Lethathamo la Mareo la Motheo la PCB leo U Lokelang ho le Tseba

Selelekela sa Mareo a Motheo a PCB

Ho utloisisa mantsoe a amanang le Printed Circuit Boards (PCBs) ho bohlokoa ho mang kapa mang ea amehang moralong oa lisebelisoa tsa elektroniki, ho etsa thepa kapa ho kopanya. Hore na o moenjineri, setsebi, kapa motho ea chesehang, ho utloisisa mantsoe a PCB ka nepo ho u thusa hore u be le puisano e ntle le kutloisiso ka har'a lebala. Lethathamo lena la motheo la mantsoe a PCB le sebetsa e le mohloli oa motheo oa ho itloaetsa mantsoe a bohlokoa le likhopolo tseo hangata li kopanang le tsona lipuisanong le litokomane tse amanang le PCB. Ka ho fumana tsebo e sebetsang ea mantsoe ana, u tla hlomelloa hamolemo ho tsamaea lefatšeng la li-PCB le ho kenya letsoho lipuisanong tse nang le morero mabapi le moralo, maqheka, kopano, liteko le mekhoa ea ho rarolla mathata. Ha re hlahlobeng mareo a bohlokoa a PCB a thehang meaho ea sebaka sena se thabisang le se matla.

 Lisebelisoa tsa motheo tsa PCB

• Subterate: Base insulating material, hangata FR-4 fiberglass.
• Prepreg: Letlapa la fiberglass le resin, le sebelisoang ka mapolanka a mangata.
• Foil ea koporo: Lera le lesesaane la koporo le etsang lipotoloho.
• konokono: Central substrate layer ka boto ea multilayer.
• Resin: Mekhahlelo e kopanyang ea polymer epoxy hammoho.
• Weave: Mokhoa oa ho matlafatsa fiberglass.
• Dielectric: Insulating thepa pakeng tsa conductors; FR-4's dielectric constant ke ~4.
• Lamination: Mokhoa oa ho kopanya foil le likarolo tsa prepreg ho sebelisa mocheso le khatello.
• Li-laminate tsa maqhubu a phahameng: Lisebelisoa tse kang laminate e khethehileng e nang le tahlehelo e tlase kapa Teflon bakeng sa lits'ebetso tsa RF/microwave.
• Thermal conductivity: Bokhoni ba thepa ea ho tsamaisa mocheso.
• CTE (Coefficient of Thermal Expansion): Katoloso ea lintho tse bonahalang/ho honyela ka mocheso.

