TU-872 SLK PCB Laminate - Lebelo le Phahameng la Tahlehelo e Nyenyane | Highleap
Highleap Electronics e fana ka TU-872 SLK laminates bakeng sa tahlehelo e tlaase, lits'ebetso tsa PCB tse potlakileng ka telecom, seva, microwave, le mekhoa ea RF. IPC-4101/126 e netefalitsoe.
TU-872 SLK Laminate - Thepa e Tahlehelo e Tlase bakeng sa li-PCB tsa lebelo le phahameng le tse phahameng
TU-872 SLK ke epoxy e fetotsoeng ka mokhoa o phahameng oa FR-4 laminate, e entsoeng ka ho khetheha bakeng sa tahlehelo e tlaase le ho tšepahala ho phahameng ho li-multilayer high-speed circuit board applications. E matlafalitsoe ka khalase ea E-'me e lumellana le ts'ebetso e tloaelehileng ea FR-4, e nolofalletsa ts'ebetso e tsitsitseng ea motlakase ho pholletsa le maqhubu a boemo ba GHz.
Ka dielectric kamehla ka tlase ho 4.0 le dissipation factor tlasa 0.009 ho 10GHz, TU-872 SLK e loketse bakeng sa:
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Lifofane tse ka morao tsa lebelo le phahameng
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RF le microwave transceivers
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Liteishene tsa motheo le li-routers tsa telecom
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Lisebelisoa tsa polokelo, seva le HPC
Ka lebaka la botsitso ba eona bo matlafalitsoeng ba mocheso (Tg> 200 ° C, Td> 340 ° C), khanyetso ea CAF, le katoloso e bataletseng ea Z-axis, TU-872 SLK e kopana le litlhoko tsa HDI e tsoetseng pele ea kajeno le meralo ea ho khutlisa e se nang lead.
Litlhaloso tsa Teknoloji ea TU-872 SLK Laminate
| Property | Boleng bo tloaelehileng | Boemo ba Teko | IPC-4101 /126 Tlhokahalo |
|---|---|---|---|
| Thepa ea Thermal | |||
| Tg (DMA) | 220 ° C | E-2/105 | > 170 ° C |
| Tg (DSC) | 200 ° C | E-2/105 | - |
| Tg (TMA) | 190 ° C | E-2/105 | - |
| Td (TGA) | 340 ° C | E-2/105 | > 340 ° C |
| CTE x-axis | 12–15 ppm/°C | E-2/105 | - |
| CTE y-axis | 12–15 ppm/°C | E-2/105 | - |
| CTE z-axis | 2.3% | E-2/105 | <3.0% |
| Thermal Stress – 288°C Solder Float | > 60 metsotsoana | A | > 10 metsotsoana |
| T260 | 60 mets | E-2/105 | > 30 mets |
| T288 | 20 mets | E-2/105 | > 15 mets |
| T300 | 5 mets | E-2/105 | > 2 mets |
| Ho tsuba | EA-94V-0 | E-24/125 | EA-94V-0 |
| Thepa ea Motlakase | |||
| Tumello @ 1GHz | 4.0 / 3.8 | SPC / 4291B | <5.2 |
| Tumello @ 5GHz | 3.9 | SPC | - |
| Tumello @ 10GHz | 3.8 | SPC | - |
| Dissipation Factor @ 1GHz | 0.008 / 0.006 | SPC / 4291B | <0.035 |
| Dissipation Factor @ 5GHz | 0.008 | SPC | - |
| Dissipation Factor @ 10GHz | 0.009 | SPC | - |
| Ho hanyetsa Molumo | > 1010 MΩ·cm | C-96/35/90 | > 106 MΩ·cm |
| Resistivity ea bokaholimo | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Matla a Motlakase | > 40 kV/mm | A | > 30 kV/mm |
| Karohano ea Dielectric | > 50 kV | A | - |
| Mechanical Properties | |||
| Young's Modulus - Warp | EA-26-GPa | A | - |
| Modulus ea Mocha – Tlatsa | EA-24-GPa | A | - |
| Flexural Strength – Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Flexural Strength - Crosswise | > 50,000 psi | A | > 50,000 psi |
| Matla a Peel - 1 oz RTF Cu | 4–7 lb/in | A | > 4 lb/in |
| Ho khaotsa Metsi | 0.13% | E-1/105 + D-24/23 | <0.5% |
HLOKOMELA
- Lintlha tsohle tsa tekheniki tse hlahisitsoeng ka holimo li thehiloe litokomaneng tse fumanehang phatlalatsa tse tsoang ho Taiwan Union Technology Corporation (TUC). Litekanyetso tsena li reretsoe ho sebelisoa feela 'me li ka fapana ho latela lits'ebetso tse itseng kapa maemo a ts'ebetso. Ha se lintlha tse netefalitsoeng.
