Ea Tšepahalang HDI PCB Manufacturer | Phaliso e potlakileng, Li-stackups tse rarahaneng, phepelo ea lefats'e
Fumana li-PCB tsa High-Density Interconnect (HDI) tse nang le li-stackups tse fihlang ho 5+N+5. E tšeptjoa ke mekhatlo ea bongaka, telecom, le likoloi. Phetoho e potlakileng: matsatsi a 5-15.
HDI PCB Manufacturing Services
U hloka li-PCB tsa HDI tse kopaneng, tse lebelo le holimo, tse nang le mefuta e mengata bakeng sa lits'ebetso tse rarahaneng? Highleap e sebetsa ka ho khetheha ho li-PCB tsa tloaelo tsa High-Density Interconnect (HDI) tse etselitsoeng ho fihlela litlhoko tse batloang haholo. Ho tloha ho li-vias tse sa boneng le tse patiloeng ho isa ho li-microvias le likhokahano tsa lera le leng le le leng, ts'ebetso ea rona e tsoetseng pele ea tlhahiso e netefatsa ts'ebetso e phahameng le ts'epo. Fumana quote kajeno 'me u potlakise tlhahiso ea sehlahisoa sa hau ka theknoloji ea HDI e tsoetseng pele.
Mefuta ea HDI PCB
HDI PCBs li fumaneha ka mefuta e fapaneng, mona ke mefuta e meng e tloaelehileng ea HDI PCBs:
1 + N + 1
Ka har'a stackup ena, "1" e emela lesela la mantlha le nang le koporo mahlakoreng ka bobeli, 'me "N" e bontša palo ea likarolo tse eketsehileng tsa koporo tse kentsoeng ka holim'a lera la mantlha.
Li-stackups tsena li loketse lisebelisoa tse kang li-smartphones tsa maemo a holimo, matlapa, lilaptop, le lisebelisoa tse ling tsa elektroniki tse tsoetseng pele.
HDI PCB 1+N+1 kaho
2 + N + 2
Ka stackup ea 2-N-2, ho na le likarolo tse peli tsa mantlha tse kentsoeng lipakeng tsa likarolo tse ngata tse eketsehileng tsa koporo.
Li-stackup tsena li loketse hantle lik'homphieutha tse sebetsang hantle, lisebelisoa tsa mehala, lisebelisoa tsa bongaka, le lisebelisoa tse ling tse tsoetseng pele tsa elektroniki.
3 + N + 3
Li-stackup tsena li loketse ka ho khetheha li-smartphone tsa sejoale-joale, matlapa, lisebelisoa tse aparoang, lisebelisoa tsa puisano tsa lebelo le holimo, le lisebelisoa tse ling tsa elektroniki tse kopaneng .
Leha ho le joalo, e boetse e hloka lits'ebetso tse nepahetseng tsa tlhahiso le bokhoni bo tsoetseng pele ba ho etsa PCB ho netefatsa liboto tse tšepahalang le tsa boleng bo holimo.
HDI PCB - Khokahano e 'ngoe le e' ngoe ea Lera
E thekesele ka HDI PCB
Ho tse thekeseleng ka HDI PCB, li-microvias li thekesela lipakeng tsa mekhahlelo e fapaneng, li fana ka maemo le sebaka sa ho tsamaisa litsela le likarolo tse hokahanyang.
Ka ho sebelisa li-vias tse tsitsitseng, baqapi ba ka ntlafatsa litsela tsa matšoao le ho fokotsa tahlehelo ea matšoao, ho netefatsa ts'ebetso e ntle le ho tšepahala ha sesebelisoa sa elektroniki.
E hlophisitsoe ka HDI PCB
Ho tse pakiloeng ka moralo, li-microvias li phuthetsoe ka holim'a tse ling ho theha likhokahano tse otlolohileng lipakeng tsa likarolo tse fapaneng tsa PCB.
Pokello e nepahetseng ea HDI e fokotsa litšenyehelo tsa hau!
