Tataiso e Pharalletseng ho Li-substrates tsa BGA

             

Li-substrates tsa BGA (ball grid array) li fetohile theknoloji e atileng haholo ea ho paka bakeng sa lipotoloho tse kopaneng (ICs), li-ASIC, li-GPU, le likarolo tse ling tse rarahaneng. Ka bokhoni ba ho amohela khokahano e phahameng ea mabitso sebakeng se senyenyane, BGA e thusa miniaturization le ntlafatso ea ts'ebetso bakeng sa mefuta e mengata ea lisebelisoa tsa elektroniki. Leha ho le joalo, ho rala le ho etsa li-substrates tsa BGA ho hloka boiphihlelo bo tebileng. Tataiso ena e felletseng e akaretsa tsohle tse hlokahalang ho sebelisa melemo ea BGA ha o ntse o qoba maraba.

BGA Substrate ke eng?

Karolo e nyenyane ea BGA e sebetsa e le motheo oa ho paka ka BGA, e fana ka tšehetso ea mochini hammoho le likhokahano tsa motlakase. The substrate e na le thepa insulating le mesaletsa conductive ho kapa ka hare ho eona hore matshwao a tsela le matla pakeng tsa khomaretse silicon shoa le e hatisitsoeng oa potoloho boto (PCB) eo BGA sephutheloana mounted.

Tšobotsi e khethollang ea liphutheloana tsohle tsa BGA ke libolo tse nyenyane tsa solder tse khabisitsoeng ka tlas'a sephutheloana ka mokhoa oa grid. libolo tsena solder hokela mesaletsa substrate ho matching lulisa mapheo holim'a PCB ha karolo ea BGA e soldered ho boto nakong kopano. Letlapa lena la bolo le thusa likhokahano tse phahameng haholo kaha libolo li ka arohanngoa haufi-ufi.

Li-substrates tsa BGA li tlameha ho raloa ka ho khetheha ho tsamaisana le silicon die le boto ea potoloho ha li ntse li kopana le litlhoko tsa motlakase, mocheso le mochini. Li-laminate, ceramics, silicon, khalase le lisebelisoa tse ling li sebelisoa ho etsa li-substrates tsa BGA. Moralo oa substrate o ipapisitse le lintlha tse kang palo ea mabitso a hlokahalang, lebelo la mats'oao, litlhoko tsa phepelo ea motlakase, litebello tsa ts'epo, le litšenyehelo.

Hobaneng ha BGA Substrates e nolofalletsa Miniaturization

Melemo ea mantlha ea BGA e bakoa ke bokhoni ba ho hokahanya likhokahano tse ngata sebakeng se senyane khahlano le mekhoa ea khale ea ho paka ea IC. Ka mohlala:

• Liphutheloana tse etellang pele joalo ka lipakete tsa quad flat (QFP) li na le metsamao feela ho potoloha, li fokotsa letsoalo la ho ikopanya.
• Pin grid arrays (PGA) sebelisa letoto la lithakhisa tse tlohang tlase ho sephutheloana, empa sebaka se fokolang sa phini se seholo ho feta libolo tsa solder.
• Bajari ba li-chip ba na le mabitso mathōkong kapa ka tlase, empa ha ba khone ho lumellana le boima ba BGA.

Ka lehlakoreng le leng, BGA e ka fihlela likhahla tse phahameng haholo ka libolo ho 0.5mm pitch kapa 0.4mm le tlase. Sena se nolofalletsa mesebetsi e mengata ka har'a liphutheloana tse nyane. Sebopeho se setle sa spherical sa libolo tsa solder se boetse se lumella sebaka se haufi-ufi le li-pin.

Lipalo tse phahameng tsa ho ikopanya li thusa ho kopanya mesebetsi e meng e kang li-processor tse ngata, memori, li-sensor, waelese, taolo ea matla, le li-accelerator tse khethehileng ka har'a liphutheloana tsa BGA tse lebisitsoeng lits'ebetsong tse kang 5G, AI, ADAS, IoT, le tse ling. Miniaturization e boetse e tsamaellana le likhetho tsa bareki bakeng sa lisebelisoa tsa elektroniki tse sebetsang haholoanyane.

