Liphutheloana tsa BGA
Notlolla Bokhoni le Litšenyehelo ka Liphutheloana tsa BGA tsa Highleap: Tlhahiso e Nolofalitsoeng, Litšenyehelo tse Fokotsoeng tsa Tlhahiso.
BGA PCB Solutions for Compact, High-Pin-Count Applications
Li-PCB tsa BGA (Ball Grid Array) li bohlokoa bakeng sa lisebelisoa tsa elektroniki tse hlokang boholo bo bonyenyane, pini e phahameng, le ts'ebetso e ntle ea mocheso. Ho fapana le liphutheloana tsa setso tse nang le mahlakoreng a mahlakoreng, likarolo tsa BGA li hokahanya ka libolo tsa solder ka tlas'a chip-ho boloka sebaka le ho ntlafatsa botšepehi ba matšoao.
Sebopeho sena se thusa:
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Sekhahla se phahameng sa likarolo ntle le ho eketsa boholo ba boto
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Ho qhalana ha mocheso ho matla bakeng sa lisebelisoa tse lebelo le phahameng kapa tse lapileng motlakase
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Tšepo e ntlafalitsoeng ea solder ka likhokahano tse tsitsitseng tsa ho phalla hape
E loketse li-smartphones, likhomphutha, lirutha le lisebelisoa tsa elektroniki tsa likoloi, li-PCB tsa BGA li ts'ehetsa ho tšoarella ha nako e telele ho meralo e kopaneng.
Highleap Electronics e fana ka tlhahiso le kopano ea turnkey BGA PCB ho tloha ho prototype ho isa tlhahisong ea bongata. Re sebelisa tlhahlobo ea X-ray ka hare ho ntlo, reflow profiling, le mekhoa e tiisitsoeng ea IPC ho etsa bonnete ba hore ho na le chai e ngata le manonyeletso a tsitsitseng a solder-esita le libotong tse rarahaneng tsa multilayer.
Highleap BGA - PCB Prototype Tsela e Bonolo
Mefuta ea liphutheloana tsa BGA tse sebelisoang hangata?
BGA (Ball Grid Array) ke mofuta o tsebahalang oa sephutheloana o sebelisoang lipotolohong tse kopaneng (ICs) le likarolo tsa elektroniki. E fana ka mokhoa o kopanetsoeng le o ts'epahalang oa ho kenya li-IC holim'a liboto tsa potoloho tse hatisitsoeng (PCBs). Mona ke mefuta e meng e sebelisoang hangata ea liphutheloana tsa BGA:
PBGA
PBGA (Plastiki Ball Grid Array) ke mofuta o sebelisoang haholo oa sephutheloana sa BGA. E na le substrate ea polasetiki e nang le marang-rang a libolo tsa solder ka tlase, e hokahanyang IC le PCB. Liphutheloana tsa PBGA li fana ka ts'ebetso e ntle ea mocheso le motlakase 'me li fumaneha ka boholo bo fapaneng le lipalo tsa bolo.
CBGA
Liphutheloana tsa CBGA (Ceramic Ball Grid Array) li sebelisa substrate ea ceramic sebakeng sa polasetiki. Ceramic e fana ka conductivity e betere ea mocheso le botsitso ha e bapisoa le polasetiki, e etsa hore CBGA e tšoanelehe bakeng sa lits'ebetso tse phahameng tse hlokang mocheso o sebetsang hantle. Li-CBGA li sebelisoa hangata ho li-processor, li-graph chips, le li-IC tse ling tse matla haholo.
TBGA
Liphutheloana tsa TBGA (Thin Ball Grid Array) li etselitsoe ho ba le boemo bo fokolang ha bo bapisoa le liphutheloana tsa setso tsa BGA. Li sebelisoa lits'ebetsong moo sebaka se fokolang, joalo ka lilaptop, matlapa le lisebelisoa tsa mehala. Liphutheloana tsa TBGA hangata li na le sekontiri se senyenyane sa bolo le botenya bo fokotsehileng ho kopana le lithibelo tsa boholo.