Litšenyehelo tsa HDI PCB li ka fokotsoa ha pokello ea hau e reriloe hantle. Baenjineri ba Highleap Electronic ba ka u thusa ho etsa mohlala le ho etsa liboto tsa potoloho tse hatisitsoeng.
Bokhoni ba rona ba HDI PCB bo sebetsang
Sheba mehlala ea 'nete ea boitseanape ba rona ba ho etsa HDI PCB-ho tloha ho lisebelisoa tsa elektroniki tse kentsoeng ho isa ho liboto tse rarahaneng tsa mehala. Morero o mong le o mong o totobatsa bokhoni ba rona ho li-microvias, ho cheka ka laser, le ho hlophisoa ka meralo.
5 Mohato HDI PCB
Rigid-Flex HDI PCB
Koporo e teteaneng ea HDI PCB
Koporo e teteaneng ea HDI PCB
Motsoako-Khatello HDI PCB
HDI PCB e nang le Metal Half-Holes
Highleap Electronics HDI PCB Manufacturing Process
HDI Process Flow bakeng sa Maboto a Mahlakore Habeli le a Multilayer Daughter ha Blind Via stack on Buried Via
Ts'ebetso ea tlhahiso ea HDI (High-Density Interconnect) bakeng sa Boto ea Mahlakore a mabeli le a Multilayer Sub Board e latela mehato e qaqileng, ho netefatsa ho nepahala le ts'ebetso e phahameng sehlahisoa sa ho qetela. Ha re ntse re feta mehatong ea ts'ebetso, litekanyo tsa bohlokoa tse kang bophara ba trace, botenya ba koporo, le mekhahlelo e fapaneng ea ho roala li bapala karolo ea bohlokoa ho khethollang boleng ba ho qetela ba PCB. Ka tlase ke karohano ea mehato ea ts'ebetso bakeng sa mefuta e 'meli ea liboto tse nyane le lintlha tsa bohlokoa bakeng sa moralo oa PCB.
Ts'ebetso ea Boto ea Barali ba Mahlakore Habeli (POFV)
Qala ka substrate → Bake substrate pele ka mor'a ho seha → Ho tšesa koporo (8±1μm) → Cheka masoba → Ho phunya → Ho penta ka koporo → Polaho e mpe → Ho penta → Ho tšesa koporo (15±3μm) → Letlapa la koporo plating 2 (Mehato e 'meli ea ho roala boto ho eketsa botenya ba koporo masoba a patiloeng ka 1μm) → Pholishe e mpe ea plating → Filimi e omeletseng ea ka hare 1 → Tlhahlobo ea filimi e omileng → Etching ka hare 15 → Tlhahlobo ea ka hare ea AOI → Oxidation e sootho.
Multilayer Daughter Board Process (POFV)
Qala ka substrate → Bake substrate pele ka mor'a ho seha → Filimi e omileng ka hare → Ho hlophisoa ka hare → Tlhahlobo ea ka hare ea AOI → Oxidation e sootho → Lamination → Bake pele 1 → Milling ea moeli → Ho tšesa koporo (8±1μm) → Cheka masoba → Deburring → Copper plating → Copper plating → Copper plating → Ho penta ha koporo (15±3μm) → Ho bentša (Mothati oa 2) → Ho penta ha koporo 1 tlhahlobo → Oxidation e sootho 1.
Mekhoa e hlalositsoeng ea HDI bakeng sa Boto ea Bana ba Mahlakore a mabeli le ea Multilayer e netefatsa hore mapolanka a finyella litekanyetso tse phahameng tsa ho teteana, ho sebetsa le ho tšepahala. Litekanyetso tsa bophara ba ho batla sebaka, sebaka, le botenya ba koporo li bohlokoa bakeng sa ho netefatsa hore liboto li fihlela litlhoko tse hlokahalang tsa ts'ebeliso e potlakileng le e phahameng. Mehato ea ts'ebetso, ho kenyeletsoa ho plating, etching, le tlhahlobo, e etsa bonnete ba hore karolo e 'ngoe le e' ngoe e bopehile hantle 'me e hokahane, e tlatsetsang ts'ebetsong le boleng ba sehlahisoa sa ho qetela.
