PCB Surface Qetella Mefuta le Papiso

Li-PCB li theha motheo oa lisebelisoa tsohle tsa elektroniki tsa sejoale-joale. Ha lipotoloho tse kopantsoeng le likarolo tse ling li ntse li fokotseha butle-butle ebile li rarahane haholoanyane, li-PCB li tlameha ho fihlela litlhoko tse thata haholoanyane bakeng sa botšepehi ba lets'oao, katleho le ts'epo. Ntlha e 'ngoe ea bohlokoa e amang litekanyo tsena ke qetello ea bokaholimo ba PCB.

Qetello ea bokaholimo, kapa ho roala, e sebelisitsoeng ho PCB e se nang letho e sebetsa mesebetsi e mengata:

• E sireletsa koporo e ka tlase ho oxidation le tšilafalo
• E nolofalletsa le ho ntlafatsa solderability
• E thusa ho kopanya likarolo le ho hokahanya
• E ama phetiso ea mats'oao le bots'epehi
• Litšusumetso tsa manufacturability le tshebetso

Ho na le likhetho tse fapaneng tse fumanehang hona joale, ho khetha sebaka se setle sa ho qetela ho kenyelletsa ts'ebetso e leka-lekaneng, litšenyehelo, tlhahiso le litlhoko tsa ts'ebeliso. Sengoliloeng sena se fana ka pono ea botekgeniki ea liphetho tse atileng haholo tsa PCB, ho kenyeletsoa litšobotsi tsa tsona tsa bohlokoa, melemo le mathata, lits'ebetso tse loketseng mofuta o mong le o mong, le lintlha tsa ts'ebetso.

Lintlha tsa ho khanna ka holim'a Surface Qetella Khetho

Lintlha tse 'maloa tse sebelisanang li tsamaisa khetho ea sebaka sa PCB bakeng sa ts'ebeliso e fanoeng, ho kenyelletsa:

• Solderability le Wettability: Ho roala ka holim'a metsi ho tlameha ho qhibiliha habonolo, ho etsa motsoako o tsitsitseng, o ts'oanang pakeng tsa li-pads / likarolo le solder ntle le lihokelo tse tlotsoeng kapa borokho. Boemo ba ho koloba bo emela ho ata / ho khomarela ha solder ea metsi ho pholletsa le qetello.
• Oxidation le Shelf Life: Qetello ea bokaholimo e thibela oxidation e tsamaisoang ke moea ea koporo ha nako e ntse e feta pele e soasoa ho boloka solderability. Bophelo ba sethala bo itšetlehile ka ho tiea ha li-coating.
• Bonding Compatibility: Bakeng sa ho tlamahanngoa ha terata kapa ho khomarela litlolo tse lumellanang kapa metsoako ea lipitsa.
• Botsoalle ba Tikoloho: Ho lumellana le molao oa tšebeliso ea thepa, litšila, litšila, bophelo bo botle ba batho/tikoloho le polokeho.
• Ho tšepahala le ho tšoarella: Ts'ebetso e tsoelang pele tlas'a khatello ea motlakase, mocheso le mochini nakong eohle ea bophelo ba sehlahisoa. E kenyelletsa ho hanyetsa mocheso oa mocheso kapa oa mechine, mokhathala, ho falla ha motlakase, le tse ling.
• Botšepehi ba Letšoao: Hloekisa mats'oao a nang le "crosstalk" e fokolang kapa mesi e tsoang kantle bakeng sa lebelo le phahameng, maqhubu a seea-le-moea (RF), kapa lits'ebetso tse bobebe.
• Ho hlahlojoa le ho Tekoa: Ho nolofalloa ha tlhahlobo ea optical e ikemetseng le tlhahlobo ea motlakase. Tlhahlobo e hlakileng ea ho qetela; mask a solder a ka kena-kenana.
• Litšenyehelo: Litšenyehelo tsa thepa le tsa ho sebetsa, tse leka-lekaneng khahlanong le ts'ebetso.
• Manufacturability: Ho lumellana le lits'ebetso tsa ho etsa lintho tse kang ho solder, ho hloekisa, ho roala le ho kopanya. Litefiso tse fokolang tsa ho sebetsa hape.

Bohlokoa ba ntlha ka 'ngoe bo itšetlehile ka mofuta oa sehlahisoa le maemo a sebetsang. Mohlala, bophelo ba lishelefo le khanyetso ea oxidation e kanna ea se be taba ka tlhahiso e phahameng ea nako e sa tsoakoang e nang le pokello e nyane. Leha ho le joalo, lihlahisoa tsa bongaka kapa tsa sefofane li ka lula likhoeli kapa lilemo pele li romelloa, tse hlokang bophelo bo bolelele.

