Laminate ea PCB ea Lebelo le Phahameng ea IT-968
Hlahloba lilampiri tsa IT-968 SE PCB bakeng sa tšebeliso ea lebelo le phahameng, ea maqhubu a phahameng. Highleap e fana ka ts'ehetso ea masela, kopano le meralo bakeng sa meaho ea multilayer IT-968.
IT-968 High-Speed PCB Laminate bakeng sa Meetso e Tsoetseng Pele ea Elektronike
IT-968 ke karolo e phahameng ea ts'ebetso ea PCB e entsoeng ke ITEQ. E na le mocheso o phahameng oa phetoho ea likhalase (Tg), botsitso bo botle ba mocheso, le litšobotsi tsa tahlehelo e tlase haholo. Sesebelisoa sena se ntlafalitsoe bakeng sa lits'ebetso tsa dijithale tsa maqhubu a holimo le a lebelo le holimo, ho kenyeletsoa meaho ea 5G, li-server tsa data center, radar ea likoloi, le tse ling.
Ho Highleap Electronics, re fana ka lits'ebeletso tsa tlhahiso le kopano ea PCB e felletseng re sebelisa li-laminate tsa IT-968, re tšehetsa prototyping le tlhahiso ea bongata ka netefatso e tiileng ea boleng.
Likopo tse tloaelehileng:
- Liteishene tsa 5G tse se nang mohala le li-millimeter-wave modules
- Li-backplane tsa lebelo le holimo, li-routers le li-switches
- Litsamaiso tsa radar ea likoloi le ADAS
- Khomphutha ea AI, ho potlakisa marang-rang, le li-module tsa RF tse ka pele
Sheba lintlha tsa tekheniki tse ka tlase ho lekola ho tšoaneleha ha IT-968 bakeng sa projeke ea hau e latelang.
ITEQ Laminate/ Prepreg : IT-968TC SE/IT-968BS SE
| Property | Botenya <0.50 mm [0.0197 in] | Botenya ≥ 0.50 mm [0.0197 in] | Litekanyetso (Metric / Senyesemane) |
Method teko (IPC-TM-650 kapa e hlokometsoe) |
||
|---|---|---|---|---|---|---|
| tloaelehileng | spec | tloaelehileng | spec | |||
| Matla a Peel – Tlase/Haholo‑Haholo‑Profile Cu (>17 µm) | 0.44–0.61 (2.5–3.5) | 0.44 (2.50) | 0.44–0.61 (2.5–3.5) | 0.44 (2.50) | N/mm (lb/in) | 2.4.8 / 2.4.8.2 |
| Matla a Peel - Profaele e Tloaelehileng (1 oz) | 0.88–1.23 (5.0–7.0) | 0.70 (4.00) | 0.88–1.23 (5.0–7.0) | 0.70 (4.00) | N/mm (lb/in) | 2.4.8.3 |
| Ho hanyetsa Molumo - C-96/35/90 | > 1010 | 106 | - | - | MΩ·cm | 2.5.17.1 |
| Volume Resistivity - Ka mor'a ho hanyetsa mongobo | - | - | > 1010 | 104 | MΩ·cm | 2.5.17.1 |
| Volume Resistivity - Ka mocheso o phahameng E‑24/125 | > 1010 | 103 | > 1010 | 103 | MΩ·cm | 2.5.17.1 |
| Bokaholimo ba Resistivity - C-96/35/90 | > 109 | 104 | - | - | MΩ | 2.5.17.1 |
| Surface Resistivity - Ka mor'a ho hanyetsa mongobo | - | - | > 109 | 104 | MΩ | 2.5.17.1 |
| Resistivity ea Bokaholimo - Ka mocheso o phahameng E‑24/125 | > 109 | 103 | > 109 | 103 | MΩ | 2.5.17.1 |
| Mongobo oa mongobo, boholo | - | - | 0.12 | 0.5 | % | 2.6.2.1 |
| Karohano ea Dielectric, bonyane | - | - | > 50 | 40 | kV | 2.5.6 |
| Tumello (Dk) 1 GHz | 3.44 | SEBELISA | 3.44 | SEBELISA | - | 2.5.5.9 |
| Tumello (Dk) 2 GHz | 3.44 | - | 3.44 | - | - | 2.5.5.13 |
| Tumello (Dk) 5 GHz | 3.35 | - | 3.35 | - | - | 2.5.5.13 |