Ha ho Stacked Laser Blind Vias Multilayer Daughter Board Process e nang le Negative Plating + Resin Plugging (Ha e Kopane le Maemo a Tlatso a PP)
Qala ka substrate → Bake substrate esale pele ka mor'a ho seha → Lefilimi le omeletseng ka hare → Ho hlophisoa ka hare → Tlhahlobo ea ka hare ea AOI → Oxidation e sootho → Lamination → Pre-bake 1 → Edge milling → Ho fokotsa koporo (8±1μm) → Phala masoba → Deburring → Copper plating → Copper plating → Copper plating Ho bentša → Ho tšesa koporo (joalokaha ho hlokeha) → Ho bentša (Mothati oa 2) → Filimi e omileng ka hare 1 → Tlhahlobo ea filimi e omileng → Etching ka hare 1 → Tlhahlobo ea ka hare ea AOI → Oxidation e sootho 1
Ho ipapisitsoe le phallo e kaholimo ea ts'ebetso, ho hlakile hore moralo oa HDI PCB o susumetsa haholo ts'ebetso e latelang ea boenjiniere ea CAM. Likhetho tse fapaneng tsa moralo le mekhoa ea tlhahiso li ka ama haholo ho bōptjoa ha lifaele tsa Gerber, tse bohlokoa bakeng sa tlhahiso ea PCB. Ka lebaka leo, meralo e rarahaneng ea li-stack-up tsa HDI PCB hangata e hloka nako e eketsehileng bakeng sa ho lokisa CAM le ho hloka boenjiniere bo eketsehileng ba QA. Ho boloka nako le litšenyehelo, baqapi ba lokela ho buisana le rona esale pele ha ba sebetsa ka li-stack-ups tsa HDI PCB tse rarahaneng. Ka ho sebelisa mokhoa ona oa ts'ebetso, lintlha tse ka 'nang tsa e-ba teng li ka tsejoa le ho rarolloa kapele, tse lebisang lits'ebetsong tse lokiselitsoeng, liphoso tse fokolitsoeng, le ho boloka mehloli ea bohlokoa.
Mokhoa oa Laser Hole Layer le Bokhoni ba Tlhahiso ea Potoloho (Lera le ka Hare)
Multilayer Daughter Board Ntle le ho Patoa ka Vias: Electroplating Hole Filling
Hlatsoa Inner etching 1 → Inner AOI tlhahlobo 2 → Brown oxidation 1
Multilayer Daughter Board e se Nang Bofofu ba Laser E Stacked Vias Ho Sebelisa Negative Plating + Resin Plugging (Ha e Kopane le Maemo a Tlatso a PP)
Hlatsoa (Mohato oa 1) → Filimi e ommeng ka hare 2 → Tlhahlobo ea filimi e omileng → Etching ka hare 2 → Tlhahlobo ea ka hare ea AOI 2 → Oxidation e sootho 2
Ts'ebetso ena e netefatsa popo e nepahetseng ea likhokahano tse phahameng haholo bakeng sa liboto tsa morali tsa multilayer. Bakeng sa liboto tse se nang li-vias tse patiloeng, mehato e kang ho phunya laser, kalafo ea plasma, le tlhoekiso ea lik'hemik'hale li etsoa ho netefatsa ho nepahala ka sebopeho. Ka mor'a tlhahlobo ea lesoba le foufetseng, koporo ea koporo, le ho tlatsa likoti tsa electroplating, koporo e tšesaane ho finyella lintlha tse hlokahalang.
Bakeng sa mapolanka a se nang stacked ka laser foufetseng vias, tshebetso kenyeletsa plating mpe le resin plugging, ho etsa bonnete ba hore vias ba hantle tlatsitsoe. Ts'ebeliso ea ho cheka ka laser le mehato e latelang e netefatsa hore e hloekile ebile e nepahetse ka sebopeho. Ts'ebetso e phethela ka ho bentša, ho fokotsa koporo, le tlhahlobo e tsoelang pele ho netefatsa hore boto e kopana le litekanyetso tsa ts'ebetso bakeng sa likopo tsa lebelo le phahameng le tse phahameng.
