RF le Microwave PCB

Boitsebiso bakeng sa RF le Microwave PCB

Li-PCB tsa RF le microwave hangata li hahiloe ka lisebelisoa tse tsoetseng pele tse nang le litšobotsi tse ikhethang bakeng sa dielectric constant (Er), tahlehelo ea tangent, le coefficient of thermal expansion (CTE).

Thepa e sebediswang ka hara thepa ya microwave PCB hangata e na le motswako wa PTFE, letsopa, hydrocarbon, le mefuta e fapaneng ya khalase. Kgetho ya thepa e itshetlehile hodima mabaka a kang boleng, ditjeo, bonolo ba tlhahiso, tshebetso ya motlakase, ho tiya ha mocheso, le ho hanyetsa mongobo.

Litaelo tsa Moralo oa RF PCB

Ho netefatsa ts'ebetso e ntle ea li-PCB tsa RF le tsa microwave, ho bohlokoa ho latela lintlha tse itseng tsa moralo. Bakeng sa lintlha tse ling mabapi le moralo oa RF PCB, etela litataiso tsa rona tsa moralo oa PCB tsa microwave.

RF le Microwave PCB Manufacturing Capabilities

Highleap Electronics e sebetsa ka mokhoa o nepahetseng ho etsa li-PCB tsa RF le Microwave, tse tšehetsang maqhubu ho tloha ho 100MHz ho isa ho 30GHz le ho feta, ho fihlela litlhoko tse thata bakeng sa botšepehi ba mats'oao a holimo le tahlehelo e tlase ea puisano, radar, sefofane le lits'ebetso tsa ho nahana ka bongaka.

Re sebelisa mekhoa le litsamaiso tse latelang tsa bohlokoa tlhahisong ea rona:

• Tsebo ea ho Tšoara Lintho tse Phahameng ka ho Fetisisa: Ho tšehetsa PTFE le thepa ea low-Dk joalo ka laminate e khethehileng e nang le tahlehelo e tlase/laminate e ikhethang e nang le tahlehelo e tlase, Taconic, Isola Astra, F4B, TP-2, jj., ho netefatsa li-constant tsa dielectric tse tsitsitseng le tahlehelo e tlase.
• Litšoantšo tsa Laser Direct Direct (LDI): E sebelisoa bakeng sa phetisetso ea mohala o motle / sebaka sa phetisetso, e ntlafatsa ho hlaka, le ho ikamahanya le meralo ea litsamaiso tse phahameng tsa RF.
• Koporo e teteaneng le Bokhoni ba ho Lamination ba Multi-Layer: E ts'ehetsa lipotoloho tse ngata tsa vacuum lamination, ho netefatsa likarolo tse tšoanang tsa dielectric ntle le voids kapa delamination.
• Taolo e tiileng ea Botenya ba Dielectric: Ho netefatsa sebaka se tsitsitseng sa lera ka AOI, profilometers, le li-coupons tsa teko ho boloka ts'ebetso ea ts'oaetso.
• Microwave Hole Copper Plating Control: Precision taolo ya koporo plating botenya bakeng sa vias foufetseng / patoa ho thibela ho thuisa le ho lahleheloa ke pontšo.
• Pheliso ea Sekaho sa Potoloho e Phahameng e Phahameng: E tšehetsa ENIG, silevera e qoelisoang, OSP, khauta e qoelisoang + methati e bonolo ea khauta, ho leka-lekanya solderability le ts'ebetso ea maqhubu a holimo.

Ebang ke bakeng sa litsela tsa phetiso ea matla a phahameng, lipotoloho tsa amplifier ea RF, kapa meaho e kopantsoeng ea mekhahlelo e mengata, re na le boiphihlelo bo boholo tlhahisong ea bophahamo ba modumo, ho netefatsa hore boto ka 'ngoe e fihlela maemo a ts'ebetso a litsamaiso tsa maqhubu a phahameng. Bakeng sa tlhaiso-leseling e batsi ka bokhoni ba rona, etela lits'ebeletso tsa rona tsa tlhahiso ea RF PCB.

Litšebeletso tsa Kopano tsa RF le Microwave PCB

Kopano ea li-PCB tsa maqhubu a phahameng e hloka bokhoni bo phahameng ba ho beoa ha ho ntse ho boloka botšepehi ba matšoao le ts'ebetso ea taolo ea mocheso nakong eohle ea ts'ebetso. Highleap Electronics e fana ka lits'ebeletso tse felletseng tsa SMT le ho kopanya ka mekoti e ntlafalitsoeng bakeng sa lihlahisoa tsa RF le Microwave.