Lisebelisoa tse Sebelisitsoeng Bakeng sa Li-substrates tsa BGA

Le ha liphutheloana tsa pele tsa BGA li ne li sebelisa li-ceramic substrates, li-substrates tse ncha tsa tlhaho li se li le teng ka lebaka la litšenyehelo tsa tsona tse tlase hammoho le melemo ea ho hanyetsa mocheso oa mocheso, ho fokotseha ha ntoa, le ho fetoha habonolo. Lisebelisoa tse tloaelehileng li kenyelletsa:

BT Substrate – Bismaleimide triazine, resin ea thermosetting, hangata e matlafalitsoeng ka faeba ea khalase le foil ea koporo. E fana ka tekano e theko e tlaase ea ts'ebetso le tlhahiso. E sebelisoa haholo lits'ebetsong tsa bareki, tsa mehala ea puisano, tsa indasteri le tsa likoloi. E mamella lits'ebetso tsa ho solder tse se nang loto.

Sekoti sa Polyimide – E fana ka botsitso bo phahameng ba mocheso empa ka theko e phahameng ho feta BT. E sebelisoa ha ho hlokahala li-substrate tse tšesaane haholo. E tloaelehile lits'ebetsong tsa mehala le tse tšepahalang haholo.

CE Substrate – Resin e kopaneng ea epoxy e matlafalitsoeng ka faeba ea khalase. Litšobotsi tse fokolang tsa ho monya mongobo. Hangata e sebelisoa libakeng tse nang le mongobo o mongata.

Substrate e Tenyetsehang – Lifilimi tsa polyimide li ka hlahisa substrate tse tšesaane haholo, tse tenyetsehang bakeng sa khanyetso e ntlafetseng ea ho thothomela/ho thothomela. E nolofalletsa meralo e tšesaane, e tiileng.

Li-ceramic substrates tsa aluminium oxide kapa aluminium nitride li ntse li ipabola bakeng sa lits'ebetso tse ling tse phahameng haholo joalo ka sebaka sa sefofane moo tšebetso ea tsona e phahameng ea mocheso e lokafatsang tefiso ea litšenyehelo. Li-silicone kapa li-interposer tsa khalase le tsona lia hlaha bakeng sa liphutheloana tse phahameng haholo tsa 2.5D/3D.

Hobaneng ha Moralo oa Automated BGA Substrate o le Bohlokoa

Ho rarahana ha mekhoa e rarahaneng ea ho phonyoha le mesaletsa ho tsoa ho batho ba makholo kapa ba likete ba likhokahano ho laola moralo o ikemetseng o sebelisoang ke komporo. Sebopeho sa substrate sa BGA ha se khonehe.

Mathata a bohlokoa a kenyelletsa:

Botšepehi ba Letšoao – Ho bapisa li-geometri tsa mohlala ho fihlela thibelo e laoloang le e tsitsitseng bakeng sa letlooa le leng le le leng ke tlamo, hammoho le lifofane tse nepahetseng tsa litšupiso bakeng sa phokotso ea lerata. Sena se hloka ntlafatso e iketsahallang.

Botšepehi ba Matla – Moralo o motle oa motlakase le lifofane tsa fatše bakeng sa kabo e sebetsang hantle ea matla ho silicon die ntle le lerata le feteletseng. Li-capacitor tse hulang le tsona li lokela ho beoa hantle.

Botenya – Ho baleha ho tloha ho BGA pad array ho hloka paterone e sa tsitsang ea li-vias le li-traces hammoho le likabelo tsa lera tse ntlafalitsoeng ho qoba ho tlala le bolelele.

Thermal – Substrate e tlameha ho dumella ho tsamaisa mocheso o lekaneng ho tloha ho die ho ya ho PCB le tikoloho. Di-vias tsa thermal di a thusa.

