hlahisa li-PCB tse sebetsang hantle, tse sebetsang hantle hona joale bakeng sa liindasteri tse fapaneng. Tlhokahalo ea lefats'e ea li-PCB tsa koporo e boima e ntse e hola ka potlako ka lebaka la ts'ebetso ea bona e phahameng lits'ebetsong tse matla haholo, joalo ka lits'ebetso tsa likoloi, matla a tsosolositsoeng le lisebelisoa tsa indasteri. Mona ke hore na ke hobane'ng ha u lokela ho nahana ka Highleap bakeng sa litlhoko tsa hau tse boima tsa koporo ea PCB:

• Tlhahiso ea Tlholisano Chaena: Highleap ke moetsi ea holimo oa China oa Heavy Copper PCB, ea fanang ka litharollo tse theko e tlaase ka linako tse potlakileng tsa ho etella pele le litekanyetso tsa boleng bo holimo. Bokhoni ba rona bo pharaletseng ba tlhahiso bo re lumella ho sebetsana le botenya ba koporo ho fihla ho 10oz, ho netefatsa hore litlhoko tsa hau tsa Heavy Copper PCB li fihlelleha ka ts'epo le ts'ebetso e phahameng.
• Ts'ebetso ea Lefatše: Highleap e sebetsa haufi-ufi le bareki ba machaba, ho fana ka tharollo e boima ea koporo ea PCB e finyellang litekanyetso tsa machaba. Feme ea rona e netefalitsoe ka ISO 9001, e netefatsa hore re fihlela litekanyetso tsa boleng bo holimo ho pholletsa le mekhoa eohle e boima ea koporo ea PCB.
• E ikamahanya le Likopo tsa Global: Hore na o lula Europe, Amerika Leboea, kapa Asia, Highleap e netefatsa hore o fumana li-PCB tsa Heavy Copper tse lokiselitsoeng kopo ea hau. Ho tloha lits'ebetsong tsa likoloi ho ea ho litharollo tsa matla a tsosolositsoeng, re sebetsana le liindasteri tse ngata tse hlokang liboto tsa morao-rao, tse sebetsang hantle.

2. Melemo ea ho Khetha Highleap joalo ka Mofani oa hau o boima oa Copper PCB

Ho khetha Highleap bakeng sa litlhoko tsa hau tse boima tsa koporo ea PCB ho tla le melemo e mengata. Ke ka lebaka lena bareki ba tšepang Highleap Electronics bakeng sa merero ea bona e boima ea koporo ea PCB:

• Bokhoni bo Phahameng ba Hona Joale ba ho Tšoara: Li-PCB tsa rona tsa Heavy Copper li etselitsoe lisebelisoa tse matla haholo. Ka botenya ba koporo ho tloha ho 4oz ho isa ho 10oz, re ka fana ka li-PCB tse hanyetsanang haholo, tse phahameng hona joale, tse loketseng lijaja tsa koloi ea motlakase, li-inverters tsa motlakase le li-drive tsa makoloi.
• Kamohelo le Tšepo ea Lefatše: Highleap e iketselitse botumo ba ho ba morekisi ea tšepahalang oa Heavy Copper PCB bakeng sa bareki ba lefats'e. Re lula re fana ka li-PCB tse sebetsang hantle tse fihlelang litlhoko tse thata tsa boleng le nako e telele, ho re etsa balekane ba ratoang indastering e kang ea sefofane, likoloi le lisebelisoa tsa elektroniki tsa indasteri.
• Prototyping e potlakileng le Phano e potlakileng: Re fana ka linako tse etellang pele ka potlako bakeng sa prototyping e boima ea koporo ea PCB, ho thusa bareki ba rona ho potlakisa lipotoloho tsa bona tsa ntlafatso ea lihlahisoa. Ka mekhoa ea rona ea tlhahiso e sebetsang hantle, re ka fana ka nako e khuts'oane ea phetoho, ho netefatsa hore projeke ea hau e lula ka kemiso.
• Litifikeiti tse Ananeloang Machabeng: Joaloka moetsi oa PCB ea tšepe o boima oa koporo naheng ea China, Highleap e kopana le ISO 9001, IATF 16949, le litifikeiti tse ling tse amehang. Sena se netefatsa tlhahiso e tsitsitseng, ea boleng bo holimo bakeng sa bareki bohle ba rona, hore na o etsa li-PCB tse boima tsa koporo bakeng sa likoloi, lisebelisoa tsa indasteri, kapa lisebelisoa tsa RF.