FBGA
Liphutheloana tsa FBGA (Fine Ball Grid Array) li na le sekhahla se senyenyane sa bolo ha se bapisoa le liphutheloana tse tloaelehileng tsa BGA. Li sebelisoa lits'ebetsong tse hlokang li-pin tse phahameng le ts'ebetso e ntlafalitsoeng ea motlakase. Li-FBGA li atisa ho fumanoa li-module tsa memori, tse kang DDR3 le DDR4 modules.
uBGA
Liphutheloana tsa uBGA (Micro Ball Grid Array) ke mefuta e nyane ea liphutheloana tsa BGA, tse etselitsoeng lintlha tse nyane haholo le li-pin tse phahameng. Li sebelisoa ho lisebelisoa tsa elektroniki tse kopaneng joalo ka li-smartphones, tse roaloang le lisebelisoa tsa IoT. Li-UBGA li na le libaka tse nyane haholo tsa bolo 'me li thata ho li kopanya le ho sebetsa bocha ka lebaka la boholo ba tsona.
CCGA
Liphutheloana tsa CCGA (Ceramic Column Grid Array) li na le litšiea tsa ceramic sebakeng sa libolo tsa solder bakeng sa likhokahano tsa motlakase. Litšiea tsa ceramic li fana ka ts'epo e ntle le matla a mochini, li etsa hore li-CCGA li tšoanelehe bakeng sa lits'ebetso tse nang le litlhoko tse phahameng tsa ts'isinyeho le ho sisinyeha, joalo ka lisebelisoa tsa elektroniki tsa likoloi le sefofane.
Ena ke mehlala e seng mekae feela ea mefuta e sebelisoang hangata ea liphutheloana tsa BGA. Mofuta o ikhethileng oa sephutheloana o khethiloeng bakeng sa ts'ebeliso e itseng o ipapisitse le lintlha tse joalo ka lithibelo tsa boholo, litlhoko tsa mocheso, palo ea li-pin, ts'ebetso ea motlakase, le lintlha tsa litšenyehelo.
Melemo ea BGA Package
Sebakeng sa lisebelisoa tsa elektroniki, liphutheloana tsa BGA li fana ka ts'ebetso ea sebaka, matla a mocheso, ts'ebetso e tsitsitseng ea motlakase, le tlhahiso e hlophisitsoeng, e fokotsang litšenyehelo. Highleap, moetsi ea ka sehloohong oa PCB & PCBA, o sebelisa melemo ea BGA bakeng sa litharollo tsa boleng bo holimo, tse bolokang chelete e ngata. Melemo ea BGA Package ke e latelang:
Tšebeliso e nepahetseng ea sebaka sa PCB
Liphutheloana tsa BGA li fana ka ts'ebeliso e ntle ea sebaka sa PCB. Ka likarolo tse fokolang tse amehang le sebaka se senyenyane sa maoto, li thusa ho boloka sebaka ho li-PCB tse tloaelehileng, ho ntlafatsa haholo bokhoni ba sebaka sa PCB. Sena ke sa bohlokoa ka ho khetheha lisebelisoa tsa elektroniki tsa compact.
Ntlafatso ea Ts'ebetso ea Thermal
Liphutheloana tsa BGA li ipabola taolong ea mocheso. Ha silicon chip e behiloe ka holimo, mocheso o mongata o ka fetela tlase ka mokhoa o atlehileng oa marang-rang a bolo. Ka lehlakoreng le leng, ha silicon chip e behiloe ka tlase, karolo e ka morao ea lefu e hokahane le bokaholimo ba sephutheloana, e nolofalletsang ho pholisa ka katleho. Ts'ebetso ena ea mocheso e fokotsa kotsi ea ho futhumala ho feteletseng le ho ntlafatsa ho tšepahala ha likarolo tsa elektronike.