Ho Tšepahala – Melao ea moralo bakeng sa bophara/sebaka sa ho latela mohlala, ka sebopeho, libopeho tsa pad, le thepa e tlameha ho leka-lekanya litšenyehelo khahlanong le ho tiea ha nako e telele tlas'a potoloho ea mocheso, ho thothomela, jj.

Ke lisebelisoa tse tsoetseng pele tsa EDA feela tse kopanyang li-algorithms tse rarahaneng tsa ho tsamaisa, batsamaisi ba lithibelo, tlhahlobo ea melao ea moralo, le papiso e ka fihlelang moralo o nepahetseng oa substrate o khahlano le liphephetso tsa tekheniki hammoho le litlhoko tsa tlhahiso.

Lintlha tsa bohlokoa tsa BGA Substrate Design

Mona ke tse ling tsa lintlha tsa bohlokoa ka ho fetisisa tseo baqapi ba lokelang ho li ela hloko ha ba theha substrate ea BGA:

• Botšepehi ba pontšo - Mesaletsa e laoloang ea ho thibela, ho ba le litšupiso tse nepahetseng le ho itšehla thajana, ho fokotsa lerata, le ho qoba meqoqo e fapaneng li bohlokoa bakeng sa matšoao a hloekileng, haholoholo ka lebelo le phahameng. Sena se khoneha ka ho tsamaisa li-angle-angle, lifofane tsa litšupiso, likhetho tsa dielectric, trace geometries, ketsiso, le bolelele ba ho bapisa.
• Botšepehi ba matla - Moralo o hlokolosi oa sefofane sa motlakase, li-decoupling capacitor, le lintlafatso tsa marang-rang a matla lia hlokahala ho fana ka matla a tsitsitseng a lerata le tlase ho silicon die. Ho lokela ho etsoa tlhahlobo ea ho theoha ha motlakase.
• Tsamaiso ea ho futhumatsa - Moralo oa substrate o tlameha ho etsa hore ho be le pholiso e sebetsang hantle le ea convective ea lefu ka PCB. Thermal vias tlas'a lefu ke ea bohlokoa. Lisebelisoa tse phahameng tsa conductivity li thusa.
• tšepahala - Lisebelisoa tsa substrate le ho latela mohlala, melao ea moralo, mohlala, tlhahlobo ea tlhahlobo le papiso li thusa ho netefatsa ho tiea tlas'a mocheso oa baesekele, ho sisinyeha, ho ts'oha, mongobo le khatello ea mokhathala nakong ea bophelo bohle ba sehlahisoa.
• Ho pholoha - Mekhoa ea ho phonyoha ho tloha mokolokong o teteaneng oa bolo ho ea moeling o hloka mela e thekeselang ea li-vias/trace e ntlafalitsoeng bakeng sa ho teteana ha litsela, bolelele ba ho bapisa le bonolo. Hangata HDI ea hlokahala.
• Boikemisetso ba ho etsa - Litloaelo tsa DFM nakong eohle ea moralo li netefatsa hore substrate e ka etsoa, ​​​​ea bokelloa, ea hlahlojoa, 'me ea lekoa ka mokhoa o tšepahalang ka litšenyehelo tse ntle.
• segokanyipalo - Liphutheloana tsa BGA tse phahameng haholo li hloka li-dielectric tse tšesaane, mela e metle le libaka, li-vias tse nyane, likarolo tse ngata, le lisebelisoa tse tsoetseng pele ho amohela palo ea likhokahano.

