Ho Khetha Substrate e Molemohali ea PCB bakeng sa Ts'ebetso e Ntlafetseng

Lefats'eng le ntseng le tsoela pele la tlhahiso ea elektroniki, khetho ea "Printed Circuit Board" (PCB) e nepahetseng ea thepa e bohlokoa haholo. E bapala karolo ea bohlokoa ho hlaloseng litšoaneleho tsa mantlha le ts'ebetso ea li-PCB. Ho ntlafatsa ts'ebetso le ts'ebetso ea liboto tsa potoloho ea hau, ho ntlafatsa thepa ea substrate ke mohato oa pele le oa bohlokoahali. Lilemong tsa morao tjena, ho hlahile lisebelisoa tse ngata tse ncha tsa substrate, tse tsamaellanang le mahlale a macha le mekhoa ea mmaraka.

Ponahalo ea 'maraka oa boto e hatisitsoeng e bone phetoho e kholo ho tsepamisitsoeng maikutlo, ho tloha ho lihlahisoa tsa khale tsa lisebelisoa tse kang li-PC tsa desktop ho ea sebakeng sa puisano e se nang mohala, li-server le liteishene tsa mehala. Lisebelisoa tsa puisano tsa mehala, tse bonts'itsoeng ke li-smartphone, li tsamaisitse theknoloji ea PCB ho fihlela meralo e phahameng haholo, boima bo fokotsehileng, le ts'ebetso e fapaneng. Ho bohlokoa ho hlokomela hore ts'ebetso ea li-PCB e hokahane ka mokhoa o ke keng oa lekanngoa le khetho ea lisebelisoa tse loketseng tsa substrate. Ka hona, khetho ea thepa ea substrate e bapala karolo ea bohlokoa ho bopeng boleng le ts'epahalo ea li-PCB ka bobeli le lihlahisoa tseo li reretsoeng ho li sebeletsa.

Ho Kopana le Litlhoko tsa High Density le Fine Lines

• Litlhoko tsa Copper Foil

  Ho lelekisa mehala e phahameng le ho feta, haholo-holo tabeng ea High-Density Interconnect PCBs (HDI PCBs), ho hloka hore ho nahanoe ka ho khetheha. Lilemong tse leshome tse fetileng, li-PCB tsa HDI li ne li hlalosoa li na le bophara ba mela (L) le likhechana tsa mela (S) tsa 0.1mm kapa ka tlase ho moo, ho latela maemo a IPC. Kajeno, litekanyo tsena li fokotsehile haholo, 'me litekanyetso tsa L le S li fihla tlaase ho 60μm,' me maemong a tsoetseng pele, esita le 40μm.

  Ka tloaelo, mekhoa ea potoloho e ne e etsoa ka mekhoa ea ho etsa litšoantšo le ho kopanya, ho finyella bonyane ba L le S boleng ba 30μm ho sebelisa li-substrates tse tšesaane tsa koporo tse nang le botenya ho tloha ho 9μm ho ea ho 12μm. Leha ho le joalo, ka lebaka la mathata a amanang le foil e tšesaane ea koporo ea Copper Clad Laminate (CCL), bahlahisi ba bangata ba PCB hona joale ba khetha mokhoa oa etching-minus-copper-foil, moo botenya ba koporo ea koporo bo eketsehang ho 18μm. Ho sa tsotellehe tšebeliso ea eona, mokhoa ona ha o khothalletsoe kaha o kenyelletsa mekhoa e mengata e rarahaneng, mathata a ho laola botenya, le litšenyehelo tse eketsehileng. Ka lebaka leo, foil ea koporo e tšesaane haholo e nang le botenya ba koporo ho tloha ho 3μm ho isa ho 5μm e nkuoa e le khetho e phahameng.

• Foil ea Koporo e Tlaase e Roughness

  Hoa hlokahala ho fihlela boima bo tlase holim'a foil ea koporo. Sena se thusa ho ntlafatsa maqhama pakeng tsa foil ea koporo le thepa ea substrate, ho netefatsa matla a peel a li-conductor. Ho fihlela liphetho tse nepahetseng, ho bohlokoa ho fokotsa ho ba le mahoashe a bokaholimo ba foil ea koporo ho ea tlase ho 3μm, kapa esita le tlase ho 1.5μm.

• Insulating Dielectric Laminates

  Li-PCB tsa High-Density Interconnect li itšetlehile haholo ka Mokhoa oa ho Aha. Le hoja Resin Coated Copper (RCC) le prepreg epoxy glass cloth e kopantsoeng le koporo foil lamination esale e sebelisoa bakeng sa potoloho e ntle, mekhoa e hlahang e kang Semi-Additive Process (SAP) le Modified Semi-Additive Process (MSPA) e ntse e hlahella. Mekhoa ena e kenyelletsa ho sireletsa filimi ea dielectric lamination ka lik'hemik'hale tsa koporo tsa lik'hemik'hale ho etsa lifofane tse tsamaisang koporo, tse nolofalletsang tlhahiso ea lipotoloho tse ntle.

