Tšehetso e nepahetseng ea PCB bakeng sa Litharollo tsa Drone tsa Mission-Critical

'Maraka oa li-drone tsa sefofane o hloka bokhoni ba PCB boo 90% ea bahlahisi ba ke keng ba bo fana. Ha tharollo ea hau ea li-drone e hloka sebaka sa mela ea li-micron tse 50, li-stackup tsa mekato e 20 tse nang le malapa a khethehileng a laminate a nang le tahlehelo e tlase, kapa ts'ebetso ho tloha ho -55°C ho isa ho +125°C, mabenkele a tloaelehileng a PCB a fihlile meeling ea ona. Ho Highleap Electronics, re hahile lits'ebetso tsa rona tsa tlhahiso ka ho khetheha ho potoloha litlhoko tsena tse thata.

Khoeling e fetileng, moetsi oa li-drone tsa khoebo o ile a re atamela ka mor'a hore bafepedi ba bararo ba PCB ba hlōlehe ho fihlela litlhoko tsa bona tsa radar module. Kopo e ne e hloka li-vias tse foufetseng tsa 0.1mm ka har'a laminate e nang le lera le 16 e nang le mamello e tlase ea impedance ea ± 5%. Litsi tse tloaelehileng li ne li sa khone ho boloka ho nepahala ha ho cheka kapa ngoliso ea lera ho lera e hlokahalang. Lisebelisoa tsa rona tsa sehlopha sa lifofane li fane ka katleho ea ho feta pele ka ho nepahala ha boemo ba 0.025mm.

Ts'ebetso e Khethehileng ea Substrate bakeng sa Likopo tse Tsoetseng Pele tsa Drone

Di-elektronike tsa drone hangata di hloka di-substrate tse sebetsang hantle ho feta FR4 e tloaelehileng—haholo-holo ditshebedisong tsa RF, tsa mocheso le tse bobebe. Ho Highleap Electronics, re latela di-stackup tse hlalositsweng ke bareki le ditaelo tsa thepa ka nepo, ka bokgoni bo netefaditsweng ba ho sebetsana le di-substrate tse hlokang thuso tse kang laminate e ikgethang ya tahlehelo e tlase ya laminate e thehilweng ho PTFE, Isola I-Tera MT40, le Panasonic Megtron 6.

Lisebelisoa tsena li hloka maemo a thata a polokelo, ntlafatso ea lithulusi, le li-parameter tse lokiselitsoeng tsa lamination-mekhoa eo re e ntlafalitseng ka boiphihlelo bo bongata ba tlhahiso.

High-Frequency PCB Haha
Re entse diphanele tse fetang 500 re sebedisa laminate e ikgethang e nang le tahlehelo e tlase bakeng sa di-module tsa antenna tsa GPS, re boloka tahlehelo ya ho kenngwa kahare ho ± 0.1dB ho 2.4GHz. Bakeng sa ditsamaiso tsa ho qoba radar le ho qoba ho thulana, ts'ebetso ya rona ya laminate e nang le tahlehelo e tlase ya hydrocarbon-ceramic e boloka phetoho ya dielectric constant (Dk) tlasa ± 0.05, e netefatsang tshebetso e tsitsitseng ya letshwao moeding wa maqhubu a millimeter.

Maboto a Tsamaiso ea Mocheso
Mohala oa rona oa aluminium-core PCB o ts'ehetsa li-substrates tsa 1.0–3.2mm tse nang le li-conductivity tsa mocheso ho tloha ho 1.0 ho isa ho 8.0 W/m·K. Sehlopha sa morao-rao sa likotoana tsa 2,000 bakeng sa tsamaiso ea drone e thehiloeng ho LED e fihletse ho hanyetsa mocheso oa 0.8 ° C / W ka compact form factor - e loketseng bakeng sa lichelete tse thata tsa mocheso.

Rigid-Flex bakeng sa Likopano tsa Gimbal
E thehiloeng ho polyimide li-PCB tse thata-flex, e sebelisoang hangata lits'ebetsong tsa taolo ea gimbal, e hloka tokiso e hlokolosi ea impedance le e tsitsitseng ka sebopeho. Re boloka ± 7% taolo ea ho thibela mekhoa ea 50Ω e nang le bophara ba mohala oa 0.1mm, e nolofalletsang ho fetisetsa khamera e potlakileng le ea sensor data ka tahlehelo e fokolang.

