Filimi ea Kapton Polyimide bakeng sa Tlhahiso ea PCB e Tenyetsehang
Kapton HN, FN, le HPP-ST ke dikereiti tsa filimi tsa polyimide tsa mokga wa boraro tse ka hlaloswang bakeng sa meralo ya PCB e tenyetsehang le e thata. Highleap Electronics e fana ka ditshebeletso tsa tlhahiso le kopano ya PCB ho latela thepa e hlalositsweng ke moreki, ditlhoko tsa ho bokella le tlhahiso.
Filimi ea Kapton Polyimide ho Likopo tsa PCB tse Fetohang
Kapton ke sehlahisoa sa filimi ea polyimide se tsoang DuPont, se nang le limaraka tse kang HN, FN, le HPP-ST tse fumanehang bakeng sa litlhoko tse fapaneng tsa tekheniki. Meralong ea potoloho e tenyetsehang, lifilimi tsa polyimide li ka hlalosoa moo ho hlokahalang kaho e tšesaane ea dielectric, ho tenyetseha ha mechini, ho thibela motlakase, kapa ho hanyetsa mocheso.
Filimi ea Kapton® e ka nahanoa ka mefuta e fapaneng ea meralo ea PCB e tenyetsehang le e thata, ho kenyeletsoa likopano tse nyane tsa elektroniki, lipotoloho tse feto-fetohang tse nang le mekhahlelo e mengata, likhokahano tsa sensor, lisebelisoa tsa elektroniki tsa indasteri, lisebelisoa tsa elektroniki tsa likoloi, le lits'ebetso tse ling tse nang le litlhoko tse ikhethileng tsa mechini kapa tsa ho kenya mocheso.
Lintho tse tloaelehileng tse lokelang ho nahanoa ka moralo oa PCB li kenyelletsa:
- Kaho ea potoloho e tenyetsehang le e thata-e tenyetsehang
- Botenya ba dielectric le PCB ka kakaretso
- Litlhoko tsa sebaka sa kobeho le tsa mechini
- Litlhoko tsa ho kenya mocheso oa motlakase le matšoao
- Ho kopanngoa le li-coverlay, li-stiffeners le lisebelisoa tse ling tsa PCB
Highleap Electronics e hlahisa le ho kopanya li-PCB ho latela thepa le litlhoko tsa moralo tse boletsoeng ke moreki. Kapton® e hlalosoa feela e le lebitso la thepa ea motho oa boraro.
Kapton® FCCL Litlhaloso tsa Tekheniki
Lethathamo la 1. Thepa ea 'Mele ea Kapton® Mofuta oa 100 HN Film, 25µm (1 mil)
| Thepa ea 'mele | Tloaelehileng Boleng ho | Method teko | |
|---|---|---|---|
| 23 ° C (73 ° F) | 200 ° C (392 ° F) | ||
| Ultimate Tensile Strength, MPa (psi) | 231 (33,500) | 138 (20,000) | ASTM D-882-91, Mokhoa oa A |
| Yield Point ho 3%, MPa (psi) | 69 (10,000) | 41 (6,000) | EA-882-ASTM |
| Khatello ea Maikutlo ho Hlahisa 5% Elongation, MPa (psi) | 90 (13,000) | 62 (9,000) | EA-882-ASTM |
| Elongation ea ho qetela,% | 72 | 83 | EA-882-ASTM |
| Tensile Modulus, GPa (psi) | 2.76 (400,000) | 2.0 (290,000) | EA-882-ASTM |
| Matla a Tšusumetso, N•cm (ft•lb) | 78 (0.58) | - | Teko ea Impact ea DuPont Pneumatic |
| Folding Endurance (MIT), li-cycle | 285,000 | - | EA-2176-ASTM |
| Matla a Meokho—A A Atisa (Elmendorf), N (lbf) | 0.07 (0.02) | - | EA-1922-ASTM |
| Tear Strength—Ea Pele (Mabitla), N (lbf) | 7.2 (1.6) | - | EA-1004-ASTM |
| Boima ba 'mele, g/cc kapa g/mL | 1.42 | - | EA-1505-ASTM |
| Coefficient of Friction-Kinetic | 0.48 | - | EA-1894-ASTM |
| Coefficient of Friction-Static | 0.63 | - | EA-1894-ASTM |
| Refractive Index (Na D Line) | 1.70 | - | EA-542-ASTM |
| Boemo ba Poisson | 0.34 | - | Avg. Mehlala e meraro e Atolositsoe |
| Bophelo bo Tlase ba Mocheso Flex | Pass | - | IPC TM 650, Mokhoa oa 2.6.18 |
Lethathamo la 2. Thermal Properties of Kapton® Type 100 HN Film, 25 µm (1 mil)
| Thepa ea Mocheso | Boleng bo tloaelehileng | Boemo ba Teko | Method teko |
|---|---|---|---|
| Melting Point | None | None | ASTM E-794 (1989) |
| Thermal Coefficient of Linear Katoloso | 20 ppm/°C (11 ppm/°F) | -14 ho isa ho 38 ° C (7 ho isa ho 100 ° F) | EA-696-ASTM |