Tlhahiso ea PCB

• CAM (Ho Etsa Lithuso tsa Khomphutha): Ts'ebeliso ea software ea komporo ho thusa ho fetolela lifaele tsa moralo bakeng sa lisebelisoa le lits'ebetso tsa tlhahiso.
• Etching: Ts'ebetso ea lik'hemik'hale ea ho tlosa koporo e sa batleheng ho PCB, ho siea mesaletsa ea koporo le liphase feela tse lakatsehang.
• Photoresist: Thepa e sa utloeng bohloko e kentsoeng ho PCB. Ha e pepesehetse leseli le ho ntlafatsoa, ​​e etsa mokoallo o sireletsang libakeng tsa koporo tse sa lokelang ho kenngoa.
• Tente: Mokhoa oa ho koahela vias (likoti) le photoresist ho ba sireletsa nakong ea etching.
• Mask ea solder: A tšireletso lera, hangata e tala empa fumaneha ka mebala e sa tšoaneng, hore e sebelisoa ka holim'a PCB ho thibela solder marokho le ho sireletsa koporo lintho tse tikoloho.
• Skrine sa silika: Lera la matshwao a enke le kentsweng ho PCB ho bontsha moo ho bewang dikarolo, baqapi ba direferense, matshwao, dintlha tsa teko, le tlhahisoleseding e nngwe.
• Ho kopanya: Ts'ebetso ea electrochemical ea ho eketsa lera la tšepe (hangata koporo) ho PCB, haholo-holo ka likoti tse phuntsoeng ho theha vias.
• Panel: Boto e kholo e nang le meralo e mengata ea PCB. Mokhoa ona o sebelisoa bakeng sa katleho ea tlhahiso. Ka mor'a ho etsoa, ​​​​phanele e robehile ho arola li-PCB ka bomong.
• Lamination: Mokhoa oa ho kopanya likarolo tse ngata tsa thepa hammoho ho sebelisa mocheso le khatello, hangata e sebelisoang ho li-PCB tse ngata.
• PTH (E entsoe ka Mokoti): A lesoba PCB e 'nileng ea e electroplated ho lumella kgokelo ya motlakase pakeng tsa mekhahlelo e fapaneng ya boto.
• OSP (Organic Solderability Preservative): Mofuta oa bokaholimo o sebelisoang ho PCB ho ntlafatsa ho solderability le ho sireletsa koporo ho oxidation.
• HDI (High Density Interconnect): Mofuta oa moralo oa PCB le tlhahiso e sebelisang lijeometri tse nyane le mamello e thata ho lumella likarolo tse ngata sebakeng se senyane.
• Microvia: Tsela e nyane haholo, e sebelisoang hangata ho meralo ea HDI, e kopanyang likarolo ho PCB ea multilayer.
• Taolo ea impedance: Mokhoa oa ho etsa PCB ho netefatsa hore mesaletsa e itseng e na le tšitiso e itseng, e bohlokoa bakeng sa meralo ea maqhubu a holimo.
• HASL (Hot Air Solder Leveling): Mokhoa oa ho sebelisa lesela le tšesaane la solder holim'a liphahlo tsa koporo ho PCB ho ntlafatsa ho solderability.
• Boima ba koporo/botenya: Botenya ba lesela la koporo ho PCB, hangata le lekanngoa ka li-ounces ka leoto le leng le le leng.
• Qetellong: Lera la ho qetela le sireletsang le le rekisoang le sebelisoa ho lipampitšana tsa koporo tse pepesitsoeng ho PCB. Mehlala e kenyelletsa OSP, HASL, ENIG (Electroless Nickel Immersion Gold), le tse ling.
• E patoa ka: Tsela e kopanyang likarolo tse ka hare tsa PCB ea multilayer 'me ha e fihle ho likarolo tse ka ntle.
• Ho foufala ka: Tsela e qalang lera e ka ntle empa e ema holim'a lera le ka hare, e sa fete ka har'a boto eohle.
• Gerber file: Foromo e tloaelehileng ea faele e nang le tlhahisoleseding e mabapi le moralo oa PCB, e sebelisoang ke bahlahisi ho hlahisa boto.
• Ring ea Annular: Sebaka sa pampiri ea koporo e pota-potileng lesoba le chekiloeng ka har'a PCB.
• Backdrilling: Mokhoa oa ho tlosa karolo e sa sebelisoeng ea sekoti se phunyeletsoeng ho fokotsa matla a parasitic.
• Bare Board: PCB e entsoeng empa ha e na likarolo tse kopantsoeng ho eona.
• Breakaway Tab: Li-tab tse nyane tse ts'oereng li-PCB ka bonngoe ka har'a phanele e kholoanyane, eo hamorao e robehileng.
• Ho Utsoa Koporo: Mekhoa ea koporo e kenyellelitsoeng likarolong tse ka ntle tsa PCB ho thusa ho etsa bonnete ba hore ho na le poleiti e lekanang ho pholletsa le boto nakong ea ho etsoa.
• Koporo e se nang Motlakase: Karolo e tšesaane ea koporo e kentsoeng ka lik'hemik'hale ntle le motlakase, hangata e sebelisoa e le selelekela sa electroplating koporo e eketsehileng.
• ENIG (Electroless Nickel Immersion Gold): Mofuta oa bokaholimo o sebelisoang ho li-PCB, o nang le lesela le ka tlase la nickel le pentiloeng e tšesaane ea khauta ka holimo.
• Epoxy Resin: Mofuta oa polymer o sebelisetsoang ho kopanya likarolo tsa PCB ea multilayer.
• Khauta ea Flash: Khauta e tšesaane haholo e koahetsoeng holim'a nickel, e sebelisoang haholo-holo bakeng sa tšireletso eseng bakeng sa ho kopanya.
• Lera ka Hare: Mekhahlelo ka har'a PCB ea multilayer, e sa bonahaleng ho tsoa kantle.
• Legend: Lentsoe le leng bakeng sa silkscreen, lileibole tse hatisitsoeng le matšoao ho PCB.
• NPTH (E sa Ateloang ka Mokoti): Likoti tse ka har'a PCB tse sa tlanngoeng ka koporo, hangata li sebelisetsoa ho kenya kapa ho etsa mesebetsi ea mochini.
• Pad: Sekhechana sa thepa ea conductive ho PCB moo karolo e hokeloang ho sebelisoa solder.
• Mask e Peelable: Mask ea nakoana ea solder e ka ebolloang ka mor'a ho soasoa.
• Reference Marker: Letšoao ho PCB, hangata e le letšoao la "+", le sebelisetsoang ho tsamaisana nakong ea kopano.
• Ho fumana lintlha: Mokhoa oa ho theha mela e fokolang holim'a phanele ea li-PCB, e li lumellang hore li arohane habonolo kamora ho etsoa.
• SMOBC (Mask ea Solder Over Bare Copper): Mokhoa oo mask a solder a sebelisoang ka ho toba holim'a koporo e se nang letho, ebe liphahlo tse pepesitsoeng tsa koporo li kenngoa.
• Mohato le ho Pheta: Ts'ebetso moo moralo o le mong oa PCB o kopitsoang makhetlo a mangata phanele e kholo ho ntlafatsa tlhahiso.
• Setlankana sa Teko: Karolo e nyane e kenyellelitsoeng phanele ea PCB e nang le meaho ea liteko, e sebelisetsoang ho netefatsa ts'ebetso ea tlhahiso.