HDI PCB Motherboard (Outer Layer) Tshebetso
Ho Tlatsa Mokoti oa Electroplating + Ho Tlatsa Paterone
Hlakola
Ho roala ka mohlala
Lamination → Pele u baka 1 → Ho cheka likoti → Ho cheka masoba → Oxidation e sootho → Ho cheka ka laser → Phekolo ea plasma → Ho hloekisa ka lik'hemik'hale → Ho hlahloba masoba a foufetseng → Ho cheka → Ts'ebetso e ntle ea photoresist
Negative Plating + Resin Plugging + Pattern Plating
Lamination → Bake pele 1 → Ho cheka ka lehlakoreng → Cheka masoba a boto → Oxidation e sootho → Ho cheka ka laser → Phekolo ea plasma → Ho hloekisa ka lik'hemik'hale → Ho hlahlojoa ha lesoba le foufetseng → Ho cheka ka resin → Ho phunya 1 → Ho tšela koporo 1 → Ho penta ho fosahetseng (15±3μm) → Ho cheka → Ts'ebetso e ntle ea photoresist
Plating Hole + Resin Plugging + Pattern Plating
Lamination → Pele ho baka 1 → Ho cheka ka mahlakoreng → Cheba masoba → Oxidation e sootho → Ho cheka ka laser → Phekolo ea lik'hemik'hale → Ho hloekisoa ka lik'hemik'hale → Ho hlahloba masoba a foufetseng → Ho cheka resin → Ho phunya 1 → Ho tšela koporo 1 → Ho penta ka boto → Sekoti → Sekoti mokhoa oa photoresist
Tlhaloso ea Ts'ebetso le Mekhahlelo ea Bohlokoa
Lits'ebetso tse hlalositsoeng li etselitsoe ho theha li-circuits tsa boleng bo holimo bakeng sa liboto tsa bo-mme, tse shebaneng le mekhoa e joalo ka ho tlatsa likoti tsa electroplating, ho penta ka mohlala, le plugging ea resin ho fihlela likhokahano tsa motlakase tse tšepahalang. Bakeng sa ho tlatsa sekoti sa electroplating, ho nepahala ha koporo e tšesaane le ho tlatsa likoti ho tiisa botšepehi bo nepahetseng ba pontšo le ts'ebetso ea meralo e phahameng haholo.
Bakeng sa plating mpe le resin plugging, tshebetso e akarelletsa ho feta mekhoa e tsoetseng pele ho etsa bonnete ba hore vias ba ka tsela e loketseng tlatsitsoe le holim 'a lula a boreleli bakeng sa mohlala plating. Bophahamo bo fokolang ba ho latella sebaka le boleng ba sebaka sa sebaka se bohlokoa bakeng sa lits'ebetso tse sebetsang hantle, ho netefatsa hore board ea mama e khona ho sebetsana le matšoao a lebelo le phahameng ha e ntse e ts'epahala.
Highleap Electronics HDI PCB One-Stop Assembly Service
Highleap Electronics e fana ka ts'ebeletso e felletseng ea kopano ea HDI PCB (High-Density Interconnect), e fanang ka tharollo e se nang moeli, ea sebaka se le seng bakeng sa litlhoko tsa hau tsa PCB. Ts'ebeletso ea rona ea kopano ea HDI PCB e akaretsa ntho e 'ngoe le e 'ngoe ho tloha ho moralo le prototyping ho ea ho tlhahiso le kopano ea ho qetela, ho netefatsa hore lihlahisoa tsa hau li tlisoa ka nako, ka ts'ebetso e phahameng le ho nepahala.