| Coefficient of Thermal Conductivity, W/m•K (cal/sec-cm-°C) | 0.20 (4.8 × 10⁻⁴) | 296 K (23°C) | ASTM D5470 |
| Mocheso o khethehileng, J/g•K (cal/g•°C) | 1.09 (0.261) | - | Likhalori tse fapaneng |
| Ho tsuba | EA-94V-0 | - | UL-94 (2-8-85) |
| Ho fokotseha,% | 0.17 1.25 |
Metsotso e 30 ka 150°C Metsotso e 120 ka 400°C |
IPC TM 650, Mokhoa oa 2.2.4A EA-5214-ASTM |
| Sealability ea Mocheso | E sa Koaheleng Mocheso | - | - |
| Ho fokotsa Oksijene Index, % | 37 | - | EA-2863-ASTM |
| Solder Float | Pass | - | IPC TM 650, Mokhoa oa 2.4.13A |
| Moloko oa Mosi | DM = <1 | - | Kamore ea Mosi ea NBS NFPA-258 |
| Mocheso oa Phetoho ea Khalase (Tg) | Phetoho ea taelo ea bobeli e etsahala Kapton® pakeng tsa 360 ° C (680 ° F) le 410 ° C (770 ° F) 'me e nkoa e le mocheso oa phetoho ea khalase. Mekhoa e fapaneng ea ho lekanya e hlahisa liphello tse fapaneng ka har'a mocheso o ka holimo oa mocheso. |
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Letlapa la 3. Lintho tsa 'Mele le tsa Thermal tsa Kapton® Mofuta oa HPP-ST Film
| Property | Boleng bo Tloaelehileng ba Botenya ba Filimi | Method teko | |||
|---|---|---|---|---|---|
| 25µm | 50µm | 75µm | 125µm | ||
| Ultimate Tensile Strength, MPa (psi) | 231 (33,500) | 234 (34,000) | 231 (33,500) | 231 (33,500) | EA-882-ASTM |
| Elongation ea ho qetela,% | 72 | 82 | 82 | 82 | EA-882-ASTM |
| Tear Strength (Elmendorf), N | 0.07 | 0.21 | 0.38 | 0.58 | EA-1922-ASTM |
| Matla a Meokho (Mabitla), N | 7.2 | 16.3 | 26.3 | 46.9 | EA-1004-ASTM |
| Mamello ea ho Mena (MIT), ×10³ | 285 | 55 | 6 | 5 | EA-2176-ASTM |
| Boima ba 'mele, g/cc | 1.42 | 1.42 | 1.42 | 1.42 | EA-1505-ASTM |
| Ho tsuba | EA-94V-0 | EA-94V-0 | EA-94V-0 | EA-94V-0 | Ul-94 |
| Ho fokotseha (150°C, 30 min),% | 0.03 | 0.03 | 0.03 | 0.03 | IPC TM 650 |
| Ho fokotsa Oksijene Index, % | 37 | 43 | 46 | 45 | EA-2863-ASTM |
Letlapa la 4. Lintho tsa 'Mele tsa Kapton® Mofuta oa FN Film
| Property | Boleng bo Tloaelehileng ba Mofuta oa Filimi | ||
|---|---|---|---|
| 120FN616 | 150FN019 | 250FN029 | |
| Ultimate Tensile Strength, MPa (psi) 23 ° C / 200 ° C |
207 (30,000) / 121 (17,500) | 162 (23,500) / 89 (13,000) | 200 (29,000) / 115 (17,000) |
| Yield Point ho 3%, MPa (psi) 23 ° C / 200 ° C |
61 (9000) / 42 (6000) | 49 (7000) / 43 (6000) | 58 (8500) / 36 (5000) |
| Khatello ea maikutlo ho 5% Elongation, MPa (psi) 23 ° C / 200 ° C |
79 (11,500) / 53 (8000) | 65 (9,500) / 41 (6000) | 76 (11,000) / 48 (7000) |
| Elongation ea ho qetela,% 23 ° C / 200 ° C |
75 / 80 | 70 / 75 | 85 / 110 |
| Tensile Modulus, GPa (psi) 23 ° C / 200 ° C |
2.48 (360,000) / 1.62 (235,000) | 2.28 (330,000) / 1.14 (165,000) | 2.62 (380,000) / 1.38 (200,000) |
| Matla a Kameho ho 23°C, N•cm (ft•lb) | 78 (0.58) | 68.6 (0.51) | 156.8 (1.16) |
| Matla a Meokho—A A Atisa (Elmendorf), N (lbf) | 0.08 (0.02) | 0.47 (0.11) | 0.57 (0.13) |
| Tear Strength—Ea Pele (Mabitla), N (lbf) | 11.8 (2.6) | 11.5 (2.6) | 17.8 (4.0) |
| Polyimide, wt% | 80 | 57 | 73 |
| FEP, wt% | 20 | 43 | 27 |
| Boima ba 'mele, g/cc kapa g/mL | 1.53 | 1.67 | 1.57 |
Hlokomela: Boleng ba tekheniki bo bontšitsoeng kaholimo bo fanoe bakeng sa litšupiso tsa boenjiniere bo akaretsang feela 'me ha se litlhaloso tse tiisitsoeng. Bakeng sa thepa e tiisitsoeng ea thepa, meaho e fumanehang, mamello, le tlhaiso-leseling ea ho latela melao, ka kopo sheba litokomane tsa tekheniki tsa moetsi oa thepa hona joale. Kapton® ke sehlahisoa sa thepa sa mokha oa boraro sa DuPont; Highleap Electronics ha e hlahise filimi ea polyimide ea Kapton® kapa ho phatlalatsa litlhaloso tsa eona tsa thepa.