Litšebeletso tsa rona tsa kopano li fana ka likarolo tse latelang:

• Ho Beha ka Nepahalo le Taolo e Tlase ya Mamello : Ho tshehetsa kopano ya dikarolo tse kang 01005, micro QFN, LGA, uBGA, SMA connectors, ho netefatsa hore maemo a bohlokwa a dikarolo tsa tsela ya RF le diphapang di ka hare ho ±50μm.

• Tšireletso ea Mocheso bakeng sa Likarolo tse Bonolo : Ho kopanya hape ha mocheso ho laoloang ke mocheso bakeng sa likarolo tse nang le matla a kang PA le LNA, ho netefatsa botšepehi.

• Ho Kopanya Sehokelo sa Maqhubu a Phahameng : E ​​tšehetsa ho kopanngoa ka ho nepahetseng ha li-interface tsa coaxial tse kang SMA, MMCX, N-type, 'me e kenyelletsa teko ea tahlehelo ea ho khutla ea maqhubu a phahameng.

• Tlhahlobo ea Optical le X-Ray e Iketsang : E ​​kopanya liteko tsa AOI le X-ray ho ntlafatsa ho nepahala ha sebaka le botsitso ba manonyeletso a solder, ho thibela mathata a kang manonyeletso a solder a batang le marokho.

• Tšehetso ea Teko ea RF : Liteko tsa S-parameter, VSWR, le tlhahlobo ea marang-rang lia fumaneha ha moreki a kopa ho netefatsa hore sehlahisoa se se se loketse lits'ebetso tsa lefats'e la nnete.

• Ts'ebetso ea ho Kopanya e se nang Lead/e sa Lead : E fana ka li-assembly tse nang le lead tse lumellanang le RoHS le tse tšepahalang haholo, tse ikamahanyang le lits'ebetso tse fapaneng tsa indasteri.

Ha re bokelle liboto tsa potoloho feela empa re fana ka sethala se felletseng sa netefatso ea ts'ebetso ea RF ho thusa bareki ho fetoha kapele ho tloha lisampoleng tsa boenjiniere ho ea netefatsong ea tlhahiso e felletseng.

Hobaneng ha Li-Brand tse etelletseng pele li Khetha Highleap bakeng sa RF PCB Manufacturing & Assembly

Ho nts'etsopele ea lihlahisoa tsa RF le Microwave, bareki ha ba tobane le tlhahiso ea PCB feela empa ba boetse ba tobana le liphephetso khethong ea thepa, taolo ea impedance, khatello ea EMC, taolo ea mocheso, le botsitso ba matšoao a sistimi. Highleap Electronics e fana ka ts'ebeletso e felletseng e felletseng, ho tloha tlhahlobong ea moralo ho isa ho phano ea sehlahisoa sa ho qetela.

Tharollo ea rona ea ho emisa e le 'ngoe e fana ka melemo e latelang:

• Kopano e Kopanetsoeng ea Tlhahiso +: Ho tloha ka thepa ea RF, tlhahiso ea lamination, modelling impedance, liteko tsa kopano, ho isa tlhahiso ea lihlahisoa tsa ho qetela, lits'ebetso tsohle li laoloa ke Highleap, ho fokotsa liphoso tsa tšebelisano pakeng tsa barekisi ba bangata.
• Tšehetso ea Boenjiniere le Tšebelisano-'moho: Re fana ka likeletso tsa moralo oa li-stack-up, lipalo tsa impedance, likhothaletso tsa ntlafatso ea tsela ea matšoao, 'me re sebetsa haufi-ufi le lihlopha tsa lisebelisoa tsa bareki.
• RF-Specific DFM le DFA Review Mechanisms: Ho thusa bareki ho tseba likotsi tse ka bang teng tsa tlhahiso, ho ntlafatsa chai ho tloha mohatong oa moralo.
• Flexible Delivery Model: Ho ts'ehetsa lits'ebetso tsa netefatso ea li-batch tse nyane le tlhahiso e kholo e tsitsitseng ea bongata, ka lipotoloho tsa ho fana ka potlako joalo ka matsatsi a khoebo a 7.
• Sistimi ea Setifikeiti sa Boleng ba Machabeng: E tsamaellana le ISO 9001, ISO 13485, IATF 16949, le litekanyetso tse ling tsa taolo ea boleng tse ikhethileng indastering, e sebeletsa bareki ba lefats'e.

Bareki ba rona ba kenyelletsa baetsi ba lisebelisoa tsa pele tsa RF, bafani ba thepa ea puisano ea sesole, baetsi ba mochini oa radar oa millimeter-wave, le bafani ba pele ba lefats'e ba fanang ka tharollo ea litšoantšo tsa bongaka. Ho khetha Highleap ho bolela ho khetha molekane ea amehang haholo, eseng moetsi feela.