Ts'ebetso ea rona ea tlhahiso ea HDI PCB e sebelisa theknoloji ea morao-rao, e re nolofalletsang ho hlahisa liboto tsa potoloho tse teteaneng tse bohlokoa haholo bakeng sa lits'ebetso tse hlokang liforomo tse nyane, ts'ebetso ea lebelo le holimo, le bokhoni ba maqhubu a holimo. Ka ts'ebeletso ea rona ea ho emisa hang, re sebetsana le likarolo tsohle tsa ts'ebetso ea kopano, ho kenyelletsa:
- Ts'ehetso ea Moralo: Sehlopha sa rona se sebetsa haufi-ufi le uena ho netefatsa hore moralo oa hau oa HDI PCB o kopana le maemo a sebetsang le a tlhahiso.
- Prototyping: Re fana ka lits'ebeletso tsa prototyping tse potlakileng, tse u lumellang hore u leke moralo oa hau pele ho tlhahiso e felletseng.
- difeme: Ho tloha ka laser drilling le microvia sebopeho ho lamination le koporo plating, re sebelisa mekhoa e molemo ka ho fetisisa ho HDI PCB ho etsa tlhahiso ho hlahisa mapolanka boleng bo phahameng.
- Seboka: Re bokella li-PCB tsa hau tsa HDI re sebelisa lisebelisoa tsa morao-rao, ho etsa bonnete ba hore likarolo li behiloe ka nepo, ka lisebelisoa tse sebetsang hantle le liteko ho netefatsa ts'ebetso e tšepahalang.
- Tlhahlobo le Tlhahlobo: Mekhoa ea rona ea tlhahlobo e phethahetseng, ho kenyeletsoa AOI (Automated Optical Inspection) le tlhahlobo ea X-ray, e netefatsa hore boto e 'ngoe le e 'ngoe e finyella litekanyetso tse tiileng tsa boleng.
Ka ho fana ka tharollo ea sebaka se le seng, Highleap Electronics e fokotsa tlhoko ea barekisi ba bangata, e fokotsa linako tsa ho etella pele le ho nolofatsa thepa. Hore na o hloka li-prototype tsa molumo o tlase kapa lihlahisoa tse kholo tsa tlhahiso, re ikemiselitse ho fana ka li-PCB tsa HDI tsa boleng bo holimo tse ipapisitseng le litlhoko tsa hau tse ikhethileng. Sehlopha sa rona se inehetseng se etsa bonnete ba hore morero o mong le o mong o sebetsoa ka hloko e kholo le boleng, ho re etsa molekane ea loketseng bakeng sa litlhoko tsa kopano ea hau ea HDI PCB.
HDI PCB Matla a Tlhahiso
Re fana ka mefuta e fapaneng ea bokhoni ba tlhahiso ea HDI PCB, ho netefatsa ho nepahala le ho ts'epahala ha lits'ebetso tse fapaneng. thekenoloji rona e tsoetseng pele re nolofalletsa ho hlahisa mefuta e fapaneng ya HDI PCBs, ho akarelletsa le Blind Vias HDI PCBs, moo vias amahanya lera e mong ho e mong ntle le ho feta ka boto kaofela; E patoa ka li-PCB tsa HDI, moo li-vias li kopanyang likarolo tse ka hare empa li sa fihle holimo; Li-PCB tsa Microvia HDI, tse nang le li-vias tse ntle bakeng sa lits'ebetso tse kopaneng, tse nang le matla a holimo; le Laser Drilled Holes, moo thekenoloji ea morao-rao ea ho phunya laser e sebelisetsoang ho etsa li-microvias le masoba a nepahetseng, a loketseng bakeng sa meralo ea potoloho e matla haholo e nang le mamello e thata. Theknoloji ena e loketse ka ho khetheha bakeng sa likopo tse hlokang sebaka se fokolang sa boto le ts'ebetso e phahameng.