Ball Pitch ka har'a liphutheloana tsa BGA

Ball pitch ke sebaka se pakeng tsa litsi tsa libolo tse haufi tsa marang-rang. Pitch e fokotsehile butle-butle ho nolofalletsa liphutheloana tsa BGA tse phahameng. Lipapali tse ling tsa hajoale tsa bolo li kenyelletsa:

• 0.8mm - sekontiri se sebelisoang haholo bakeng sa liphutheloana tsa BGA tse sa jeng chelete e ngata, tse mahareng tsa sepakapaka
• 0.65mm - Tekanyo e tloaelehileng e phahameng ea sekhahla bakeng sa li-IC tse rarahaneng ho fihlela boholo ba 35x35mm
• 0.5mm - E nkuoa e le sekontiri se setle haholo se ka fihlellehang ka boqapi bo tsoetseng pele ba PCB
• 0.4mm - Leqhubu le thata haholo le hatellang meeli ea bokhoni ba tlhahiso

Mokhoa o lebisang ho lebelo le lenyenyane la bolo o lumella boholo ba liphutheloana tse nyane bakeng sa palo e fanoeng ea likhokahano kapa litšupiso tse phahameng ka boholo ba liphutheloana tse kholoanyane. Leha ho le joalo, shrinkage e tlisa mathata taolong ea ts'ebetso ea kopano, ts'epahalo e kopaneng ea solder, mathata a rework, le kutloelo-bohloko ho PCB warpage. Sekhahla se setle haholo se hloka mamello e matla.

Litšobotsi tsa Bohlokoa tsa BGA Substrates

                         

Tse ling tsa likarolo tse khethollang tsa li-substrates tsa BGA tse hlalosang melemo ea tsona le mekhoa ea khale ea liphutheloana li kenyelletsa:

• Boima bo phahameng ba khokahano - Bokhoni ba ho tsepamisa maikutlo ho li-100 ho isa ho tse 1000 tsa mabitso sebakeng se senyenyane se lumella ho kopanngoa ha ts'ebetso e eketsehileng le I / O ka mokhoa o kopanetsoeng.
• Inductance e tlase - Bolelele bo fokolang ba ho etella pele pakeng tsa silicon die le PCB bo fana ka ts'ebetso e phahameng ea motlakase, haholo-holo bakeng sa matšoao a phahameng a maqhubu.
• Likamano tse khutšoanyane, tse tobileng - Likhokahano tse otlolohileng li tlosa likhoele tse senyehileng le lithapo tse ka robehang. Ho tšepahala ho phahame.
• Tšebelisano-'moho - Liphutheloana tsa BGA li ka behoa holim'a metsi joaloka likarolo tse ling tsa SMT sethaleng sa kopano ea PCB, ho fokotsa litšenyehelo.
• Thermal conduction - Khokahano e tobileng ea lefu le likhokahano tse khutšoane li thusa ho ata ha mocheso ho PCB le tikolohong e haufi, ho fokotsa libaka tse chesang.
• Boiketsi ba ho ikamahanya - Ts'ebetso e kaholimo ea solder ea metsi e tsamaisana le libolo tse tšoanang nakong ea kopano ea reflow. Boikutlo bo fokolang ba ho nepahala ha ho beoa.
• Tekeletso - Liphutheloana tsa BGA li lumella tlhahlobo e felletseng ea pele ho kopano ea lefu le kentsoeng pele ho boto.

Mathata a BGA Substrate Routing

Litsela tsa ho tsamaisa ka hare kapa ka har'a karolo ea BGA substrate li baka mathata a rarahaneng a moralo ho kenyelletsa:

Botšepehi ba Letšoao - Ho laola ho sitisa ho latela mohlala, ho bua ka tsela e fapaneng, le boleng ba lets'oao ho hloka hore ho bapaloe li-geometri tse tsamaellanang, litšupiso tse nepahetseng, taolo ea li-stubs, ho bapisa mekhahlelo, le ketsiso.

Botšepehi ba Matla – Phano e hloekileng ea motlakase e itšetlehile ka litsela tse sa keneleng metsi haholo, ho aroloa ho lekaneng, ho aroloa ha sefofane hantle, tsamaiso ea mocheso le tlhahlobo.

