Seboka sa PCB se Phahameng sa lebelo le phahameng la IS620i le Litšebeletso tsa Tlhahiso
Highleap Electronics e fana ka kopano le tlhahiso ea IS620i PCB e sebelisang thepa ea Isola, e etselitsoeng lits'ebetso tsa dijithale tse potlakileng le tsa RF.
Setsebi sa Tlhahiso ea PCB bakeng sa Likopo tsa Lebelo le Phahameng - Ho kenyeletsoa lisebelisoa tsa IS620i
Ho Highleap Electronics, re moetsi oa PCB ea fanang ka litšebeletso tse felletseng le ntlo ea kopano, re khona ho sebetsana le lisebelisoa tsohle tsa laminate tse tloaelehileng le tse tsoetseng pele—ho tloha ho FR-4 e tloaelehileng ho isa ho IS620i, li-laminate tse nang le tahlehelo e tlase ea hydrocarbon-ceramic, MEGTRON6, le tse ling.
Feme ea rona e na le lisebelisoa tse thata, HDI, RF, le tlhahiso ea PCB ea multilayer, 'me re sebetsa le baqapi ho pholletsa le liindasteri ho tlisa meralo ea bona ea PCB ea lebelo le holimo, ea tahlehelo e tlase ka nepo e ke keng ea lekanngoa.
IS620i, e entsoeng ke Isola Group, ke e 'ngoe ea lisebelisoa tse ngata tseo re li tšehetsang. Thepa ena ea phetoho e emela ea pele sehlopheng sa lihlahisoa tsa dijithale e hahiloeng holim'a mahlale a teng, empa e fana ka melemo e mengata bakeng sa lefatše la kajeno la dijithale. IS620i e entsoe ka mokhoa o ikhethileng bakeng sa lits'ebetso tsa lebelo le holimo ho tloha ho 2 ho isa ho 15 GHz, e fana ka baqapi le baetsi ba masela ka mokhoa o bonolo oa moralo oa dijithale, tiisetso ea phepelo, le boiketlo ba ts'ebetso e tloaelehileng ea FR-4.
Litlhaloso tsa Bohlokoa Ha U habanya
- Mocheso oa Phetoho ea Khalase (Tg): 225 ° C
- Thempereichara ea ho senyeha (Td): 364 ° C
- Dielectric Constant (Dk): 3.58
- Taba ea Phallo (Df): 0.006
Litlhaloso tsa tekheniki tsa IS620i Laminate
Tafole e latelang e fana ka litlhaloso tse felletseng tsa tekheniki bakeng sa IS620i ea boleng bo holimo ba laminate le lisebelisoa tsa prepreg. Litekanyetso tsohle ke thepa e tloaelehileng 'me li fanoe molemong oa litšupiso tsa boenjiniere.