HDI PCB Tshebetso le Matla a Line
Ts'ebetso ea rona ea tlhahiso e ts'ehetsa mefuta e fapaneng ea botenya ba koporo, e fana ka maemo a bonolo bakeng sa litlhoko tse fapaneng tsa moralo. Re sebetsana le botenya ba koporo ho tloha ho 0.33 oz ho isa ho 1 oz, ka botenya ba koporo bo felileng ba 25μm bakeng sa koporo ea 0.5 oz le 35μm bakeng sa 1 oz koporo. Lethathamo lena le re lumella ho kopana le litlhaloso tse fapaneng tsa ts'ebetso ha re ntse re netefatsa boleng bo tsitsitseng ho pholletsa le mefuta e fapaneng ea boto.
Bokhoni ba rona ba tlhahiso bo boetse bo kenyelletsa bophara ba mela e metle, ka bokhoni ba ho fihlela bophara ba mela e le moqotetsane joalo ka 2.0 mil bakeng sa koporo ea 0.5 oz le 2.5 mil bakeng sa koporo e 1 oz. Bophara bona bo botle bo bohlokoa bakeng sa ho theha meralo e kopaneng haholo e hlokang ho nepahala le ho sebetsa hantle, haholo lits'ebetsong tsa lebelo le holimo le tse phahameng haholo.
E tsoetseng pele HDI PCB Technologies
Re sebelisa mahlale a tsoetseng pele ho netefatsa boleng bo holimo le ts'ebetso ea li-PCB tsa rona tsa HDI:
- Back Drilling: Mokhoa o sebelisoang ho hakolla karolo ea lesoba le petelitsoeng ho tsoa ho likarolo tse ling ka hare, ho fokotsa litaba tsa botšepehi ba matšoao le ho netefatsa ts'ebetso e ntlafetseng lits'ebetsong tsa lebelo le holimo.
- Ho Chesoa ka botebo ho Laolehileng: Ho cheka ho laoloang ka mokhoa o nepahetseng ho tiisa botebo bo nepahetseng ba lesoba le ho tsamaisana, e leng ntho ea bohlokoa bakeng sa meralo ea mekhahlelo e mengata.
- Bokhoni ba patiloeng: Ka ho kenyelletsa lera le tšesaane la dielectric, re matlafatsa botšepehi ba lets'oao ka matla a ho fokotsa matla, ho ntlafatsa ts'ebetso ea mats'oao a lebelo le holimo.
- Mamello ea Mokoti: Thepa ea rona ea ho cheka ka mokhoa o nepahetseng haholo e re lumella ho boloka mamello ea likoti tse thata le libaka tse nepahetseng tsa likoti, tse hlokahalang bakeng sa likhokahano tse ka tšeptjoang tsa li-interlayer le ho pata ka har'a lesoba.
Ka theknoloji ena e tsoetseng pele ea tlhahiso, re ka hlahisa li-PCB tsa HDI tse finyellang litekanyetso tse phahameng ka ho fetisisa tsa indasteri, ho netefatsa botšepehi, ts'ebetso, le katleho bakeng sa likopo tsohle.
Qala morero oa hau oa PCB!
Highleap, joalo ka bahlahisi ba nang le boiphihlelo ba HDI PCB, e na le boiphihlelo bo batsi ba ho hlahisa li-PCB tsa HDI bakeng sa bareki ho pholletsa le liindasteri tse fapaneng tse kang tsa bongaka, tsa likoloi le tsa elektroniki. Re na le bokhoni ba ho sebetsana le merero eohle ea HDI PCB ka ho nepahala ho ke keng ha bapisoa le boleng bo phahameng, ho netefatsa hore re finyella litlhoko tsa hau tse khethehileng le ho lula ka har'a tekanyetso ea hau.
Khetho ea lisebelisoa bakeng sa HDI PCB
Ho khetha thepa e nepahetseng ea dielectric kapa resin ho bohlokoa bakeng sa ts'ebetso ea HDl. Lintlha tse latelang ke tsa bohlokoa:
Decomposition Temperature (Td)
Thepa ea HDI PCB e lokela ho ba le Td e ka holimo ho mocheso oa mocheso oa kopo ea eona. Lithempereichara tsa solder nakong ea kopano ea HDI PCB li maemong a 250 ℃ ho isa ho 300 ℃, kahoo etsa bonnete ba hore Td ea thepa e phahame ho feta mefuta ena.