Botebo ba Tsela – Mekhoa ea ho phonyoha e otlolohileng e tlameha ho lumella likanale tsa ho tsamaisa lipakeng tsa mela e arohaneng ea li-vias/traces tse tsoang ho array e teteaneng ea matrix.

Tlhahiso - Melao ea moralo mabapi le bophara ba mohlala, sebaka, libopeho, li-via le thepa e tlameha ho tsamaellana le bokhoni ba tlhahiso ha e ntse e ntlafatsa litšenyehelo le ts'epo.

Taolo ea Thermal – Substrate e tlameha ho jala mocheso ka katleho ho PCB le tikolohong e potolohileng ho qoba libaka tse chesang tlas'a die e teteaneng.

Tšepahala – Lisebelisoa, melao ea moralo, taolo ea tlhahiso, ho etsa mohlala, le liteko li thusa ho netefatsa hore substrate e tla mamella likhatello nakong eohle ea sehlahisoa.

Lisebelisoa tse tsoetseng pele tsa EDA le lienjineri tse nang le boiphihlelo li bohlokoa ho sebetsana le liphephetso tsena tse itšetlehileng ka tse ling ha u ntse u qoba moralo o fetelletseng o eketsang litšenyehelo tse sa hlokahaleng. Nts'etsopele ea substrate e sebelisana haholo le ntlafatso e tsoelang pele.

BGA Substrate Materials Overview

Joalokaha ho hlahisitsoe pejana, lisebelisoa tse atileng haholo tse sebelisoang ho etsa li-substrates tsa BGA li kenyelletsa:

Li-substrates tsa Organic

• BT (bismaleimide triazine) - E sebelisoa haholo ka lebaka la tekanyo ea litšenyehelo / ts'ebetso
• Polyimide - Botsitso bo botle ba mocheso empa litšenyehelo tse phahameng
• FR-4 - Lisebelisoa tsa khale tsa epoxy PCB tse matlafalitsoeng ka khalase, ts'ebetso e tlase / litšenyehelo
• CE (composite epoxy) - E sebelisoa libakeng tse nang le mongobo o phahameng
• Li-substrates tse feto-fetohang - Lifilimi tsa Polyimide kapa LCP li thusa li-substrates tse tšesaane, tse tenyetsehang

Lisebelisoa tsa Ceramic

• Aluminium oxide (aluminium) - E tloaelehileng haholo, e batlang e le theko e tlaase ea ceramic
• Aluminium nitride - Ts'ebetso e phahameng ea mocheso bakeng sa lits'ebetso tse hlokang haholo
• Beryllia - Chefo e fokotsa tšebeliso ea beryllium oxide ceramic

Li-substrates tse ling tse tsoetseng pele

• Li-interposer tsa silicon - Numella 2.5D/3D chip stacking ka TSVs
• Li-interposer tsa khalase - Thepa e sireletsang e loketseng khokahano e phahameng

Thepa e nepahetseng e ipapisitse le litlhoko tsa ts'ebeliso joalo ka makhetlo a mangata, maemo a matla, litlhoko tsa ts'epahalo, thepa ea dielectric, litšenyehelo tsa ho etsa thepa le nako ea bophelo ba sehlahisoa.

Matšoenyeho a Tsamaiso ea Kopano ea BGA

Ho fihlella manonyeletso a ka tšeptjoang nakong ea kopano ea SMT ea liphutheloana tsa BGA ho li-PCB, ho khothaletsoa mehato e itseng ea ts'ireletso:

• Sebelisa mocheso o lekaneng ho phalla libolo tsohle tsa solder ka botšepehi ntle le likarolo tse tebileng tsa mocheso
• Netefatsa hore le ho futhumatsa ho pholletsa le sebaka sohle sa BGA ho qoba li-offsets tse ka senyang sephutheloana
• Sebelisa pente e sa hloekang ea solder e etselitsoeng kopano ea BGA e se nang lead ho qoba ho tšoasoa ke masala.
• Laola ka nepo li-profiles tsa mocheso ho kenyeletsoa litselana, ho inela le ho pholisa
• Felisa ho tombstone ka li-depositi tse nepahetseng tsa peista, likarolo tsa setsi, le profiling
• Thibela likheo ka ho sebelisa palo e nepahetseng ea peista e tsamaellanang le boholo ba bolo, meralo ea lithupa, le matla a ho beha
• Lekola ka hloko ho bona matšoao a ho se kolobise hantle, likoli tsa hlooho-in-mosamo, ho se tšoane, le liphoso tse ling.
• Netefatsa lits'ebetso ka moralo oa liteko (DOE) le liteko tse joalo ka tlhahlobo ea matla a ho shear holim'a lisampole tsa manonyeletso

Ka li-BGA tse ntle haholo, kopano e hloka mamello e matla, mekhoa e tsoetseng pele ea tlhahlobo, le taolo e tsitsitseng ea ts'ebetso ho fumana chai e ngata le ho ts'epahala.

Ho hlahloba Manonyeletso a Solder a BGA

Ho fapana le manonyeletso a thehiloeng ho lead, likhokahano tsa solder ka tlas'a BGA ha li khone ho hlahlojoa ka pono. Ho e-na le hoo, litšoantšo tsa X-ray ke tharollo e nepahetseng bakeng sa ho hlahloba boleng bo kopanetsoeng ba solder ka mor'a kopano ea BGA.

Sistimi ea Automated X-ray inspection (AXI) e hlahisa litšoantšo tse phahameng tse senolang:

• Ho tsamaisana le bolo ea solder, bophahamo ba standoff, le compression
• Ho ba teng ha likheo, mapetsong, ho kolobisa ho sa lekaneng, kapa liphoso tse ling
• Solder ball deformation ho tloha sebopeho se setle
• Ho se kopane pakeng tsa manonyeletso
• Lintho tse tsoang kantle ho naha, litšila, kapa masalla

AXI e fana ka tšireletso e felletseng ea tlhahlobo ho tseba liphoso tsa kopano pele lihlahisoa li romelloa hammoho le likotsi tse ka bang teng tsa nako e telele tsa ts'epo. Bokhoni ba 3D bo fana ka leseli le eketsehileng mabapi le sebopeho se kopaneng. Haeba ho na le bofokoli leha e le bofe, mokhoa ona o ka lokisoa ho felisa sesosa sa sesosa.

BGA Rework le Tokiso

Haeba litlhahlobo tsa ka morao ho kopano kapa tlhahlobo e latelang e senola mefokolo ho manonyeletso a solder, ho beoa ha likarolo, kapa likhokahano tsa boemo ba boto tse amanang le ho beoa ha BGA, ho tla hlokahala ho sebetsa bocha. Mekhoa e meng e metle e kenyelletsa:

• Sebelisa lisebelisoa tse ikhethileng tsa BGA tse nang le li-preheaters, thermocouples, vacuum pick-up, le ho hokahanya ha mahlo.
• Ka ho khetheha sebelisa mocheso o tsepamisitsoeng feela ho karolo e nang le bokooa ntle le ho chesa thepa e haufi
• Laola ka hloko lebelo la ho nyoloha, ho inela le ho pholisa nakong eohle ea ts'ebetso ea phepelo hape
• Sebelisa pente ea solder kapa flux e etselitsoeng BGA rework ho kolobisa liboto tsa boto ka ts'epahalo le ho qoba borokho.
• Sebelisa bonyane ba palo ea solder peste e tsamaellanang le pad/ball volumes ho qoba solder e feteletseng
• Hlahloba ka pono bakeng sa tlhophiso e nepahetseng pele o khutlisa hape; sebelisa AXI ka mor'a moo ho netefatsa botšepehi bo kopanetsoeng
• Tlosa phallo eohle e setseng ka mor'a ho sebetsa hape u sebelisa lihloekisi tse etselitsoeng masala a tlase

Ka li-BGA tse hlakileng, lisebelisoa tse khethehileng, lisebelisoa le lits'ebetso li bohlokoa bakeng sa ho sebetsa hape ka katleho. Thibelo e molemo ka ho fetisisa ka moralo o matla oa ts'ebetso le taolo.

