TLX-8
TLX-8 ke eng?
Kakaretso ea Boitsebiso
- Moetsi oa Hona Joale: AGC
- Sehlahisoa: TLX-8
- Mofuta oa Boitsebiso: PTFE e Matlafalitsoeng ke Fiberglass
- Dkt e tloaelehileng: 2.55 ± 0.04
- Tloaelo ea Df: 0.0018
- Tšebeliso ea mantlha: Li-PCB tsa RF le Microwave
Likaroloana
- Tahlehelo ea Dielectric e tlase
- Sesebelisoa sa kamehla sa dielektri se laoloang
- Mongobo o Tlase
- Sebopeho se Matlafalitsoeng sa Fiberglass
- Likhetho tse ngata tsa Botenya
- Dikgetho tse fapaneng tsa ho kwahela koporo
melemo e
- Tlase ebile o tsitsitse Dr
- Thepa e Ntle ea Mechini le Thermal
- Dimensionally Stable
- Mongobo o Tlase
- DF e tlase
- Lintlha tsa UL 94 V-0
- Bakeng sa Meetso ea Microwave e tlase ea Layer Count
dikopo
- Li-antenna tsa RF le Microwave
- Sistimi ea Radar
- Lisebelisoa tsa Puisano tse Selefouno
- Lisebelisoa tsa Teko ea Microwave
- Lisefa tsa RF
- Li-Mixer le Li-Reverter tsa Maqhubu
- Likarohano tsa Matla, Li-Splitter le Li-Combiner
- Likarolo tse sa sebetseng tsa RF le Microwave
Thepa e Akaretsang ea TLX-8
| Matlo | Mekhoa ea Teko | Unit | latela boleng ba | Unit | latela boleng ba |
|---|---|---|---|---|---|
|
DK @ 10 GHz |
IPC-650 2.5.5.3 |
|
2.55 |
|
2.55 |
|
Df @ 1.9 GHz |
IPC-650 2.5.5.5.1 |
|
0.0012 |
|
0.0012 |
|
Df @ 10 GHz |
IPC-650 2.5.5.5.1 |
|
0.0017 |
|
0.0017 |
|
Karohano ea Dielectric |
IPC-650 2.5.6 |
kV |
> 45 |
kV |
> 45 |
|
Ho monya mongobo |
IPC-650 2.6.2.1 |
% |
0.02 |
% |
0.02 |
|
Flexural Strength (MD) |
ASTM D 709 |
psi |
28,900 |
N / mm² |
|
|
Flexural Strength (CD) |
ASTM D 709 |
psi |
20,600 |
N / mm² |
|
|
Tensile Strength (MD) |
ASTM D 902 |
psi |
35,600 |
N / mm² |
|
|
Matla a Tensile (CD) |
ASTM D 902 |
psi |
27,500 |
N / mm² |
|
|
Elongation at Break (MD) |
ASTM D 902 |
% |
3.94 |
% |
3.94 |
|
Elongation at Break (CD) |
ASTM D 902 |
% |
3.92 |
% |
3.92 |
|
Young's Modulus (MD) |
ASTM D 902 |
kpsi |
980 |
N / mm² |
|
|
Young's Modulus (CD) |
ASTM D 902 |
kpsi |
1,200 |
N / mm² |
|
|
Young's Modulus (MD) |
ASTM D 3039 |
kpsi |
1,630 |
N / mm² |
|
|
Boemo ba Poisson |
ASTM D 3039 |
|
0.135 |
N / mm |
|
|
Matla a Peel (1 oz.ed) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
15 |
N / mm |
|
|
Matla a Peel (1 oz.RTF) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
17 |
N / mm |
|
|
Matla a Peel (½ oz.ed) |
IPC-650 2.4.8.3 (Mocheso o Phahameng.) |
Ibs./linear inch |
14 |
N / mm |
|
|
Matla a Peel (½ oz.ed) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
11 |
N / mm |
|
|
Matla a Peel (1 oz. e phuthiloe) |
IPC-650 2.4.8 Sec.5.2.2 (Thermal Stress.) |
Ibs./linear inch |
13 |
N / mm |
2.1 |
|
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec.5.5 (Kamora Ho Bake.) |
mls/in. |
0.06 |
mm/M |
|
|
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec.5.4 (Kamora Ho Bake.) |
mls/in. |
0.08 |
mm/M |
|
|
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec.5.5 (Thermal Stress.) |
mls/in. |
0.09 |
mm/M |
|
|
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec.5.5 (Thermal Stress.) |
mls/in. |
0.1 |
mm/M |
|
|
Resistivity ea bokaholimo |
IPC-650 2.5.17.1 Sec.5.2.1 (Mocheso o Phahameng.) |
Mohm |
6.605 x 10⁸ |
Mohm |
6.605 x 10⁸ |
|
Resistivity ea bokaholimo |
IPC-650 2.5.17.1 Sec.5.2.1 (Mongobo oa Mongobo.) |
Mohm |
3.550 x 10⁶ |
Mohm |
3.550 x 10⁶ |
|
Ho hanyetsa Molumo |
IPC-650 2.5.17.1 Sec.5.2.1 (Mocheso o Phahameng.) |
Mohm/cm |
1.110 x 10¹⁰ |
Mohm/cm |
1.110 x 10¹⁰ |
|
Ho hanyetsa Molumo |
IPC-650 2.5.17.1 Sec.5.2.1 (Mongobo oa Mongobo.) |
Mohm/cm |
1.046 x 10¹⁰ |
Mohm/cm |
1.046 x 10¹⁰ |
|
Ho khanna ho chesang |
ASTM F433/ASTM 1530-06 |
W/M*K |
0.19 |
W/M*K |
0.19 |
|
CTE (X axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
21 |
ppm/℃ |
21 |
|
CTE (Y axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
23 |
ppm/℃ |
23 |
|
CTE (Z axis) (25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
215 |
ppm/℃ |
215 |
|
Density (Specific Gravity) |
ASTM D 792 |
g / cm³ |
2.25 |
g / cm³ |
2.25 |
|
Td (2% Ho theola boima ba 'mele) |
IPC-650 2.4.24.6 (TGA) |
℃ |
535 |
℃ |
|
|
Td (5% Ho theola boima ba 'mele) |
IPC-650 2.4.24.6 (TGA) |
℃ |
553 |
℃ |
|
|
Flammability Rating |
Ul-94 |
|
V-0 |
|
V-0 |
Mantsoeng a
- Boleng bo thathamisitsoeng ka holimo ke data e tloaelehileng ea litšupiso tsa thepa 'me bo ka fapana ho latela botenya ba laminate, kaho ea koporo, maemo a ts'ebetso, le mekhoa ea liteko.