Dielectric Constant (Dk)
Bakeng sa li-PCB tsa HDI, ho molemo ho sebelisa thepa ea substrate e nang le boleng bo tlase ba DK. Ha boleng ba DK bo le tlase, botšepehi ba lets'oao le taolo ea impedance li ba betere, haholo-holo maqhubung a phahameng. Lisebelisoa tsa DK tse tlase li fokotsa tahlehelo ea lets'oao, puisano e fapaneng, le mathata a mang a motlakase, ho netefatsa ts'ebetso e tšepahalang bakeng sa matšoao a dijithale le a RF a lebelo le phahameng.
Mocheso oa Phetoho ea Khalase (Tg)
Ha ho hlahiswa PCB ya HDI, thepa e nang le Tg e phahameng hangata e kgethwa. FR4 e nang le Tg ya 170°C kapa ho feta e sebediswa hangata bakeng sa di-PCB tsena, kaha e fana ka thepa e ntle ya mocheso le ya mechini.
Tahlehelo e nyane
Ho lahleheloa ke matla ha lets'oao ha le ntse le feta moleng oa phetiso holim'a thepa ea dielectric.
Coefficient of Thermal Expansion (CTE)
Katoloso ena ea tšohanyetso le ho honyela ha potoloho ho ka ba le litlamorao tse mpe ho likarolo, haholo liphutheloana tse kholo tsa silicon chip. Libaesekele tse feteletseng tsa mocheso li fella ka ho hlōleha ha manonyeletso a solder hobane potoloho e atoloha ka lebelo le potlakileng ho feta silicon chip e lekantsoeng ho mamella. Ho feta moo, sena se tla fella ka matla a ho kuta a hlahisang meokho e menyenyane ha nako e ntse e feta.
Lisebelisoa tse Tloaelehileng tsa HDI PCBs
Re na le lethathamo le lekaneng la mefuta e fapaneng ea thepa ea HDI PCB le tšebelisano ea nako e telele le bafani ba thepa e babatsehang ho felehetsa moralo oa hau oa HDI PCB.
Lebelo le Tloaelehileng le Tahlehelo
Lisebelisoa tse tloaelehileng tsa lebelo le tahlehelo li loketse ka ho fetisisa lisebelisoa tsa digital tse lekanyelitsoeng ho GHz tse seng kae. Mohlala o tummeng oa thepa e joalo ke Isola 370HR.
Lebelo le Mahareng le Tahlehelo e Bohareng
Lisebelisoa tsa lebelo le mahareng li loketse lits'ebetso tse lekantsoeng ho 10 Ghz empa eseng ho feta. Nelco N7000-2 ke mohlala o tsebahalang ho tsoa sehlopheng sena sa lisebelisoa.
Lebelo le Phahameng, Tahlehelo e tlase
Lisebelisoa tsena li na le melemo ea tahlehelo e tlase ea dielectric le lerata le lenyenyane la motlakase. Lisebelisoa tsena tse phahameng tsa ts'ebetso li na le Tg ea hoo e batlang e le 180 ° CA mohlala o tummeng oa lebelo le phahameng, thepa ea tahlehelo e tlaase ke Isola's I-Speed.
Lebelo le Phahameng haholo, Tahlehelo e tlase haholo
Lebelo le Phahameng haholo, Thepa ea Tahlehelo e tlase haholo e lumellana le lits'ebetso tse nyolohelang ho 100 Ghz le holimo. Isola Tachyon 100G ke thepa e tsebahalang eo e leng ea sehlopha sena.
HDI PCB Manufacturing Technology
Bothata ba ho etsa HDI PCB ke li-microvias, tse entsoeng ka metallization le lithapo tse tšesaane.
