Tlhahlobo e Felletseng ea PCB
Eba le Boleng bo Ntlafetseng ba PCB ka Highleap's SPI, AOI, AXI, le Mekhoa ea Tekolo ea ICT!
Litšebeletso tse Pharalletseng tsa Tlhahlobo ea PCB & PCBA
Ho Highleap Electronics, PCB e 'ngoe le e 'ngoe le PCBA eo re e hlahisang e feta ka mokhoa o hlophisitsoeng, oa mekhahlelo e mengata ho netefatsa bonnete ba boleng ba boleng ho tloha ho etsoa ho ea ho kopano ea ho qetela. Re sebelisa litsamaiso tse tsoetseng pele tsa tlhahlobo mohatong o mong le o mong oa bohlokoa - ho tloha ho netefatso ea boto ho isa tlhahlobong e kopaneng ea boto - ho thusa ho fokotsa mefokolo, ho thibela ho sebetsa bocha, le ho netefatsa ts'ebetso e ts'epahalang.
Bakeng sa li-PCB tse se nang letho, litlhahlobo li kenyelletsa Automated Optical Inspection (AOI) ho bona bofokoli ba etching, li-circuits tse khutšoane, kapa mesaletsa e bulehileng, hammoho le licheke tse nepahetseng le tlhahlobo ea pono. Habohlokoa, re etsa Teko ea Motlakase ea 100% (Flying Probe kapa Bed-of-Nails) botong e 'ngoe le e 'ngoe e se nang letho ho netefatsa khokahanyo, tsoelo-pele le ho nepahala ha tlhahiso. Netefatso ena e phethahetseng ea motlakase e etsa bonnete ba hore mefokolo efe kapa efe ea masela e tsejoa le ho rarolloa pele kopano e qala.
Nakong ea PCBA, re kopanya Tlhahlobo ea Solder Paste (SPI), AOI bakeng sa ho beha likarolo le boleng ba motsoako oa solder, tlhahlobo ea X-ray bakeng sa manonyeletso a patehileng a kang BGAs, le In-Circuit Testing (ICT) ho netefatsa ts'ebetso ea motlakase le ts'ebetso e nepahetseng ea karolo.
Ho netefatsa ts'ebetso ea sehlahisoa sa ho qetela le ho tšoarella nako e telele, re boetse re etsa Teko ea Ts'ebetso tlas'a maemo a sebele a lefats'e, Tlhahlobo ea Burn-In ho tseba ho hloleha ha bophelo ba pele ka lebaka la khatello ea mocheso, le Teko ea Tikoloho ho netefatsa ho ts'epahala ha nako e telele ho pholletsa le mocheso o feteletseng, mongobo le tikoloho. Mokhoa ona o felletseng o netefatsa hore boto e 'ngoe le e' ngoe e tlisoang e loketse ts'ebetso e tšepahalang ts'ebelisong ea hau ea ho qetela.
1. Bare PCB Tlhahlobo
Morero : E netefatsa botšepehi ba sebopeho le ts'ebetso ea motlakase pele e kena moleng oa kopano.
Mekhoa ea Bohlokoa :
- Tlhahlobo e bonoang: E hlahloba hore na ha ho na mengoapo, ho ngolisoa hampe, likoli tsa maske a solder, le ho hlaka ha silika.
- Teko ea Motlakase (100%): E netefatsa hore ha ho na li-circuits kapa marikhoe a makhutšoane a sebelisang probe e fofang kapa mochini oa liteko.
- Tekanyo ea Impedance: E netefatsa litekanyo tsa bohlokoa tsa ho latela lits'ebetso tse laoloang tsa impedance.
- Netefatso ea Dimensional & Hole: E netefatsa boholo bo nepahetseng ba lesoba, ho tsamaisana le liphaephe, le ngoliso ea lera.
Mokhahlelo oa Tlhahlobo : Kamora tlhahiso ea PCB, pele ho kopano ea SMT kapa ea lesoba le phunyeletsang.
2. Tlhahlobo ea Solder Paste (SPI)
Morero : E netefatsa ho nepahala ha ho beoa ha peista ea solder kamora ho hatisoa ha stencil.
Melemo ea Bohlokoa :
- E lemoha solder e sa lekaneng kapa e feteletseng
- E thibela borokho, tombstones, le ho bula manonyeletso
- E fana ka 'mapa oa bolelele ba 3D bakeng sa taolo ea ts'ebetso
Theknoloji e Sebelisitsoe: Litsamaiso tse phahameng tsa 3D SPI
Sethala sa Tlhahlobo: Kamora khatiso ea solder peista, pele khetha & sebaka
3. Tlhahlobo e Ikemetseng ea Optical (AOI)
Morero : Ho khetholla liphoso tse bonahalang le tsa ho beha holim'a mapolanka a kopaneng.