3. Hobaneng ha Highleap's Heavy Copper PCB Solutions e nepahetse bakeng sa Power Electronics, Automotive, le RF Applications

Highleap Electronics e ipapisitse le ho rala li-PCB tsa Heavy Copper bakeng sa lisebelisoa tsa motlakase tse matla haholo, lisebelisoa tsa likoloi le lits'ebetso tsa RF. Ke ka hona li-PCB tsa rona tse boima tsa koporo li loketseng liindasteri tsena:

• Lisebelisoa tsa motlakase: Li-PCB tsa Heavy Copper li loketse lisebelisoa tsa elektronike tse hlokang ho ts'oaroa ha hona joale le ho senya mocheso hantle. Li-PCB tsa rona tse boima tsa koporo li fana ka ts'ebetso e ntle ea mocheso, e li etsang hore li phethahale bakeng sa lits'ebetso tse kang lisebelisoa tsa motlakase, likoloi tsa motlakase, li-inverters tsa matla a letsatsi, le litsamaiso tsa taolo ea betri.
• Likoloi tsa Elektroniki: Litsamaiso tsa likoloi li hloka li-PCB tse ka mamellang meroalo e phahameng ea mocheso le khatello ea mochini. Li-PCB tsa Highleap's Heavy Copper li hahiloe ho sebetsana le maqhubu a phahameng bakeng sa lits'ebetso tse kang likarolo tsa taolo ea enjene (ECUs), lisebelisoa tsa mabone, le litsamaiso tsa polokeho. Ka conductivity e phahameng ea mocheso le impedance e tlase, li-PCB tsa rona tse boima tsa koporo li netefatsa ts'ebetso e ka tšeptjoang libakeng tse hlokang likoloi.
• Lisebelisoa tsa RF le Microwave: Li-PCB tsa koporo e boima le tsona li bohlokoa bakeng sa lits'ebetso tsa RF le microwave ka lebaka la ho se sebetse hantle ha tsona le ponts'o e ntle ea matšoao. Highleap e fana ka li-PCB tse boima tsa koporo bakeng sa li-amplifiers tsa RF, li-antenna, lisebelisoa tsa radar, le lisebelisoa tsa puisano, ho netefatsa tahlehelo e fokolang ea matšoao le ts'ebetso e ntlafetseng ka maqhubu a phahameng.

4. Li-PCB tsa Highleap's Heavy Copper li Thusa ho Fokotsa EMI le ho Ntlafatsa Botšepehi ba Letšoao

O mong oa melemo ea bohlokoa ea li-PCB tsa Heavy Copper ke bokhoni ba tsona ba ho fokotsa ho kena-kenana le motlakase oa motlakase (EMI) le ho ntlafatsa botšepehi ba matšoao. Mona ke kamoo li-PCB tsa koporo tse boima tsa Highleap li thusang ho fihlela sena:

• Superior Shielding bakeng sa EMI: Mekhahlelo e teteaneng ea koporo ka har'a li-PCB tse boima tsa koporo li sebetsa e le lithebe tse sebetsang hantle, tse thibelang tšitiso ea motlakase le lerata la mats'oao. Sena se etsa hore li-PCB tsa rona tsa Heavy Copper e be tse loketseng lits'ebetso tsa maqhubu a holimo moo ho boloka botšepehi ba matšoao ho leng bohlokoa.
• Impedance e tlase le Tahlehelo e Fokotseng ea Letšoao: Li-PCB tsa Heavy Copper li fana ka impedance e tlase, e bohlokoa bakeng sa lipotoloho tse lebelo le lits'ebetso tsa RF. Mesaletsa ea koporo e teteaneng e fana ka kabo ea matla e betere, e thusa ho boloka ts'ebetso e ts'oanang le ho fokotsa tahlehelo ea mats'oao ho li-circuits tsa dijithale tse lebelo le holimo.