Tlhahiso ea Microvia
Ho etsa Microvia esale e le taba ea mantlha ea tlhahiso ea HDI PCB. Ho na le mekhoa e 'meli ea mantlha ea ho cheka:
1.Mechanical drilling, eo ho tloaelehileng ka ho phunya sekoti kamehla ke khetho e ntle ka ho fetisisa bakeng sa katleho ea eona e phahameng le theko e tlaase. Ka nts'etsopele ea bokhoni ba machining, ts'ebeliso ea eona ho microvias le eona e ntse e tsoela pele kamehla.
2.Laser drilling, eo ho eona ho nang le mefuta e 'meli: photothermal ablation le photochemical ablation. Ea pele e bua ka ts'ebetso eo lisebelisoa tsa ts'ebetso li futhumatsang ho qhibiliha le ho fetoha mouoane ka ho thehoa ka sekoting ka mor'a hore laser e matla haholo e kene. Ea ho qetela e bua ka phello ea matla a matla a photon le lasers a fetang 400nm sebakeng sa ultraviolet.
Ka metallization
Phephetso e kholo ka ho fetisisa ea metallization ea lesoba ke hore ho thata ho finyella ho kopanya ho tšoanang. Bakeng sa theknoloji ea electroplating e tebileng ea li-microvias, ntle le tšebeliso ea tharollo ea electroplating e nang le dispersibility e phahameng, tharollo ea plating mochine oa electroplating e lokela ho ntlafatsoa ka nako. Sena se ka etsoa ka ho sisinyeha ho matla ha mochini kapa ho sisinyeha, ho sisinyeha ha ultrasonic, le ho fafatsa ka mokhoa o otlolohileng. Ho feta moo, mongobo oa lebota la lesoba o tlameha ho eketsoa pele o beoa.
Ntle le ntlafatso ea ts'ebetso, mokhoa oa metallization oa HDIs o boetse o bone ntlafatso e kholo ea theknoloji: tsena li kenyelletsa theknoloji ea tlatsetso ea lik'hemik'hale, theknoloji e tobileng ea electroplating, joalo-joalo.
Potoloho e nyane
Ho phethahala ha mela e mesesaane ho kenyelletsa phetiso ea litšoantšo tsa setso le litšoantšo tsa laser tse tobileng. Ho fetisoa ha setšoantšo sa setso ho tšoana le mokhoa oa ho etsa mela ka mokhoa o tloaelehileng oa lik'hemik'hale.
Bakeng sa litšoantšo tse tobileng tsa laser, setšoantšo se thehoa ka ho toba filiming ea photosensitive ka laser. Lebone la ultraviolet (UV) le sebelisetsoa ho sebetsa, e le hore tharollo ea mokelikeli ea anticorrosion e ka finyella litlhoko tsa qeto e phahameng le ts'ebetso e bonolo.CAD/CAM e ka kopanngoa ka ho toba ho khutsufatsa potoloho ea tlhahiso le ho etsa hore e tšoanelehe bakeng sa tlhahiso e fokolang le e mengata.
Khetha Highleap joalo ka Moetsi oa hau oa PCB
Tsebo e Feletseng
Re na le boiphihlelo bo bongata mefuteng eohle ea tlhahiso ea PCB le kopano. Ho tloha ho theko ea karolo ho isa ho phano ea lihlahisoa, re ka phethela mohato o mong le o mong ka boleng bo holimo.
Netweke e Matla ea Bafani
Ka boiphihlelo ba lilemo tse 10 indastering ea PCB, Highleap e na le marang-rang a barekisi a re fang phihlello e tšepahalang ea ho fumana likarolo tsa boleng bo holimo ka litheko tsa tlholisano.
Ka thata-thata Quality Control
Ka ts'ebetso e 'ngoe le e' ngoe, re laola ka thata boleng ka ho kenya ts'ebetsong mefuta e fapaneng ea liteko le litlhahlobo ho netefatsa hore PCBA e 'ngoe le e' ngoe e fihla boleng bo phahameng ka ho fetisisa.
Nka Qotso e Potlakileng
Fumana hore na boitseanape ba rona bo ka u thusa joang ka projeke ea hau e latelang ea PCB.