Kopano ea PCB

• Conformal Coating:Seaparo se sireletsang se sebelisoang ho boto ea potoloho e hatisitsoeng ho thibela tšenyo ea mongobo, lerōle, lik'hemik'hale le mocheso o feteletseng.
• SMT (Surface Mount Technology): Likarolo ba soldered ka ho toba ka holim'a mekatelo PCB ho ena le ka masoba. Mokhoa ona o ntlafatsa boima ba likarolo mme o lumella sebopeho sa PCB se kopaneng haholoanyane.
• Reflow Soldering: Mokhoa oa ho kopanya likarolo tsa SMT ka ho futhumatsa kopano eohle ea PCB ka ontong ea convective. Sena se qhibilihisa peista ea solder, se tiisa kamano pakeng tsa likarolo le PCB.
• Wave Soldering: Mokhoa oa ho solder o ile oa tsamaisa likarolo tsa lesoba ka ho fetisa PCB holim'a leqhubu la solder e qhibilihisitsoeng.
• Kopano ea Hand: Mokhoa oa matsoho o kenyelletsang lisebelisoa tsa soldering le ho beoa. E sebelisoa haholo-holo bakeng sa lihlopha tse nyenyane, ho sebetsa hape le ho lokisa.
• Khetha le Sebaka: Mochini o ikemetseng o nkang likarolo ebe o li beha ka nepo ho li-PCB pele li soasoa.
• Khatiso ea Screen: Ts'ebetso e sebelisang stencil ho kenya solder paste ho PCB, e lumellang solder hore e behoe hantle moo likarolo li tla kenngoa teng.
• AOI (Automated Optical Inspection): Mokhoa oa tlhahlobo ea pono o sebelisang mechini e ikemetseng ho skena PCB e kopaneng bakeng sa liphoso.
• J-STD-001: Tekanyetso e kopaneng ea indasteri e hlalosang lisebelisoa, mekhoa le litekanyetso tsa netefatso bakeng sa ho hlahisa likhokahano tsa boleng bo holimo tse rekisoang.
• BGA (Ball Grid Array): Mofuta oa sephutheloana sa holim'a holim'a metsi bakeng sa li-circuits tse kopantsoeng. E sebelisa libolo tsa solder ka tlase e le lihokelo tsa eona.
• QFN (Quad Flat No-lead): Mofuta o mong oa sephutheloana sa holim'a holim'a metsi bakeng sa li-circuits tse kopantsoeng, tse khetholloang ka ho ba le li-terminals ka tlase empa ha ho na li-lead tse hlahelletseng.
• Tlatsetso: Epoxy e sireletsang e sebelisoang lipakeng tsa BGA kapa lichifi tse ling le PCB. E thusa ho matlafatsa manonyeletso a solder le ho sireletsa khahlanong le khatello ea kelello ea mechine.
• Tlhahlobo ea X-Ray: Mokhoa o sa senyeheng oa tlhahlobo o sebelisang litšoantšo tsa X-ray ho hlahloba manonyeletso a kahare a solder, a bohlokoa haholo bakeng sa li-BGA le likhokahano tse ling tse patiloeng.
• Likarolo tsa Thru-Hole: Likarolo tse tlang le li-lead tse etselitsoeng ho rekisoa ka masoba a pshatlehileng ho PCB.
• ECO (Taelo ea Phetoho ea Boenjiniere): Tokomane ea molao e bontšang phetoho ho moralo oa PCB kapa bili ea thepa. E sebelisoa ha ho hlokahala liphetoho ka mor'a mohato oa pele oa moralo.
• Ho hlalosa: Mokhoa oa ho arola li-PCB ka bomong ho tloha liphanele tse kholo ka mor'a ts'ebetso ea kopano. Hangata sena se etsoa ha li-PCB tse ngata li entsoe ka phanele e le 'ngoe bakeng sa katleho ea tlhahiso.