Ts'ebetso e Ntlafetseng ea Motlakase
Liphutheloana tsa BGA li fana ka ts'ebetso e tsitsitseng ea motlakase ka tekanyo e kholo. Ha li na lithapo tse kobehang kapa tse robehang, tse fokotsang kotsi ea mathata a khokahanyo ea motlakase. Botsitso bona bo tiisa ts'ebetso e tsitsitseng le e ka tšeptjoang ea lipotoloho tse kopantsoeng.
Streamlined Soldering Process
Liphutheloana tsa BGA hangata li na le libolo tse kholo haholo. Sena se etsa hore soldering ea sebaka se seholo e laolehe le ho ba bonolo nakong ea ts'ebetso ea tlhahiso. Ka lebaka leo, lebelo la tlhahiso ea PCB le eketseha, 'me lihlahisoa tsa tlhahiso ea kakaretso lia ntlafatsoa. Ho phaella moo, libolo tse kholoanyane tsa solder li etsa hore ho tsosolosoe, ha ho hlokahala, ho be bonolo haholoanyane.
Tšenyo e Fokotseng ea Loto
Lieta tsa BGA li na le libolo tse tiileng tsa solder, tse sa senyeheng habonolo nakong ea ho ts'oaroa, ho bokana, kapa ho sebelisoa ha ho bapisoa le liphutheloana tsa setso tse nang le lead tse senyehang. Ho tšoarella hona ho kenya letsoho ho pheleng nako e telele le ho tiea ha lisebelisoa tsa elektroniki.
Ho fihlela melemo ena, ho sebelisana 'moho le baetsi ba PCB ba nang le boiphihlelo le PCBA ho bohlokoa. Highleap, moetsi ea tsebahalang oa PCB & PCBA, o eme e le molekane ea tšepahalang ho elelloeng melemo ea liphutheloana tsa BGA. Boitseanape ba rona mabapi le mekhoa ea ho etsa le ho bokana bo netefatsa litharollo tsa boleng bo holimo le tse theko e tlaase bakeng sa mefuta e mengata ea lisebelisoa tsa elektroniki.
Lintlha tse Amang Boleng ba Kopano ea PCB BGA?
Boleng ba kopano ea PCB BGA (Ball Grid Array) bo ka susumetsoa ke lintlha tse fapaneng. Ho etsa bonnete ba hore ho ela hloko lintlha tsena ho bohlokoa ho fihlela likopano tsa BGA tse ka tšeptjoang le tsa boleng bo holimo. Mokhoa oa rona oa tšebelisano, o kenyelletsang baqapi ba PCB, litsebi tsa kopano, le basebetsi ba taolo ea boleng, o netefatsa taolo e sebetsang ea lintlha tsena, e leng se etsang hore ho be le kopano e atlehileng ea BGA bakeng sa mefuta e fapaneng ea likopo. Mona ke lintlha tsa bohlokoa tse ka amang boleng ba kopano ea PCB BGA:
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Sesebelisoa sa Solder Paste
Tšebeliso ea solder paste ke ea bohlokoa bakeng sa ho fumana manonyeletso a matle a solder. Lintlha tse kang moralo oa stencil, sebopeho sa solder paste, le mekhahlelo ea ts'ebetso ea khatiso (mohlala, khatello ea squeegee, lebelo, le alignment) li ka ama ho beoa ha solder paste. Kopo e nepahetseng ea solder paste e netefatsa palo e lekaneng ea solder bakeng sa ho etsa likhokahano tse tšepahalang.
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Khokahano ea Karolo ea BGA:
Khokahano e nepahetseng ea karolo ea BGA ho PCB e bohlokoa. Ho se tsamaisane hantle ho ka baka likhokahano tse mpe tsa solder kapa lifupi lipakeng tsa libolo tsa solder tse haufi. Tlhahlobo le taolo e lekaneng nakong ea ts'ebetso ea ho beha li thusa ho netefatsa boemo bo nepahetseng ba karolo ea BGA ho PCB.