- TU-872 SLK e ntlafalitsoe ke TUC e sebelisa theknoloji e ntseng e emetse patent ho fihlela litlhoko tse phahameng tsa ts'epo ea RF e tsoetseng pele le meralo ea potoloho e lebelo le holimo. Bakeng sa lintlha tse qaqileng tsa ts'ebetso ea thepa, litataiso tsa ts'ebetso, kapa lipotso mabapi le ts'ebetso, ka kopo ikopanye le Taiwan Union Technology Corporation ka kotloloho.
- Ho Highleap Electronics, re litsebi tsa tlhahiso ea PCB le feme ea kopano e nang le phihlelo ea ho sebetsa le TU-872 SLK le lisebelisoa tse ling tse phahameng tsa maqhubu. Haeba o hloka tataiso mabapi le khetho ea thepa, therisano ea PCB ea ho bokella, kapa ho etsa li-turnkey le litšebeletso tsa kopano, sehlopha sa rona sa boenjiniere se teng ho u thusa.
Ka kopo, ikutloe u lokolohile ho ikopanya le rona bakeng sa therisano ea tekheniki, li-database tse felletseng, kapa mantsoe a qotsitsoeng a ikamahanyang le litlhoko tsa hau tsa moralo.
Melemo ea Boitsebiso & Tšebelisano ea Ts'ebetso
TU-872 SLK e fana ka tekanyo ea ts'ebetso le tlhahiso. E lumellana ka botlalo le lits'ebetso tse tloaelehileng tsa FR-4 lamination le etching, ha e ntse e fana ka ts'ebetso e phahameng bakeng sa meralo ea maqhubu a holimo le e hlokang mocheso.
Lintlha tsa bohlokoa li kenyeletsa:
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E netefalitsoe ho IPC-4101E /29, /99, /101, le /126 litekanyetso
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UL e tsejoa (Faele: E189572) e nang le tekanyo ea ho chesa ha 94V-0
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CTE e ntlafalitsoeng, ho hanyetsa CAF, le botsitso ba mongobo
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Matla a matle haholo a peel le ho ts'epahala ha lesoba
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E fumaneha ka mefuta e mengata ea copper cladding (1/3 oz - 5 oz) le mekhoa ea prepreg
Sebelisa TU-872 SLK ha u hloka:
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Mofuta o mong oa ho theola FR-4 o nang le ts'ebetso e phahameng ea motlakase
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Ho tšepahala ho netefalitsoeng ke IPC bakeng sa backdrill kapa HDI stackups
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Ts'ebetso e tsitsitseng ea dielectric ho fihla ho 10GHz
Tlhahiso le Kopano ea PCB bakeng sa Merero ea TU-872 SLK
Highleap Electronics e fana ka lits'ebeletso tsa tlhahiso ea PCB le kopano ea PCB bakeng sa merero e kenyeletsang TU-872 SLK, ho tloha meahong ea mehlala ho isa tlhahisong ea bongata. Tlhahiso e etsoa ho latela moralo oa PCB o amohetsoeng, pokello, litlhoko tsa thepa le litokomane tsa kopano.
Lihlopha tsa rona tsa boenjiniere le tsa tlhahiso li hokahanya tlhahiso ea boto e se nang letho le litlhoko tsa kopano ho boloka kaho e felletseng ea PCB e ts'oana ho tloha tlhahlobong ea moralo ho isa tlhahlobong ea ho qetela le liteko.
- Tlhahiso ea PCB ea mekhahlelo e mengata le ts'ebetso ea impedance e laoloang
- Tlhahlobo ea DFM, ho bokellana ha PCB, le monyetla oa tlhahiso
- Kopano ea SMT/THT le ho fumana likarolo
- AOI, X-ray, liteko tsa motlakase, le liteko tse sebetsang tsa PCBA
- Tšehetso ea tlhahiso ea mohlala, sehlopha se senyenyane le bophahamo ba modumo
Na projeke ea TU-872 SLK PCB e se e loketse tlhahiso? Re romelle lifaele tsa hau tsa Gerber, pokello, BOM, le litlhoko tsa kopano bakeng sa tlhahlobo ea boenjiniere le khotheishene.
Ikopanye le Highleap Electronics ho buisana ka litlhoko tsa hau tsa tlhahiso le kopano ea PCB.
Nka Qotso e Potlakileng
Fumana hore na boitseanape ba rona bo ka u thusa joang ka projeke ea hau e latelang ea PCB.