5. Ho Khetha Highleap bakeng sa Custom Heavy Koporo PCB Solutions

Haeba u batla tharollo e boima ea koporo ea PCB, Highleap e ka fana ka mokhoa o hlophisitsoeng ho fihlela litlhoko tsa hau tse ikhethang. Ke sena se re khethollang:

• Litharollo tsa Koporo e Boima e Iketselitsoeng: Highleap e fana ka li-PCB tsa koporo tse boima tse etselitsoeng ho kopana le litlhaloso tsa hau hantle. Hore na o hloka PCB e nang le koporo ea 10oz bakeng sa sesebelisoa sa motlakase kapa PCB ea koporo ea 4oz bakeng sa lipotoloho tsa RF, re ka etsa moralo o lumellanang le litlhoko tsa hau tsa hajoale le litlhoko tsa nako e telele.
• Design for Manufacturability (DFM): Moralo oa rona oa tšebetso ea manufacturability (DFM) o netefatsa hore meralo ea hau e boima ea koporo ea PCB e ntlafalitsoe bakeng sa tlhahiso e ntle, ho fokotsa litšenyehelo le ho netefatsa chai e ngata.
• Tšehetso ea Boenjiniere ea Motho ka Mong: Highleap e fana ka tšehetso ea boenjiniere ea litsebi nakong eohle ea moralo le ts'ebetso ea tlhahiso. Sehlopha sa rona se sebetsa haufi-ufi le uena ho netefatsa hore meralo ea hau e boima ea koporo ea PCB e kopana le ts'ebetso, ts'epahalo, le litekanyetso tsa tlhahiso.

Litaelo tsa Moralo oa Koporo ea Boima ba PCB

Ho theha PCB e boima ea koporo ho feta hole feela ho holisa mesaletsa kapa ho eketsa botenya. E hloka mokhoa o akaretsang - lisebelisoa tsa ho leka-lekanya, tsamaiso ea mocheso, ts'ebetso ea motlakase, ts'epahalo ea sebopeho, le tlhahiso. Tataiso ena e fana ka lintlha tsa bohlokoa tsa moralo ho u thusa ho fihlela ts'ebetso e matla le e ts'epahalang lits'ebetsong tsa morao-rao, tse nang le mocheso o phahameng.

1. Khetho ea Lisebelisoa le Koporo ea Foil

Li-PCB tsa koporo tse boima, mofuta oa foil oa koporo o sebelisoang ke oa bohlokoa. Rolled Annealed (RA) koporo e fana ka ductility e phahameng le sebaka se boreleli, e leng se etsang hore e be se loketseng bakeng sa lits'ebetso tse phahameng tse ka tšeptjoang le tse phahameng. Electro-Deposited (ED) koporo e sebelisoa haholo bakeng sa meralo e tloaelehileng ea sejoale-joale.

Ho latela IPC-4562, bokaholimo ba metsi (Rz) bo ama haholo tahlehelo ea khafetsa le phetiso ea mocheso oa sehokelo. Bakeng sa substrate, lisebelisoa li lokela ho khethoa ka Tg e phahameng (≥170 ° C), CTE e tlaase (≤14 ppm / ° C), le conductivity ea mocheso ≥0.6 W / m · K ho boloka botsitso ba sebopeho tlas'a libaesekele tse futhumetseng.

2. Motlakase le Thermal Co-Design

Bokhoni ba hona joale ba ho jara bo lokela ho baloa ho latela IPC-2152, ka litokiso bakeng sa botenya ba koporo ka holimo ho 4oz. Kamano e teng lipakeng tsa bongata ba hona joale, ho phahama ha mocheso, le bophara ba trace e tlameha ho hlahlojoa ka nepo. Bakeng sa koporo e ka ntle, tekanyo ea I = 0.048 × ΔT^0.44 × A^0.725 (ka Amps) e ka sebelisoa.

Ka maqhubu a phahameng, phello ea letlalo e fetoha e sa tsotelleng. Hape, koporo e teteaneng e fokotsa ts'oaetso-haholo-holo ea bohlokoa lipotolohong tse laoloang ke impedance. Baqapi ba tlameha ho fetola bophara ba sekhahla le botenya ba dielectric ho latela, ha ba ntse ba ikarabella bakeng sa mamello ea botenya ba koporo (± 10%), e ka hlahisang mefuta e sa tšoaneng ea impedance ea ± 3Ω.

3. Taolo ea Mocheso le Taolo ea Khatello

Li-PCB tse matla tsa koporo hangata li sebetsana le phallo e phahameng ea mocheso. Lisebelisoa tsa papiso ea mocheso joalo ka ANSYS Icepak li khothaletsoa ho etsa mohlala oa kabo ea mocheso oa 3D le litsela tsa phallo. Litharollo tse sebetsang hantle tsa mocheso li kenyelletsa li-blocks tsa koporo tse kentsoeng, likarolo tse fapaneng tsa koporo (mohlala, 4oz top / 2oz tlase), le mocheso o motenya ka li-arrays.

