Lisebelisoa tsa PCB tsa Ts'ebetso e Phahameng - DuPont™ Pyralux® AP
Explore DuPont™ Pyralux® AP, top-tier adhesiveless polyimide laminate e loketseng bakeng sa ho etsa PCB e tenyetsehang le e thata. E tšehetsoa ke Highleap Electronics.
DuPont™ Pyralux® AP Flexible Laminate
Pyralux® AP ke laminate e tenyetsehang ea koporo e sebetsang hantle, e nang le polyimide e felletseng e etselitsoeng lipotoloho tse tenyetsehang tse nang le mekhahlelo e mengata le lits'ebetso tsa PCB tse thata . Ka lebaka la ho se be le lera le khomarelang le botsitso bo botle ba mocheso le boholo, Pyralux® AP e fihlela litlhoko tse tiileng tsa tikoloho ea elektroniki e tšepahalang haholo.
- Excellent dimensional le thermal botsitso tlas'a maemo a feteletseng
- E loketse lits'ebetso tsa multilayer flex le rigid-flex PCB
- UL 94V-0 e netefalitsoe mme IPC 4204/11 e lumellana
- Mefuta e mengata e fapaneng ea motsoako oa koporo le dielectric botenya bo teng
Boitsebiso bona bo sebelisoa haholo ho lisebelisoa tsa elektronike tsa likoloi, lisebelisoa tsa bongaka, lisebelisoa tsa lifofane, le lisebelisoa tsa puisano tsa 5G.
Pyralux®
Linyehelo tsa lihlahisoa tsa AP
| Code Product | Botenya ba Dielectric (mil) | Botenya ba Koporo (oz/ft²) |
|---|---|---|
| AP 7163E | 1.0 | 0.25 |
| AP 7164E | 1.0 | 0.33 |
| AP 8515R | 1.0 | 0.5 |
| AP 9111R | 1.0 | 1.0 |
| AP 7156E | 2.0 | 0.25 |
| AP 7125E | 2.0 | 0.33 |
| AP 8515E | 1.0 | 0.5 |
| AP 8525R | 2.0 | 0.5 |
| AP 9121R | 2.0 | 1.0 |
| AP 9222R | 2.0 | 2.0 |
| AP 8535R | 3.0 | 0.5 |
| AP 9131R | 3.0 | 1.0 |
| AP 9232R | 3.0 | 2.0 |
| AP 8545R | 4.0 | 0.5 |
| AP 9141R | 4.0 | 1.0 |
| AP 9242R | 4.0 | 2.0 |
| Thepa ea Laminate | IPC TM-650 (* kapa tse ling) | AP-9111 1 mil dielectric |
AP-9121 2 mil dielectric |
AP-9131–9161 3-6 mil dielectric |
|---|---|---|---|---|
| Ho khomarela Cu (Matla a Peel) Joalo ka ha e entsoe, N/mm (lb/in) Ka mor'a solder, N/mm (lb/in) |
mokhoa 2.4.9 | 1.6 (9) | >1.8 (10) | >1.8 (10) |
| 1.6 (9) | >1.8 (10) | >1.8 (10) | ||
| Sephaphatha ka Solder ho 288°C (550°F) | mokhoa 2.4.13 | Pass | Pass | Pass |
| Botsitso ba Dimensional Mokhoa oa B,% Mokhoa oa C,% |
mokhoa 2.2.4 | –.04 ho –.08 –.05 ho –.08 |
–.04 ho –.08 –.04 ho –.07 |
–.03 ho –.06 –.03 ho –.06 |
| Dielectric Thickness Tolerance,% | mokhoa 4.6.2 | ± 10 | ± 10 | ± 10 |
| UL Flammability Rating | *UL-94 | V-0 | V-0 | V-0 |
| Dielectric Constant*, 1 MHz | mokhoa 2.5.5.3 | 3.4 | 3.4 | 3.4 |
| Phahamisa Factor*, 1 MHz | mokhoa 2.5.5.3 | 0.003 | 0.002 | 0.002 |
| Matla a Dielectric, kV/mil | mokhoa 2.5.6.1 | 6-7 | 6-7 | 6-7 |
| Ho hanyetsa ha Volume, ohm-cm | mokhoa 2.5.17.1 | E16 | E17 | E17 |
| Resistance ea Bokaholimo, ohms | mokhoa 2.5.17.1 | >E16 | >E16 | >E16 |
| Mongobo le Insulation Res., ohms | mokhoa 2.6.3.2 | E11 | E11 | E11 |
| Mongobo oa Mongobo,% | mokhoa 2.6.2 | 0.8 | 0.8 | 0.8 |
| Matla a Tensile, MPa (kpsi) | mokhoa 2.4.19 | >> (345 (> 50) | >> (345 (> 50) | >> (345 (> 50) |
| Elongation,% | mokhoa 2.4.19 | > 50 | > 50 | > 50 |
| Tšimoloho Matla a Meokho, g | mokhoa 2.4.16 | 700-1000 | 900-1200 | 900-1200 |
| Phatlalatso Matla a likhapha, g | mokhoa 2.4.17.1 | > 10 | > 20 | > 20 |
| Khanyetso ea lik'hemik'hale, min. % | mokhoa 2.3.2 | Feta, >95% | Feta, >95% | Feta, >95% |
| Solderability | *IPC-S-804, M. 1 | Pass | Pass | Pass |
| Flexural Endurance, min. lipotoloho | mokhoa 2.4.3 | 6000 | 6000 | 6000 |
| Phetoho ea Khalase (Tg), °C | - | 220 | 220 | 220 |
| Modulus, kpsi | - | 700 | 700 | 700 |
| Ka Sefofane CTE (ppm/°C) T | - | 25 | 25 | 25 |
| Ka Sefofane CTE (ppm/°C) T>Tg | - | 40 (esita.) | 40 (esita.) | 40 (esita.) |
- Pyralux® AP ke sehlahisoa sa DuPont.