Ho Highleap, ha re tšehetse lisebelisoa tse tsoetseng pele feela—re etsa bonnete ba hore liboto tsa hau tsa sefofane li hahiloe ka mokhoa o nepahetseng hantle, ka taolo ea ts'ebetso le netefatso ea boleng ho tsamaisana le tikoloho e batloang haholo ea sefofane le indasteri.

Bokhoni ba Drone PCB ha u habanya

✓ Tšehetso ea Microvia & HDI: Ho theohela ho 0.05mm ka boholo, ka bokhoni ba 4+N+4 stackup
✓ Impedans e Laolang: ± 5% mamello bakeng sa lipara tse fapaneng ho fihla ho 12GHz
✓ Likhetho tse Rigid-Flex: E loketse bakeng sa li-drones tse menahaneng ka matsoho kapa li-UAV tse ka aparoang
✓ Holim a qeta: ENIG, OSP, ENEPIG, Silivera ea ho qoelisoa, Khauta e Kentsoeng
✓ Setifikeiti-Se Loketse: IPC-6012 Sehlopha sa 3, RoHS e lumellana, ISO 9001: 2015 e netefalitsoeng
✓ Scalable Lota boholo: Ho tloha ho li-prototypes tse fetohang kapele (<10 li-pcs) ho isa ho li-volume tse felletseng (> 10,000 pcs)

Global Drone Solutions e Batla Boenjiniere bo Khethehileng ba PCB

Ditshebediso tsa sejwalejwale tsa di-drone di akaretsa diindasteri tse fapaneng, e nngwe le e nngwe e hlahisa diphephetso tse ikgethang tsa elektroniki tseo tlhahiso e tloaelehileng ya PCB e ke keng ya di rarolla. Ditharollo tsa di-drone tsa kgwebo tsa kajeno di hloka mahlale a ikgethang a boto ya potoloho makaleng a mangata:

• Sistimi ea ho tsamaisa thepa e ikemetseng e sebetsang maemong a arctic ho tloha ho -55°C ho ea +85°C
• Li-drones tsa temo tse nepahetseng tsa temo tse nang le litlhoko tsa ho nepahala tsa GPS ka har'a mamello ea 2.5cm
• Li-platform tsa tlhahlobo ea indasteri tse sebelisang radar ea 77GHz bakeng sa ho qoba ho thulana le ho lemoha litšitiso
• Li-UAV tsa likarabo tsa maemo a tšohanyetso tse hlokang ho romelloa ka potlako le botšepehi ba puisano ba 99.9%.
• Liphuputso tsa merafo li tsamaisana le lerole, ho thothomela le mocheso o feteletseng libakeng tse thata
• Sistimi ea tlhahlobo ea grid ea matla e kopanyang litšoantšo tse futhumetseng le phetiso ea data ea nako ea nnete
• Li-drones tsa ho nka lifoto tsa bareki tse batlang meralo e bobebe e thata-thata bakeng sa likopano tsa gimbal

Sesebelisoa se seng le se seng se hloka litharollo tsa PCB tse fetang bokhoni bo tloaelehileng. Hore na e boloka kutlo ea seamoheli sa GPS ho -40°C, ho fihlela ts'ebetso ea radar ea 77GHz ka li-substrates tse laoloang, kapa ho fana ka ts'epahalo ea lihora tse 50,000+ tsa sefofane lits'ebetsong tsa phano ea thepa, litharollo tsa baenjiniere ba Highleap Electronics PCB tse nolofalletsang ts'ebetso e matla maemong a sebele a ts'ebetso ea lefats'e.

Phethahatso ea PCB e Tsepamisitsoeng Boenjiniere bakeng sa Mekhoa ea Sebele ea Lefatše ea Drone

Li-drone li sebetsa maemong a fapaneng haholo—ho tloha litšoantšong tsa ka tlung ho ea ho litlhahlobo tsa indasteri tse phahameng—'me meralo ea tsona ea PCB e bontša seo. Ho Highleap Electronics, re ikhethile ka ho hlahisa ho latela lifaele tsa hau tsa moralo, litlhaloso tsa thepa le litlhoko tsa stackup, ho netefatsa hore ts'ebetso e fanoa hantle joalo ka ha e entsoe.

Re sebetsana le meaho e mengata e fapaneng e hlalosoang ke bareki, ho kenyelletsa:

• Li-drone tsa bareki tse nang le meralo ea 4-6 e thehiloeng ho FR4 e ntlafalitsoeng bakeng sa li-module tsa khamera le li-controller tse nyane

• Li-UAV tsa khoebo tse sebelisang metsoako e thata-thata bakeng sa matsoho a ka menoang, tse nang le tsela e laoloang ea impedance le litsela tsa phetisetso tse nang le tahlehelo e tlase

• Li-drone tsa maemo a indasteri tse hlokang li-stackup tse kopantsoeng tse nang le li-substrate tse khethehileng tsa laminate tse nang le tahlehelo e tlase, polyimide, kapa aluminium-core joalo ka ha ho boletsoe litokomaneng tsa bareki.