- TLX-8 ke karolo ea pokello ea laminate ea RF/microwave ea AGC. Bakeng sa litlhaloso tsa hajoale, botenya bo fumanehang, likhetho tsa ho koahela koporo, le tlhaiso-leseling ea mangolo, sheba litokomane tsa morao-rao tsa tekheniki tse tsoang ho AGC.
- Lintlha tsa thepa tse leqepheng lena li fanoe bakeng sa litšupiso tsa boenjiniere ka kakaretso 'me ha lia lokela ho sebelisoa e le litlhaloso tse tiisitsoeng bakeng sa PCB e felileng kapa kopano ea elektroniki.
TLX-8 e Utloisisa Neng bakeng sa RF kapa Microwave PCB?
TLX-8 e ka ba ea bohlokoa ho hlahlojoa ha RF kapa microwave PCB e hloka laminate e thehiloeng ho PTFE e nang le tahlehelo e tlase ea dielectric, thepa ea dielectric e laoloang, le matlafatso ea fiberglass. Qeto e lokela ho ipapisa le tlhoko e felletseng ea potoloho ho fapana le lebitso la thepa feela.
Bakeng sa baqapi ba PCB, TLX-8 e bohlokoa haholo ha boitšoaro ba mohala oa phetiso, tahlehelo ea ho kenya, botsitso ba impedance, le jiometri ea RF li na le tšusumetso e nang le moelelo potolohong e felileng. Merero e tloaelehileng e ka kenyelletsa marang-rang a antenna, lisebelisoa tsa elektroniki tsa radar, li-filter tsa RF, lipotoloho tse sa sebetseng tsa microwave, lisebelisoa tsa puisano, le lisebelisoa tsa liteko kapa tsa tekanyo.
- Litsela tsa lets'oao la RF le microwave: E loketse meralo moo tahlehelo ea dielectric e leng karolo ea bohlokoa ea palo ea mohala oa phetisetso.
- Li-antenna le lipotoloho tsa radar: E ka 'na ea nahanoa bakeng sa meaho e nang le maqhubu a phahameng moo jiometri ea mohlala, botenya ba dielectric, boemo ba koporo, le mobu li hlokang ho hlalosoa ka thata.
- Li-filter le marangrang a RF a sa sebetseng: E thusa bakeng sa dipotoloho tse itshetlehileng hodima litekanyo tsa mohala wa phetiso o laolwang le boitshwaro ba dielectric bo ka phetwang.
- Liboto tsa RF tse nang le palo e tlase ho isa ho e mahareng: TLX-8 e ka hlahlojoa bakeng sa meaho ea li-PCB tsa microwave tse sa hlokeng meralo e tšoanang ea thepa le li-backplane tse rarahaneng tsa dijithale tse nang le maemo a holimo.
- Meralo ea impedance e laoloang: Laminate e ka kenyelletsoa ka har'a li-PCB stack-ups moo lipheo tsa impedance li hlalosoang hammoho le botenya ba koporo le sebaka sa dielectric.
- Meaho ea li-PCB tse kopaneng: Mererong e meng, lera la PTFE RF le ka kopanngoa le thepa e meng e amohetsoeng ea PCB ha litlhoko tsa motlakase, tsa mechini le tsa litšenyehelo li tšehetsa ho bokellana ha motsoako.
TLX-8 ha se laminate e nepahetseng ka bo eona bakeng sa PCB e 'ngoe le e 'ngoe e nang le maqhubu a phahameng. Maqhubu a ts'ebetso, sepheo sa ho kenngoa le tahlehelo, botenya ba boto, palo ea lera, topology ea RF, litlhoko tsa mocheso, ho rarahana ha tlhahiso, maemo a kopano, le ho fumaneha ha thepa kaofela li lokela ho nahanoa pele ho lokolloa ha PCB ea ho qetela.
Bakeng sa merero ea tlhahiso ea PCB ea TLX-8 le kopano ea PCB, Highleap Electronics e sebetsa ho tsoa ho callout ea thepa e amohetsoeng, stack-up, Gerber data, litlhoko tsa impedance, litšoantšo tsa mechini, le lifaele tsa kopano ho nts'etsapele moaho o tsamaellanang oa tlhahiso ea PCB.
Romela projeke ea hau ea TLX-8 PCB bakeng sa tlhahlobo ea tlhahiso le khotheishene