PCB Fabrication Process Overview

PCB e ts'ehetsa likarolo tsa elektroniki ha e ntse e fana ka likhokahano tsa motlakase lipakeng tsa tsona. Boto ka boeona ke insulating fiberglass epoxy laminate e nang le foil e tšesaane ea koporo mahlakoreng a le mong kapa ka bobeli. Foil ena e entsoe ka mokhoa oa fotolithographically ka mesaletsa le liphaephe, ho etsa litsela tse tsamaisang. Likarolo li rekisoa ho li-pads, ebang ke ka lesoba kapa ka holim'a metsi (SMT). Liboto tse nang le mekhahlelo e mengata li bokella likarolo tse ling tsa conductive le tse sireletsang kahare.
Liboto tse se nang letho tse tsoang ho lesela la PCB li tlameha ho etsa lits'ebetso tse 'maloa tsa ho qetela pele palo ea batho e na le likarolo:

Ho Lokisetsa Bokaholimo – Ho hlatswa le ho betla ka ho feletseng ho etsa hore koporo e be ntle le ho ntsha oxidation kapa tshilafatso polokelong, thomellong kapa tsamaisong.

Tšebeliso ea Qetello ea Bokaholimo - Seaparo se sebelisoa ka mekhoa ea lik'hemik'hale tse metsi tse hlalositsoeng ka tlase bakeng sa mofuta o mong le o mong oa qetello. Botenya, ho ba thata, le liparamente tse ling li laoloa haufi-ufi.

Sekoahelo sa maske se koaheloang – Bokaholimo bohle ba boto bo koaheloa ka enke ea epoxy, ho sa kenyeletsoe li-contact pad le lihokelo tse siiloeng li pepesitsoe. E fana ka ho thibela le matšoao.

Tšebeliso ea skrine ea silkscreen - Matšoao a hatisitsoeng bakeng sa likarolo, matšoao, litšupiso tsa boto, litsupa tsa polarity le tse ling tse thusang tlhahiso le ho rarolla mathata.

Teko ea motlakase - Boto ka 'ngoe e etsoa liteko tsa potoloho ho netefatsa ho latela melao ea ho tsoela pele ha motlakase le ho tšoara liphoso kapele. Boto lia feta/li hloleha ho latela litlhoko tse thata tsa boleng.

Qetello e ka holimo e etsa lesela le ka ntle le kopanyang koporo ea pad le solder e sebelisitsoeng, 'me ka hona e ka ama liphello tsa ts'ebetso e latelang haeba e sa tsamaisane hantle le eona. Joale a re hlahlobeng likhetho tse atileng haholo tsa ho qetela:

Mocheso oa Solder Leveling (HASL)

Sebaka se selelele ka ho fetisisa sa PCB se emeng holimo, hot air solder leveling (HASL) e koahela boto ka solder e entsoeng ka ho qhibilihisoa, ho etsa lesela le rekisoang la tin-lead alloy. Joalokaha lebitso la eona le bontša, lithipa tse futhumetseng tsa naetrojene li thethefatsa solder ea metsi ha e ntse e phola, e fokotsa ho bokellana ho sa lekaneng. HASL e se nang loto e nka sebaka sa li-solders tsa tin-silevera-koporo.

Tshebetso: Maboto a kena tsamaisong ea HASL holim'a conveyor, a feta tlas'a leqhubu le tsoelang pele la solder e qhibilihisitsoeng e tšoaretsoeng ka kamoreng e mengata. Ka mor'a ho qoelisoa, lithipa tsa moea li phatlola liboto ka naetrojene e futhumetseng kapa khase ea argon ho batalatsa solder e batang hore e be seaparo se lekanang ka ho kolobisa koporo hantle pele solder e tiea. Lithako tsa moeli li na le ts'ebetso. Mekhahlelo - mocheso, linako tsa ho pepeseha, phallo ea khase le khatello - li hloka taolo e thata ho hlahisa liphetho tse tsitsitseng, tsa boleng bo holimo.