Melemo ea BGAs

Mona ke tse ling tsa melemo ea bohlokoa e entseng hore liphutheloana tsa BGA li aparele lisebelisoa tsa elektroniki:

Botebo bo Phahameng - Bokhoni ba ho tsepamisa maikutlo haholoanyane likhokahanong tsa I/O ka mokhoa o monyane bo lumella ho kopanngoa ha ts'ebetso le likarolo tse ling tse eketsehileng.

Botšepehi ba Matshwao a Lebelo le Phahameng - Metsotso e mekgutshwane pakeng tsa die le boto e fana ka melemo ya tshebetso ya motlakase, haholoholo bakeng sa matshwao a dijithale a potlakileng.

Ho Tšepahala - Likhokahano tse otlolohileng tse otlolohileng li qoba litlamo tsa terata tse senyehang habonolo 'me li-lod li ka robeha ka lebaka la khatello ea mocheso kapa ea mechine.

Tshebetso ya Thermal – Ho kopana ka ho toba le dikgokelo tse kgutshwane ho kgothaletsa ho tsamaisa mocheso hole le silicon e teteaneng, e chesang ho ya ho PCB le moya o potolohileng.

Ho Tenyetseha ha Moralo – Mefuta e mengata ea thepa ea substrate e nang le thepa e fapaneng ea dielectic e ka khethoa ho fihlela litlhoko tsa tekheniki le tsa litšenyehelo.

Ho lekoa habonolo – Sesepa se tsebahalang hantle se ka lekoa ka botlalo ka har'a liphutheloana tsa BGA pele ho kopano ea boto bakeng sa chai e ntlafetseng.

Ho lumellana ha Ts'ebetso - Liphutheloana tsa BGA li ka kenngoa holim'a metsi joalo ka likarolo tse ling tsa SMT, li sebelisa kopano ea PCB e nang le molumo o phahameng.

Meeli ea liphutheloana tsa BGA

Leha ho na le melemo e mengata, li-BGA le tsona li tla le mefokolo le likhohlano tse itseng:

Ho Hlahlobisisa – Ho se kgone ho hlahloba ka mahlo manonyeletso a ka hare a solder ho bolela hore tlhahlobo ya X-ray e a hlokahala ho netefatsa bonnete ba kopano.

Bothata ba ho Sebetsa Bocha - Ho tlosa le ho nkela BGA sebaka ntle le ho senya mapolanka kapa likarolo tse haufi ho hloka lisebelisoa le tsebo e tsoetseng pele.

Ho ba le Kutloelo-bohloko ha Leqephe la Boto - Khatello ea mocheso e ka sotha mapolanka ka ho lekaneng ho roba likhokahano ho libolo tsa solder tse sothehileng habonolo tlas'a li-BGA tse kholo.

Litšenyehelo - Tlhahiso ea khokahano e nang le bongata bo phahameng le thepa e tsoetseng pele ea substrate e phahamisa litšenyehelo ho feta mekhoa ea khale ea liphutheloana ka palo e tlase ea likhokahano.

Ho Tlala ha Tsela ea Matshwao – Palo e hodimo haholo ya I/O ya di-BGA e hloka dikarolo tse ngata, tse teteaneng tsa tsela le dipaterone tse rarahaneng tsa ho phonyoha tse eketsang ditshenyehelo tsa tlhahiso ya PCB.

Kgokelo ya Boemo ba Bobedi – Ho hlokahala mohato o arohaneng wa kopano ho hokela die hodima substrate ya BGA pele ho kenngwa boto.

Khatello ea Thermal - Ho se lumellane ha CTE pakeng tsa silicon, substrate, boto le li-solder ho lokela ho nahanoa ho qoba ho hloleha ha potoloho ea mocheso.