Melemo ea Bohlokoa :
- E lemoha likarolo tse sieo/tse sa lumellaneng hantle, liphoso tsa polarity, le litaba tsa solder
- E nka litšoantšo tsa 2D le 3D ka bobeli bakeng sa tlhahlobo e nepahetseng
- E netefatsa maikutlo a potlakileng, a boleng bo holimo nakong ea tlhahiso ea SMT
Theknoloji e Sebelisitsoe: Sistimi ea kh'amera ea HD e nang le kananelo ea setšoantšo se tsamaisoang ke AI
Sethala sa Tlhahlobo: Tlhahlobo ea ka mor'a ho behoa le ka mor'a ho khutlisetsoa morao
4. Tlhahlobo ea X-ray e Ikemetseng (AXI)
Morero : E hlahloba manonyeletso a patiloeng a solder tlas'a BGA, QFN, le likarolo tse felisitsoeng ka tlase.
Melemo ea Bohlokoa :
- E hlahisa mathata a kahare joalo ka li-voids, solder e sa lekaneng, kapa borokho
- E tšehetsa li-PCB tse nang le mahlakore a mabeli le tse phahameng haholo
- E tlatsana le AOI bakeng sa litaba tse felletseng
Theknoloji e Sebelisitsoe: Sistimi ea 3D X-ray tomography
Sethala sa Tlhahlobo: Ka mor'a reflow kapa wave soldering
5. Teko ea Potoloho (ICT)
Morero : E netefatsa ts'ebetso ea potoloho le botšepehi ba motlakase botong e kopaneng ka botlalo.
Melemo ea Bohlokoa :
- E netefatsa boleng ba li-resistors, capacitor, diode, joalo-joalo.
- E hlwaya marikgwana a makgutshwane, a bulehe, le diphoso tsa sebopeho sa dikarolo
- E ts'ehetsa tlhahlobo ea ts'ebetso ea boikhethelo
Theknoloji e Sebelisitsoe: Li-platform tsa ICT tsa bethe ea lipekere le lipatlisiso tse fofang
Sethala sa Tlhahlobo: Ho laola boleng ba ho qetela pele ho paka le ho pepa
Ke Hobane'ng ha Tlhahlobo ea Highleap's PCB e le Bohlokoa
Sistimi e pharalletseng ea Highleap ea tlhahlobo—ho kenyeletsoa SPI, AOI, AXI, le ICT—ha se tšebeletso ea boikhethelo kapa monahano o itseng. E hokahane ka botebo ts'ebetsong ea rona ea ho etsa le ho kopanya PCB ea ho qetela. Theknoloji ena e fana ka boleng bo felletseng feela ha re laola bophelo bohle ba tlhahiso, ho tloha ho boto e se nang letho ho isa kopanong ea ho qetela.
| Mothati oa tlhahiso | Embedded Testing | Seo E se Tšosang | Hobaneng ho le Bohlokoa ha re Haha & re Kopana |
|---|---|---|---|
| 1. Letlapa le entsoeng ka boto | • Lera le ka hare la AOI & LDI • Ngoliso ea ho cheka X-ray • Teko ea motlakase ea 100% e fofang |
Mesaletsa e sa hlakang, marikhoe a makhutšoane/a bulehang, ho fetoha ha maemo, ka ho ngolisoa hampe | Sehlopha sa rona sa CAM se sebetsa ho latela lintlha tsa AOI & ET ka nako ea sebele—liphaello lia lokisoa pele boto e fihla ho SMT. |
| 2. Khatiso ea solder-paste | SPI (tlhahlobo ea solder-paste ea 3D) | Sekgoa se sa lekaneng/se fetelletseng, ho tlotsa, borokgo | Beha lintlha tsa bophahamo li fepa ka kotloloho ho printa ea rona ea skrineng bakeng sa tokiso ea hang-hang - ha ho tieho ea ho tsoa. |
| 3. Ho beha likarolo le ho phalla hape | AOI pele le ka morao ho phalliso | Likarolo tse sieo, tse pota-potiloeng, tse mabitleng, tsa boleng bo fosahetseng; marokho a solder | Liphetho tsa AOI li etsa hore ho be le tokiso ea ho khetha le ho beha sebaka. Re emisa mathata, eseng feela ho a bona. |
| 4. Metsoako ea liphutheloana tse rarahaneng | AXI (3D X-ray) | Voids, libolo tsa BGA, hlooho-in-mosamo, ka litaba tsa ho tlatsa | Kahobane re kentse li-vias, maikutlo a AXI a re thusa ho ntlafatsa ho cheka le ho rala potolohong e latelang. |
| 5. PCBA e felile | Teko ea ICT / ea ts'ebetso e nang le lisebelisoa tse tloaelehileng | Shorts, bula, boleng bo fosahetseng, liphoso tsa logic | Litokiso li hokahane le lifaele tsa rona tsa mantlha tsa ho cheka, ho netefatsa tlhahlobo e nepahetseng le ho lokisa liphoso kapele. |
| 6. Tšebelisano e kopaneng | MES e bohareng e hokahanya masela, SMT, le tlhahlobo | Nalane e felletseng: boto, phanele, karolo, lotho | Tlaleho e le 'ngoe, sehlopha se le seng. Ha ho molato kapa tieho ea tlhahlobo ea sesosa sa sesosa. |
Hlahloba Litšebeletso tsa ho fumana likarolo tsa Highleap Electronic.