  Khetho ea thepa ea dielectric e laminating e bohlokoa haholo. E tlameha ho ba le ts'ebetso e hlokahalang ea dielectric, litšobotsi tsa ho thibela mocheso, ho hanyetsa mocheso le litšobotsi tsa ho kopanya tse lumellanang le theknoloji ea HDI PCB.

Ho Kopana le Litlhoko tsa Maqhubu a Phahameng le Lebelo le Phahameng

Tswelopele ho tloha theknolojing ya puisano e nang le mehala ho ya ho ya waelese le phetoho ho tloha phetisong e nang le maqhubu a tlase, lebelo le tlase ho ya phetisong e nang le maqhubu a phahameng, lebelo le phahameng e emela diphetoho tse kgolo. Phetoho ho tloha theknolojing ya 4G ho ya ho 5G ho di-smartphone e totobatsa tlhokeho ya phetiso e potlakileng ya data le bokgoni bo eketsehileng ba data.

Ho finyella litlhoko tsa phetisetso e phahameng ea maqhubu le lebelo le phahameng, khetho ea lisebelisoa tse sebetsang hantle ke ea bohlokoa. Ntho e ka sehloohong eo ho nahanoang ka eona ke dielectric constant (Dk) le tahlehelo ea dielectric (Df) ea thepa ea substrate. Lisebelisoa tsa substrate tse nang le Dk ka tlase ho 4 le Df ka tlase ho 0.010 li khetholloa e le liboto tse bohareng tsa Dk/Df laminate. Bakeng sa ts'ebetso e phahameng le ho feta, ho khethoa liboto tse tlase tsa Dk/Df tse nang le Dk ka tlase ho 3.7 le Df ka tlase ho 0.005.

Mefuta e 'maloa ea thepa ea substrate e fumaneha bakeng sa liboto tsa potoloho ea maqhubu a phahameng, ho kenyeletsoa resin ea letoto la fluorine (mohlala, PTFE), resin ea PPO kapa PPE, le resin ea epoxy e fetotsoeng. PTFE , e tsebahalang ka thepa ea eona e ntle ea dielectric, e loketse lihlahisoa tse sebetsang maqhubung a 5GHz kapa ho feta. Ka lehlakoreng le leng, li-substrate tsa epoxy FR-4 kapa PPO tse fetotsoeng li loketse maqhubu a tlohang ho 1GHz ho isa ho 10GHz.

Khetho har'a lisebelisoa tsena tse phahameng tsa maqhubu a phahameng e kenyelletsa khoebo pakeng tsa litšenyehelo, thepa ea dielectric, ho monya metsi le litšobotsi tsa khafetsa. Fluorine-series resin e fana ka ts'ebetso e ikhethang ea dielectric empa ka theko e phahameng. Ka lehlakoreng le leng, resin ea epoxy e na le litšenyehelo tse ngata empa e lieha ho sebetsa ka dielectric.

Maemong ao lihlahisoa li sebetsang ka maqhubu a fetang 10GHz, resin ea fluorine-series e fetoha thepa ea khetho. Ho bohlokoa ho hlokomela hore li-substrates tsa PTFE li kanna tsa ba le mathata joalo ka litšenyehelo tse phahameng, ho tiea ho fokolang, le li-coefficients tse phahameng tsa katoloso ea mocheso. Ho sebetsana le mathata ana, lisebelisoa tsa inorganic tse kang silicon dioxide li ka sebelisoa e le li-filler kapa lesela la khalase li ka eketsoa ho matlafatsa substrate rigidity le ho fokotsa katoloso ea mocheso.

Li-Resins tse Ikemetseng tse Ikhethang le Bokhopo ba Bokaholimo ba Koporo

Ntle le khetho ea thepa ea substrate, lintlha tse ling li kenella bakeng sa phetiso ea mats'oao a maqhubu a phahameng. Bokaholimo ba li-conductor tsa koporo bo ama haholo tahlehelo ea phetisetso ea matšoao ka lebaka la ketsahalo ea Skin Effect. The Skin Effect e etsahala ha motlakase oa motlakase ka maqhubu a phahameng a qobella hore hona joale a tsepamise maikutlo holim'a conductor, e leng se bakang tahlehelo e eketsehileng ea pontšo.

Ho fokotsa tahlehelo ea lets'oao, ho thatafala ha copper conductor ho tlameha ho laoloa. Ka nako e ts'oanang, boima bo phahameng ba holim'a metsi bo lebisa tahlehelong e kholo ea matšoao. Ka hona, bofokoli ba koporo bo lokela ho bolokoa bo le tlase kamoo ho ka khonehang, hantle ka tlase ho 1μm, haholo-holo bakeng sa matšoao a kaholimo ho 10GHz. Foil ea koporo e nang le mafika a tlase haholo (0.04μm) e molemo haholo. Phekolo e nepahetseng ea oxidation le li-resin tsa sekhomaretsi li bohlokoa bakeng sa ho fihlela boima bo batloang ba bokaholimo.