Highleap Electronics e fana ka lits'ebeletso tsa tlhahiso ea PCB le kopano ea PCB bakeng sa meralo ea bareki e hlalosang filimi ea Kapton® polyimide kapa lisebelisoa tse ling tse lumelletsoeng tsa potoloho e tenyetsehang. Re hlahloba pokello e amohetsoeng ke moreki, callout ea thepa, litlhoko tsa tlhahiso, le litokomane tsa kopano pele ho tlhahiso. Ho fumaneha ha thepa le kaho ea ho qetela ea PCB li tiisoa ho latela projeke ka 'ngoe.
Kapton®-Thehiloeng PCB Manufacturing bokgoni
Ho Highleap Electronics, re fana ka litšebeletso tse felletseng tsa ho qapa le ho kopanya tse etselitsoeng li-PCB tse tenyetsehang tse thehiloeng ho Kapton®. Sehlopha sa rona sa boenjiniere se utloisisa litlhoko tsa ts'ebetso ea thepa ea polyimide mme se ts'ehetsa merero e tlase le e phahameng.
- Tšehetso ea lintho tse bonahalang: Kapton® HN, HPP-ST, le lifilimi tsa FN ho tloha ho 25µm ho isa ho 125µm
- Mekhoa e lumellanang: laser cheka, coverlay lamination, matla kobang libaka
- Tlhahiso e nepahetseng: Etching ea kamore e hloekileng, ho nka litšoantšo ka mela e metle, le ho qeta ho lokiselitsoe ke SMT
- Li-stack-ups tse ikhethileng tsa ts'ebeliso: Metsoako e tsitsitseng-flex, multilayer PI lamination
- Litemoso: IPC Sehlopha sa 2/3 tikoloho ea tlhahiso e lumellanang
Ebang ke bakeng sa insurance-grade-grade kapa meralo ea compact FPC, setsi sa rona se netefatsa ho nepahala ha litekanyo, ho tsoa ha motlakase ho tlase, le ts'ebetso e tsitsitseng ea motlakase.
Fumana Khotheishene bakeng sa Liprojeke tsa PCB tse Feto-fetohang tse Hlalosang Filimi ea Kapton
Haeba moralo oa hau oa PCB o tenyetsehang kapa oa PCB o tiileng o totobatsa filimi ea Kapton polyimide, Highleap Electronics e ka hlahloba litlhoko tsa tlhahiso le kopano ea PCB ho latela litšoantšo tsa hau tse amohetsoeng, pokello, tlhahlobo ea thepa le litokomane tsa tlhahiso.
Jwalo ka moetsi wa PCB le mofani wa ditshebeletso tsa kopano ya PCB, mosebetsi wa rona o shebane le boto ya potoloho e fedisitsweng le PCBA ho ena le tlhahiso ya filimi ya polyimide ka boyona.
- Tlhahlobo ea DFM bakeng sa meralo ea PCB e tenyetsehang le e thata-thata
- Tlhahlobo ea PCB e hlophisitsoeng e ipapisitse le thepa e boletsoeng ke bareki
- Pontšo le bophahamo ba modumo tenyetsehang PCB tlhahiso
- Mekhoa ea ho koahela, ho tiisa, ho cheka, ho plating le ho tsamaisa
- Kopano ea SMT/THT, ho fumana likarolo, tlhahlobo le liteko
Boteng ba thepa le kaho ea ho qetela ea PCB li tiisoa ho latela litlhoko tsa projeke ka 'ngoe pele ho tlhahiso.
📩 Ikopanye le rona ho kopa khotheishene ea PCB kapa tlhahlobo ea boenjiniere. Ka kopo romela lifaele tsa hau tsa Gerber, pokello, BOM, litšoantšo le litlhoko tsa kopano bakeng sa tlhahlobo.
Kapton® ke sehlahisoa sa thepa sa mokga wa boraro sa DuPont. Lebitso lena le boletswe feela ho hlwaya ditlhoko tsa thepa tse totobaditsweng ke moreki. Highleap Electronics ke moetsi ya ikemetseng wa PCB le mofani wa kopano ya PCB mme ha a etse filimi ya polyimide ya Kapton®.