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Solder Reflow Profile
Ts'ebetso ea solder reflow e kenyelletsa ho futhumatsa PCB ho qhibilihisa peista ea solder le ho theha likhokahano tsa solder. Boemo ba reflow bo kenyelletsa liparamente tse kang preheat, soak, le lithempereichara tse phahameng, hammoho le litekanyetso tsa ho nyoloha le ho theoha. Profaele e ntlafalitsoeng hantle e netefatsa ho koloba le ho phalla hantle ha solder paste, ho qoba litaba tse kang molumo o sa lekaneng oa solder, voids, kapa solder ball collapse.
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Mehopolo ea Mocheso
Liphutheloana tsa BGA li ka hlahisa mocheso o moholo nakong ea ts'ebetso. Tsamaiso ea mocheso ke ea bohlokoa ho thibela mocheso o feteletseng, o ka amang ho tšepahala ha manonyeletso a solder. E nepahetseng moralo mogote, ho akarelletsa le ho sebelisa vias mogote, lisinki mocheso, le mesaletsa e lekaneng ea koporo PCB, thusa dissipate mocheso ka katleho le ho thibela ho hloleha thermally-i susumetsoa.
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Litlhaloso tsa Moqapi oa PCB
Moralo oa PCB o bapala karolo ea bohlokoa ho boleng ba kopano ea BGA. Lintlha tsa moralo tse joalo ka sebopeho sa pad, ka ho beoa, le moralo oa mask oa solder li ama sebopeho le ho ts'epahala ha motsoako oa solder. Boholo bo nepahetseng ba pad, sebopeho, le sebaka se arohaneng li bohlokoa ho etsa bonnete ba ho kolobisa ka mokhoa o lekaneng le ho thibela borokho ba solder kapa bolo ea solder e fosahetseng.
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Khetho ea Lintho tsa PCB
Khetho ea lisebelisoa tsa PCB e ka ama boleng ba kopano ea BGA. Lintlha tse kang coefficient ea katoloso ea mocheso (CTE) ea thepa ea PCB e lokela ho lumellana le karolo ea BGA le mokhoa oa kopano. Li-CTE tse sa lumellaneng li ka lebisa khatellong ea mocheso le ho hloleha ha manonyeletso a solder ka nako.
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Tlhahlobo le Teko
Lits'ebetso tsa tlhahlobo le liteko tse phethahetseng li bohlokoa bakeng sa ho netefatsa boleng ba likopano tsa BGA. Mekhoa e joalo ka tlhahlobo ea X-ray, tlhahlobo ea optical e iketsang (AOI), le tlhahlobo ea motlakase li thusa ho lemoha mefokolo joalo ka molumo o sa lekaneng oa solder, ho se tsamaisane hantle, marikhoe a makhutšoanyane kapa likhokahano tse bulehileng. Mekhoa e nepahetseng ea tlhahlobo le tlhahlobo e thusa ho tseba le ho lokisa mathata afe kapa afe pele sehlahisoa sa ho qetela se sebelisoa.
Bokhoni ba Highleap BGA
Bokhoni ba kamehla ba tlhahiso ea BGA fekthering ea rona bo tjena. Haeba u na le litlhoko tse khethehileng, ka kopo ikopanye le rona ho Highleap. Re na le sehlopha sa litsebi tsa tšebetso ea tekheniki:
Botlaaseng ba bophara ba BGA pad ke 0.2MM (moeli oa sampole e ka ba 0.15MM).
Bonyane BGA ho moleng ke 3MIL (moeli oa mohlala o ka ba 2.5MIL).
Sebaka se fokolang ho tloha moeling oa BGA ho ea ho li-pads tsa lisebelisoa tse ling ke 0.15mm.
Bonyane sebaka ho tloha bohareng ba e 'ngoe ea BGA solder pad ho ea bohareng ba BGA e 'ngoe solder padis 0.35mm.