Ho tloha Gerber ho fihlela kopano e felileng, re ikamahanya le sepheo sa hau sa boenjiniere - hore na o etsa prototyping ea gimbal board kapa o sebelisa li-drones tsa tlhahlobo tse tsamaisoang ke radar. Ke ka lebaka leo bafani ba litharollo tsa lefats'e tsa drone ba itšetlehileng ka Highleap Electronics bakeng sa ts'ebetso e nepahetseng, tlhahiso e phahameng ea ts'epo, le ts'ebetso ea nako e telele ho pholletsa le mehaho.

Ho Ikamahanya le Moralo oa PCB ho Li-Platform tse fapaneng tsa Drone

Ho theha li-PCB bakeng sa lits'ebetso tsa drone ho hloka ho feta bokhoni bo tloaelehileng ba ho etsa. Sethala se seng le se seng sa drone - ebang se etselitsoe bareki, khoebo kapa indasteri - se beha lithibelo tse fapaneng tsa motlakase, tsa mochini le tsa tikoloho. Ho tsoa ho lintlha tsa sebopeho se kopaneng ho li-drones tse phuthoang ho bonts'a bots'epehi lits'ebetsong tsa RF, phephetso e holim'a ho fana ka meaho e ts'eptjoang haholo ha e ntse e kopana le boima ba 'mele, litšenyehelo le bophahamo ba lipehelo.

Highleap Electronics e rarolla mathata ana ka mokhoa o tenyetsehang le o tsamaisoang ke boenjiniere:

• Re haha ​​liboto tse bobebe tsa FR4 le li-halogen-free bakeng sa li-drones tsa bareki tse nang le taolo e tsitsitseng ea ts'ebetso
• Re ts'ehetsa litsamaiso tse thata tsa flex le li-multi-board bakeng sa li-gimbals, kabo ea matla, le li-module tsa khamera
• Re fana ka mokhoa oa ho etsa li-stackup ka lisebelisoa tse nyalisitsoeng, ho kenyeletsoa PTFE, polyimide, le laminate e tlatsitsoeng ka ceramic.
• Re netefatsa ts'epahalo ka ts'ireletso e laoloang, netefatso ea moralo oa mocheso, le ho tiea ha EMI
• Re amohela meaho e ikhethileng ea projeke, ho tloha ho li-prototypes tsa pele ho isa lits'ebetsong tse felletseng tsa tlhahiso.

Ho sa tsotellehe hore na kopo ea hau e kenyelletsa sefofane sa ho fana ka sebaka se tlaase kapa UAV ea tlhahlobo ea nako e telele e nang le meputso e boima, re fetola moralo oa rona oa PCB le mokhoa oa ho etsa masela ho lumellana le litlhoko tsa hau tsa sebele tsa ts'ebetso ea lefats'e-ho netefatsa ts'ebetso, botsitso le ts'epo ea tšimo mohatong o mong le o mong.

Selekane le Moetsi ea Utloisisang Drone Electronics

Highleap Electronics ke moetsi ea inehetseng oa PCB le mofani oa likopano, e sebeletsang indasteri ea lisebelisoa tsa elektroniki lefatšeng ka bophara e tsepamisitse maikutlo holim'a liboto tse rarahaneng haholo, tse ikhethileng ka ts'ebeliso. Ho tloha likopanong tse thata tse feto-fetohang bakeng sa li-drones tsa bareki tse phuthoang ho ea ho li-hybrid-material RF board bakeng sa li-UAV tsa indasteri, re sebetsa ka kotloloho ho tsoa ho lifaele tsa hau tsa boenjiniere ho fana ka liphetho tse lokiselitsoeng tlhahiso-ka tekanyo, ka nepo.

Libaka tsa rona li hlomeletsoe ho sebetsana le tlhahiso ea PCB le PCBA tlas'a marulelo a le mong, ho lumella taolo e tiileng ea ts'ebetso, ho pheta-pheta ka potlako, le boleng bo tšepahalang ho pholletsa le lihlopha tse nyane le tlhahiso ea bongata. Re tšehetsa thepa e tsoetseng pele, impedance e laoloang, li-stackup tse ikhethileng, le meaho ea lits'ebetso tse ngata - tsohle li etselitsoe ho fihlela litlhoko tse ntseng li fetoha tsa litsamaiso tsa drone ho pholletsa le likarolo tsa thepa, temo, 'mapa, meralo ea motheo le ts'ireletso.