| Tumello (Dk) 10 GHz | 3.34 | - | 3.34 | - | - | 2.5.5.13 |
| Loss Tangent (Df) 1 GHz | 0.0027 | SEBELISA | 0.0031 | SEBELISA | - | 2.5.5.9 |
| Loss Tangent (Df) 2 GHz | 0.0030 | - | 0.0030 | - | - | 2.5.5.13 |
| Loss Tangent (Df) 5 GHz | 0.0035 | - | 0.0035 | - | - | 2.5.5.13 |
| Loss Tangent (Df) 10 GHz | 0.0038 | - | 0.0038 | - | - | 2.5.5.13 |
| Flexural Strength - Taelo ea bolelele | - | - | 444 (64 380) | 415 (60 190) | N/mm² (psi) | 2.4.4 |
| Flexural Strength - Tsela ea sefapano | - | - | 415 (60 175) | 345 (50 040) | N/mm² (psi) | 2.4.4 |
| Arc Resistance, bonyane | > 60 | 60 | > 60 | 60 | s | 2.5.1 |
| Khatello ea Mocheso 288 °C 10 s – E sa sebetsanoang | Pass | Feta Visual | Pass | Feta Visual | Rating | 2.4.13.1 |
| Khatello ea Mocheso 288 °C 10 s - E ngotsoe | Pass | Feta Visual | Pass | Feta Visual | Rating | 2.4.13.1 |
| Matla a Motlakase, bonyane | > 30 | 30 | - | - | kV / limilimithara | 2.5.6.2 |
| Ho tsuba | V‑0 | V‑0 | V‑0 | V‑0 | Rating | UL94 |
| Glass Transition Temperature (TMA) | - | - | 175 | 170 mets | ° C | 2.4.24 |
| Thempereichara ea ho senyeha (5 % wt tahlehelo) | - | - | 400 | 340 mets | ° C | 2.4.24.6 |
| X/Y Axis CTE (40–125 °C) | - | - | 12-14 | - | ppm / ° C. | 2.4.24 |
| Z-Axis CTE – Alpha 1 | - | - | 45 | 60 max | ppm / ° C. | 2.4.24 |
| Z-Axis CTE – Alpha 2 | - | - | 260 | 300 max | ppm / ° C. | 2.4.24 |
| Katoloso ea Z‑Axis 50–260 °C | - | - | 2.3 | 3.5 max | % | 2.4.24 |
| Thermal Resistance T260 | - | - | > 60 | 30 mets | le 'na | 2.4.24.1 |
| Thermal Resistance T288 | - | - | > 60 | 15 mets | le 'na | 2.4.24.1 |
| Khanyetso ea CAF | - | - | Pass | SEBELISA | Pasa / Hloloa | 2.6.25 |
HLOKOMELA
- Lintlha tse ka holimo le litataiso tsa tlhahiso li fanoe bakeng sa baqapi le baetsi ba PCB e le litšupiso. Leha tlhahisoleseling ho lumeloa hore e nepahetse, boleng ba 'nete bo ka fapana ho latela mekhoa ea liteko le maemo a tlhahiso. Litlhaloso tsa ho qetela tsa sehlahisoa li lokela ho netefatsoa ho latela tumellano le ITEQ. ITEQ e na le tokelo ea ho nchafatsa data ntle le tsebiso ea pele ho netefatsa hore lintlha tsa morao-rao li fumaneha ho basebelisi.
- Highleap Electronics ke moetsi oa PCB ea hloahloa le mokopanyi ea fanang ka lits'ebeletso tse felletseng ho tloha ho prototyping ho isa tlhahiso ea molumo. Re sebetsa ka mefuta e mengata e fapaneng ea lisebelisoa tsa ts'ebetso e phahameng - ho kenyeletsoa empa ha e felle feela ho IT-968 SE - le ho ts'ehetsa li-stack-ups tse rarahaneng bakeng sa lits'ebetso tsa lebelo le holimo le tsa RF.
- Haeba o hloka therisano ea moralo, thuso ea khetho ea thepa, kapa litlhahiso tse ikhethileng tsa ho bokella o sebelisa IT-968 SE kapa li-substrates tse ling, sehlopha sa rona sa boenjiniere se ikemiselitse ho thusa. Ikopanye le rona ho qala morero oa hau kajeno.