Litšobotsi tsa bohlokoa:

• Ts'ebetso ea theko e tlase e nang le phallo e phahameng
• Theknoloji e tsoetseng pele e nang le rekoto ea lilemo tse 50
• Li-solder li sebetsa hantle ho li-solders tse entsoeng ka thini le likaroloana
• E ntle holim'a metsi le ho hlaka
• Tšireletso e phahameng ea koporo e hanana le oxidation
• E fumaneha mahala ho latela litlhoko tsa RoHS
• Qetello e bonahalang e bonahala

dikopo:

Ka ts'ebetso e matla maemong a theko e tlase, HASL e lumellana le lisebelisoa tsa elektronike tse sa tsotelleng litšenyehelo, lisebelisoa, lisebelisoa tsa elektronike tsa likoloi, le lisebelisoa tsa thelefono / tsa marang-rang.

le menyetla:

• E theko e tlaase, e nang le bokhoni ba molumo o phahameng
• Bophelo ba shelofo e telele
• Solderability e tsitsitseng
• Ho hanyetsa ho hoholo / tšilafalo
• Reworkable
• E bonahala bakeng sa tlhahlobo

go tlhoka mesola:

• Ha e na moralo o lekaneng bakeng sa li-IC tsa molumo o motle
• Thermal shock ka sotha mapolanka
• Ho qhibiliha ha tšepe ka nako
• Ho kopanya likotsi ka meralo e teteaneng
• Ho hlabana ka litaba ka thini e hloekileng
• Matlakala le ho bopeha ha lesela

Organic Solderability Preservative (OSP)

OSP e koahela mesaletsa ea koporo ka filimi e sireletsang ea tlhaho e entsoeng ka imidazole, triazole, kapa metsoako e meng ea heterocyclic. Lera lena le tšesaane la polymer e mpa e le 10-100 angstroms e teteaneng e thibela oxidation bakeng sa likhoeli tse 6-12 ha e ntse e lumella solder ho phalla hang ha e futhumetse. Ho roala ho sebelisoa ka ho qoelisoa kapa ho fafatsa mapolanka ka mor'a hore ho be le microetching.

Process:

Ho lokisoa ha bokaholimo ho sebelisa ho hloekisa le ho etsa liboto tse nyane ho lokisa liboto bakeng sa ts'ebeliso ea OSP:

1. mapolanka a kena ka phaposing e koetsoeng
2. Moholi oa OSP o fafatsoa ka ho lekana ho pholletsa le mapolanka
3. mapolanka a tsoa ka kamoreng ebe o omella
4. ho hloekisa ho qetela

Litharollo tsa OSP li na le lisebelisoa tse tsitsitseng le li-buffers tsa pH bakeng sa ts'ebetso e nepahetseng. Atomization ea metsi, mocheso, nako ea ho lula, likhahla tsa lik'hemik'hale le ts'ebetso ea ka morao ea ho roala li tlameha ho laoloa ho hlahisa boleng bo nepahetseng ba ho roala le ho tsitsisa.

Litšobotsi tsa bohlokoa:

• Sekhabiso se pepeneneng se tšesaane haholo
• E se nang lead le tikoloho-e bolokehileng
• Boreleli ho feta HASL e nang le polane e ntle haholo
• Qetello e sebetsang hape
• Theko e tlase ea pele ho feta liaparo tse ling

dikopo:

OSP e sebetsa hantle bakeng sa lisebelisoa tsa elektronike tse se nang mohala le tse nkehang habonolo, lihlahisoa tsa IoT, likoloi, lifofane, le lisebelisoa tsa elektroniki tsa bongaka moo ho ts'epahala le litaba tse etelletsoeng pele li tlamehang ho fokotsoa. Sebaka sa polane se thusa liboto tse petelitsoeng ka bongata.

le menyetla:

• Sesebelisoa se bonolo sa theko e tlase
• Qetello e hlophisitsoeng haholo
• Nako e telele ea bophelo ba sethala
• Solderability e tsitsitseng
• Rework e bonolo ea mapolanka a koahetsoeng ke OSP
• E fokotsa borikhoe bo khuts'oane

go tlhoka mesola:

• E ka hlakoloa haeba e sa koaheloe
• Bokhoni bo fokolang ba ho pata ka solder
• Ho thata ho hlahloba ka mahlo
• Fensetere e khuts'oane ea kopano e kile ea buloa
• Ho tšepahala ho fokolang ho latela tlhahlobo ea IPC*
• Copper oxidation e qala hape kapele ka holimo ho 175°C

Teko ea IPC e hokahanya liphahlo tsa OSP tse nang le litheko tse ntseng li eketseha tsa ho hloleha tlas'a maemo a mocheso, mongobo le ho sisinyeha. Leha ho le joalo, ba bangata ba sebelisa OSP ka katleho ho sa tsotelehe.

