MEGTRON-4
MEGTRON-4 ke eng?
Kakaretso ea Boitsebiso
- Moetsi: Indasteri ea Panasonic
- Letoto la Lihlahisoa: MEGTRON4
- Laminate: R-5725
- Ho ikatisa pele: R-5620
- Dkt e tloaelehileng @ 1 GHz: 3.83
- Tloaelo ea Df @ 1 GHz: 0.005
litsobotsi
- Matla a Hlollang a Mechini
- Ntlafatso ea ho hanyetsa Thermal Resistance & Stability
- Ts'ebetso e Phahameng ea Thermal & Motlakase
- E loketse li-PCB tsa Multilayer & High Conductor Density
- Ntho e Tlase ea Dielectric Constant & Dissipation Factor (Bokhoni ba Lebelo le Phahameng)
dikopo
- Antenna
- K'homphieutha e kholo
- Sesebelisoa sa ho Lekanya
- ICT Infrastructure Equipment
MEGTRON-4 Kakaretso Thepa
| Matlo | Litekanyetso | Method teko | boemo | Boleng bo tloaelehileng | |
|---|---|---|---|---|---|
| Thepa ea Thermal | |||||
| Mocheso oa Phetoho ea Khalase (Tg) | ° C | DSC | Joalo ka E Amohetse | 176 | |
| TMA | 170 | ||||
| DMA | 210 | ||||
| Thermal Decomposition Temperature (Td) | ° C | TGA | 360 | ||
| Nako ea ho Hlakola (T288) | Ntle le Cu | le 'na | IPC-TM-650 2.4.24.1 | - | > 120 |
| Ka Cu | 30 | ||||
| CTE α1 | X-selekane | ppm / ° C. | IPC-TM-650 2.4.24 | <Tg | 12-14 |
| Y-selekane | 13-15 | ||||
| Z axis | 35 | ||||
| CTE α2 | Z axis | >Tg | 265 | ||
| Thepa ea Motlakase | |||||
| Ho hanyetsa Molumo | MΩ·cm | IPC-TM-650 2.5.17.1 | C-96/35/90 | 1 × 109 | |
| Resistivity ea bokaholimo | MΩ | 1 × 108 | |||
| Dielectric Constant (Dk) | - | IPC-TM-650 2.5.5.9 | C-24/23/50, 1 GHz | 3.83 | |
| Dissipation Factor (Df) | - | IPC-TM-650 2.5.5.9 | C-24/23/50, 1 GHz | 0.005 | |
| Matlo a 'mele | |||||
| Ho khaotsa Metsi | % | IPC-TM-650 2.6.2.1 | D-24/23 | 0.14 | |
| Matla a Peel | 1 oz ea Cu | kN/m | IPC-TM-650 2.4.8 | Joalo ka E Amohetse | 1.2 |
| Ho tsuba | Rating | UL | C-48/23/50 | EA-94V-0 | |
Mantsoeng a
- Boleng bo bontšitsoeng kaholimo bo fanoe bakeng sa litšupiso tse akaretsang tsa boenjiniere ba PCB 'me ha boa lokela ho nkoa e le litlhaloso tse tiisitsoeng bakeng sa li-PCB tse felileng.
- Lintlha tsa litšupiso tse thathamisitsoeng li tsamaellana le sampole ea 32 mil (0.8 mm) e nang le kaho ea #3313 × 8-ply.
- MEGTRON4, R-5725, le R-5620 ke mabitso a thepa ea Indasteri ea Panasonic. Litlhaloso tsa thepa ea hona joale le meaho e fumanehang li lokela ho netefatsoa ho sebelisoa litokomane tsa morao-rao tsa tekheniki tsa moetsi.
- Highleap Electronics e fana ka lits'ebeletso tsa tlhahiso ea PCB le kopano ea PCB. Bakeng sa lipotso tsa tlhahiso ea PCB, ka kopo iteanye le rona.
Polokelo ea Lintho
- R-5725 laminate le R-5620 prepreg e tšoana le lisebelisoa tsa rona tse tloaelehileng tsa FR-4.