Lisebelisoa tsa PCB

• Li-layers: Palo ea lihlopha tsa koporo.
• botenya: Kakaretso ea botenya ba boto.
• Boemo ba likarolo: Karolelano ea botenya ho bonyane ba mohlala / bophara ba sebaka.
• sekontiri se metsi: Phapang pakeng tsa diphini kapa mesaletsa.
• Track/Trace: Ho tsamaisa potoloho ea koporo.
• Sebaka: Lekhalo pakeng tsa mesaletsa e bapileng.
• Bophara ba mola: Bophara ba mohlala.
• Ring ea selemo: Sebaka sa koporo se pota-potileng sekoti.
• Boholo ba lesoba le feliloeng: Bophara ba lesoba le phuntsoeng ka mor'a ho pola.
• mamello: Phapang e lumellehang ea liparamente.
• Phaliso: Sebaka pakeng tsa likarolo tsa koporo holim'a lera le le leng.
• Katoloso ea mask: Ho khutlisa mask a solder ho tloha pheletsong ea koporo.
• Stackup: Tlhophiso ea likarolo ho PCB ea multilayer.
• Ho tšela fatše: Ho hokahanya libaka tse ka thoko le fatše ho fokotsa EMI.
• Lebelo la balebeli: Letlapa le le leng pakeng tsa mesaletsa e 'meli ea mats'oao ho thibela crosstalk.