Thepa ea Thermal
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Glass Transition Temperature (Tg) ka DSC | 225 | ° C | IPC-TM-650 2.4.25C |
| Decomposition Temperature (Td) ka TGA @ 5% tahlehelo ea boima ba 'mele | 364 | ° C | IPC-TM-650 2.4.24.6 |
| Nako ea ho Delaminate ka TMA (Koporo e tlositsoe) - T260 | 60 | metsotso e | IPC-TM-650 2.4.24.1 |
| Nako ea ho Delaminate ka TMA (Koporo e tlositsoe) - T288 | > 20 | metsotso e | IPC-TM-650 2.4.24.1 |
| Z-Axis CTE - Pele ho Tg | 55 | ppm / ° C. | IPC-TM-650 2.4.24C |
| Z-Axis CTE - Post-Tg | 230 | ppm / ° C. | IPC-TM-650 2.4.24C |
| Z-Axis CTE – 50 ho 260°C (Katoloso e Akaretsang) | 2.8 | % | IPC-TM-650 2.4.24C |
| X/Y-Axis CTE Pre-Tg | 13 | ppm / ° C. | IPC-TM-650 2.4.24C |
| Ho khanna ho chesang | 0.35 | W / mK | ASTM E1952 |
| Khatello ea Mocheso Metsotsoana e 10 @ 288°C – E sa sebetsanoang | Pass | Feta Visual | IPC-TM-650 2.4.13.1 |
| Thermal Stress 10 sec @ 288°C – E Etched | Pass | Feta Visual | IPC-TM-650 2.4.13.1 |
Thepa ea Motlakase
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Dk, tumello @ 100 MHz | 3.59 | - | IPC-TM-650 2.5.5.3 |
| Dk, Tumello @ 1 GHz | 3.58 | - | IPC-TM-650 2.5.5.9 Bereskin Stripline |
| Dk, Tumello @ 2 GHz | 3.58 | - | Bereskin Stripline |
| Dk, Tumello @ 5 GHz | 3.54 | - | Bereskin Stripline |
| Dk, Tumello @ 10 GHz | 3.54 | - | Bereskin Stripline |
| Df, Loss Tangent @ 100 MHz | 0.0051 | - | IPC-TM-650 2.5.5.3 |
| Df, Loss Tangent @ 1 GHz | 0.0059 | - | IPC-TM-650 2.5.5.9 Bereskin Stripline |
| Df, Loss Tangent @ 2 GHz | 0.0060 | - | Bereskin Stripline |
| Df, Loss Tangent @ 5 GHz | 0.0066 | - | Bereskin Stripline |
| Df, Loss Tangent @ 10 GHz | 0.0071 | - | Bereskin Stripline |
| Volume Resistivity - Ka mor'a ho hanyetsa mongobo | 8.9 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Volume Resistivity - Ka mocheso o phahameng | 6.5 × 10⁸ | MΩ-cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity - Ka mor'a ho hanyetsa mongobo | 2.21 × 10⁶ | MΩ | IPC-TM-650 2.5.17.1 |
| Surface Resistivity - Ka mocheso o phahameng | 4.4 × 10⁸ | MΩ | IPC-TM-650 2.5.17.1 |
| Karohano ea Dielectric | > 50 | kV | IPC-TM-650 2.5.6B |
| Arc Resistance | 110 | Likhoeli tsa bobeli | IPC-TM-650 2.5.1B |
| Matla a Motlakase (Laminate & laminated prepreg) | 55 (1400) | kV/mm (V/mil) | IPC-TM-650 2.5.6.2A |
| Comparative Tracking Index (CTI) | 2 (250-399) | Sehlopha (Volts) | UL 746A ASTM D3638 |
Mechanical Properties
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Matla a Peel - Foil ea koporo e tlase (> 17 μm) | 1.14 (6.5) | N/mm (lb/inch) | IPC-TM-650 2.4.8C |
| Matla a Peel - Koporo ea boemo bo tloaelehileng ka mor'a khatello ea mocheso | 0.96 (5.5) | N/mm (lb/inch) | IPC-TM-650 2.4.8.2A |
| Matla a Peel - Koporo e tloaelehileng ea profil ka mor'a tharollo ea ts'ebetso | 0.90 (5.1) | N/mm (lb/inch) | IPC-TM-650 2.4.8.3 |
| Flexural Strength - Taelo ea bolelele | 69.2 | khosana | IPC-TM-650 2.4.4B |
| Flexural Strength - Tsela ea sefapano | 62.4 | khosana | IPC-TM-650 2.4.4B |
| Matla a Tensile - Taelo ea bolelele | 42.1 | khosana | ASTM D3039 |
| Tensile Strength - Cross direction | 39.7 | khosana | ASTM D3039 |
| Young's Modulus – Taelo ya bolelele | 3217 | khosana | ASTM D790-15e2 |
| Young's Modulus - Tsela e fapaneng | 3207 | khosana | ASTM D790-15e2 |
| Karolelano ea Poisson - tataiso ea bolelele | 0.166 | - | ASTM D3039 |
| Karolelano ea Poisson - tataiso ea sefapano | 0.164 | - | ASTM D3039 |
Thepa e Eketsehileng
| Property | Boleng bo tloaelehileng | Litekanyetso | Method teko |
|---|---|---|---|
| Ho monya mongobo | 0.24 | % | IPC-TM-650 2.6.2.1A |
| Ho chesa (Laminate & laminated prepreg) | V-0 | Rating | UL 94 |
| Mocheso o Moholo oa ho sebetsa | 130 | ° C | UL 796 |
Lintlha tsa Bohlokoa tsa Theknoloji
Litekanyetso tsohle tsa tekheniki tse bontšitsoeng ka holimo bakeng sa IS620i laminates ke thepa e tloaelehileng e hatisitsoeng ke Isola Group 'me e fanoe ka tieo bakeng sa boitsebiso ba boenjiniere. Ts'ebetso ea 'nete e ka fapana ho ipapisitsoe le sebopeho sa PCB ea hau, sebopeho sa lera, ka moralo le ts'ebetso ea tlhahiso.