Tšebelisano ea Tlhahiso le Bokhoni ba Boenjiniere
Highleap Electronics e na le boiphihlelo bo pharaletseng ba ho etsa lipalo tse phahameng, tse lebelo le holimo, le li-RF PCB tse sebelisang li-laminate tsa IT-968 SE. Re utloisisa ka botlalo boits'oaro ba ho lamination, taolo ea ho cheka, le litlhoko tsa botšepehi ba matšoao tse amanang le thepa ena e tsoetseng pele ea Dk, ultra-low Df.
Mehaho ea rona e na le lisebelisoa tsa ho sebetsana le meaho e rarahaneng ha e ntse e netefatsa ts'epo ea mocheso le ts'ebetso ea motlakase e hlokahalang bakeng sa meralo e thehiloeng ho IT-968. Hore na o sebetsa ho lisebelisoa tsa marang-rang tse lebelo le holimo, li-backplanes, likarete tsa line, kapa li-module tsa waelese / RF, mela ea rona ea tlhahiso e ntlafalitsoe bakeng sa ho ts'oana, ho nepahala le ho sebetsa.
- E tšehetsa li-stackups tsa PCB tse ngata ho tloha ho 2 ho isa ho 60 layers
- Bokhoni bo tsoetseng pele ba HDI bo nang le bofofu / ba patiloeng ka meaho
- Tsela e laoloang ke tšitiso ka papiso ea Dk le netefatso ea setharoli sa tšimo
- Liqeto tse holimo: ENIG, ENEPIG, silevera ea ho qoelisoa, le tse ling
- Tlhahlobo e felletseng: Teko ea E-100%, X-ray bakeng sa likarolo tse ka hare, tlhahlobo ea microsection
- E netefalitsoe ho IPC Class 2 kapa maemo a 3 a mosebetsi
Ntle le tlhahiso, sehlopha sa rona sa boenjiniere se fana ka ts'ehetso e felletseng ea meralo - ho kenyelletsa moralo oa li-stackup, mohlala oa mocheso, tlhahlobo ea phano ea thepa, le ntlafatso ea CAM - ho u thusa ho fokotsa litšenyehelo le kotsi ntle le ho senya boleng.
Bakeng sa merero e hlokang IT-968 SE kapa li-laminate tsa ts'ebetso e phahameng tse bapisoang, ikopanye le rona ho buisana ka lithibelo tsa ho etsa thepa, nako ea ho fetoha, le lipehelo tsa ts'epo. Litharollo tsa rona li tšeptjoa ke li-OEM ho mehala, ts'ireletso le khomphutha e sebetsang hantle haholo.
Kopa Tšehetso ea Khoutu kapa Boenjiniere
Ho rala sesebelisoa sa dijithale se potlakileng haholo kapa sa RF se hlokang ts'ebetso ea laminate ea IT-968? Highleap Electronics e ikemiselitse ho u thusa ho fetola meralo ea hau hore e be li-PCB tse ka tšeptjoang, tse itokiselitseng tlhahiso - ka potlako le ka theko e tlase.
Sehlopha sa rona se sebetsa ka ho khetheha ho IT-968-based PCB, 'me re fana ka:
- Licheke tsa mahala tsa DFM (Design for Manufacturability) le litlhahlobo tse ikhethileng tsa li-stackup bakeng sa li-PCB tsa lebelo le holimo tsa IT-968.
- Tšehetso ea boenjiniere bakeng sa khetho ea thepa le ketsiso ea dielectric
- Prototyping e potlakileng le tlhahiso e felletseng e sebelisang laminate ea IT-968 bakeng sa lits'ebetso tsa RF
- Litharollo tsa sebaka se le seng: Stencil ea SMT, lenaneo le kopano ea PCB ea turnkey
Na u hloka linako tsa ho etella pele ka potlako, taolo e betere ea litšenyehelo, kapa tataiso mabapi le ho sebelisa IT-968 bakeng sa meaho ea PCB e mengata? Baenjiniere ba rona ba mona ho fana ka temohisiso le litlhahiso tse etselitsoeng morero oa hau.
Kopa khotheishene hang-hang kapa u hlophise tlhahlobo ea tekheniki kajeno.
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