Ho sebetsana le Tlhokahalo e Phahameng ea Mocheso le Litlhoko tsa ho Felisa

Ha disebediswa tsa elektroniki di ntse di fokola mme di le matla haholo, di hlahisa mocheso o eketsehileng. Tsamaiso e sebetsang ya mocheso e bohlokwa ho netefatsa tshebetso e ntle ya sesebediswa. Di-PCB tsa Metal Core ( MCPCBs ) kapa Di-PCB tsa Insulated Metal Substrate (IMS) di fana ka thepa e ntle ya ho qhala mocheso.

Aluminium ke thepa e bolokang chelete e ngata ebile e tsamaisa mocheso e sebelisoang hangata ho li-MCPCB. E fana ka bokhoni bo botle ba ho hanyetsa mocheso le matla a ho senya. Ntho ea bohlokoa bakeng sa tsamaiso e sebetsang ea mocheso e itšetlehile ka ho tiisa hore ho na le ho khomarela ka matla pakeng tsa motheo oa tšepe le sefofane sa potoloho.

Ho khetha Lisebelisoa tsa Substrate bakeng sa li-PCB tse Khethehileng

Ts'ebeliso e ntseng e eketseha ea li-PCB tse thata le li-PCB tse tenyetsehang/tse thata mafapheng a fapaneng e hlahisa litlhoko tse ncha mabapi le palo le ts'ebetso. Mefuta e fapaneng ea li-substrates e ntse e hlaha ho fihlela litlhoko tsena.

Lifilimi tsa Polyimide, tse fumanehang ka mefuta e fapaneng e kang e pepeneneng, e tšoeu, e ntšo, le e mosehla, e fana ka khanyetso e phahameng ea mocheso le li-coefficients tse tlase tsa katoloso ea mocheso. Lisebelisoa tsena li fana ka litlhoko tse fapaneng tsa ts'ebeliso.

Li-substrates tsa Mylar, tse tsejoang ka katleho ea litšenyehelo, li bonts'a litšobotsi tse kang elasticity e phahameng, botsitso ba dimensional, boleng bo holimo, photonic coupling, le ho hanyetsa tikoloho, e leng se etsang hore e be khetho e fapaneng bakeng sa litlhoko tse sa tšoaneng.

Phetiso ea mats'oao a lebelo le phahameng, a maqhubu a holimo a bohlokoa bakeng sa li-PCB tse tenyetsehang (Flex PCBs). Tahlehelo ea kamehla ea dielectric le dielectric ea thepa ea flex substrate e tlameha ho nahanoa ka hloko. Li-polyimide le li-advancing polyimide substrates, hammoho le li-substrates tse nang le li-additives tse sa tloaelehang, li ka lokisoa ho finyella litlhoko tse khethehileng, tse kang Dr / Df e tlaase bakeng sa phetisetso ea lebelo le phahameng kapa li-conductor tse matla bakeng sa likopo tse nang le maqhubu a maholo.

Itšetlehe ho Highleap Electronic bakeng sa Khetho ea Setsebi ea Lintho le Tlhahiso ea PCB

Ho khetha thepa e nepahetseng ea substrate bakeng sa PCB ea hau ke qeto ea bohlokoa, 'me e hloka kutloisiso e tebileng ea litšobotsi tse fapaneng tse amehang. Haeba u iphumana u ntse u shebana le ho rarahana ha mantsoe a substrate material and criterias performance, ho na le tharollo e bolokang chelete e fumanehang ho u thusa ho etsa liqeto tse nepahetseng.

Highleap Electronic, mofani ea ka sehloohong oa lefats'e ka bophara oa ho etsa boto e se nang letho, kopano ea PCB, le lits'ebeletso tsa ho fumana likarolo, e sebetsa ka ho khetheha ho lokisa litharollo tse nepahetseng tsa PCB tse tsamaellanang le litlhoko tse ikhethang tsa projeke, tekanyetso le litebello tsa ts'ebetso. Baenjineri ba rona ba nang le boiphihlelo ba ela hloko lintlha tse joalo ka tikoloho ea ts'ebeliso, ts'ebetso, le tekanyetso ea hau ho u tataisa ts'ebetsong ea khetho ea thepa ea substrate.

Ka boiphihlelo ba lilemo tse fetang leshome le rekoto ea ho phethela merero ea PCB ka katleho, Highleap Electronic ke molekane oa hau eo u mo tšepang tabeng ea ho khetha thepa e phethahetseng ea substrate le ho etsa li-PCB tse sebetsang hantle haholo tse fihlelang litebello tsa hau.

Bakeng sa li-PCB tse nang le li-substrate tse tloaelehileng tsa FR4, u ka fumana khotheishene hang-hang inthaneteng ka webosaete ea rona. Haeba projeke ea hau e hloka thepa e khethehileng ea substrate joalo ka li-Flex PCB , li-PCB tse ikhethileng tsa laminate tse nang le tahlehelo e tlase , kapa li-PCB tse thehiloeng ho Aluminium , re u khothaletsa ho ikopanya le rona ka kotloloho bakeng sa khotheishene e ikhethileng. Kholiseha hore Highleap Electronic e tla u thusa ho etsa khetho e nepahetseng ea thepa ea substrate bakeng sa projeke ea hau le ho fana ka li-PCB tse sebetsang hantle ka ho fetisisa.