Ho Highleap Electronics, re sebelisa feela li-laminate tsa IS620i tsa 'nete tse nkiloeng ka kotloloho ho tsoa liteisheneng tse amohetsoeng ke Isola, ho netefatsa boleng le ho ts'oaroa ha tlhahiso e ngoe le e ngoe.
Lintlha, leha ho lumeloa hore li nepahetse ebile li thehiloe mekhoeng ea tlhahlobo e nkoang e ka tšeptjoa, ke ea merero ea tlhahisoleseling feela. Thekiso efe kapa efe ea lihlahisoa tsena e tla laoloa ke lipehelo le lipehelo tsa tumellano eo li rekisoang tlas'a eona.
Ke Hobane'ng ha Baenjiniere ba Khetha IS620i bakeng sa Merero ea PCB e Phahameng ka ho Fetisisa, e Tahlehelo e tlase
Ho Highleap Electronics, re khothaletsa li-laminate tsa IS620i bakeng sa li-circuits tsa dijithale tsa lebelo le holimo, haholo-holo bakeng sa meralo e sebetsang ho 2 ho isa ho 15 GHz. Thepa ena e hlahella ka lebaka la ts'ebetso ea eona e phahameng ea motlakase, botsitso ba mocheso, le ho sebetsa habonolo. IS620i e netefatsa botšepehi bo ikhethang ba lets'oao le tahlehelo e fokolang ea mats'oao, e e etsa khetho e nepahetseng bakeng sa lits'ebetso tse hlokang tharollo ea PCB ea lebelo le holimo, ea tahlehelo e tlase, joalo ka likhokahano tsa mehala, likhomphutha tse tsoetseng pele le lits'ebetso tsa dijithale.
Melemo ea Bohlokoa ea IS620i
- Ts'ebetso e Phahameng ea Motlakase: IS620i e fana ka dielectric constant tsa 3.58 le dissipation factor of 0.006 at 10 GHz, e netefatsang botšepehi bo botle ba pontšo le tahlehelo e fokolang ea matšoao ho feta mefuta e mengata ea maqhubu, e loketseng bakeng sa likopo tse phahameng ka potlako.
- Thermal Stability e ikhethang: Ka mocheso oa mocheso oa khalase (Tg) oa 225 ° C le mocheso oa ho bola oa 364 ° C, IS620i e sebetsa ka botšepehi esita le libakeng tse batlang mocheso, ho etsa hore e tšoanelehe bakeng sa lisebelisoa tsa elektronike tse matla.
- Ho sebetsa ka bonolo: IS620i e lumellana le mekhoa e tloaelehileng ea ho sebetsana le FR-4, e thusang ho fokotsa litšenyehelo tsa tlhahiso ha e ntse e boloka ts'ebetso e phahameng. E loketse ka bobeli li-prototypes tse nyane le tlhahiso e kholo, e fana ka mefuta e mengata nakong eohle ea tlhahiso.