Silivera ea ho qoelisoa

Ho qoelisa li-PCB ka har'a lipoleiti tsa ho hlapa tsa silevera tse behang lik'hemik'hale 'mala o mosesaane oa silevera holim'a mesaletsa ea koporo, ho sebelisoa karabelo ea galvanic displacement. Ho roala ho na le li-microinches tse 15-25 (0.4-0.6 microns) tse teteaneng. E hanela ho silafala kapa oxidation ka nako e telele.

Process:

Microetching e kenya tšebetsong bokaholimo ba koporo. Liboto li qoelisoa ka har'a acidic silver nitrate kapa silver fluoborate tharollo e nang le organic stabilizers le accelerators e kenyellelitsoeng. Li-ion tsa koporo li fapanyetsana sebaka le li-ion tsa silevera tse koahelang boto. Mekhahlelo - mocheso, nako ea ho lula, litlolo tsa lik'hemik'hale le likhakanyo tsa tsona - kaofela li hloka taolo e hlokolosi ho ntlafatsa botsitso le ka mokhoa o ts'oanang.

Litšobotsi tsa bohlokoa:

• Ts'ebetso ea theko e tlase e nang le ts'ebetso e itekanetseng
• Excellent solderability le conductivity
• E hanyetsana le tarnish le oxidation
• Matla a matle a ho khomarela le ho sebetsa hape
• E loketse bakeng sa aluminium e kopanyang mohala

dikopo:

Silivera ea qoelisoa e sebetsa bakeng sa likhokahano tse se nang mohala, infotainment ea likoloi le litsamaiso tsa ADAS, mabone a LED, le lisebelisoa tse ling tsa elektroniki tse itšetlehileng ka ts'epo.

le menyetla:

• Ho tšepahala ha lenonyeletso le matla la solder
• Tšireletso ea nako e telele ea holim'a metsi
• Sebaka se sephara se sephara haholo
• Litsenyehelo tse tlase ho feta likhau tsa khauta
• Ha e na lead ebile e tsamaellana le RoHS

go tlhoka mesola:

• Bokaholimo bo fetoha mebala ha nako e ntse e ea
• E khona ho kolobisoa nakong ea lipalesa
• Bophelo bo bokhutšoanyane ba ho sebetsa bo kile ba pepesoa
• Ho thata bakeng sa tlhahlobo ea potoloho
• Lithempereichara tse phahameng tsa ho sebetsa

Tin ea ho qoelisoa

Ho qoelisa li-PCB tse hloekisitsoeng ka har'a litharollo tsa thini e futhumetseng ho beha lesela le sireletsang ka masela holim'a mesaletsa ea koporo. Li-additives tse hlahisoang ka bateng ea ho qoelisoa li fetola sebopeho sa lesela la satin ho tloha ho kristale e kholo ho ea ho micro-crystalline, ho qoba mathata a litelu tsa tin.

Process:

Boitokisetso ba boto bo etsoa ka ho hloekisa ka mokhoa o tloaelehileng, ho etsa microetching, ho hlatsoa metsi le ho qoelisoa ka asiti pele u kena ka bateng ea ho qoelisoa. Ho boloka taolo e nepahetseng ea mocheso oa litharollo tsa alkaline tin hammoho le nako e laoloang ea ho lula, lebelo la ho phahamisa, le likhakanyo tsa tlatsetso li lebisa ho ts'ebetsong. Deposition e haha ​​​​4-10 microinch (0.1 - 0.25 micron) e teteaneng ea matte tin layer.

Litšobotsi tsa bohlokoa:

• Ho roala ka tin e tšoeu ea matte
• Solderability e ntle e bolokiloe
• Ho lekana ka botenya ba lera
• Ho qhibiliha ha koporo ho fokolang
• Phetoho ea tharollo ea tin-in bakeng sa loto ea thini

dikopo:

Lijase tsa masenke tse qoelisoang li entsoe ka liboto tse thata, tse petelitsoeng hantle. E mamella li-alloys tse phahameng tsa mocheso joalo ka lisebelisoa tsa silevera-copper brazing. Ts'ebetso e theko e tlaase e boetse e lumellana le ts'ebeliso ea ts'epo e phahameng ts'ireletso, sepakapaka, ho sesa le likhokahano.

le menyetla:

• Smooth planar coat bakeng sa ultra fine pitch ICs
• Ha ho mathata a whisking
• Qetello e ka lokisoang hape e ka lokisoang
• Ha e kenelle ho oxidation polokelong
• Bokhoni ba ho solder bo se nang Flux
• Theko e tlase ea nako e telele

go tlhoka mesola:

• Bophelo bo bokhutšoanyane ba ho sebetsa bo kile ba pepesoa
• E tloaetse ho silafatsa le ho thothomela
• Mathata a ho felisoa ka matte finish
• Ho thata ho hlahloba ka mahlo
• Ts'ebetso e hlokolosi ea mocheso

Khauta e Kentsoeng (ENIG)

Electroless nickel mersion gold (ENIG) e beha likarolo tse peli tsa tšepe bakeng sa tšireletso e matla le ho solderability. Taba ea pele, lipoleiti tsa nickel tsa auto-catalytic ho tšela koporo ho isa botenya ba li-microns tse 3-7 ntle le motlakase. Ebe karabelo ea phalliso lipakeng tsa nickel le tharollo e nkela liathomo tse holim'a nickel sebaka ka mokhabiso o mosesaane oa khauta o botenya ba 0.05-0.15 microns.

Process:

PCB ea pele ea microetching e lokisa koporo. Liboto li kenya tanka ea nickel plating e se nang motlakase. Hang ha e se e hlophisitsoe, ts'ebetso ena ea "autocatalytic deposition" e tsoela pele ho bokella nickel ntle le motlakase. Mocheso, li-buffers tsa pH, likhahla tsa lik'hemik'hale le nako ea ho lula li tlameha ho lula li leka-lekane bakeng sa botsitso. Ka mor'a ho hlatsoa ka metsi, liboto li qoelisoa ka har'a motsoako oa khauta o futhumetseng o tlosang liathomo tsa nickel, 'me li etsa lesela le lesesaane la khauta.

Litšobotsi tsa bohlokoa:

• Litšenyehelo tse itekanetseng bakeng sa tšireletso e tšepahalang
• Likhoeli tse 12+ bophelo ba sethala
• Khauta lera lula haholo inert
• E ka rekisoa ntle le preconditioning
• Sebaka se bataletseng haholo
• Ts'ebetso e tšepahalang empa e rarahaneng

dikopo:

ENIG e lumellana le lihlahisoa tsa boleng bo holimo joalo ka li-server tsa khoebo, meaho ea mehala ea mehala, lisebelisoa tsa elektroniki tsa ts'ireletso, li-avionics le lihlahisoa tsa bongaka moo bophelo bo bolelele ba sethala le boleng ba ts'epo bo tsamaisang boleng ho feta litšenyehelo.

le menyetla:

• Tšireletso ea nako e telele ea oxidation
• Polanete e ntle e thusang li-IC tsa molumo o motle
• Botenya bo ts'oanang bo ts'oanang
• Haholo solderable holim
• Lera la khauta le thata le mamella ho apara
• E loketse bakeng sa ho kopanya terata ea aluminium

go tlhoka mesola:

• Litšenyehelo tse phahameng tsa thepa (khauta)
• Taolo ea ts'ebetso e rarahaneng
• Brittle nickel layer ka tlas'a khauta
• Kotsi ea pad e ntšo ka nako
• Khauta botenya ho thata ho hlahloba

Electrolytic Nickel/Khauta

Lisebelisoa tsa nickel / khauta li sebelisa likarolo tse peli tsa tšepe tse sebelisang motlakase ho fapana le ENIG. "Nickel" ea pele e khanyang ka tlas'a metsi e teteaneng haholo ho li-microinches tse 100-250 (2.5-6 microns) pele lesela la khauta le theoha ho 10-50 microinches (0.25-1.25 microns). Mokhoa ona oa electrolytic o lumella likarolo tsa khauta tse teteaneng, tse thata haholoanyane.

Kakaretso ea Ts'ebetso:

Li-PCB tse nyenyane li kenngoa ka har'a litanka tsa nickel le khauta tsa electrolytic plating ka tatellano moo li-anode le li-cathode tse ka tlas'a metsi li lumellang hore hona joale ho phalle ho kenya tšepe holim'a liboto. Ho laola ka nepo k'hemistri ea tharollo, lithempereichara, li-voltage le liparamente tsa waveform li netefatsa botsitso. Meralo ea thepa e qoba lipokotho tsa moea kapa phapang pakeng tsa liboto.