Teko ea PCB le Boleng

• ICT (Teko ea ka hare ho potoloho): Mokhoa oa ho etsa liteko moo mochini o hlahlobang PCB e nang le batho ba bangata, o batla marikhoe a makhutšoane, a bulang, a hanyetsang, a nang le bokhoni, le lintho tse ling tsa motheo ho netefatsa kopano e nepahetseng.
• Teko ea Flying Probe: Mofuta oa ICT o sa hlokeng tlhahlobo ea tlhahlobo. Li-probes tse tsamaeang li sebelisoa ho lekola li-PCB kapele ntle le tlhoko ea tlhahlobo ea lipekere tse inehetseng.
• Teko ea Mosebetsi: Kamora ICT, PCB e etsa tlhahlobo ea ts'ebetso ho etsisa tikoloho ea ho qetela ea motlakase le ho netefatsa hore e etsa mosebetsi o reriloeng.
• AOI (Automated Optical Inspection): Mokhoa oa ho hlahloba ka mahlo moo mochini o hlahlobang PCB e kopaneng bakeng sa likarolo le mefokolo ea solder.
• Tlhahlobo ea X-ray: Teko e sa senyeheng ea ho hlahloba manonyeletso a solder tlasa BGA kapa likarolo tse ling moo solder e sa bonahaleng ka mahlo.
• Sekena sa Meeli (JTAG): Mokhoa oa teko o lekola likhokahano tsa solder le ho netefatsa ts'ebetso ea likarolo tse ling.
• Teko ea ho Chesa: Liboto li tsamaisoa 'me li tlas'a khatello ea mocheso ho lemoha ho hlōleha ha pele.
• Teko ea Khatello ea Tikoloho: Ho pepesa PCB maemong a mangata a tikoloho ho netefatsa ts'ebetso ho pholletsa le mocheso, mongobo le lintlha tse ling tsa tikoloho.
• Thermal Cycling: Ho lekola karabelo ea PCB ho liphetoho tsa mocheso ho tsebahatsa mefokolo e ka bang teng ea manonyeletso.
• Teko ea Vibration le Shock: E etsisa likhatello tsa mochini tseo PCB e ka tobanang le tsona nakong ea bophelo ba eona ho netefatsa ho ts'epahala.
• Golden Board: Boto ea litšupiso e tsebahalang e se na sekoli eo ho bapisoang li-PCB tse entsoeng.
• DFT (Design For Testability): Ho theha PCB ka tsela e etsang hore ho be bonolo ho etsa liteko, ho netefatsa liphetho tse nepahetseng le ho rarolla mathata.
• FCT (Teko e sebetsang ea potoloho): Teko e lekolang hore na PCB e sebetsa ka tsela e reriloeng, hangata e kenyeletsang litšebelisano tsa firmware le software.
• Ts'ebetso ea Ts'ebetso: Ho lekola hore na boholo ba potoloho ea PCB bo lekoa ke mekhoa ea tlhahlobo ea hajoale.
• FA (Tlhahlobo ea ho hloleha): Haeba tlhahlobo e hloleha, FA e etsoa ho utloisisa sesosa sa ho hloleha.
• Tlhahlobo ea lihlahisoa: E lekanya karo-karolelano ea liboto tse ntle tse hlahisoang ho mapolanka kaofela a entsoeng. Metric ea bohlokoa bakeng sa ho lekola katleho ea tlhahiso le boleng.
• Matla a Ts'ebetso (Cpk): Tekanyo ea lipalo-palo ea ho lekola hore na ts'ebetso e ka hlahisa tlhahiso ka har'a meeli e boletsoeng.
• DPPM (Mefokolo ka milione): Metric e lekanyang sekhahla sa sekoli sa ts'ebetso ea tlhahiso.
• Teko ea Tumellano ea RoHS: E netefatsa hore kopano ea PCB e latela Restriction of Hazardous Substances Directive, e fokotsang tšebeliso ea thepa e itseng e kotsi.
• Teko ea Tsoelo-pele le ho Ikhetholla: E netefatsa hore likhokahano tsa motlakase li felile le hore ha ho na likhokahano tse sa rereloang.