- Tlhokomeliso ea Indasteri le Tumellano: IS620i e tiisitsoe ka UL (Nomoro ea Faele E41625) 'me RoHS ea lumellana, ho netefatsa hore e finyella litekanyetso tsa indasteri bakeng sa polokeho le tumellano ea tikoloho. E fumaneha ka mefuta ea laminate le prepreg, IS620i e fana ka maemo a bonolo bakeng sa meralo e rarahaneng ea li-multilayer.
Likopo tse nepahetseng bakeng sa IS620i
IS620i e loketse mefuta e fapaneng ea ts'ebetso ea ts'ebetso e phahameng, ho kenyelletsa le lipotoloho tsa dijithale tse potlakileng, meaho ea mehala ea mehala, lisebelisoa tsa setsi sa data, le lisebelisoa tse tsoetseng pele tsa komporo. Lintho tsa eona tse thibelang mahlaseli a kotsi a UV le AOI fluorescence li fana ka melemo e eketsehileng ho automated Optical inspection (AOI), ho ntlafatsa taolo ea boleng nakong ea tlhahiso. Ho Highleap Electronics, re fana ka boeletsi ba mahala ho thusa bareki ho khetha lisebelisoa tse ntle ka ho fetisisa bakeng sa ts'ebetso ea bona, litšenyehelo, le litlhoko tsa tlhahiso, ho netefatsa tharollo e nepahetseng bakeng sa litlhoko tsa hau tse ikhethileng.
IS620i PCB Fabrication & Assembly Solutions
Ho Highleap Electronics, re fana ka tse fetang feela tlhahiso ea IS620i PCB. Re molekane oa hau oa ts'ebeletso e felletseng bakeng sa litlhoko tsohle tsa PCB, ho tloha ho 2-layer FR4 prototypes ho isa HDI ea 60-layer HDI le li-PCB tse ngata. Litšebeletso tsa rona tse akaretsang li koahela ntho e 'ngoe le e' ngoe ho tloha ho moralo le khetho ea thepa ho ea ho li-turnkey le ho kopanya, ho netefatsa hore litharollo tsa ts'ebetso e phahameng li lumellana le litlhoko tsa morero oa hau.
Matla a rona a IS620i PCB
- Precision Impedans Control: Ho fihlella ho nepahala ha ±5% bakeng sa lipara tse fapaneng le lithapo tsa phetiso ea RF, ho netefatsa botšepehi bo nepahetseng ba matšoao.
- Ts'ebetso e tsoetseng pele ea HDI: Ka li-microvias, via-in-pad, le ka plugging bakeng sa meralo e matla haholo.
- Li-Stackups tse rarahaneng tsa Multilayer: Tsebo ea lisebelisoa tse nyalisitsoeng (mohlala, IS620i + FR4) bakeng sa ts'ebetso e bolokang chelete e ngata.
- Premium Surface Finishes: Ho kenyeletsoa ENIG, ENEPIG, khauta e thata, le OSP, ho fihlela litlhoko tse ikhethang tsa kopo.
Kopano e Felletseng ea SMT ea Turnkey le Tiisetso e Matla ea Boleng
Re fana ka kopano e felletseng ea SMT bakeng sa likarolo tsa BGA, QFN, 01005, le sebaka sa thebe ea RF. Teko ea rona e matla ea QA e kenyelletsa AOI, tlhahlobo ea X-ray, liteko tsa ts'ebetso, le liteko tsa probe tse fofang bakeng sa ts'epo e phahameng ka ho fetisisa. Merero eohle e sebelisa li-laminate tsa 'nete tsa IS620i tse tsoang ho Isola Group, tse tšehetsoang ke maemo a IPC Class 2/3. Hore na o hloka IS620i, laminate ea hydrocarbon-ceramic e nang le tahlehelo e tlase, kapa li-substrate tsa FR-4, re na le boiphihlelo le meralo ea motheo ea ho fana ka liphetho tse ikhethang bakeng sa projeke efe kapa efe.
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