Litšobotsi tsa bohlokoa:

• Mefuta e mengata e matla ea khauta e thata
• E mamella linako tsa ho nyalana khafetsa
• Ha e na lead ebile e tsamaellana le RoHS
• Qetello e sebetsang hape

dikopo:

Lihokelo, menoana e ka thōko, libaka tsa ho ikopanya le li-pads tsa bonding li sebelisa nako e telele ha theko e itekanetseng e lumellana le lits'ebetso tse sa bitseng litšenyehelo tse phahameng.

le menyetla:

• Ho thata, ho feta ho apara khauta e hanyetsanang
• Theko e tlase ea thepa khahlano le ENIG
• Likarolo tse tšepahalang tsa solder
• Ts'ebetso e phahameng ea tlhahiso
• E lumella tlhahlobo ea probe

go tlhoka mesola:

• Teknoloji e hlokolosi haholo
• Nako e telele ea ts'ebetso
• Brittle layers e ka 'na ea peperana
• Li-PCB tse teteaneng tse behang kotsi kotsing
• Libaka tse koahetsoeng ka letsoho li ka hloka libese

Electroless Ni Electroless Pd Immersion Au (ENEPIG)

ENEPIG e phethela ho ntlafatsa ENIG, e nkela "nickel underlayer" ka "electroless palladium" pele e beoa khauta bakeng sa ts'ireletso e ntlafalitsoeng ea bokaholimo ntle le ho bola ha nickel kapa kotsi ea pad e ntšo. Joalo ka ts'ebetso e ncha, hajoale e bitsa chelete e ngata ho feta ENIG leha ho le joalo.

Litšobotsi tsa bohlokoa:

• Bophelo bo botle ba sethala 
• E thibang kutu ebile e inetse
• Thibelo e phahameng ea oxidation
• Ha e na lead ebile e tsamaellana le RoHS
• Qetello e sebetsang hape

dikopo:

ENEPIG e lumellana hantle le lits'ebetso tse ts'epahalang haholo tse nang le lishelefo tse telele tse phelang joalo ka sefofane, ts'ireletso le lihlahisoa tsa bongaka moo litataiso tse tšepahalang li leng bohlokoa ho feta litšenyehelo tsa pele.

le menyetla:

• Ho tšepahala ka ho fetisisa le ho phela nako e telele
• E felisa kotsi ea pad e ntšo
• E loketse bakeng sa litlhoko tsa terata
• Sebaka se sephara se sephara haholo
• E ka rekisoa ka lilemo tse 10+

go tlhoka mesola:

• Qetello e phahameng ka ho fetisisa ea litšenyehelo
• Nako ea ts'ebetso e lelefalitsoeng
• Boiphihlelo bo fokolang ba indasteri
• Liphephetso tsa taolo ea ts'ebetso
• Ho thata ho hlahloba ka mahlo

fihlela qeto e

Kakaretso ena ea liphetho tsa mantlha e bonts'itse kamoo PCB ea maiketsetso e emelang letoto la lits'ebetso tse itšetlehileng ka tse ling moo mohato o mong le o mong tseleng o amang sephetho sa tse latelang. Qetello ea bokaholimo - ebang ke Hot Air Solder Leveled, Organic Solderability Preservative, Immersion Silver, Immersion Tin, Electroless Nickel Immersion Gold, Electrolytic Nickel Gold kapa mefuta e meng e amanang le eona - e na le tšusumetso e kholo.

Baenjineri ba nka karolo bophelong ba lishelefo, ho solderability, ho lekana, litlhoko tsa ts'epahalo, botšepehi ba matšoao, le likhaello tsa litšenyehelo har'a tse ling tse khethollang ha ba khetha pheletso bakeng sa ts'ebeliso ea bona le tikoloho ea ts'ebetso. Lintlha tse ling li kenyelletsa tlhahiso, tlhahiso, tšebeliso ea lisebelisoa le boiketlo ba taolo ea boleng.

Ho ikitlaelletsa ho ba le ts'ebetso e nepahetseng ho pholletsa le matrix ena ea mehopolo qetellong ho nolofalletsa lisebelisoa tsa elektroniki tse sebetsang, tse tšepahalang le tse baballang chelete e ngata. Ha lits'ebetso li ntse li tsoela pele 'me litlhoko li ntse li hola le ho feta, re ka lebella ntlafatso e tsoelang pele ea likhetho tsa ho qetela le mekhoa ea ts'ebetso ho fihlela litlhoko tse hlahang.