- Boleng ba tekheniki bo fanoa bakeng sa litšupiso tsa boenjiniere bo akaretsang feela. Ka kopo sheba litokomane tsa hajoale tsa moetsi oa thepa bakeng sa litlhaloso tse tiisitsoeng.
- Highleap Electronics ke moetsi ea ikemetseng oa PCB le mofani oa litšebeletso tsa kopano 'me ha se moetsi oa Pyralux® AP.
Melemo ea Bohlokoa le Lisebelisoa tsa Pyralux® AP
Pyralux® AP e fana ka ts'ebetso e etelletseng pele indastering bakeng sa baqapi le baetsi ba li-PCB tse tenyetsehang. E fana ka thepa ea motlakase e tsitsitseng le ts'epo e phahameng ea mocheso bakeng sa lits'ebetso tsa bohlokoa.
Main Melemo:
- Coefficient e tlase ea Katoloso ea Thermal (CTE) - e nepahetse bakeng sa li-multilayer tse thata-flex
- Ho khomarela ho phahameng pakeng tsa koporo le polyimide bakeng sa botšepehi bo matla ba potoloho
- Taolo e ntle ea botenya ba dielectric bakeng sa meralo e laoloang ea impedance
- Ts'ebetso e tsitsitseng libakeng tse thata: mongobo o phahameng, ho palama libaesekele tse futhumetseng, le ho pepesehela lik'hemik'hale
Masimo a Kopo:
- Lisebelisoa tsa tlhahlobo ea bongaka (mohlala, litsamaiso tsa litšoantšo, lintho tse ka roaloang)
- Tšireletso le lisebelisoa tsa elektronike tsa sefofane (litsamaiso tsa sathelaete, li-avionics)
- Sistimi ea mehala e potlakileng le li-antenna tsa 5G
- Li-ECU tsa Likoloi, li-sensor, le li-control tsa elektronike tse ka har'a cabin
Tlhahiso ea PCB e Tenyetsehang ka Pyralux® AP e Khethiloeng ke Moreki
Highleap Electronics e fana ka lits'ebeletso tsa tlhahiso le kopano ea PCB e tenyetsehang le PCB e thata e feto-fetohang ho latela litšoantšo tsa bareki, litlhoko tsa ho bokellana, le lisebelisoa tse boletsoeng tsa laminate. Merero e hlalosang Pyralux® AP e ka hlahlojoa bakeng sa ho fumaneha ha thepa le litlhoko tsa tlhahiso pele ho tlhahiso.
Bokgoni ba ho Etsa Dihlahiswa tsa PCB bo Tenyetsehang
- Tlhahiso ea PCB e tenyetsehang ea lera le le leng le e nang le mekhahlelo e mengata
- Tlhahiso ea PCB e thata-thata le lamination ea mekhahlelo e mengata
- Ho cheka ka laser le ka mechine
- Ho sebetsana le ho koahela le ho lamination
- Li-stack-up tsa PCB tse laoloang ka ho thibela ho laoloa
- Kopano ea SMT, THT, tlhahlobo le liteko
Pyralux® AP e tsebahala leqepheng lena feela e le thepa ea PCB e ka khethoang ke moreki. Highleap Electronics ke moetsi ea ikemetseng oa PCB le mofani oa litšebeletso tsa kopano.
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