Haeba u ntse u nts'etsapele li-platform tsa drone tse hlokang ho feta litharollo tse kantle ho sethala, Highleap Electronics e se e loketse ho ba molekane oa hau oa kaho - ho tloha ho prototyping ho isa phepelong e felletseng.

FAQ: Ho Khetha Moetsi oa PCB oa Drone o Nepahetseng Chaena

Q1: Ke bo-mang ba ka sehloohong baetsi ba PCB ba drone Chaena?
Highleap Electronics e ikhetha ka bokgoni ba yona ba botekgeniki ba ho etsa le ho kopanya di-PCB tsa drone. Ka setifikeiti sa AS9100D le boiphihlelo bo pakilweng ka malapa a laminate a ikgethang a tahlehelo e tlase, re tshehetsa meaho e rarahaneng e fihlang ho 20, di-microvia tsa 0.05mm, le ditshebediso tsa mocheso o feteletseng. Mabitso a mang a kenyeletsa SYTECH (di-substrate) le SCC (bokgoni ba boima, ho iketsetsa ho fokolang). Tshebetso ya thepa, ditsamaiso tsa boleng, le botebo ba boenjiniere di bohlokwa ho feta sekala feela.

Q2: Ke litifikeiti life tseo morekisi oa PCB oa sesole kapa aerospace-grade-grade a lokelang ho ba le tsona?
Bafepedi ba lokela ho ba le AS9100D, IPC-6012 Sehlopha sa 3, mme ba boloke ho latelwa ha thepa ka botlalo. Ba tlameha ho tshehetsa HDI, di-vias tse foufetseng/tse patilweng, le thepa ya sefofane jwalo ka laminate e ikgethang e nang le tahlehelo e tlase kapa Isola. Highleap e fihlela tsena tsohle mme e fana ka boleng bo hodimo ba Cpk (>1.67), e netefatsang ho latela maemo a UAV le avionics a batlang.

P3: Ke lik'hamphani life Chaena tse nang le boiphihlelo ba 'nete ka li-PCB tsa drone tse ikhethang tse thehiloeng ho laminate tse nang le tahlehelo e tlase?
Lifeme tse fokolang li sebetsana hantle le malapa a laminate a khethehileng a nang le tahlehelo e tlase. Highleap e hlahisitse li-laminate tse fetang 500 tse hahang laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic 'me e boloka mamello ea ± 0.05 ho li-Dk shifts bakeng sa laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic. Re molekane ea lumelletsoeng oa laminate e nang le tahlehelo e tlase ea hydrocarbon-ceramic ea khethehileng le ho cheka, ho lamination le ho qeta bakeng sa lits'ebetso tsa UAV tse sebelisoang khafetsa. Kamehla hlahloba bophahamo ba tlhahiso, sekhahla sa chai, le lithuto tsa linyeoe - eseng feela "litlaleho tsa bokhoni."

Q4: Ke mang ea fanang ka litšebeletso tsa kopano ea drone PCB ka ho fetisisa?
Highleap Electronics e fana ka kopano ea 0.2mm BGA, 5µm AOI, le bokhoni bo felletseng ba tlhahlobo ea RF. Re na le boiphihlelo bo matla ka li-module tsa GPS, li-IMU, le litefo tse boima. Sekhahla sa rona sa ho pasa se feta 99.8%, se tšehelitsoe ke netefatso ea tšebetso, ICT, le RF. Ha re bapisoa le bafani ba bangata ba EMS, re tsepamisa maikutlo haholo litlhoko tse khethehileng tsa drone.

Q5: Nka leka-lekanya litšenyehelo le bokhoni ba tlhahiso ea drone PCB joang?
Qoba ho feteletseng-bafani ba theko e tlaase ba ka 'na ba hloka taolo ea ts'ebetso, ha masela a phahameng a ka feta tekanyetso ea hau. Highleap e fana ka likarolo tse tsoetseng pele (HDI, li-hybrid builds, kopano e nepahetseng) ka litheko tse phahameng. Ho tloha ho li-prototypes tse 5 ho isa ho tlhahiso ea likotoana tse 10,000, re hlophisa maano a ts'ebetso ea litšenyehelo projeke ka 'ngoe.