BGA Substrates khahlano le LGA

Liphutheloana tsa marang-rang a marang-rang (LGA) li fana ka mokhoa o mong oa BGA o nang le li-tradeoffs tse ikhethang:

Ho tlosoa – Li-LGA li sebelisa li-land pad ho fapana le libolo tsa ho solder, e leng se lumellang ho kenngoa/ho tlosoa ho lihokelo tsa socket ho li-PCB. Li-BGA li soldered ka ho sa feleng.

Botšepehi – Li-LGA li qoba mekhoa ea ho hloleha ha mokhathala oa solder, empa likhokahano tse ngata tsa socket ha li tšepahale ho feta li-solder joints tlas'a potoloho ea mocheso.

Ho Sebetsa Botjha – Di-LGA tse nang le sekoli di ka arolwa le ho nkeloa sebaka ntle le ho tlosa di-solder kapa ho futhumatsa boto. Di-BGA di hloka ho kgutlisetswa morao hape.

Ho hlakola ka ho ama – Li-pad tsa LGA li hohla lipini tsa sehokelo nakong ea ho kenngoa, ho tlosa oxidation le lithōle bakeng sa khanyetso e tlase ea ho ama. Li-BGA li itšetlehile ka ho soldera feela.

Tsela – Makhotla a mmuso a hloka bongata bo boholo ba masoba a koahetsoeng ka har'a li-vias bakeng sa li-socket pin ha li-BGA li hloka tsela ea ho baleha bakeng sa mesaletsa.

Liprofaele – LGA e telele ho feta BGA bonyane ka bophahamo ba sokete. BGA e fana ka profaele e tlase.

Litšenyehelo – Bakeng sa tlhahiso e ngata, BGA hangata e theko e tlase. LGA e ka 'na ea khethoa bakeng sa li-volume tse itekanetseng.

Khetho e nepahetseng e ipapisitse le litebello tsa litšenyehelo, litebello tsa potoloho ea bophelo, litlhoko tsa ts'ebeletso ea tšimo, le litlhoko tsa ts'ebetso.

Likopo tsa BGA Hohle Liindasteri

Ts'ebetso e phahameng, boholo bo nyane, le ts'epahalo ea liphutheloana tsa BGA li bone ho amoheloa lits'ebetsong tse fapaneng:

Consumer Electronics

• Li-smartphone, matlapa, lilaptop
• Li-consoles tsa lipapali, li-set-top boxes
• Lik'hamera tsa dijithale, tse ka roaloang

Kfz-Händler

• Diyuniti tsa taolo ya enjene, infotainment
• Li-module tsa ADAS, LiDAR
• Balaoli ba 'mele

Sefofane le Sesole

• Liboto tsa k'homphieutha tsa Avionics
• Litsamaiso tsa radar le litšoantšo
• Sistimi ea tataiso ea limisaele

Telecom le Marang-rang

• Li-switches, li-routers, liteishene tsa motheo
• server
• Li-module tsa fiber optics

Medical

• Mekhoa ea ho etsa litšoantšo e kang MRI, CT, PET scanners
• Bahlokomeli ba mokuli le tlhahlobo ea mafu
• Li-implantable joalo ka li-pacemaker

fihlela qeto e

Joalo ka ha tataiso ena e bonts'itse, li-substrates tsa BGA li hloka boenjiniere bo nahannoeng ho pholletsa le lithuto tse ngata - motlakase, mocheso, mochini, mahlale a thepa, fisiks, tlhahiso le tse ling.

Ha li entsoe ka nepo, li-substrates tsa BGA li fana ka mokhoa o ts'eptjoang haholo oa khokahano o nolofalletsang tsoelopele e tsoelang pele ea theknoloji. Empa li hloka mohlala o hlokolosi, tlhahlobo, ho latela mekhoa e metle ea moralo, le taolo e tiileng ea ts'ebetso ho fihlela lipheo tsa boleng ba sehlahisoa le ts'epahalo.