Ho tšepahala ha mechine ho lokela ho rarolloa ka ho fokotsa khatello ea mocheso libakeng tse mahlonoko (ε_max <0.3%). Maano a ho cheka - ho kenyeletsoa karo-karolelano ea likoti, ho cheka mokokotlo, le tšehetso ea pad - e tlameha ho ntlafatsoa ho qoba mefokolo ea mokhathala joalo ka ho petsola kapa ho phahamisa liphahlo.

4. Ntlafatso ea Moqapi o Lebeletsoeng ke Tlhahiso

Ho kenya koporo e teteaneng ho hlahisa mathata a maholo. Matšeliso a Side etch a lokela ho baloa esale pele ho sebelisoa ΔW = 2 × Copper Thickness / Etch Factor, moo etch factor e fapaneng le boima ba koporo (mohlala, 3oz: 3.0, 6oz: 2.5).

Sebelisa boima bo eketsehileng ba koporo (mohlala, 4oz, 6oz, kapa ho feta) hafeela li fana ka molemo o bonahalang-joaloka matla a ho jara hona joale kapa ho fokotseha ho fokolang. Tšebeliso e feteletseng e ka lebisa ho raraaneng ho sa hlokahaleng le litšenyehelo.

Ho amohela koporo e boima nakong ea ho cheka, ka moralo o tlameha ho fetoloa ka nepo. Qala ka 0.6mm vias bakeng sa 4oz koporo le eketsa ho 0.8mm kapa e khōloanyane bakeng sa le dikarolo tenya ho qoba ho apara sesebelisoa le ho etsa bonnete ba plating e ka tšeptjoang. Ho feta moo, boholo ba reng ea annular bo lokela ho eketsoa ho ≥0.25mm. Matla a eketsehileng a ho phunya a hlokehang bakeng sa koporo e boima a eketsa kotsi ea ho phunya le ho senyeha ha pad - mehele e pharaletseng e fokotsa kotsi ena le ho matlafatsa botšepehi ba mochine.

Ka mokhoa o ts'oanang, bophara ba tranelate bo lokela ho eketseha. Koporo e boima e fana ka khanyetso e tlase, e nolofalletsang mesaletsa e pharalletseng ho tsamaisa nako e phahameng ka katleho. Bakeng sa koporo ea 4oz–6oz, sebelisa 0.2–0.3mm trace width e le motheo, ho fihla ho 0.5mm kapa ho feta bakeng sa lisebelisoa tsa koporo tse boima haholo.

Bakeng sa mefuta e fapaneng ea koporo ea sebakeng sa heno, hlalosa boima ba koporo bo ikhethileng sebakeng sa lifaele tsa hau tsa Gerber kapa ODB++, ho netefatsa liphetoho tse thellang-e khothalelitsoeng ≤45° taper ka bolelele ba ≥3mm. Botenya ba koporo e kentsoeng ka lesoba e lokela ho ba ≥25μm, 'me ka ho tlatsa tumello ea mask ea solder e tlameha ho fihlela litlhoko tse kopaneng tsa motlakase, mocheso le mochini.

5. Tiiso ea Papiso le Tiiso ea Boleng

Pele ho tlhahiso ea bongata, netefatsa khanyetso ea trace u sebelisa mokhoa oa terata e mene 'me u hlahlobe kabo ea mocheso ka infrared thermography. Bakeng sa botšepehi ba matla, Sigrity simulation e eletsoa, ​​ha ANSYS e ka netefatsa khatello ea mocheso le mochine.

Litlhahlobo tsa tlhahiso e sebelisang Valor NPI li thusa ho ntlafatsa phallo ea prepreg, ho ts'oana ha koporo, le ho bokellana ha lamination, ho eketsa chai ea ho qetela. Bakeng sa lits'ebetso tse ts'epahalang haholo makaleng a likoloi, liindasteri le matla, etsa liteko tsa mocheso oa mocheso (-55 ° C ho ea + 125 ° C) le liteko tsa triaxial vibration ho netefatsa ho tšoarella ha nako e telele tlas'a maemo a thata.