- Laminate e lokela ho bolokoa e bataletse sebakeng se pholileng se omeletseng. Qoba ho kobeha kapa ho hopa bokaholimo ba laminate.
- Ha ho khoneha boloka laminate ka setshelo sa pele.
- Prepreg e lokela ho bolokoa e bataletse tikolohong e pholileng e omileng e laoloang, 73℉ (23℃) kapa ka tlase le 50% RH kapa ka tlase.
Laminate Surface Tokiso
- Kamehla Shiny Copper e ka hloekisoa ho sebelisoa lik'hemik'hale tse tloaelehileng tsa indasteri tse hloekileng kapa li hloekile ka mochini.
- Reverse Treat Copper e lokela ho hloekisoa ho sebelisoa lik'hemik'hale tse tloaelehileng tsa indasteri.
Kalafo ea Inner Layer Bond
- Black kapa Brown oxide e ka sebelisoa.
- Kalafo e 'ngoe ea Oxide e sebelisang theknoloji ea Peroxide / Sulfuric etch le eona e ka sebelisoa.
Ho omella
- Omella ka ho feletseng likarolo tse ka hare ho tlosa mongobo leha e le ofe o monyehileng kapa mongobo o ka holimo.
- Ho besoa ka rake ho 300℉ (150℃) ka lihora tse 1-2 hoa rateha. Bakeng sa ts'ebetso ea oxide e 'ngoe e tsamaisoang ka tsela e fapaneng, lisebelisoa tse ling li ka ba le bokhoni bo lekaneng ba ho omisa. Leha ho le joalo, ho besoa ka rake hoa khothaletsoa.
Ho tloha ho Stack-Speed-Hodimo ho isa ho PCBA e Felletseng
Bakeng sa merero ea PCB ea mekhahlelo e mengata e kenyeletsang MEGTRON4, Highleap Electronics e shebane le ho fetolela moralo oa motlakase o amohetsoeng hore e be oa tlhahiso le oa kopano o sebetsang. Tlhahlobo ea tlhahiso e hokahanya kaho ea li-stack-up, litlhoko tsa impedance, ka meralo, likarolo tsa koporo, le li-interface tsa kopano e le hore boto e se nang letho le PCBA ea ho qetela li latele motheo o tšoanang oa tlhahiso.
Tlhahlobo ea Sebopeho sa Matšoao
Mehlala ea li-impedance tse laoloang, lipara tse fapaneng, lifofane tsa litšupiso, sebaka sa dielectric, le liphetoho tsa lera li hlahlojoa hammoho le PCB e amohetsoeng. Sena se thusa ho theha liparamente tsa tlhahiso tse hlokahalang bakeng sa tlhahiso ea boto ea lera le nang le lebelo le phahameng.
Khokahano ea Kaho ea Mekhahlelo e Mengata
Ngoliso ea lera, ho cheka, meaho ea masoba a poleiti, tatellano ea lamination, kabo ea koporo, le botenya ba boto bo felileng li hokahanngoa ho latela moralo oa PCB le litokomane tsa tlhahiso.
Phetisetso ea ho Etsa le ho Kopanya
Qetello ea bokaholimo, sebopeho sa phanele, libaka tsa likarolo, litlhoko tsa ho kopanya, lintlha tsa tlhahlobo, le litlhoko tsa liteko li hlahlojoa pele ho tlhahiso ea PCBA e le hore litlhoko tsa tlhahiso ea PCB le kopano li lule li tsamaellana.
Highleap Electronics e fana ka tlhahiso ea li-PCB tse nang le mekhahlelo e mengata, tlhahiso ea li-impedance tse laoloang, kopano ea SMT/THT, tlhahlobo le liteko ho tsoa meahong ea li-prototype ka tlhahiso ea bophahamo. Bakeng sa merero e kenyeletsang MEGTRON4 R-5725 / R-5620, litlhoko tsa thepa li kenyelletsoa litokomaneng tsa PCB tse amohetsoeng pele ho tlhahiso.
Re romelle lifaele tsa hau tsa Gerber, pokello, le BOM bakeng sa tlhahlobo le khotheishene ea tlhahiso ea PCB.