Litokiso le Liphetoho tsa PCB

• Hlakola hape: Mokhoa oa ho nchafatsa le ho hlahisa mofuta o mocha oa sebopeho sa PCB ho lokisa litaba tse tšoailoeng mofuteng o fetileng.
• Errata: E ngotse litaba tse tsebahalang kapa liphoso ho PCB. E fana ka li-workaround kapa litokiso bakeng sa basebelisi le bahlahisi.
• Li-Jumpers: Litharollo tsa nakoana tse sebelisang lithapo ho hokahanya lintlha tse peli ho PCB, hangata li sebelisetsoa ho kheloha mohlala o robehileng kapa ho lokisa phoso ea moralo.
• Sebetsa hape: Mokhoa oa ho lokisa liphoso ho li-PCB tse seng li bokane. Sena se ka kenyelletsa phetoho ea likaroloana, soldering le mesebetsi e meng.
• Rework ea Moea o Chesang: Ho sebelisa sethunya sa moea o chesang ho senya le ho fetola likarolo tse fosahetseng tsa SMT ntle le ho senya likarolo tsa boahelani.
• BGA Rework Station: Thepa e khethehileng bakeng sa ho tlosa le ho nkela sebaka sa liphutheloana tsa Ball Grid Array (BGA), tse hlokang tlhophiso e nepahetseng le taolo ea mocheso.
• Hand Soldering: Mokhoa oa letsoho oa solder o sebelisetsoang ho fetola likarolo, ho eketsa li-jumpers, kapa ho lokisa marokho a solder.
• Desoldering: Mokhoa oa ho tlosa solder ho tsoa ho motsoako, hangata o sebelisa lisebelisoa tse kang wick ea solder, lipompo tsa desoldering, kapa moea o chesang.
• Tokiso ea Pad: Ho lokisa lipache tse phahamisitsoeng kapa tse senyehileng ho PCB, hangata ho sebelisoa epoxy le foil ea koporo.
• Tokiso ea Trace: Ho khutlisetsa trace e senyehileng kapa e robehileng ka ho sebelisa enke e tsamaisang, tepi ea koporo kapa lithapo tsa jumper.
• Rework ea Conformal Coating Rework: Ho tlosa le ho kenya ts'ebetso ea ts'ireletso ho tsoa karolong ea PCB ho thusa ho lokisa.
• go tseleganya: Ketso ea ho fetola PCB ka ho seha mesaletsa, ho eketsa lithapo, kapa ho etsa liphetoho tse ling tsa 'mele ho lokisa liphoso tsa moralo kapa ho ntlafatsa ts'ebetso.
• Tlatsetso e sa Tlatsehang: Ho tlosa epoxy ka tlas'a motsoako (joaloka BGA) ho thusa ho tlosoa le ho nkeloa sebaka.
• Reballing: Mokhoa oa ho fetola libolo tsa solder ka tlas'a BGA kapa sephutheloana se seng sa bolo.
• Thermal Profileing: Ho fetola boemo ba mocheso oa lisebelisoa tsa soldering hore li lumellane le litlhoko tse khethehileng tsa PCB, ho netefatsa phallo e nepahetseng ea solder le motsoako oa motsoako nakong ea ho tsosolosa.
• IR e tsepamisitsoeng (Infrared): Ho sebelisa mocheso oa infrared ho kenya mocheso sebakeng se itseng sa PCB, ho lumella ho tlosoa ha karolo e lebisitsoeng ntle le ho ama boto kaofela.
• Phekolo ea Epoxy: Ho sebelisa mocheso kapa leseli la UV ho thatafatsa epoxy e kentsoeng, e sebelisoang hangata nakong ea tokiso ea pad kapa trace.
• Kotulo ea Karolo: Ho tlosa lintho tse ka sebelisoang botong e nang le bothata bakeng sa ho sebelisoa hape kapa ho hlahlojoa.
• Ho hloekisa PCB: Ho tlosa masala a flux, litšila, kapa lithōle ka mor'a ts'ebetso ea ho lokisa ka ho sebelisa li-solvents kapa li-ultrasonic cleaners.
• tlhahlobo: Ho sebelisa magnification, AOI, kapa mekhoa ea X-ray ho netefatsa boleng ba mosebetsi oa ho lokisa le ho fetola.

fihlela qeto e

Ka kakaretso, mareo a amanang le li-PCB a akaretsa likarolo tse fapaneng tsa moralo oa motlakase, tlhahiso, kopano, liteko, taolo ea boleng le botšepehi. Ha u ntse u teba ka botebo lefapheng la boenjiniere ba PCB, mareo ana a tla u tloaela haholoanyane. Buka ena ea mantsoe e ka sebetsa e le mohloli oa bohlokoa oa ho nchafatsa mohopolo oa hau le ho matlafatsa kutloisiso ea hau ea mantsoe a bohlokoa a PCB. Ka ho atolosa tsebo ea hau ea mareo a PCB, u tla hlomelloa hamolemo ho sebetsana le mathata a boenjiniere ba PCB le ho kenya letsoho ntlafatsong ea litsamaiso tse ncha tsa elektroniki.

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